ADS6149IRGZ25 - 14-Bit 250MSPS Low-Power ADC | Texas Instruments
Référence : ADS6149IRGZ25 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $38.5 | $38,50 |
| 10 | $34.2 | $342,00 |
| 100 | $28.95 | $2 895,00 |
| 500 | $24.1 | $12 050,00 |
| 1 000 | $20.85 | $20 850,00 |
ADS6149IRGZ25 Présentation
An analog-to-digital converter (ADC) is a semiconductor device that transforms continuous analog signals into discrete digital codes for processing by DSPs, FPGAs, or microcontrollers. Pipelined ADCs use a multi-stage architecture to achieve high sampling rates while maintaining moderate resolution; they sit within the data converter hierarchy of successive-approximation-register (SAR) and flash ADCs. The ADS6149 specifically targets applications where high dynamic range and low power are required simultaneously, such as communications infrastructure and medical imaging.
Key features include 250 MSPS maximum sample rate, 14-bit resolution, 687 mW total power dissipation at 250 MSPS, DDR LVDS outputs for reduced pin count at high speeds, and parallel CMOS options for flexible interfacing. The device provides excellent spurious-free dynamic range (SFDR) and signal-to-noise ratio (SNR) across a wide input bandwidth, suitable for digitizing IF and baseband signals in wireless and test equipment.
The ADS6149 uses a switched-capacitor pipelined architecture with internal reference and sample-and-hold, supporting both single-ended and differential analog interfaces. The integrated DDR LVDS interface enables transfer of two data bits per cycle, minimizing the number of LVDS pairs required for 250 MSPS operation. Programmable gain, offset, and test-pattern features simplify system calibration and verification in production test environments.
Typical applications include wireless multi-carrier communications infrastructure, software-defined radio (SDR), power amplifier linearization, test and measurement instrumentation, high-definition video, medical imaging, and radar systems. The pin compatibility with the ADS5547 family allows designers to migrate designs across resolution/speed nodes without PCB rework.
When designing with this ADC, allocate the analog and digital supply domains carefully—place 1.8V AVDD and 3.3V DRVDD decoupling capacitors close to the supply pins. Use controlled-impedance differential routing for analog inputs and 50-ohm termination on LVDS outputs to preserve signal integrity at full sample rate.
This page synthesizes distributor pricing, drop-in pin-compatible alternatives within the ADS5547/ADS614X family, and practical design notes not consolidated on a single manufacturer or distributor page.
Alternatives de remplacement direct pour ADS6149IRGZ25 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ADS6149IRGZ25 (même facteur de forme et même empreinte) — différant par Package, Operating Temperature Range, Resolution, Analog Supply Voltage, Input Type.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ADS6149IRGZT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADS6129IRGZ25
✅ Remplacement direct✓ En stock
$23.1 / unité
Voir la fiche technique →ADS6148IRGZ25
✅ Remplacement direct✓ En stock
$52.1 / unité
Voir la fiche technique →ADS6149IRGZRG4
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADS5547IRGZT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADS6128IRGZ25
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADS6149IRGZ25 Valeurs maximales et caractéristiques électriques
| Résolution | 14 bits |
| Number of Channels | 1 |
| Sample Rate (Max) | 250 MSPS |
| Architecture | Pipelined |
| Input Type | Differential / Single-ended |
| Analog Supply Voltage | 1.8 V |
| Digital I/O Supply Voltage | 3.3 V |
| Power Dissipation | 687 mW at 250 MSPS |
| Output Interface | DDR LVDS / Parallel CMOS |
| Boîtier | 48-VQFN (RGZ) 7x7 mm |
| Plage de température de fonctionnement | -40 °C to +85 °C (Industrial) |
| Nombre de broches | 48 |
| Terminal Form | No Lead (HVQCCN) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de ADS6149IRGZ25
| Broche 1 | AVDD — Analog supply, 1.8 V |
| Broche 2 | AVDD — Analog supply, 1.8 V |
| Broche 3 | GND — Analog ground |
| Broche 4 | INP — Positive analog input |
| Broche 5 | INN — Negative analog input |
| Broche 6 | VCM — Common-mode voltage output |
| Broche 7 | GND — Analog ground |
| Broche 8 | REFT — Reference top decoupling |
| Broche 9 | REFB — Reference bottom decoupling |
| Broche 10 | GND — Analog ground |
| Broche 11 | AVDD — Analog supply, 1.8 V |
| Broche 12 | CLK — Differential clock input positive |
| Broche 13 | CLK_B — Differential clock input negative |
| Broche 14 | GND — Clock ground |
| Broche 15 | DRVDD — Digital I/O supply, 3.3 V |
| Broche 16 | GND — Digital ground |
| Broche 17 | DRVDD — Digital I/O supply, 3.3 V |
| Broche 18 | D0P — LVDS data output pair 0, positive |
| Broche 19 | D0N — LVDS data output pair 0, negative |
| Broche 20 | D1P — LVDS data output pair 1, positive |
| Broche 21 | D1N — LVDS data output pair 1, negative |
| Broche 22 | D2P — LVDS data output pair 2, positive |
| Broche 23 | D2N — LVDS data output pair 2, negative |
| Broche 24 | D3P — LVDS data output pair 3, positive |
| Broche 25 | D3N — LVDS data output pair 3, negative |
| Broche 26 | D4P — LVDS data output pair 4, positive |
| Broche 27 | D4N — LVDS data output pair 4, negative |
| Broche 28 | D5P — LVDS data output pair 5, positive |
| Broche 29 | D5N — LVDS data output pair 5, negative |
| Broche 30 | D6P — LVDS data output pair 6, positive |
| Broche 31 | D6N — LVDS data output pair 6, negative |
| Broche 32 | DRVDD — Digital I/O supply, 3.3 V |
| Broche 33 | GND — Digital ground |
| Broche 34 | CLKP — DDR LVDS clock output positive |
| Broche 35 | CLKN — DDR LVDS clock output negative |
| Broche 36 | DRVDD — Digital I/O supply, 3.3 V |
| Broche 37 | GND — Digital ground |
| Broche 38 | OE — Output enable |
| Broche 39 | RESET — Reset, active low |
| Broche 40 | SCLK — Serial interface clock |
| Broche 41 | SDATA — Serial interface data |
| Broche 42 | SEN — Serial interface enable |
| Broche 43 | SDOUT — Serial interface data output |
| Broche 44 | GND — Ground |
| Broche 45 | AVDD — Analog supply, 1.8 V |
| Broche 46 | GND — Analog ground |
| Broche 47 | NC — Not connected |
| Broche 48 | GND — Exposed pad / ground |
Applications typiques
ADS6149IRGZ25 convient pour 6 applications: Wireless Multi-Carrier Communications Infrastructure, Software Defined Radio (SDR), Power Amplifier Linearization, Test and Measurement Instrumentation, Medical Imaging Systems, Radar Systems.
Wireless Multi-Carrier Communications Infrastructure
The ADS6149IRGZ25 fits multi-carrier wireless base-station receivers because its 14-bit resolution at 250 MSPS preserves SFDR when digitizing wide-bandwidth IF signals containing multiple modulated carriers. The 1.8 V analog and 3.3 V digital supplies align with typical base-station line-card rails, and the DDR LVDS interface streams two data bits per clock cycle so fewer LVDS pairs are routed to the FPGA. Total power of 687 mW leaves thermal headroom in sealed outdoor enclosures. Designers place the ADC downstream of the analog AGC and connect INP/INN through a balun for differential drive. Pin compatibility with the ADS5547 family lets one PCB support multi-band, multi-resolution product variants without board respins.
Recommandé
Software Defined Radio (SDR)
The ADS6149IRGZ25 suits SDR platforms because its 250 MSPS sample rate and wide analog input bandwidth allow direct digitization of IF blocks up to 100 MHz or more, removing analog downconversion and increasing receiver flexibility. The 14-bit dynamic range supports 802.16/e and other broadband waveforms where peak-to-average ratios are high. DDR LVDS output eases board layout to Xilinx Kintex or similar FPGAs by halving the data-lane count. Industrial -40 to 85 °C operation allows use in outdoor or rugged SDR enclosures. Drop-in compatibility with the ADS5547 lets designers tune resolution versus power per platform tier.
Recommandé
Power Amplifier Linearization
The ADS6149IRGZ25 is widely used in digital predistortion (DPD) feedback paths for power amplifier linearization, where a sample of the PA output is digitized and used to compute correction coefficients. Its 250 MSPS rate captures multi-carrier signals including 802.16/e and LTE waveforms, while 14-bit resolution captures intermodulation products critical for ACPR correction. The 687 mW dissipation is acceptable in densely populated multi-antenna (MIMO) base stations. Differential analog inputs reject common-mode switching noise from the PA supply. The same VQFN-48 footprint across the ADS614X family lets designers reuse the feedback ADC site across multiple PA platforms.
Recommandé
Test and Measurement Instrumentation
The ADS6149IRGZ25 fits modular instruments such as oscilloscopes, spectrum analyzers, and signal analyzers because its 14-bit SFDR and 250 MSPS rate enable faithful capture of repetitive and transient signals across a wide frequency range. The DDR LVDS output delivers data to FPGAs with minimal lane count, simplifying dense multi-channel digitizer layouts. Differential inputs accept standard balun-driven test signals with high common-mode rejection. Industrial temperature grade supports bench and field instruments. The TI datasheet documents the SNR/SFDR specifications that bench designers need for instrument gain calibration, and the ADS6129IRGZ25 lower-power variant supports portable form factors.
Recommandé
Medical Imaging Systems
The ADS6149IRGZ25 is suitable for medical imaging front-ends such as ultrasound beamformers and MRI receivers, where high dynamic range and high sample rates are needed to digitize echoes or RF signals with fine amplitude resolution. Its 14-bit resolution supports the contrast range required for diagnostic imaging, and 250 MSPS is sufficient for many ultrasound and MRI channel architectures. The compact 48-VQFN 7x7 mm footprint enables high channel density on receiver boards. Industrial -40 to 85 °C operation supports clinical and portable medical devices. Differential analog inputs reject common-mode noise from switching power supplies typical in MRI gradient amplifiers.
Recommandé
Radar Systems
The ADS6149IRGZ25 supports radar IF digitization in ground-based, marine, and surveillance radar systems where bandwidth and dynamic range drive ADC requirements. Its 14-bit resolution at 250 MSPS captures complex pulsed-Doppler waveforms while preserving range-bin SNR. DDR LVDS output routes data to FPGAs/ASICs running FFT-based Doppler processing. The differential analog input rejects common-mode noise from the radar's switching transmitter. The industrial temperature rating accommodates outdoor deployments. Designers planning family gain provide placement for an ADS6129IRGZ25 footprint-compatible lower-power variant on the same PCB for cost-optimized product tiers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ADS6149IRGZ25 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ADS6149IRGZT | ADS6129IRGZ25 | ADS6148IRGZ25 | ADS5547IRGZT | ADS6128IRGZ25 |
|---|---|---|---|---|---|---|
| Package | 48-VQFN (RGZ) 7x7 mm | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) 7x7 mm - same | 48-VQFN (RGZ) 7x7 mm - same |
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Resolution | 14 bits | 14 bits | 12 bits | 14 bits | 14 bits | 12 bits |
| Max Sample Rate | 250 MSPS | 250 MSPS | 250 MSPS | 210 MSPS | 210 MSPS | 210 MSPS |
| Analog Supply | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
| Digital I/O Supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Output Interface | DDR LVDS / Parallel CMOS | DDR LVDS / Parallel CMOS | DDR LVDS / Parallel CMOS | DDR LVDS / Parallel CMOS | DDR LVDS / Parallel CMOS | DDR LVDS / Parallel CMOS |
| Temperature Grade | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) | -40 °C to +85 °C (Industrial) |
| Pin Compatibility Family | ADS5547 family | ADS5547 family | ADS614X/ADS612X family | ADS614X/ADS612X family | ADS5547 family | ADS614X/ADS612X family |
Principaux différenciateurs
- Pin-compatible with ADS5547 family for drop-in platform reuse (vs ADS5547IRGZT)
- 14-bit resolution for higher SFDR in same TWT module (vs ADS6129IRGZ25)
- 250 MSPS maximum sample rate in 14-bit class (vs ADS6148IRGZ25)
Notes de conception
Estimated: at 1.8 V AVDD ~250 mA and 3.3 V DRVDD ~80 mA, total analog plus digital dissipation is approximately 687 mW at 250 MSPS per the TI ADS6149 datasheet. Decouple each AVDD and DRVDD pin with a 0.1 µF ceramic plus a 10 µF low-ESR bulk capacitor placed within 5 mm of the supply pin. Use a star-ground topology tying the ADC ground to the analog ground plane, with the digital return currents routed separately to avoid coupling digital noise into the analog front-end.
Route the differential analog input pair (INP/INN) with 100-ohm differential controlled-impedance traces and keep them short and symmetric to preserve SNR and SFDR. The differential clock input (CLK/CLK_B) should follow the same 100-ohm differential layout. Place the input balun or driver amplifier close to the ADC inputs. Route the DDR LVDS data pairs with 100-ohm differential impedance and 50-ohm single-ended, and keep the LVDS output traces away from the analog input traces to avoid digital feedback into the analog front-end.
Terminate the DDR LVDS data outputs with 100-ohm differential termination at the FPGA side. Series-stagger a small common-mode choke on LVDS pairs if EMI is a concern. Provide a clean low-jitter clock to CLK/CLK_B because aperture jitter directly limits SNR; TI recommends using a clock jitter cleaner or dedicated clock generator such as the CDCE62005. Keep the analog input amplitude within the datasheet full-scale range to maximize SNR.
The 48-VQFN (RGZ) package has an exposed thermal pad that must be soldered to a continuous ground plane with thermal vias to the inner layers to keep the junction temperature within limits. Estimated: at 687 mW dissipation, the junction-to-ambient thermal resistance should be below ~50 C/W to ensure safe operation at 85 °C ambient. Avoid placing the ADC near other heat-dissipating devices such as power inductors or switching regulators without adequate copper area.
Do not leave the exposed pad unconnected; this degrades thermal performance and can cause erratic behavior. Always enable the digital outputs through the OE pin before attempting to capture data. Do not apply analog inputs before AVDD is ramped; power-supply sequencing is documented in the TI ADS6149 datasheet. When migrating between ADS614X and ADS612X variants, revalidate the digital backend because 12-bit vs 14-bit data alignment may differ. Verify the VCM common-mode voltage is correctly bypassed for the external driver amplifier reference.
Informations de conformité
RoHS and lead-free per TI product page. Industrial temperature grade -40 to +85 °C. Not AEC-Q100 qualified (this is a standard industrial/commercial part).
