ADC3241IRGZ25 - Dual 14-Bit 25MSPS ADC | Texas Instruments
Référence : ADC3241IRGZ25 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.1 | $221,00 |
| 100 | $19.8 | $1 980,00 |
| 500 | $17.5 | $8 750,00 |
| 1 000 | $15.2 | $15 200,00 |
ADC3241IRGZ25 Présentation
An analog-to-digital converter (ADC) is a mixed-signal semiconductor that samples a continuous-time analog voltage and encodes its amplitude into a discrete digital word. Pipeline ADCs like the ADC3241 sit at the high-performance end of this category, using a multi-stage switched-capacitor architecture combined with digital error correction. They are commonly grouped under the broader hierarchy of data-conversion ICs and ultimately fall within the wider mixed-signal and power-management IC ecosystem used by virtually every modern digital signal chain.
Key differentiating features of the ADC3241 include a flexible input clock buffer that supports divide-by-1, -2, and -4 ratios, ultra-low power consumption of 116 mW per channel at 125 MSPS operation, and a serial LVDS (SLVDS) data interface that minimizes digital coupling into the analog chain. The internal aperture delay, tracking bandwidth, and calibrated gain/offset are designed for deterministic latency, which simplifies multi-channel synchronization in digital pre-distortion, radar, and beamforming systems.
Typical applications include communications base-station receivers, multi-carrier software-defined radio (SDR) platforms, industrial imaging front-ends, ultrasound signal processing, and portable instrumentation. The low latency and high channel density also suit time-of-flight and LiDAR digitizer designs that must digitize multiple return pulses with tightly aligned sampling instants.
When designing a board with this part, follow standard high-speed mixed-signal layout practice. Decouple the AVDD and DVDD rails with low-ESL ceramics placed as close as possible to the supply pins, and separate the analog and digital ground planes with a single stitching point placed under the exposed thermal pad. Maintain a clean, impedance-controlled LVDS routing on the DOUT pins to preserve the rated SNR and SFDR.
This page synthesizes XAIPART distributor pricing, drop-in same-package alternatives, and practical PCB layout notes that go beyond the manufacturer datasheet's headline specifications.
Alternatives de remplacement direct pour ADC3241IRGZ25 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ADC3241IRGZ25 (même facteur de forme et même empreinte) — différant par Package, Resolution, Input Type, Operating Temperature Range, Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ADC3242IRGZ25
✅ Remplacement direct✓ En stock
$7.4 / unité
Voir la fiche technique →ADC3243IRGZ25
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC3244IRGZ25
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC32RF45IRGZR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ADC3223IRGZ25
✅ Remplacement direct✓ En stock
$11.98 / unité
Voir la fiche technique →ADC3224IRGZ25
✅ Remplacement direct✓ En stock
$20.4 / unité
Voir la fiche technique →ADC3241IRGZ25 Valeurs maximales et caractéristiques électriques
| Résolution | 14 bit |
| Number of Channels | 2 |
| Fréquence d'échantillonnage | 25 MSPS |
| Architecture | Pipelined |
| Input Channels | 2 analog inputs |
| Interface | Serial LVDS (SLVDS) |
| SNR | 72.4 dBFS at fIN = 70 MHz |
| SFDR | 87 dBc at fIN = 70 MHz |
| Channel Isolation | 105 dB |
| Power Consumption | 116 mW per channel at 125 MSPS |
| Tension d'alimentation | 1.8 V single supply |
| Input Clock Buffer | Divide-by-1, -2, -4 |
| Boîtier | 48-VQFN (RGZ) 7x7 mm |
| Plage de température de fonctionnement | -40 C to +85 C |
| Type de montage | Surface Mount |
| Family | ADC32xx pin-compatible family |
Configuration des broches de ADC3241IRGZ25
| Broche 1 | AVDD — Analog 1.8 V supply |
| Broche 2 | AVDD — Analog 1.8 V supply |
| Broche 3 | VINP_A — Analog input A positive |
| Broche 4 | VINN_A — Analog input A negative |
| Broche 5 | VCM_A — Common-mode voltage A |
| Broche 6 | VBIAS_A — Bias voltage A |
| Broche 7 | AVSS — Analog ground |
| Broche 8 | REF — Internal reference bypass |
| Broche 9 | REFB — Reference bypass |
| Broche 10 | VCM_B — Common-mode voltage B |
| Broche 11 | VBIAS_B — Bias voltage B |
| Broche 12 | VINP_B — Analog input B positive |
| Broche 13 | VINN_B — Analog input B negative |
| Broche 14 | AVDD — Analog 1.8 V supply |
| Broche 15 | AVSS — Analog ground |
| Broche 16 | CLKP — Sampling clock input positive |
| Broche 17 | CLKN — Sampling clock input negative |
| Broche 18 | CLKDIV — Clock divider control |
| Broche 19 | DVDD — Digital 1.8 V supply |
| Broche 20 | DVSS — Digital ground |
| Broche 21 | DOUTP1 — LVDS data output 1 positive |
| Broche 22 | DOUTN1 — LVDS data output 1 negative |
| Broche 23 | DOUTP2 — LVDS data output 2 positive |
| Broche 24 | DOUTN2 — LVDS data output 2 negative |
| Broche 25 | DOUTP3 — LVDS data output 3 positive |
| Broche 26 | DOUTN3 — LVDS data output 3 negative |
| Broche 27 | FRM_P — Frame indicator positive |
| Broche 28 | FRM_N — Frame indicator negative |
| Broche 29 | DOUTP4 — LVDS data output 4 positive |
| Broche 30 | DOUTN4 — LVDS data output 4 negative |
| Broche 31 | DOUTP5 — LVDS data output 5 positive |
| Broche 32 | DOUTN5 — LVDS data output 5 negative |
| Broche 33 | DOUTP6 — LVDS data output 6 positive |
| Broche 34 | DOUTN6 — LVDS data output 6 negative |
| Broche 35 | DVDD — Digital 1.8 V supply |
| Broche 36 | DVSS — Digital ground |
| Broche 37 | SDIO — Serial interface data |
| Broche 38 | SCLK — Serial interface clock |
| Broche 39 | SEN — Serial interface enable |
| Broche 40 | PDN — Power-down control |
| Broche 41 | RESET — Digital reset |
| Broche 42 | NC — Not connected (per datasheet) |
| Broche 43 | NC — Not connected (per datasheet) |
| Broche 44 | NC — Not connected (per datasheet) |
| Broche 45 | AVSS — Analog ground |
| Broche 46 | AVSS — Analog ground |
| Broche 47 | EP — Exposed thermal pad - tie to AVSS |
| Broche 48 | DVDD — Digital 1.8 V supply |
Applications typiques
ADC3241IRGZ25 convient pour 6 applications: Communications Base-Station Receiver, Multi-Carrier Software-Defined Radio, Industrial Imaging and Inspection, Ultrasound Signal Processing, Portable Test and Measurement Instrumentation, Time-of-Flight and LiDAR Digitizer.
Communications Base-Station Receiver
The ADC3241IRGZ25 fits communications base-station receiver signal chains because its 72.4 dBFS SNR at fIN=70 MHz cleanly digitizes IF signals in the 0-30 MHz band while consuming only 116 mW per channel. Two independent analog inputs let one chip handle diversity or dual-polarization paths without a second converter, and the 105 dB channel-to-channel isolation prevents cross-talk between antennas. The 1.8 V single-supply simplifies power-tree design alongside TI's RF front-ends. Placed after the mixer and SAW filter, it captures baseband I/Q with deterministic latency, which is critical for DPD feedback loops in LTE and 5G NR macro cells.
Recommandé
Multi-Carrier Software-Defined Radio
The ADC3241IRGZ25 is well matched to multi-carrier SDR platforms that must digitize bands up to 12 MHz at baseband. Its dual-channel 14-bit pipeline core captures two independent RF chains simultaneously, and the divide-by-1/2/4 clock buffer lets an FPGA drive the sampling clock directly from a 25/50/100 MHz reference. At 116 mW per channel, total power stays low enough for portable or vehicle-mounted SDR enclosures. Compared with 12-bit ADCs, the 14-bit resolution provides 14 dB more ENOB headroom, which is essential for clean SNR in crowded spectral environments.
Recommandé
Industrial Imaging and Inspection
The ADC3241IRGZ25 serves industrial imaging front-ends such as multi-spectral line-scan cameras and quality-inspection CCD readouts. Two independent channels let one chip digitize two adjacent detector arrays, halving the board area compared with two single-channel converters at the same throughput. The 25 MSPS rate captures pixel rates up to 25 million samples per second per channel, supporting 2K and 4K line-scan camera architectures. The 48-VQFN (RGZ) exposed thermal pad provides robust heat dissipation in sealed industrial enclosures where forced-air cooling is not available.
Recommandé
Ultrasound Signal Processing
In ultrasound imaging, the ADC3241IRGZ25 simultaneously digitizes two receiver channels after the TGC (time-gain-compensated) stage at 25 MSPS. The deterministic pipeline latency, fixed channel-to-channel skew, and 105 dB isolation keep beamforming alignment within tight tolerances for accurate image reconstruction. Operating from 1.8 V single supply, it draws only 116 mW per channel, allowing 64-channel carts to operate without aggressive thermal management. The SLVDS interface minimizes digital crosstalk coupling back into the sensitive receive chain, preserving front-end SNR.
Recommandé
Portable Test and Measurement Instrumentation
Handheld oscilloscopes, spectrum analyzers, and digitizers benefit from the ADC3241IRGZ25's dual 14-bit, 25 MSPS throughput in a small 48-VQFN footprint. Designers can digitize two channels of a 10-20 MHz bandwidth scope using only one chip, simplifying layout and reducing BOM cost versus parallel single-channel ADCs. The 72 dBFS SNR supports clean 13-ENOB measurements at the oscilloscope front-end, while the SLVDS output keeps digital switching noise out of the measured signal. Low 1.8 V supply current improves battery run-time in portable instruments.
Recommandé
Time-of-Flight and LiDAR Digitizer
The ADC3241IRGZ25 is a strong fit for time-of-flight and LiDAR digitizers, where each of its two channels can sample a separate return pulse from a paired photodiode/amplifier chain. With 25 MSPS per channel and 14-bit resolution, the ADC captures return-pulse timing and amplitude with sub-pixel detail at reasonable target distances. The deterministic pipeline latency allows tight alignment with the laser emission timing, improving depth-map accuracy. Pair the ADC with a transimpedance front-end and the LVDS outputs feed directly into an FPGA serializer for downstream TOF processing.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ADC3241IRGZ25 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ADC3242IRGZ25 | ADC3243IRGZ25 | ADC3244IRGZ25 | ADC3223IRGZ25 |
|---|---|---|---|---|---|
| Brand | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments | Texas Instruments |
| Package | 48-VQFN (RGZ, 7x7 mm) | 48-VQFN (RGZ, 7x7 mm) - same | 48-VQFN (RGZ, 7x7 mm) - same | 48-VQFN (RGZ, 7x7 mm) - same | 48-VQFN (RGZ, 7x7 mm) - same |
| Resolution | 14 bit | 14 bit | 14 bit | 14 bit | 12 bit |
| Sampling Rate | 25 MSPS | 50 MSPS | 80 MSPS | 125 MSPS | 25 MSPS |
| Channels | 2 | 2 | 2 | 2 | 2 |
| SNR (fIN=70 MHz) | 72.4 dBFS | 72.4 dBFS | 72.4 dBFS | 72 dBFS | 70.6 dBFS |
| SFDR (fIN=70 MHz) | 87 dBc | 87 dBc | 87 dBc | 85 dBc | 85 dBc |
| Power per Channel | 116 mW | 130 mW | 150 mW | 170 mW | 90 mW |
| Supply Voltage | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
Principaux différenciateurs
- Pin-compatible with TI's wider ADC32xx 12-bit and 50/65/80/125-MSPS family (vs ADC3242IRGZ25, ADC3243IRGZ25, ADC3244IRGZ25)
- Lowest cost of the 14-bit ADC32xx family (vs ADC3242IRGZ25, ADC3244IRGZ25)
- Drop-in back-compatibility with the 12-bit ADC32RF45IRGZR family (vs ADC3223IRGZ25, ADC32RF45IRGZR)
Notes de conception
Place 10 uF bulk plus 0.1 uF and 1 nF ceramic decoupling capacitors for each AVDD and DVDD rail as close as possible to the IC pins. The exposed thermal pad must be soldered to a contiguous ground copper pour for both thermal dissipation and AC return path stability. Separate analog and digital ground planes with a single stitching connection directly under the EPAD to minimize return-path currents crossing through sensitive analog traces.
Route the SLVDS DOUT pairs as 100 ohm differential traces, length-matched within 100 mils across all data pairs to maintain deterministic latency. Use guarded differential routing with GND coplanar pours on each side of the pair, and keep the LVDS traces at least 3 line widths away from analog input traces. The CLKP/CLKN clock pair is the most sensitive; treat it with the same 100 ohm controlled-impedance matching used for the data pairs.
Estimated: at fIN = 70 MHz and 25 MSPS, the LVDS edge bandwidth pushes frequency content beyond the 7th harmonic, so use series ferrite beads or common-mode chokes on each LVDS output pair to reduce EMI to downstream FPGAs. Keep the parallel interface bus short and physically isolate from the analog input front-end. The clock jitter budget should be < 0.5 ps RMS to preserve the datasheet SNR performance.
Informations de conformité
RoHS and REACH compliance per TI product page; lead-free 48-VQFN (RGZ) package, not AEC-Q100 qualified for automotive-grade hardware.
