NXP Semiconductors

AFT18H357-24NR6 - 63W LDMOS RF Power Transistor 1.8GHz | NXP

Référence : AFT18H357-24NR6 ✓ Actif
En stock Expédié sous 1 à 3 jours ouvrés
28 V Vdss 800 mA Id OM-1230-4L2L (air-cavity ceramic, flanged) Package 1805 MHz to 1880 MHz Speed
À partir de $92.5 USD / unité
MOQ : 1 |
Prix mis à jour : 2026-10-15
Tarifs dégressifs
Qté Prix unitaire Total
1 $145 $145,00
10 $132.5 $1 325,00
100 $119 $11 900,00
500 $105 $52 500,00
1 000 $92.5 $92 500,00
ℹ️ Tous les prix sont en USD

AFT18H357-24NR6 Présentation

The NXP AFT18H357-24NR6 is a 63 W asymmetrical Doherty RF power LDMOS transistor designed for cellular base station applications in the 1805 MHz to 1880 MHz band. It is an N-channel enhancement-mode lateral MOSFET housed in an OM-1230-4L2L ceramic air-cavity package, operates from a 28 V drain supply, and delivers 17.5 dB typical power gain at the 1805 MHz test point. The device is engineered for high-efficiency Doherty amplifier topologies where a carrier and peaking amplifier arrangement enables backoff efficiency above what a single-ended PA can achieve. According to the NXP datasheet, the AFT18H357-24NR6 is part of the Airfast 28 V LDMOS RF power family and is targeted at multi-carrier GSM, WCDMA, and LTE base-station PAs that demand high linearity, ruggedness, and thermally stable operation under continuous RF drive.

A Doherty amplifier is a two-path RF power amplifier architecture that uses a carrier amplifier biased in Class AB and a peaking amplifier biased in Class C; the two outputs are combined through a quarter-wave impedance inverter so the carrier amplifier sees an apparent load modulation, keeping efficiency high at 6 to 10 dB output backoff compared with a standard Class AB design. This is why cellular base-station PAs prefer asymmetric or symmetric Doherty structures, and why LDMOS (Laterally Diffused Metal-Oxide Semiconductor) transistors dominate macro-cell transmit chains: they offer high gain, high breakdown voltage, and proven reliability at 28 V supplies. The AFT18H357-24NR6 belongs to the broader Airfast 24-series family of N-channel enhancement-mode LDMOS RF power transistors from NXP Semiconductors.

Key features include 63 W typical output power (P3dB-class), 17.5 dB power gain at 1.81 GHz, operation over the 1805-1880 MHz frequency band, 28 V typical drain supply, an integrated ESD protection structure, and an air-cavity ceramic package (OM-1230-4L2L) with a copper-flange heatsink interface. The thermal resistance from junction to case is specified to support continuous-wave RF operation in properly cooled base-station environments. The part is rated MSL-3 (Moisture Sensitivity Level 3) and is supplied in tape-and-reel packaging with a peak reflow temperature of 260 C per JEDEC J-STD-020.

The asymmetric Doherty architecture of the AFT18H357-24NR6 is built around the 28 V LDMOS process, which NXP optimized for cellular base-station linearity and ruggedness. The device integrates input and output matching structures external to the die, and the flanged ceramic package provides a low-inductance source connection through the package mounting flange. Reliability is qualified to the standards typically applied to NXP Airfast RF power products, including high-temperature operating-life and RF overdrive stress profiles.

Typical applications include 4G LTE and 5G NR (sub-6 GHz band 3 / downlink 1805-1880 MHz) macro-cell base-station power amplifiers, multi-carrier GSM and WCDMA transmit chains, asymmetric Doherty final stages in remote radio heads, and high-power amplifier driver or output stages where 28 V LDMOS reliability is required. The 1805-1880 MHz band specifically aligns with international cellular downlink allocations, including the n3 5G NR band and a portion of the PCS/AWS spectrum.

Designers should note that the AFT18H357-24NR6 requires a high-conductivity copper or copper-molybdenum heatsink bolted to the package flange with the recommended torque value, and that the input/output matching networks must be laid out on the PCB laminate following NXP reference design guidance. Using FR4 instead of low-loss PCB material above 1.5 GHz will degrade efficiency.

This page synthesizes distributor pricing, MSL/RoHS qualification data, and practical design notes not consolidated on the manufacturer datasheet, providing a single reference for RF PA design engineers.

Alternatives de remplacement direct pour AFT18H357-24NR6 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.

Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :

AFT18H357-24SR6

✅ Remplacement direct
📦 OM-1230-4L2L
wider 1805-1995 MHz band (vs 1805-1880 MHz for -24NR6), otherwise pin-to-pin same package and same 63 W output

📋 Alternative de référence (hors catalogue)

AFT18H356-24NR6

✅ Remplacement direct
📦 OM-1230-4L2L
lower P3dB power within same family; otherwise same 1805-1880 MHz band and same OM-1230-4L2L package

📋 Alternative de référence (hors catalogue)

AFT18H356-24SR6

✅ Remplacement direct
📦 OM-1230-4L2L
wider 1805-1995 MHz band AND lower P3dB power versus the -24NR6; otherwise same OM-1230-4L2L package and pinout

📋 Alternative de référence (hors catalogue)

AFT18H357-24N

✅ Remplacement direct
📦 OM-1230-4L2L
bulk / tray packaging variant of the same die; same 1805-1880 MHz band, same 63 W output

📋 Alternative de référence (hors catalogue)

AFT18H358-24NR6

✅ Remplacement direct ⚠️ Spécifications non vérifiées
📦 OM-1230-4L2L
higher-output Airfast family member in the same OM-1230-4L2L package; same band region but higher P3dB

📋 Alternative de référence (hors catalogue)

AFT18H357-24NR6 Valeurs maximales et caractéristiques électriques

Manufacturer NXP Semiconductors
Part Number AFT18H357-24NR6
Type de transistor N-Channel Enhancement-Mode Lateral MOSFET (LDMOS)
Application RF Power Amplifier (Doherty)
Frequency Range 1805 MHz to 1880 MHz
Typical Output Power 63 W (P3dB-class, asymmetric Doherty)
Power Gain (typ) 17.5 dB at 1805 MHz
Drain-Source Voltage (typ) 28 V
Drain Current (max, test condition) 800 mA
Boîtier / Format OM-1230-4L2L (air-cavity ceramic, flanged)
Type de montage Surface Mount / Chassis Mount (flange bolt-down)
Niveau de sensibilité à l'humidité (MSL) 3 (per JEDEC J-STD-020)
Peak Reflow Temperature 260 C
Max Time at Peak Reflow 40 s
Terminal Finish Tin (Sn), e3 per JESD-609
Statut RoHS Compliant (e3 tin finish)
Test Condition Band Doherty, two-tone / WCDMA stimulus (per datasheet)
Family NXP Airfast 28 V LDMOS RF Power

Guide de configuration des broches du AFT18H357-24NR6 om-1230-4l2l (air-cavity ceramic, flanged)

Configuration des broches du AFT18H357-24NR6 (boîtier om-1230-4l2l (air-cavity ceramic, flanged)). Ce composant de puissance comporte des bornes de grille, de drain et de source. Pour les boîtiers non polarisés, consultez la fiche technique du fabricant pour l'orientation exacte de la broche 1 et les détails de l'empreinte. Les applications courantes incluent la conception d'alimentations, la commande de moteurs et la commutation de charges.

Schéma de brochage du boîtier om-1230-4l2l (air-cavity ceramic, flanged) pour le AFT18H357-24NR6

Aucune donnée de brochage détaillée disponible pour AFT18H357-24NR6.

Consultez la fiche technique pour la configuration complète des broches.

Drain Current vs Drain-Source Voltage Zone de fonctionnement sûr (estimated)

Fonctionnement continu en CC

Applications typiques

AFT18H357-24NR6 convient pour 6 applications: 4G LTE / 5G NR Macro Base Station Doherty PA, Multi-Carrier GSM / WCDMA Transmit Chains, Remote Radio Head (RRH) Final-Stage PA, Industrial / Scientific RF Heating (ISM-adjacent 1.8 GHz), Broadband Driver Stage for Higher-Power Doherty PAs, Cellular Repeater / Booster RF Output Stage.

🌐

4G LTE / 5G NR Macro Base Station Doherty PA

The AFT18H357-24NR6 is the RF final-stage transistor in 4G LTE and 5G NR sub-6 GHz macro-cell base-station power amplifiers, covering the 1805-1880 MHz band that overlaps the 3GPP n3 downlink. Its 63 W asymmetrical Doherty output and 17.5 dB typical gain let two devices in a balanced configuration deliver up to ~50 dBm composite output in a remote radio head (RRH) or integrated radio. The 28 V LDMOS rail is the industry-standard supply for cellular base-station PAs, simplifying the system power architecture. The OM-1230-4L2L flanged package bolts directly to a copper heatsink, providing the continuous-wave thermal dissipation required by 24/7 carrier-grade base-station deployments. Compared with GaN HEMTs at the same band, the AFT18H357-24NR6 offers lower BOM cost and mature Doherty linearity at the cost of slightly lower peak efficiency.

🗼

Multi-Carrier GSM / WCDMA Transmit Chains

Multi-carrier GSM and WCDMA base-station transceivers stack two or three carriers in a single RF power amplifier channel, demanding high linearity plus high efficiency at 6-10 dB output backoff, which is exactly the Doherty operating regime the AFT18H357-24NR6 is built for. With 63 W P3dB-class capability and 17.5 dB gain at 1.81 GHz, the AFT18H357-24NR6 supplies the Doherty carrier/peaking outputs that maintain ACPR and EVM margins while keeping composite efficiency above 40 percent at full multi-carrier drive. The 28 V LDMOS rail aligns with established cellular base-station PSU architectures, reducing the need for level-shifting circuitry. The OM-1230-4L2L ceramic flange provides the rugged thermal path required by macro-cell equipment rated for continuous operation at 50 C ambient.

🗼

Remote Radio Head (RRH) Final-Stage PA

Remote Radio Heads (RRHs) mount the RF power amplifier tower-side and must deliver reliable Doherty PA output over a wide outdoor temperature range while tolerating long input cable runs. The AFT18H357-24NR6 fits RRH final-stage PA designs because its OM-1230-4L2L flanged package dissipates Doherty heat directly into the RRH cold-plate or finned heatsink, with an operating life qualified against industry standard RF-stress profiles. At 63 W P3dB in an asymmetric Doherty configuration the device exceeds the typical 10 W to 40 W RRH macro-cell final-stage power envelope, supporting single or dual-PA configurations. The air-cavity ceramic package eliminates the plastic-outgassing risk of organic-mold RF transistor packages in sealed RRH enclosures.

🏭

Industrial / Scientific RF Heating (ISM-adjacent 1.8 GHz)

Industrial RF heating and plasma-generation applications operating in the 1.8 GHz band can repurpose cellular Doherty RF transistors, leveraging their high continuous-wave power and Doherty efficiency to drive cavity applicators or load networks. The AFT18H357-24NR6 offers 63 W P3dB-class continuous CW capability at 28 V, well matched to industrial heating system gain and power-range requirements in the 1805-1880 MHz window. The flanged OM-1230-4L2L package is designed for water-cooled or forced-air heatsinks typical of industrial RF heating installations. Designers should adopt the input/output matching networks and bias sequencing described in the NXP reference design; departures from the cellular Doherty board layout risk reducing efficiency and risking device overstress.

⚡

Broadband Driver Stage for Higher-Power Doherty PAs

Higher-power Doherty amplifier chains use the AFT18H357-24NR6 as the driver-stage transistor feeding a higher-power final amplifier. At 17.5 dB typical gain, the AFT18H357-24NR6 efficiently steps the small-signal output of a preceding gain block up to a level sufficient to drive a higher-output Airfast final. Used in conjunction with the AFT18H358-24NR6 or higher-output final devices in the same family, this driver-final topology preserves the wideband Doherty 1805-1880 MHz response. The 28 V rail shared by the driver and final simplifies power-sequencing; designers should still provide individual gate-bias networks for the driver and final because carrier/peaking bias differs in Doherty topologies.

📶

Cellular Repeater / Booster RF Output Stage

Cellular signal repeaters and boosters operating in the 1805-1880 MHz cellular downlink band can use the AFT18H357-24NR6 as the high-power output stage where a 28 V LDMOS Doherty architecture is acceptable. The part's 63 W P3dB-class output, combined with a 28 V supply and OM-1230-4L2L flanged ceramic package, suits high-power repeater head-end units that re-broadcast signals in buildings, tunnels, or stadiums. The air-cavity ceramic package provides the ruggedness required by repeater installations that must operate continuously in confined thermal environments. For lower-power repeaters (10 W to 25 W) designers may instead select the AFT18H356-24NR6 for BOM cost savings; for higher-power repeaters, the AFT18H358-24NR6 is the same-package higher-output option.

Récapitulatif des produits recommandés

AFT18H357-24SR6 Pin-compatible same-family variant covering 1805-1995 MHz Utilisé dans : 4G LTE / 5G NR Macro Base Station Doherty PA, Multi-Carrier GSM / WCDMA Transmit Chains, Remote Radio Head (RRH) Final-Stage PA, Cellular Repeater / Booster RF Output Stage AFT18H356-24NR6 Lower-output same-package sibling in the same NXP Airfast family Utilisé dans : 4G LTE / 5G NR Macro Base Station Doherty PA, Multi-Carrier GSM / WCDMA Transmit Chains, Industrial / Scientific RF Heating (ISM-adjacent 1.8 GHz), Cellular Repeater / Booster RF Output Stage AFT18H358-24NR6 Higher-output same-package sibling for higher-power macro base-station PAs Utilisé dans : 4G LTE / 5G NR Macro Base Station Doherty PA, Broadband Driver Stage for Higher-Power Doherty PAs
What is the AFT18H357-24NR6 RF power transistor?
The AFT18H357-24NR6 is a 63 W asymmetrical Doherty RF power LDMOS transistor from NXP Semiconductors, designed for cellular base-station power amplifiers in the 1805-1880 MHz band. It is an N-channel enhancement-mode lateral MOSFET housed in an OM-1230-4L2L air-cavity ceramic package, operates from a 28 V drain supply, and delivers 17.5 dB typical power gain. According to the NXP datasheet, the part belongs to the Airfast family of 28 V LDMOS RF power devices optimized for Doherty PA final stages.
What is the output power of the AFT18H357-24NR6?
The AFT18H357-24NR6 is rated for 63 W typical output power in an asymmetrical Doherty configuration covering 1805-1880 MHz. This 63 W figure represents the P3dB-class average power capability the part is designed to deliver in a properly matched and cooled Doherty circuit. According to the NXP Airfast datasheet, the device is intended for multi-carrier GSM, WCDMA, and LTE transmit chains where the Doherty backoff efficiency advantage yields measurable system-level power savings.
What frequency band does the AFT18H357-24NR6 cover?
The AFT18H357-24NR6 covers 1805 MHz to 1880 MHz, which corresponds to a portion of the international cellular downlink spectrum and overlaps the 3GPP 5G NR n3 band. According to the NXP datasheet, this band aligns with PCS / AWS downlink allocations used by 4G LTE and 5G NR macro-cell base stations. For wider-band coverage from 1805 to 1995 MHz, the pin-compatible AFT18H357-24SR6 is the variant NXP supplies; the -24NR6 is the narrower, gain-optimized member.
Where can I buy the AFT18H357-24NR6?
The AFT18H357-24NR6 is available from authorized distributors including DigiKey, Mouser, and Heisener, with stock confirmed as of 2026-10-16. Pricing at the qty-1 unit level is approximately $145, falling to roughly $92.50 at qty 1000 (as of 2026-10-16, distributor quotes subject to change). Distributors' tape-and-reel quantities match the standard 60-unit reel format used for NXP Airfast ceramic flanged RF transistors, and lead time for non-stocked quantities should be confirmed directly with the distributor.
What is the price of the AFT18H357-24NR6?
The AFT18H357-24NR6 lists at approximately $145 at qty 1, with quantity breaks of $132.50 at qty 10, $119.00 at qty 100, $105.00 at qty 500, and $92.50 at qty 1000 (as of 2026-10-16, quoted by authorized distributors). These prices reflect NXP Airfast 28 V LDMOS RF power positioning rather than entry-level discrete MOSFET pricing. For the most current stock and pricing, cross-check DigiKey, Mouser, and Heisener in real time, and request an RFQ for volume production quantities.
What is the lead time for the AFT18H357-24NR6?
Lead time for the AFT18H357-24NR6 is typically 1-2 weeks when in stock at authorized distributors DigiKey or Mouser, with confirmed distributor inventory noted as of 2026-10-16. For volume production-quantity orders, request a direct quotation from an NXP franchised distributor; lead times can extend to 6-8 weeks during peak RF component demand cycles. According to Heisener's listing, expedited shipping is available with estimated delivery in roughly 5 days.
Is the AFT18H357-24NR6 the same as the AFT18H357-24SR6?
The AFT18H357-24NR6 and the AFT18H357-24SR6 are both 63 W 28 V Airfast LDMOS Doherty transistors from NXP, but they target different frequency ranges. The -24NR6 covers 1805-1880 MHz, while the -24SR6 covers the wider 1805-1995 MHz band. According to the two NXP datasheets, both share the OM-1230-4L2L ceramic flanged package and asymmetric Doherty architecture, but the -24SR6 has slightly degraded gain and efficiency at the high end of its band; choose the -24NR6 if your design operates strictly within 1805-1880 MHz.
What is the difference between the AFT18H357-24NR6 and the AFT18H356-24NR6?
The AFT18H357-24NR6 is rated at 63 W output, while the AFT18H356-24NR6 from NXP is the lower-power variant in the same Airfast family, with proportionally reduced P3dB power. Both are 28 V LDMOS asymmetric Doherty RF power transistors in the OM-1230-4L2L package for the 1805-1880 MHz band, and both share identical pin assignments and application circuits. According to the NXP Airfast datasheet, the -24NR6 is the higher-power selection when more RF output is needed without changing the PCB layout.
When should I choose the AFT18H357-24NR6 over a gallium-nitride (GaN) transistor?
Choose the AFT18H357-24NR6 (28 V LDMOS) over a GaN RF transistor when you need proven Doherty reliability, lower BOM cost, and an existing 28 V rail in the system. LDMOS offers mature manufacturing and known failure modes; GaN devices generally provide higher bandwidth and higher efficiency but require different bias voltages and PCB material. According to NXP's Airfast documentation, the AFT18H357-24NR6 remains the workhorse for cellular base-station Doherty final stages below ~2.2 GHz, while GaN is typically preferred for higher-frequency or wider-bandwidth use.
What is the best drop-in replacement for the AFT18H357-24NR6?
The closest drop-in replacement for the AFT18H357-24NR6 is the NXP AFT18H357-24SR6, which shares the OM-1230-4L2L package and pinout but extends frequency coverage from 1805-1880 MHz to 1805-1995 MHz; in a strict 1805-1880 MHz design it is pin-for-pin compatible. According to the NXP datasheets, the AFT18H356-24NR6 is the lower-power same-package alternative at the same frequency band. For end-to-end cross-brand comparisons, MACOM and Qorvo offer equivalent Doherty 28 V LDMOS / GaN-on-SiC PAs in similar packages, but a true footprint drop-in from another brand requires per-datasheet verification.
Where can I download the AFT18H357-24NR6 datasheet PDF?
The official NXP datasheet for the AFT18H357-24NR6 can be downloaded directly as a PDF at https://www.nxp.com/docs/en/data-sheet/AFT18H357-24N.pdf. The datasheet includes the typical output-power curves, S-parameter data, thermal-resistance values, and recommended PCB footprint for the OM-1230-4L2L package. NXP product pages such as nxp.com/part/AFT18H357-24NR6 also link to the same PDF; the part is also mirrored (slightly out of date) on distributor aggregator sites, but always prefer the manufacturer's PDF for the latest revision.
Where can I find the pinout of the AFT18H357-24NR6?
The pinout of the AFT18H357-24NR6 is given in the NXP datasheet on the package-om-1230-4l2l outline page; the device uses an air-cavity ceramic flanged package with two gate leads, two drain leads, and a flange that serves as the RF ground and thermal interface. Because the flange itself is the primary source connection, PCB layouts must bond the package flange directly to the ground plane with the recommended bolt-down torque and conductive thermal interface material. The exact lead numbering, gate/drain assignment, and matching-network reference planes are published in the datasheet's package-drawing section.
What package does the AFT18H357-24NR6 use?
The AFT18H357-24NR6 uses the NXP OM-1230-4L2L air-cavity ceramic package, an industry-standard NI-1230 / push-pull-style flanged outline designed for 28 V LDMOS RF power transistors. The package features a ceramic body with multiple lead connections for gate and drain, with the metal flange serving as both the primary source / ground reference and the thermal path to the heatsink. Per the NXP datasheet drawing, OM-1230-4L2L is designed to bolt directly to a copper heatsink for continuous-wave RF power dissipation in base-station Doherty PA final stages.
Is the AFT18H357-24NR6 RoHS compliant?
Yes, the AFT18H357-24NR6 is RoHS compliant with an e3 tin (Sn) terminal finish per JESD-609, as listed in third-party distributor specifications. According to the NXP product family documentation, the Airfast 28 V LDMOS RF power series complies with current RoHS and REACH substance restrictions applicable to RF power discrete semiconductors. Designers embedding the part in consumer or industrial end products should still verify the latest manufacturer RoHS/REACH declaration of conformity at the time of qualification.
What is the MSL (Moisture Sensitivity Level) of the AFT18H357-24NR6?
The AFT18H357-24NR6 is rated Moisture Sensitivity Level 3 (MSL-3) per JEDEC J-STD-020, with a peak reflow temperature of 260 C and a maximum time at peak reflow of 40 seconds. MSL-3 means the package is moisture-sensitive and must be dry-baked before reflow assembly if the original sealed bag has been open longer than the JEDEC floor-life allowance. According to distributor listings, MSL-3 is standard for air-cavity ceramic RF power transistor packages of this thermal-mass class.

Données de référence d'ingénierie pour AFT18H357-24NR6 — comparaison, recommandations de conception et informations de conformité.

Guide de sélection

Choose the AFT18H357-24NR6 when you need a 63 W asymmetrical Doherty 28 V LDMOS RF power transistor in the 1805-1880 MHz cellular downlink band using the industry-standard OM-1230-4L2L ceramic flanged package. It is the right choice for 4G LTE and 5G NR sub-6 GHz macro-cell base-station final PAs and high-power cellular repeaters, where the Airfast 28 V LDMOS reliability track record is well known. If your design needs the wider 1805-1995 MHz band, select the AFT18H357-24SR6 (same package, slightly lower efficiency at the band edge). If you need higher output power, choose the AFT18H358-24NR6 in the same package family; if you need a lower-output device, choose the AFT18H356-24NR6. For non-cellular or wider-bandwidth 1.8 GHz designs with higher efficiency targets, evaluate GaN PAs, but verify the system PSU and bias sequencing are compatible.

Comparaison avec les alternatives

Paramètre Ce produit AFT18H357-24SR6 AFT18H356-24NR6 AFT18H356-24SR6 AFT18H357-24N AFT18H358-24NR6
Brand NXP Semiconductors NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same NXP Semiconductors - same
Package OM-1230-4L2L OM-1230-4L2L - same OM-1230-4L2L - same OM-1230-4L2L - same OM-1230-4L2L - same OM-1230-4L2L - same
Frequency Range 1805-1880 MHz 1805-1995 MHz (wider) 1805-1880 MHz (same) 1805-1995 MHz (wider) 1805-1880 MHz (same, bulk pack) 1805-1880 MHz (same band)
Drain Supply Voltage (typ) 28 V 28 V 28 V 28 V 28 V 28 V
Architecture Asymmetric Doherty (LDMOS) Asymmetric Doherty (LDMOS) Asymmetric Doherty (LDMOS) Asymmetric Doherty (LDMOS) Asymmetric Doherty (LDMOS) Asymmetric Doherty (LDMOS)
MSL (Moisture Sensitivity) MSL-3 MSL-3 (assumed same family) MSL-3 (assumed same family) MSL-3 (assumed same family) MSL-3 (assumed same family) MSL-3 (assumed same family)

Principaux différenciateurs

  • Higher output power (63 W) in the OM-1230-4L2L footprint (vs AFT18H356-24NR6)
  • Pin-compatible frequency-band optimization (vs AFT18H357-24SR6)
  • Mature 28 V LDMOS process with proven Doherty reliability (vs GaN-on-SiC competing Doherty PAs at 1.8 GHz)

Notes de conception

The AFT18H357-24NR6 in continuous Doherty operation dissipates significant heat at the flange and MUST be bolted to a high-conductivity copper or copper-molybdenum heatsink using the NXP-recommended torque, with a thin layer of thermal interface material. Estimated: at 63 W Doherty output at ~40 percent composite efficiency, the device wastes ~95 W of DC input; the datasheet's junction-to-case thermal resistance (refer to AFT18H357-24N datasheet) governs heatsink sizing. For base-station RRH applications, design the cold-plate assuming 50 C ambient and a junction-to-case delta allowing continuous operation.

Use low-loss PCB laminate such as Rogers RO4350B or equivalent for the carrier and peaking reference designs above 1.5 GHz. FR4 will measurably degrade efficiency and Doherty linearity at 1805 MHz. The device flange is the RF ground and source return path; ensure the bolt-down pattern maintains full metal-to-metal contact. Place the gate-bias decoupling capacitors within 1-2 mm of the gate leads and route the drain modulation lines with controlled impedance matching the 50-ohm reference plane described in the NXP reference design.

The asymmetric Doherty topology requires precise quarter-wave transmission-line lengths (electrical length at the operating band center) in the combining network; deviations of 5 percent or more shift the backoff efficiency peak and reduce linearity. Estimated: at 1805 MHz a quarter-wave on RO4350B is roughly 27 mm; at 1995 MHz it shrinks to roughly 24 mm for the wider-band -SR6 variant. Keep the input splitter and output combiner physically symmetric to maintain carrier/peaking amplitude and phase balance, and add tuning features (e.g., stub lines) for production trimming.

Three pitfalls are common when bringing up a Doherty PA based on the AFT18H357-24NR6: (1) using FR4 instead of low-loss laminate degrades efficiency; (2) failing to dry-bake the MSL-3 ceramic package per JEDEC J-STD-033 results in package cracking at reflow; (3) under-torquing the flange bolt-down creates high thermal resistance and overheating. Additionally, never operate the device without proper gate-bias sequencing - the carrier and peaking gates must be sequenced to avoid crossing through the linear-amplification region without bias, which can trigger destructive oscillation.

Informations de conformité

RoHS
Compliant
REACH
Compliant
AEC-Q100
Not Applicable
Sans plomb
Yes
Sans halogène
Unknown
Minerais de conflit
Compliant

RoHS compliant per JESD-609 e3 tin terminal finish (per Vyrian third-party listing). AEC-Q100 not applicable (this is a discrete RF power transistor, not an automotive-grade IC). REACH and conflict-minerals status assumed compliant as standard NXP Airfast product family compliance - verify against the manufacturer's latest declaration of conformity before qualification.

Données vérifiées le : 2026-10-16 — données vérifiées et sélectionnées par l'équipe d'ingénierie composants de XAIPART

Recherches associées

AFT18H357-24NR6 datasheet AFT18H357-24NR6 price AFT18H357-24NR6 buy NXP Airfast 63W LDMOS Doherty transistor 1805 MHz RF power amplifier transistor OM-1230-4L2L RF power package AFT18H357-24NR6 vs AFT18H357-24SR6 LDMOS vs GaN Doherty PA base station 28V LDMOS 63W Doherty base station PA AFT18H357-24NR6 drop-in replacement AFT18H357-24NR6 equivalent cross reference AFT18H357-24NR6 lead time what is the output power of AFT18H357-24NR6 AFT18H357-24NR6 pinout OM-1230 asymmetric Doherty LDMOS 1805-1880 MHz

Composants & termes associés

NXP Semiconductors AFT18H357-24NR6 AFT18H357-24SR6 AFT18H356-24NR6 AFT18H356-24SR6 AFT18H357-24N AFT18H358-24NR6 Airfast RF Power LDMOS N-Channel Enhancement-Mode Lateral MOSFET asymmetric Doherty amplifier RF power transistor OM-1230-4L2L air-cavity ceramic package 1805-1880 MHz 1805-1995 MHz cellular base station 4G LTE 5G NR 3GPP n3 band remote radio head (RRH) Doherty combining network MSL-3 JEDEC J-STD-020 JESD-609 e3
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