ATSAM3SD8BA-MUR - 512KB Flash Cortex-M3 MCU 64MHz | Microchip
Référence : ATSAM3SD8BA-MUR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.2 | $6,20 |
| 10 | $5.58 | $55,80 |
| 100 | $4.95 | $495,00 |
| 500 | $4.45 | $2 225,00 |
| 1 000 | $3.98 | $3 980,00 |
ATSAM3SD8BA-MUR Présentation
A 32-bit microcontroller (MCU) is an integrated circuit that combines a processor core, memory, and peripherals on a single chip, executing embedded control and connectivity tasks. Within the product hierarchy, the ATSAM3SD8BA-MUR belongs to the ARM Cortex-M3 core family of microcontrollers, which sits under 32-bit MCUs, under the broader microcontroller semiconductor category. The SAM3S series is Atmel/Microchip's general-purpose flash MCU line optimized for cost-sensitive industrial and consumer designs that need a balance of performance, memory, and peripheral integration.
Key features of the ATSAM3SD8BA-MUR include the 64 MHz Cortex-M3 RISC processor with nested vectored interrupt controller, 512KB of on-chip flash for program storage, a rich peripheral set typical of the SAM3S family (USART, SPI, TWI/I2C, PWM, ADC, and USB device connectivity per the SAM3SD8 family definition), industrial temperature grade operation, and green/RoHS packaging marked MRL A per distributor listings.
The SAM3SD8 variant integrates a dedicated USB device port, making it distinct within the SAM3S family for applications requiring USB connectivity without an external USB controller. The Cortex-M3 architecture provides deterministic interrupt latency and Thumb-2 instruction efficiency, enabling compact code in the 512KB flash while delivering real-time responsiveness for control loops.
Typical applications include industrial control and automation nodes, consumer appliances with USB interfaces, PC peripherals and accessories, battery-powered instrumentation, and building automation sensors where 64 MHz performance and 512KB code capacity are appropriate.
Design consideration: the exposed-pad QFN package requires a well-defined thermal via array and solid ground connection on the PCB land pattern; verify supply voltage options (1.8V/2.5V/3.3V per family documentation) against your power tree before layout.
This page synthesizes verified distributor data, drop-in same-package alternatives, and practical design guidance not consolidated in the manufacturer datasheet, providing engineers and buyers a single citable reference for the ATSAM3SD8BA-MUR.
Alternatives de remplacement direct pour ATSAM3SD8BA-MUR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM3SD8BA-MUR (même facteur de forme et même empreinte) — différant par RoHS Status, Package, Supply Voltage, Temperature Grade, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM3SD8BA-MU
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →ATSAM3S8BA-MUR
✅ Remplacement direct✓ En stock
$5.15 / unité
Voir la fiche technique →ATSAM3N4BA-MU
✅ Remplacement direct✓ En stock
$3.48 / unité
Voir la fiche technique →ATSAM3SD8BA-MUR Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Fréquence d'horloge maximale | 64 MHz |
| Flash Memory Size | 512KB (512K x 8) |
| Program Memory Type | FLASH |
| Series | SAM3S (SAM3SD8) |
| Tension d'alimentation | 1.8V / 2.5V / 3.3V (family options) |
| Boîtier | 64-VFQFN Exposed Pad, 9x9 mm |
| Nombre de broches | 64 |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Temperature Grade | Industrial (IND TEMP) |
| Packaging Option | QFN, Green, MRL A |
| Statut RoHS | Compliant (Green) |
| USB | USB device (SAM3SD8 family feature) |
Guide de configuration des broches du ATSAM3SD8BA-MUR 64-vfqfn exposed pad, 9x9 mm
Configuration des broches du ATSAM3SD8BA-MUR (boîtier 64-vfqfn exposed pad, 9x9 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAM3SD8BA-MUR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAM3SD8BA-MUR convient pour 6 applications: Industrial Control and Automation, USB Peripherals and PC Accessories, Consumer Appliances, Building Automation and Smart Sensors, Portable and Battery-Powered Instrumentation, Embedded Networking Nodes.
Industrial Control and Automation
The ATSAM3SD8BA-MUR fits industrial control nodes where deterministic real-time response matters: the 64 MHz ARM Cortex-M3 core with nested vectored interrupt controller delivers predictable interrupt latency for control loops, while 512KB flash holds protocol stacks and application logic without external memory. Its industrial temperature rating (-40C to +85C) and green QFN packaging (MRL A per Mouser data) suit factory-floor environments. Typical circuits place the MCU as a field-bus or sensor-aggregation controller, using USART/SPI/TWI peripherals for module interconnect. The exposed-pad 9x9 mm QFN requires a grounded via array for thermal robustness, but saves board area versus leaded packages in dense I/O modules.
Recommandé
USB Peripherals and PC Accessories
The SAM3SD8 sub-family exists specifically to add a dedicated USB device controller to the SAM3S platform, making the ATSAM3SD8BA-MUR a natural fit for PC peripherals, HID devices, instrument front ends, and appliance interfaces that must enumerate as USB devices. At 64 MHz, the Cortex-M3 core comfortably services USB interrupt traffic in firmware while running the main application, and 512KB flash accommodates a USB stack plus feature-rich firmware. Designs typically connect the USB D+/D- lines directly to the device pins with appropriate series termination. Compared with a discrete USB interface chip plus MCU, the integrated solution reduces BOM count, board area, and firmware complexity.
Recommandé
Consumer Appliances
Appliance control panels, motor-drive user interfaces, and connected home devices benefit from the ATSAM3SD8BA-MUR's combination of 64 MHz processing, 512KB code space for graphical or multi-language UI firmware, and USB connectivity for servicing and configuration. The 1.8V/2.5V/3.3V family supply options allow direct interfacing with common appliance logic rails. The 64-pin 9x9 mm QFN exposed-pad package keeps the controller compact on two-layer or four-layer consumer PCBs, with the exposed pad providing a low-inductance ground return that helps EMC compliance in mains-powered products. Industrial-grade silicon margins also improve field reliability versus consumer-only MCU grades.
Recommandé
Building Automation and Smart Sensors
Networked building sensors - occupancy, environmental, and HVAC zone controllers - need MCU performance for protocol handling and enough flash for OTA-ready firmware images, which the ATSAM3SD8BA-MUR provides with 512KB. The SAM3SD8 USB device port doubles as a convenient commissioning and service interface alongside the primary RS-485/TWI sensor bus implemented on USART/TWI peripherals. Its -40C to +85C industrial rating covers rooftop and mechanical-room installations. The 64 MHz Cortex-M3 core leaves ample headroom for encryption or sensor-fusion routines, and the QFN exposed pad anchors a solid ground plane that reduces EMI in long unshielded sensor wiring environments.
Recommandé
Portable and Battery-Powered Instrumentation
Handheld meters, dataloggers, and portable test instruments leverage the ATSAM3SD8BA-MUR's 64 MHz core for signal processing and display updates while the SAM3S family's low-power modes extend battery life between charges. The 1.8V supply option allows operation from a single lithium cell via a boost regulator, and the USB device port enables straightforward data offload to a PC without a dedicated bridge IC. The 512KB flash stores calibration tables, logging buffers, and UI firmware simultaneously. Board designers value the 9x9 mm QFN footprint for fitting the controller and display interface on compact instrument PCBs.
Recommandé
Embedded Networking Nodes
Protocol gateways and embedded communication nodes use the ATSAM3SD8BA-MUR's multiple USART, SPI, and TWI interfaces to bridge field buses with USB or supervisory links. The 64 MHz Cortex-M3 delivers the throughput needed for framed protocol processing with CRC and buffering, while 512KB flash supports dual-image firmware for safe field updates. The industrial temperature grade and green RoHS packaging (MRL A) satisfy typical integration and compliance requirements for networked equipment. Firmware teams benefit from the mature SAM3S ecosystem, including Microchip's Atmel Studio/Studio 7 toolchain and extensive application notes for the SAM3S peripheral set.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM3SD8BA-MUR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM3SD8BA-MU | ATSAM3S8BA-MUR | ATSAM3N4BA-MU |
|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) Exposed Pad | 64-VQFN (9x9 mm) Exposed Pad - same | 64-VQFN (9x9 mm) Exposed Pad - same | 64-VQFN (9x9 mm) Exposed Pad - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit | ARM Cortex-M3, 32-bit |
| Max Clock Frequency | 64 MHz | 64 MHz | 64 MHz | 64 MHz |
| Flash Memory | 512KB | 512KB | 512KB | 512KB-class |
| USB Device Controller | Yes (SAM3SD8 dedicated USB device) | Yes (same) | Yes (SAM3S8B configuration) | No |
| Power Profile | Standard SAM3S power modes | Standard SAM3S power modes | Standard SAM3S power modes | Lower-power SAM3N optimization |
| Temperature Grade | Industrial (-40C to +85C) | Industrial | Industrial | Industrial |
| Packing Format | Tape & Reel (R suffix) | Tray (no R suffix) | Tape & Reel | Tray |
Principaux différenciateurs
- Dedicated USB device controller in SAM3S platform (vs ATSAM3N4BA-MU)
- Identical silicon availability in tray format (vs ATSAM3SD8BA-MU)
- Same footprint with alternate USB configuration (vs ATSAM3S8BA-MUR)
Notes de conception
The 64-pin VQFN 9x9 mm package has an exposed pad on the underside that must be connected to the PCB ground plane through an array of thermal vias (typically a 3x3 or 4x4 via pattern under the pad). Use an NSMD (non-solder-mask-defined) land pattern with via-in-pastepartial or reduced stencil aperture (approximately 50-70% coverage) on the center pad to prevent excessive solder wicking that lifts the perimeter pins. Follow the Microchip SAM3S hardware design guidelines for the recommended footprint dimensions before release to fabrication.
The SAM3S family supports multiple supply configurations (1.8V, 2.5V, 3.3V options per distributor data). Verify the VDDCORE versus VDDIO architecture and any internal regulator requirements for your chosen voltage in the SAM3S datasheet, and place 100 nF ceramic decoupling capacitors at each supply pin pair plus bulk capacitance near the regulator. Confirm that the maximum 64 MHz operating frequency is valid at the selected supply voltage - some family datasheets apply frequency derating at the lowest voltage options. Power-supply sequencing requirements must also be validated before layout freeze.
For the USB device interface, route D+ and D- as a 90-ohm differential pair with matched lengths, keep the pair away from switching nodes, and place the required series resistors/termination per the SAM3S USB hardware application note. Ground the crystal load capacitors directly to the exposed-pad ground region. These practices prevent eye-diagram failures during USB compliance testing and reduce radiated emissions from the 9x9 mm QFN's ground return path.
Do not assume drop-in interchange between the SAM3SD8 and SAM3N sub-families: although ATSAM3N4BA-MU shares the 64-QFN footprint class, it lacks the SD8 dedicated USB device controller and may differ in peripheral multiplexing on individual pins. Always verify pin function tables in the respective datasheets, and check the packing suffix (R = tape and reel, plain = tray) against your SMT feeder setup when ordering production quantities.
Informations de conformité
Distributor listings (Mouser, PCB Electronics) describe the part as 'QFN, Green, IND TEMP, MRL A', indicating green (RoHS/halogen-free) packaging and moisture rating MRL A. REACH and conflict-minerals status not stated in provided data.
