ATSAM3SD8BA-MU - Cortex-M3 MCU 64MHz 512KB Flash | Microchip
Référence : ATSAM3SD8BA-MU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.21 | $7,21 |
| 10 | $6.6 | $66,00 |
| 100 | $5.95 | $595,00 |
| 500 | $5.4 | $2 700,00 |
| 1 000 | $4.95 | $4 950,00 |
ATSAM3SD8BA-MU Présentation
An ARM Cortex-M3 microcontroller is a 32-bit embedded processor based on the ARMv7-M architecture, combining a 3-stage pipeline core with a Nested Vectored Interrupt Controller (NVIC) and efficient Thumb-2 instruction set. Within the power hierarchy of embedded systems, an MCU like the SAM3S series integrates CPU, memory, peripherals, and clocking onto a single chip, serving as the main system controller in embedded product designs.
Key features include the 64 MHz Cortex-M3 core delivering approximately 1.25 DMIPS/MHz, 512KB on-chip Flash with a dedicated page-erase controller, the SAM3S peripheral set including USB, USART, SPI, TWI, and ADC peripherals, and operation from 1.8V, 2.5V, or 3.3V supply rails per distributor data. The industrial temperature grade (IT) suits deployments beyond office environments, and the green/RoHS 64-QFN package with exposed pad supports thermal and ground-plane design.
The ATSAM3SD8 belongs to the SAM3S Flash family (AT91SAM architecture), positioning it as Microchip/Atmel's cost-optimized general-purpose Cortex-M3 line. The fixed-ROM variant (SAM3SD8) targets secure code storage, while the in-system-programmable Flash supports field firmware updates over USB or UART.
Typical applications include industrial control panels, consumer appliances, battery-powered data loggers, and USB-connected embedded devices where a 64 MHz 32-bit core with 512KB program memory covers code growth without a redesign.
When designing with this device, budget Flash usage against the 512KB limit and confirm the 1.62V-3.6V supply window against your rail tolerances; the exposed pad must be soldered to a ground pour for signal integrity and thermal performance.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, adding cross-reference value beyond standard product listings.
Alternatives de remplacement direct pour ATSAM3SD8BA-MU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM3SD8BA-MU (même facteur de forme et même empreinte) — différant par Package, RoHS Status, Supply Voltage, Series, Temperature Grade.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM3SD8BA-MUR
✅ Remplacement direct✓ En stock
$3.98 / unité
Voir la fiche technique →ATSAM3S8BA-MUR
✅ Remplacement direct✓ En stock
$5.15 / unité
Voir la fiche technique →ATSAM3S4BA-MU
✅ Remplacement direct✓ En stock
$5.12 / unité
Voir la fiche technique →ATSAM3N4BA-MU
✅ Remplacement direct✓ En stock
$3.48 / unité
Voir la fiche technique →ATSAM3SD8BA-MU Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M3 |
| Core Size | 32-Bit |
| Fréquence d'horloge maximale | 64 MHz |
| Flash Memory Size | 512KB (512K x 8) |
| Tension d'alimentation | 1.8V / 2.5V / 3.3V |
| Series | SAM3S (AT91SAM) |
| Boîtier | 64-QFN (9x9 mm) Exposed Pad |
| Type de montage | Surface Mount |
| Nombre de broches | 64 |
| Temperature Grade | Industrial (IT) |
| Package Code (JEDEC Style) | HVQCCN |
| Program Memory Type | FLASH |
| Statut RoHS | Compliant (Green package) |
Guide de configuration des broches du ATSAM3SD8BA-MU hvqccn
Configuration des broches du ATSAM3SD8BA-MU (boîtier hvqccn). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAM3SD8BA-MU.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAM3SD8BA-MU convient pour 6 applications: Industrial Control Panels, USB Connected Embedded Devices, Consumer Appliances, Battery-Powered Data Loggers, Sensor Acquisition Systems, Building Automation Nodes.
Industrial Control Panels
The ATSAM3SD8BA-MU fits industrial control panels because its 64 MHz Cortex-M3 core and 512KB Flash comfortably host control loops, Modbus/UART stacks, and HMI logic simultaneously. Industrial grade temperature rating per distributor data and 3.3V supply compatibility align with standard industrial logic rails, while the 64-QFN exposed-pad package provides low-inductance grounding for noisy factory-floor environments. Its USART, SPI, and TWI peripherals connect PLC I/O modules, sensors, and displays without external bridges. Flash density leaves headroom for field firmware updates over the communication bus, extending service life and reducing recall risk in deployed installations.
Recommandé
USB Connected Embedded Devices
The SAM3S peripheral set of the ATSAM3SD8BA-MU includes USB connectivity, making it well suited to USB device applications such as data loggers, card readers, and instrument front-ends. The 64 MHz core sustains USB transfer handling alongside application code, and 512KB Flash accommodates full USB class stacks (CDC, MSC, HID) with room for application logic. Running from 3.3V, the MCU pairs directly with USB PHY-level circuitry typical of SAM3S reference designs. Compared with smaller S4/S8 variants, the D8 Flash density prevents painful stack trimming late in development when the USB stack and application both grow.
Recommandé
Consumer Appliances
Consumer appliance control boards benefit from the ATSAM3SD8BA-MU's balance of 32-bit performance and single-chip integration. The 64 MHz Cortex-M3 handles user-interface touch decoding, motor timing, and communication in one device, while 512KB Flash stores multi-language UI resources and OTA-style update images. The 1.8V/3.3V supply options allow designers to match house power rails, and the RoHS-oriented green 64-QFN package supports lead-free high-volume assembly. The 9x9 mm exposed-pad QFN keeps board area compact for appliance PCBs, and the industrial temperature grade adds reliability margin over consumer-grade parts at similar cost.
Recommandé
Battery-Powered Data Loggers
For battery-powered data loggers, the ATSAM3SD8BA-MU offers 32-bit processing with a flexible 1.8V-3.3V supply window, allowing direct operation from Li-ion or multi-cell alkaline rails through simple regulation. The Cortex-M3's efficient Thumb-2 instruction set and low-power SAM3S architecture support sleep-based duty-cycling, and ADC plus TWI/SPI peripherals read sensor arrays directly. 512KB Flash doubles as log storage, reducing external memory BOM cost, and the exposed-pad QFN's thermal characteristics aid passive designs. Verify exact sleep-mode current figures on the manufacturer datasheet when the loggers' multi-year battery-life budgets demand precise µA-level accounting.
Recommandé
Sensor Acquisition Systems
The ATSAM3SD8BA-MU suits multi-channel sensor acquisition because its SAM3S ADC, SPI, and TWI peripherals interface analog front-ends and digital sensors without glue logic. The 64 MHz Cortex-M3 applies filtering and protocol formatting in real time, while 512KB Flash stores calibration tables, compensation curves, and communication stacks concurrently. The 3.3V industrial-grade operation matches common sensor rails, and the 64-QFN package integrates cleanly under sensor headers on compact PCBs. Compared with the SAM3N family, the SAM3S peripheral complement better serves mixed analog/digital nodes where USB or richer DMA resources shorten development time.
Recommandé
Building Automation Nodes
In building automation, the ATSAM3SD8BA-MU serves as a room-controller node running BACnet/Modbus-style protocol stacks over USART or TWI while managing dampers, valves, and occupancy sensors. The 64 MHz core sustains concurrent protocol and control tasks, and 512KB Flash keeps room for protocol growth, web-style configuration pages, and logged setpoint histories. Its industrial temperature grade tolerates rooftop and mechanical-room environments, and the green 64-QFN package meets lead-free assembly requirements of commercial building products. The single-chip integration reduces BOM count versus two-chip 8-bit-plus-coprocessor approaches common in legacy HVAC controllers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM3SD8BA-MU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM3SD8BA-MUR | ATSAM3S8BA-MUR | ATSAM3S4BA-MU | ATSAM3N4BA-MU |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9) EP | 64-QFN (9x9) EP - same | 64-QFN (9x9) EP - same | 64-QFN (9x9) EP - same | 64-QFN (9x9) EP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Packaging | Tray | Tape & Reel | Tape & Reel | Tray | Tray |
| Temperature Grade | Industrial (IT) | Industrial (IT) | Industrial (IT) | Industrial | Industrial |
| Family Series | SAM3S (SAM3SD8) | SAM3S (SAM3SD8) | SAM3S (SAM3S8) | SAM3S (SAM3S4) | SAM3N (SAM3N4) |
Principaux différenciateurs
- Maximum Flash density in the SAM3S 64-pin family (vs ATSAM3S8BA-MUR)
- Identical-silicon reel alternative exists (vs ATSAM3SD8BA-MUR)
- Richer SAM3S peripheral set versus SAM3N (vs ATSAM3N4BA-MU)
- Cost-down path without redesign (vs ATSAM3S4BA-MU)
Notes de conception
Solder the exposed pad of the 64-QFN (9x9) package to a continuous ground pour with an array of thermal vias. The exposed pad is both the primary ground return and the main thermal path; skipping it increases ground bounce on GPIO banks and complicates rework. Use a solder-mask-defined aperture per Microchip's QFN layout guidelines, and keep the 9x9 mm land pattern within the datasheet tolerance so the leadframe tips wet correctly during reflow.
The device accepts 1.8V, 2.5V, or 3.3V rails per distributor data, but confirm the exact operating window in the SAM3S datasheet before finalizing the regulator. If the board also hosts 5V USB circuitry, use a low-noise LDO or buck regulator with adequate PSRR between the USB VBUS-derived rail and the MCU core supply. Decouple each supply pin with 100 nF ceramics placed within 2 mm of the pin, plus one bulk 10 uF capacitor per rail near the package.
When migrating from ATSAM3SD8BA-MU to the 256KB siblings (ATSAM3S8BA/ATSAM3S4BA), verify Flash page-erase organization and bootloader size assumptions - link-time placed code can exceed 256KB after adding the USB stack. Also distinguish -MU (tray) from -MUR (Tape & Reel) ordering codes on purchase orders to avoid receiving packing that your pick-and-place line cannot load. Confirm per-pin peripheral multiplexing against the 64-pin QFN variant, not the 100-pin variant, in the family datasheet.
Keep crystal and USB differential traces short and length-matched on the SAM3S layout. Route the USB D+/D- pair as a 90-ohm differential pair over a solid ground plane, avoiding crossings of switching traces. For the main clock, place the load capacitors close to the oscillator pins and guard the crystal area with ground pour to reduce jitter contribution in USART/SPI timing margin.
Informations de conformité
Mouser lists the part as QFN, Grn (Green), indicating RoHS-oriented green packaging. Full REACH, halogen-free, and conflict-minerals declarations must be confirmed from Microchip official compliance documents.
