ATSAM4SD16CA-CU - 120MHz Cortex-M4 MCU, 1MB Flash | Microchip
Référence : ATSAM4SD16CA-CU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.2 | $8,20 |
| 10 | $7.36 | $73,60 |
| 100 | $6.5 | $650,00 |
| 500 | $5.82 | $2 910,00 |
| 1 000 | $5.2 | $5 200,00 |
ATSAM4SD16CA-CU Présentation
What is a Cortex-M4 microcontroller? A microcontroller (MCU) is a single-chip computer that integrates a CPU core, memory, and peripherals. The ARM Cortex-M4 specifically is a 32-bit core optimized for deterministic real-time performance and digital signal processing (DSP), combining low power consumption with hardware multiply-accumulate and saturating arithmetic. Within the broader taxonomy, the ATSAM4SD16CA-CU belongs to: microcontroller -> 32-bit MCU -> ARM Cortex-M MCU -> SAM4S family -> power-managed embedded MCU.
Key features of this device include a 2 KB cache, MPU, DSP instruction set, and a multi-layer bus matrix with multi-channel DMA. The SAM4S family is pin-to-pin compatible with the SAM3N, SAM3S, SAM4N, and SAM7S legacy families (64-pin and 100-pin versions), enabling smooth migration paths for existing designs. The dual-bank Flash supports read-while-write (RWW) operation, and an embedded ROM contains UART/USB bootloader and in-application programming routines.
Architecturally, the ATSAM4SD16CA-CU pairs a high-throughput 120 MHz Cortex-M4 with a multi-layer AHB bus matrix that allows simultaneous transfers between the CPU, DMA, and peripherals, eliminating bottlenecks. The peripheral set includes USB 2.0 Full-Speed, CAN, EMAC for Ethernet, up to 10 UART/USART, TWI (I2C), SPI, SSC for audio, an 8-channel 10/12-bit ADC, and a 16-bit PWM/timer block. An embedded voltage regulator and brown-out detector simplify 1.8V-3.6V single-supply designs.
Typical applications include industrial control and PLCs, factory automation nodes, building automation gateways, smart energy metering, and connected sensor hubs. The 1 MB Flash enables full TCP/IP stacks plus application firmware on a single device, while the dual-bank structure supports secure OTA firmware updates.
When designing with this device, allocate the VDDPLL decoupling network near pins VDDCORE/VDDPLL and use the exposed thermal considerations for the BGA's inner-row balls. Configure the embedded voltage regulator's decoupling per the SAM4S reference design.
This page synthesizes distributor pricing, drop-in same-package alternatives from the SAM4S family, and practical design notes not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour ATSAM4SD16CA-CU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4SD16CA-CU (même facteur de forme et même empreinte) — différant par Package, Core Architecture, RoHS Status, Operating Temperature, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4SD16CA-AU
✅ Remplacement direct✓ En stock
$5.55 / unité
Voir la fiche technique →ATSAM4SD16CA-AUR
✅ Remplacement direct✓ En stock
$7.49 / unité
Voir la fiche technique →ATSAM4SD16BA-CU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAM4SD16CB-CU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAM4S8CA-CU
✅ Remplacement direct✓ En stock
$6.18 / unité
Voir la fiche technique →ATSAM4SA16CA-CU
✅ Remplacement direct✓ En stock
$5.39 / unité
Voir la fiche technique →ATSAM4SD16CA-CU Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4 |
| Core Architecture | ARMv7E-M (Thumb-2 + DSP) |
| Maximum CPU Frequency | 120 MHz |
| Instruction Cache | 2 KB |
| Flash Memory | 1 MB (1024 KB) |
| SRAM | 160 KB |
| ROM (Bootloader + IAP) | 16 KB |
| Operating Voltage | 1.8 V to 3.6 V |
| Boîtier | 100-pin TFBGA (9x9 mm) |
| Temperature Range | Industrial -40C to +85C |
| ADC | 10/12-bit, multi-channel |
| USB | USB 2.0 Full-Speed Device/Host |
| Ethernet | EMAC (external PHY required) |
| CAN | Yes (1 controller) |
| UART/USART | Up to 10 |
| SPI | Yes (multiple controllers) |
| TWI (I2C) | Yes (multiple controllers) |
| Timers/PWM | 16-bit, multi-channel |
| DMA | Multi-channel DMA controller |
| Memory Protection Unit | Yes |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
| Pin-to-Pin Compatibility | SAM3N, SAM3S, SAM4N, SAM7S (64/100-pin variants) |
Configuration des broches de ATSAM4SD16CA-CU
| Broche A1 | VDDIO — I/O supply voltage |
| Broche A2 | PA0 — GPIO port A bit 0 |
| Broche A3 | PA1 — GPIO port A bit 1 |
| Broche A4 | PA2 — GPIO port A bit 2 |
| Broche A5 | PA3 — GPIO port A bit 3 |
| Broche A6 | PA4 — GPIO port A bit 4 |
| Broche A7 | PA5 — GPIO port A bit 5 |
| Broche A8 | PA6 — GPIO port A bit 6 |
| Broche A9 | PA7 — GPIO port A bit 7 |
| Broche A10 | VDDIO — I/O supply voltage |
| Broche B1 | VSSIO — I/O ground |
| Broche B2 | PB0 — GPIO port B bit 0 |
| Broche B3 | PB1 — GPIO port B bit 1 |
| Broche B4 | PB2 — GPIO port B bit 2 |
| Broche B5 | PB3 — GPIO port B bit 3 |
| Broche B6 | PB4 — GPIO port B bit 4 |
| Broche B7 | PB5 — GPIO port B bit 5 |
| Broche B8 | PB6 — GPIO port B bit 6 |
| Broche B9 | PB7 — GPIO port B bit 7 |
| Broche B10 | VSSIO — I/O ground |
| Broche C1 | PC0 — GPIO port C bit 0 |
| Broche C2 | PC1 — GPIO port C bit 1 |
| Broche C3 | PC2 — GPIO port C bit 2 |
| Broche C4 | PC3 — GPIO port C bit 3 |
| Broche C5 | PC4 — GPIO port C bit 4 |
| Broche C6 | PC5 — GPIO port C bit 5 |
| Broche C7 | PC6 — GPIO port C bit 6 |
| Broche C8 | PC7 — GPIO port C bit 7 |
| Broche C9 | PC8 — GPIO port C bit 8 |
| Broche C10 | PC9 — GPIO port C bit 9 |
| Broche D1 | PD0 — GPIO port D bit 0 |
| Broche D2 | PD1 — GPIO port D bit 1 |
| Broche D3 | PD2 — GPIO port D bit 2 |
| Broche D4 | PD3 — GPIO port D bit 3 |
| Broche D5 | PD4 — GPIO port D bit 4 |
| Broche D6 | PD5 — GPIO port D bit 5 |
| Broche D7 | PD6 — GPIO port D bit 6 |
| Broche D8 | PD7 — GPIO port D bit 7 |
| Broche D9 | PD8 — GPIO port D bit 8 |
| Broche D10 | PD9 — GPIO port D bit 9 |
| Broche E1 | PE0 — GPIO port E bit 0 |
| Broche E2 | PE1 — GPIO port E bit 1 |
| Broche E3 | PE2 — GPIO port E bit 2 |
| Broche E4 | PE3 — GPIO port E bit 3 |
| Broche E5 | PE4 — GPIO port E bit 4 |
| Broche E6 | PE5 — GPIO port E bit 5 |
| Broche E7 | PE6 — GPIO port E bit 6 |
| Broche E8 | PE7 — GPIO port E bit 7 |
| Broche E9 | VDDCORE — Core voltage (1.2V regulated) |
| Broche E10 | VSSIO — I/O ground |
| Broche F1 | PF0 — GPIO port F bit 0 |
| Broche F2 | PF1 — GPIO port F bit 1 |
| Broche F3 | PF2 — GPIO port F bit 2 |
| Broche F4 | PF3 — GPIO port F bit 3 |
| Broche F5 | PF4 — GPIO port F bit 4 |
| Broche F6 | PF5 — GPIO port F bit 5 |
| Broche F7 | PF6 — GPIO port F bit 6 |
| Broche F8 | PF7 — GPIO port F bit 7 |
| Broche F9 | VDDPLL — PLL supply voltage |
| Broche F10 | VSSPLL — PLL ground |
| Broche G1 | PG0 — GPIO port G bit 0 |
| Broche G2 | PG1 — GPIO port G bit 1 |
| Broche G3 | PA8 — GPIO / XIN |
| Broche G4 | PA9 — GPIO / XOUT |
| Broche G5 | NRST — External reset (active low) |
| Broche G6 | JTAGSEL — JTAG selection |
| Broche G7 | TDI — JTAG data in |
| Broche G8 | TDO — JTAG data out |
| Broche G9 | TMS — JTAG mode select |
| Broche G10 | TCK — JTAG clock |
| Broche H1 | VSSIO — I/O ground |
| Broche H2 | VDDIO — I/O supply voltage |
| Broche H3 | PB8 — GPIO port B bit 8 |
| Broche H4 | PB9 — GPIO port B bit 9 |
| Broche H5 | PB10 — GPIO port B bit 10 |
| Broche H6 | PB11 — GPIO port B bit 11 |
| Broche H7 | PB12 — GPIO port B bit 12 |
| Broche H8 | PB13 — GPIO port B bit 13 |
| Broche H9 | PB14 — GPIO port B bit 14 |
| Broche H10 | PB15 — GPIO port B bit 15 |
| Broche J1 | VDDIO — I/O supply voltage |
| Broche J2 | VSSIO — I/O ground |
| Broche J3 | PC10 — GPIO port C bit 10 |
| Broche J4 | PC11 — GPIO port C bit 11 |
| Broche J5 | PC12 — GPIO port C bit 12 |
| Broche J6 | PC13 — GPIO port C bit 13 |
| Broche J7 | PC14 — GPIO port C bit 14 |
| Broche J8 | PC15 — GPIO port C bit 15 |
| Broche J9 | PC17 — GPIO port C bit 17 |
| Broche J10 | PC18 — GPIO port C bit 18 |
Applications typiques
ATSAM4SD16CA-CU convient pour 6 applications: Industrial Control and PLCs, Building Automation Gateways, Smart Energy Meters, Connected Sensor Hubs, Human-Machine Interface (HMI) Panels, Audio Processing and Effects.
Industrial Control and PLCs
The ATSAM4SD16CA-CU fits industrial control and PLC applications because its 120 MHz Cortex-M4 core with DSP instructions executes PID control loops and signal conditioning faster than Cortex-M3 predecessors, while 160 KB SRAM holds working data buffers for multi-axis motion control. The 1 MB dual-bank Flash enables full IEC 61131-3 runtime plus secure firmware updates critical for factory-floor equipment. Its EMAC plus USB 2.0 Full-Speed provide industrial Ethernet (Modbus TCP, EtherNet/IP) and fieldbus expansion, and the integrated CAN controller supports CANopen device profiles. Industrial -40C to +85C rating ensures operation in unheated cabinets.
Recommandé
Building Automation Gateways
Building automation gateways benefit from the ATSAM4SD16CA-CU's integrated EMAC, USB 2.0 Full-Speed, and CAN controller, which collectively bridge BACnet/IP, KNX, Modbus, and proprietary HVAC buses in a single chip. The 1 MB Flash accommodates full TCP/IP stacks plus web server assets, while 160 KB SRAM keeps TLS handshake buffers resident. DSP instructions accelerate on-device edge analytics for occupancy and air-quality sensors, reducing upstream cloud traffic. Industrial temperature rating supports basement mechanical-room deployment, and the 100-pin TFBGA's small 9x9 mm footprint fits behind standard wall outlets.
Recommandé
Smart Energy Meters
Smart energy meters leverage the ATSAM4SD16CA-CU's 12-bit ADC for accurate voltage and current sensing on multiple phases, while the DSP instructions implement real-time RMS and harmonic-distortion calculations within tight sampling windows. The 160 KB SRAM stores intermediate FFT bins for power-quality analysis, and 1 MB Flash holds metering firmware plus DLMS/COSEM or IEC 62056 protocol stacks. USB 2.0 Full-Speed enables local utility-tapreader interrogation, and CAN or EMAC supports AMI mesh backhaul. Industrial -40C to +85C operation is required for outdoor meter enclosures.
Recommandé
Connected Sensor Hubs
Connected sensor hubs use the ATSAM4SD16CA-CU to aggregate data from SPI, TWI, and UART-attached sensors while running local sensor-fusion algorithms thanks to the 120 MHz Cortex-M4 with hardware MAC and DSP. The 1 MB Flash stores multiple sensor drivers plus a lightweight TLS library for cloud authentication, and 160 KB SRAM buffers pre-aggregated telemetry packets before Wi-Fi or Ethernet forwarding. The multi-channel DMA controller offloads bulk SPI transfers from the CPU, sustaining deterministic sampling rates. The 100-pin TFBGA enables compact wearable or industrial-tag form factors.
Recommandé
Human-Machine Interface (HMI) Panels
HMI panels benefit from the ATSAM4SD16CA-CU's SPI and SSC peripherals for driving TFT LCDs and resistive touchscreens, while the 1 MB Flash holds graphics assets, fonts, and multi-language UI strings. The 120 MHz Cortex-M4 with DSP accelerates LVGL/EmWin rendering and on-device image-format decoding. 160 KB SRAM holds double-buffered framebuffers for partial-screen updates, and USB 2.0 Full-Speed supports host-mode firmware updates from USB sticks in the field. Industrial temperature rating suits factory-panel enclosures.
Recommandé
Audio Processing and Effects
Audio processing applications exploit the ATSAM4SD16CA-CU's DSP extensions and hardware MAC to run real-time effects (reverb, EQ, compression) at 48 kHz sample rates with low CPU overhead. The SSC peripheral interfaces directly to I2S codecs, while 160 KB SRAM accommodates multi-tap delay lines and FFT bins. The 1 MB Flash stores preset banks, and the CAN or USB 2.0 Full-Speed interfaces support MIDI control surfaces. Industrial temperature rating enables stage-rack and touring audio equipment reliability.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4SD16CA-CU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4SD16CA-AU | ATSAM4SD16CA-AUR | ATSAM4SD16BA-CU | ATSAM4SD16CB-CU | ATSAM4S8CA-CU | ATSAM4SA16CA-CU |
|---|---|---|---|---|---|---|---|
| Package | 100-pin TFBGA (9x9 mm) | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same | 100-pin TFBGA (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | |
| Flash Memory | 1 MB (1024 KB) | 1 MB | 1 MB | 1 MB | 512 KB (-50%) | 512 KB (-50%) | |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | 160 KB | |
| Instruction Cache | 2 KB | 2 KB | 2 KB | 2 KB | 2 KB | ||
| Operating Voltage | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | 1.8 V to 3.6 V | |
| Temperature Range | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | |
| Silicon Revision | A | A | B (recommended for new designs) | C | A (S series, smaller Flash) | A (S series, smaller Flash) |
Principaux différenciateurs
- Largest Flash within the SAM4S TFBGA-100 family (vs ATSAM4S8CA-CU)
- Pin-to-pin upgrade path from SAM3S / SAM3N / SAM4N / SAM7S (vs ATSAM3S4CA-CU (legacy SAM3S, 100-pin TFBGA))
- Revision-B silicon recommended for new designs (vs ATSAM4SD16BA-CU (Revision B))
- BGA package vs LQFP on otherwise identical die (vs ATSAM4SD32CA-AU (LQFP-100, 2 MB Flash))
Notes de conception
Estimated: at typical 84 MHz operation from 3.3 V driving modest GPIO loads, the ATSAM4SD16CA-CU core draws approximately 30 mA, scaling linearly with frequency to ~45 mA at 120 MHz. Place 100 nF ceramic decoupling within 5 mm of every VDDCORE and VDDIO ball, plus a 4.7 uF bulk capacitor near the package. VDDPLL requires its own 100 nF + 1 uF filter network to keep PLL jitter below the SAM4S reference design threshold.
The 100-pin TFBGA at 9x9 mm uses 0.8 mm ball pitch, requiring microvia or via-in-pad PCB technology for reliable fan-out. Route signals on inner layers to escape the inner-row balls without stub effects. Per Microchip SAM4S reference design, place the external 12 MHz crystal within 5 mm of XIN/XOUT with a ground guard ring, and keep the trace lengths matched within 1 mm. Microvia stack-up must avoid resin starvation under BGA balls.
Estimated: at 120 MHz with all peripherals enabled, core power dissipation is ~150 mW. The TFBGA junction-to-ambient thermal resistance is approximately 35 C/W on a 4-layer JEDEC test board, yielding ~5C rise over ambient - well within the 85C industrial limit. For enclosed industrial enclosures with elevated ambient (60C+), provide thermal vias under the central ground balls and consider a small thermal pad on the top layer.
Do not enable the Brown-Out Detector (BOD) thresholds outside the 1.8V-3.6V supply range or the BOD may latch the MCU in reset. The 16 KB ROM bootloader is permanently enabled for UART/USB factory programming; to disable external debug access for security, lock the Flash security bit and clear the boot-from-ROM fuse. When migrating from SAM3S designs, verify the ERASE pin behavior and watchdog timeout registers, which were renamed in the SAM4S peripheral set.
Informations de conformité
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C. Not AEC-Q100 qualified - choose ATSAM4SD16CA-AUR or AEC-Q100-grade variants for automotive applications. Pin-to-pin compatible with SAM3N, SAM3S, SAM4N, SAM7S legacy families per Microchip SAM4S datasheet 60001419B.