ATSAM4SD16CB-CFNR - SAM4S Cortex-M4 120MHz 1MB MCU | Microchip
MPN: ATSAM4SD16CB-CFNR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $9.85 | $9.85 |
| 10 | $8.92 | $89.20 |
| 100 | $7.65 | $765.00 |
| 500 | $6.83 | $3,415.00 |
| 1,000 | $6.12 | $6,120.00 |
ATSAM4SD16CB-CFNR Overview
A microcontroller (MCU) is a single-chip processor that integrates a CPU core, memory (Flash and SRAM), and a rich set of peripherals including timers, communication interfaces (USART, SPI, TWI), and analog blocks (ADC). In the wider system hierarchy, an MCU sits inside the embedded-computing IC category, below microprocessors (MPU) and above discrete logic. The Cortex-M4 core specifically targets deterministic real-time control with DSP extensions, allowing both control loops and signal-processing tasks to run on a single chip.
Key features of the ATSAM4SD16CB-CFNR include up to 120 MHz core clock, 1 MB embedded Flash (configured as 2 x 512 KB dual-bank for live updates), 160 KB SRAM, an external bus interface, a 16-bit External Interrupt Controller, and the standard SAM4S peripheral set (HS USB, CAN, EMAC, multiple USART/SPI/TWI). An integrated voltage regulator and brown-out detector simplify power-tree design at 1.2 V core / 3.3 V I/O operation.
Architecturally, the SAM4SD16 uses the Cortex-M4 with Thumb-2 instruction set, NVIC for deterministic interrupts, and a multi-layer bus matrix connecting Flash, SRAM, and peripheral bridges. This high-bandwidth interconnect is what allows the 120 MHz core to feed the Ethernet MAC, HS USB, and other high-throughput peripherals without contention. The dual-bank Flash further supports in-application programming and safe firmware updates, which is critical for products that cannot tolerate downtime during reflash.
Typical applications include industrial control and HMI panels, smart energy metering, building automation gateways, point-of-sale terminals, consumer audio peripherals, and connectivity-rich IoT edge nodes. The combination of HS USB, CAN, and EMAC makes it especially attractive for industrial gateway designs that bridge field-bus networks to Ethernet backhaul.
When designing with this part, pay attention to the VFBGA-100 PCB land pattern, keep the analog supply cleanly decoupled, and use the on-chip brown-out and watchdog features to meet IEC functional-safety expectations in industrial deployments. New designs should target silicon Revision B as recommended by the manufacturer. This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Drop-in alternatives for ATSAM4SD16CB-CFNR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4SD16CB-CFNR (same form factor and footprint) — differing in Package, ADC, Operating Temperature, Program Memory (Flash), USB.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAM4SD16CB-CFN
✅ Drop-In✓ In Stock
$8.85 / Unit
View Datasheet →ATSAM4S16CB-CFN
✅ Drop-In✓ In Stock
$4.95 / Unit
View Datasheet →ATSAM4S8CB-CFNR
✅ Drop-In✓ In Stock
$6.85 / Unit
View Datasheet →ATSAM4S4CB-AN
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAM4SA16CB-AN
✅ Drop-In ⚠️ 参数待验证✓ In Stock
$5.95 / Unit
View Datasheet →ATSAM4SD16CB-CFNR Maximum Ratings & Electrical Characteristics
| Core | ARM Cortex-M4F (32-bit, single-precision FPU) |
| Core Frequency | 120 MHz |
| Program Memory (Flash) | 1 MB (2 x 512 KB dual-bank) |
| SRAM | 160 KB |
| Supply Voltage (VDDCORE) | 1.2 V (typ) |
| I/O Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Package | 100-VFBGA (7x7 mm) |
| Mounting Type | Surface Mount (BGA) |
| Operating Temperature | -40 C to +85 C (extended) |
| Peripherals | HS USB, CAN, EMAC, USART, SPI, TWI, EBI |
| ADC | 1 x 16-channel 12-bit ADC |
| Timers | Multiple TC, PWM, RTC |
| External Interrupt Controller | Yes (16-line) |
| MSL Level | 3 (per JEDEC J-STD-020) |
| RoHS Status | Compliant |
| Silicon Revision | Revision B (recommended for new designs) |
ATSAM4SD16CB-CFNR 100-vfbga (7x7 mm) Pin Configuration Guide
Pin configuration for ATSAM4SD16CB-CFNR (100-vfbga (7x7 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4SD16CB-CFNR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4SD16CB-CFNR is suitable for 6 applications: Industrial HMI Control Panel, Smart Energy Metering, Building Automation Gateway, Point-of-Sale Terminal, Consumer Audio Peripheral, IoT Edge Sensor Node.
Industrial HMI Control Panel
The ATSAM4SD16CB-CFNR fits industrial HMI control panels because its 120 MHz Cortex-M4F core can drive a TFT LCD via the External Bus Interface while running a real-time control loop on the integrated timers. The 1 MB dual-bank Flash allows safe in-application firmware updates without halting the HMI, and 160 KB SRAM holds frame buffers and widget state. With the HS USB, CAN, and EMAC peripherals integrated, the same MCU can also handle touchscreen input, field-bus comms, and Ethernet backhaul in a single chip, reducing the BOM versus a discrete MPU plus per-host co-processor design.
Recommended
Smart Energy Metering
The ATSAM4SD16CB-CFNR suits smart energy metering because the 12-bit ADC with up to 16 channels can sample current and voltage transducers simultaneously while the Cortex-M4F runs DSP-class RMS and harmonic calculations. The 160 KB SRAM is enough to buffer one full AC line cycle at high sample rates, and the 1 MB dual-bank Flash stores metrology libraries plus communication stacks for DLMS/COSEM or wireless M-Bus. The -40 C to +85 C industrial temperature range satisfies outdoor cabinet deployments common in AMI rollouts.
Recommended
Building Automation Gateway
The ATSAM4SD16CB-CFNR works well as a building automation gateway because it bridges field buses (CAN, RS-485 over USART) to Ethernet via the integrated EMAC, all on one chip. The 120 MHz Cortex-M4F can run BACnet, Modbus, or KNX stacks concurrently, and the dual-bank 1 MB Flash supports OTA firmware updates so installers do not need to physically recall gateways for bug fixes. The small 100-VFBGA 7x7 mm package fits DIN-rail enclosures with strict width budgets.
Recommended
Point-of-Sale Terminal
The ATSAM4SD16CB-CFNR powers point-of-sale terminals because the HS USB port connects to peripherals (barcode scanners, NFC readers, printers), the EMAC links to the store LAN, and the 12-bit ADC reads battery and thermal-printer head currents. The Cortex-M4F DSP extensions accelerate crypto for PCI-PTS tokenization, and the dual-bank Flash enables secure boot with rollback to a known-good image if an update fails - critical for payment terminals.
Recommended
Consumer Audio Peripheral
The ATSAM4SD16CB-CFNR drives consumer audio peripherals because the Cortex-M4F single-precision FPU executes audio DSP (EQ, mixing, SRC) in real time, while the HS USB port streams 24-bit 96 kHz audio from a host. The 160 KB SRAM holds several seconds of audio buffer at typical sample rates, and the rich set of I2S-capable peripherals (configurable as SPI) connects directly to DACs and ADCs without an external bridge IC.
Recommended
IoT Edge Sensor Node
The ATSAM4SD16CB-CFNR suits IoT edge sensor nodes because its low-power SAM4S sleep modes combined with the Cortex-M4F DSP extensions let the device wake, process sensor data, and transmit before returning to sleep. The HS USB simplifies factory provisioning, the integrated EMAC gives wired backhaul when needed, and the 1 MB Flash stores TLS stacks plus an OTA updater. The 100-VFBGA 7x7 mm footprint enables very compact sensor-pod form factors.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4SD16CB-CFNR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4SD16CB-CFN | ATSAM4S16CB-CFN | ATSAM4S8CB-CFNR | ATSAM4S4CB-AN | ATSAM4SA16CB-AN |
|---|---|---|---|---|---|---|
| Package | 100-VFBGA (7x7) | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same | 100-VFBGA (7x7) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash | 1 MB (dual-bank) | 1 MB (dual-bank) | 1 MB (single-bank) | 512 KB | 256 KB | 1 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 128 KB | 64 KB | 160 KB |
| Ethernet MAC | Yes (EMAC) | Yes | Yes | Yes | Yes | No |
| Temperature Range | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
| Operating Voltage (Core) | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V | 1.2 V |
Key Differentiators
- Dual-bank 1 MB Flash for safe OTA updates (vs ATSAM4S16CB-CFN)
- Full SAM4S peripheral set with Ethernet MAC (vs ATSAM4SA16CB-AN)
- Tape-and-reel packaging for high-volume SMT (vs ATSAM4SD16CB-CFN)
Design Notes
Estimated: the 100-VFBGA 7x7 mm package uses a 0.65 mm ball pitch. Per Microchip layout guidelines, place a 4-layer stack-up with a continuous ground plane under the BGA, fan-out via microvias-in-pad, and provide at least 1 oz copper for power planes. Bypass VDDCORE with 100 nF X7R per pin and bulk 4.7 uF tantalum, and keep VDDIO decoupling within 2 mm of each supply ball to meet the 120 MHz core's switching-noise envelope.
Do not assume all 100-VFBGA SAM4S parts have dual-bank Flash; the ATSAM4S16 is single-bank and cannot safely perform OTA rollbacks the way the ATSAM4SD16 (dual-bank) can. Also note that the SAM4SA family drops the EMAC peripheral, so the ATSAM4SA16CB-AN is not a substitute if you need Ethernet. Confirm peripheral presence in the device selection table of the SAM4S datasheet before committing to a layout.
Estimated: at 120 MHz with all peripherals active, the ATSAM4SD16CB-CFNR dissipates under 300 mW typical. The 100-VFBGA with a 4-layer JEDEC test board dissipates this comfortably at 85 C ambient without external cooling. For continuous 100% CPU load at elevated ambient, verify junction rise using theta_JA from the SAM4S package thermal characteristics section rather than relying on bare-package ratings.
Route the HS USB differential pair (D+/D-) with 90 ohm differential impedance and length matching within 150 mil. Keep the crystal traces short and symmetric, place the 12 pF load capacitors within 2 mm of the XIN/XOUT balls, and guard the analog VDDANA pin with a ferrite bead plus dedicated LDO. Following these layout rules avoids the most common SAM4S EMC and USB-compliance failures seen during certification.
Compliance Information
RoHS compliant per Microchip product page. AEC-Q100 not applicable (industrial/consumer MCU). MSL Level 3 per JEDEC J-STD-020 for VFBGA packages.
