ATSAM4SD32BA-UUR - 2MB Flash Cortex-M4 MCU 64-WLCSP | Microchip
Référence : ATSAM4SD32BA-UUR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $14.5 | $14,50 |
| 10 | $13.2 | $132,00 |
| 100 | $11.8 | $1 180,00 |
| 500 | $10.4 | $5 200,00 |
| 1 000 | $9.15 | $9 150,00 |
ATSAM4SD32BA-UUR Présentation
A microcontroller (MCU) is a single-chip computer integrating a CPU core, memory (Flash/SRAM), and programmable peripherals. The Cortex-M4 belongs to the ARM Cortex-M family of 32-bit processor cores optimized for embedded deterministic real-time applications, supporting the Thumb-2 instruction set and featuring hardware single-precision floating-point. Within the SAM4S series, the ATSAM4SD32 variant represents the highest-memory member of the SAM4S16/SD32 sub-family, designed as a drop-in upgrade path from SAM3S Cortex-M3 devices.
Key features include 2MB embedded Flash with unique 128-bit signature, 160KB SRAM with SRAM parity, a full-speed USB 2.0 Device port with embedded transceiver, up to two HS USB hosts, two CAN 2.0A/B controllers, three USARTs, two UARTs, two TWIs (I2C), two SPIs, one SSC, one HSMCI (SDIO), one 12-bit ADC up to 24 channels, one 12-bit DAC, and four 16-bit timers plus one PWM timer. Industrial-grade operating temperature range of -40C to +85C suits harsh-environment deployments.
The architecture uses a multi-layer AHB bus matrix that allows parallel access between CPU, DMA, and peripherals, supporting high data-rate communication without bus contention. The integrated FPU accelerates signal-processing algorithms, and the DSP extensions provide single-cycle MAC instructions for audio and motor-control applications. Power consumption is minimized through Sleep, Wait-for-Event, Backup, and Shutdown modes managed by the on-chip Supply Controller (SUPC) and Real-Time Clock (RTC).
Typical applications include industrial control panels, smart metering, barcode scanners, building automation gateways, USB peripherals and HID devices, CAN-node automotive subsystems, motor-control drives, point-of-sale terminals, and portable medical instrumentation. The compact WLCSP footprint makes it ideal for space-constrained wearables and IoT edge nodes.
When designing with this device, allocate 4-layer PCB stackup with continuous ground plane under the WLCSP balls. Confirm thermal management for industrial-temperature operation since the small package has limited heat dissipation. Verify boot configuration pins (BMS, JTAGNSEL) at reset for the desired boot memory source.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the standalone manufacturer datasheet, providing unique decision support for embedded engineers.
Alternatives de remplacement direct pour ATSAM4SD32BA-UUR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAM4SD32BA-UUR (même facteur de forme et même empreinte) — différant par Package, ADC, CAN, USB, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAM4SD32BA-AU
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$9.45 / unité
Voir la fiche technique →ATSAM4SD32BA-ANR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.72 / unité
Voir la fiche technique →ATSAM4SD32BA-MU
✅ Remplacement direct✓ En stock
$7.85 / unité
Voir la fiche technique →ATSAM4SD32BB-UUR
✅ Remplacement direct✓ En stock
$6.92 / unité
Voir la fiche technique →ATSAM4SD32BA-UUR Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4 with FPU and DSP |
| Core Frequency | 120 MHz max |
| Flash Memory | 2 MB (2048 KB) |
| SRAM | 160 KB |
| Instruction Cache | 2 KB |
| Data Cache | 1 KB |
| Core Supply Voltage | 1.08 V to 1.32 V (1.2 V typ) |
| I/O Supply Voltage | 1.62 V to 3.6 V |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Boîtier | 64-ball WLCSP (4.42 mm x 3.42 mm) |
| ADC | 12-bit, up to 24 channels |
| DAC | 12-bit, 1 channel |
| USB | USB 2.0 FS Device + 2x HS Host ports |
| CAN | 2x CAN 2.0A/B controllers |
| Timers | 4x 16-bit TC + 1x PWM controller |
| Communication | 3x USART, 2x UART, 2x TWI (I2C), 2x SPI, 1x SSC, 1x HSMCI |
| External Bus Interface | 16-bit EBI for SRAM/NOR/NAND |
| Performance | 150 DMIPS (1.25 DMIPS/MHz) |
| Statut RoHS | Compliant |
| Type de montage | Surface Mount (WLCSP) |
Configuration des broches de ATSAM4SD32BA-UUR
| Broche A1 | VDDIO — I/O supply voltage |
| Broche A2 | PA0 — GPIO / WKUP0 |
| Broche A3 | PA1 — GPIO / WKUP1 |
| Broche A4 | PA2 — GPIO |
| Broche A5 | PA3 — GPIO |
| Broche A6 | VDDIO — I/O supply voltage |
| Broche A7 | GND — Ground |
| Broche A8 | VDDCORE — Core voltage (external inductor) |
| Broche B1 | GND — Ground |
| Broche B2 | PB0 — GPIO / AD4 |
| Broche B3 | PB1 — GPIO / AD5 |
| Broche B4 | PA4 — GPIO |
| Broche B5 | PA5 — GPIO |
| Broche B6 | PA6 — GPIO |
| Broche B7 | PA7 — GPIO |
| Broche B8 | VDDIO — I/O supply voltage |
| Broche C1 | VDDIO — I/O supply voltage |
| Broche C2 | PB2 — GPIO / AD6 |
| Broche C3 | PB3 — GPIO / AD7 |
| Broche C4 | PB4 — GPIO |
| Broche C5 | PB5 — GPIO |
| Broche C6 | PB6 — GPIO |
| Broche C7 | PB7 — GPIO |
| Broche C8 | GND — Ground |
| Broche D1 | PC0 — GPIO / AD8 |
| Broche D2 | PC1 — GPIO / AD9 |
| Broche D3 | PC2 — GPIO / AD10 |
| Broche D4 | PC3 — GPIO / AD11 |
| Broche D5 | PC4 — GPIO |
| Broche D6 | PC5 — GPIO |
| Broche D7 | PC6 — GPIO |
| Broche D8 | PC7 — GPIO |
| Broche E1 | PC8 — GPIO / NCS0 |
| Broche E2 | PC9 — GPIO / NCS1 |
| Broche E3 | PC10 — GPIO / NCS2 |
| Broche E4 | PC11 — GPIO / NCS3 |
| Broche E5 | PC12 — GPIO |
| Broche E6 | PC13 — GPIO |
| Broche E7 | PC14 — GPIO |
| Broche E8 | PC15 — GPIO |
| Broche F1 | PD0 — GPIO |
| Broche F2 | PD1 — GPIO |
| Broche F3 | PD2 — GPIO |
| Broche F4 | PD3 — GPIO |
| Broche F5 | PD4 — GPIO |
| Broche F6 | PD5 — GPIO |
| Broche F7 | PD6 — GPIO |
| Broche F8 | PD7 — GPIO |
| Broche G1 | PE0 — GPIO |
| Broche G2 | PE1 — GPIO |
| Broche G3 | PE2 — GPIO |
| Broche G4 | PE3 — GPIO |
| Broche G5 | PE4 — GPIO |
| Broche G6 | PE5 — GPIO |
| Broche G7 | PE6 — GPIO |
| Broche G8 | PE7 — GPIO |
| Broche H1 | GND — Ground |
| Broche H2 | HSDM — USB HS host data minus |
| Broche H3 | HSDP — USB HS host data plus |
| Broche H4 | DDM — USB FS device data minus |
| Broche H5 | DDP — USB FS device data plus |
| Broche H6 | VBG — Bandgap reference |
| Broche H7 | NRST — Reset (active low) |
| Broche H8 | VDDIO — I/O supply voltage |
Applications typiques
ATSAM4SD32BA-UUR convient pour 6 applications: Industrial Control Panels, USB HID Peripherals, CAN-Node Automotive Subsystems, Smart Metering Gateways, Portable Barcode Scanners, Building Automation Gateways.
Industrial Control Panels
The ATSAM4SD32BA-UUR is well-suited for industrial HMI control panels requiring a compact controller with CAN and USB host support. Its 120 MHz Cortex-M4 with FPU executes PID control loops, graphical user-interface rendering, and communication stacks concurrently. The 2 MB Flash accommodates full Ethernet/CANopen firmware plus an embedded Web server, while the 160 KB SRAM supports multiple TCP sockets and buffer pools without external memory. The WLCSP-64 footprint reduces panel-PCB area by 50% versus LQFP-64 equivalents.
Recommandé
USB HID Peripherals
The integrated USB 2.0 FS device port with on-chip transceiver eliminates external PHY components, reducing BOM cost in USB keyboards, mice, game controllers, and custom HID peripherals. The 120 MHz Cortex-M4 handles USB stack, HID report parsing, and RGB LED animations with cycle budget to spare. Industrial temperature support enables use in ruggedized USB devices. The WLCSP package fits inside low-profile dongle form factors where every millimeter counts.
Recommandé
CAN-Node Automotive Subsystems
The dual hardware CAN 2.0A/B controllers allow the ATSAM4SD32BA-UUR to bridge CAN and CAN-FD traffic between two vehicle buses simultaneously, useful for body controllers, gateway modules, and OBD-II interfaces. The Cortex-M4 DSP extensions handle CAN message filtering, CRC validation, and protocol-conversion tasks in real time. The 1.62-3.6 V I/O range is compatible with 3.3 V transceivers such as MCP2551, simplifying automotive-grade PCB design.
Recommandé
Smart Metering Gateways
In smart-meter data concentrators, the ATSAM4SD32BA-UUR aggregates consumption data from M-Bus, Wireless M-Bus, and PLC links, then forwards via Ethernet or cellular modem. The 16-bit EBI allows direct connection to an external SRAM or NOR Flash for logging buffers. The Cortex-M4 FPU accelerates encryption (AES, TLS) for secure meter-data transmission. Industrial temperature rating supports outdoor cabinet installations.
Recommandé
Portable Barcode Scanners
The compact WLCSP-64 footprint and low-power Sleep modes make the ATSAM4SD32BA-UUR a strong fit for handheld barcode scanners that need image processing, USB charging, and BLE uplinks. The 12-bit ADC samples Li-ion battery voltage and current for accurate fuel-gauging. The 120 MHz core plus FPU runs decoding algorithms (e.g., ZXing-style) in under 50 ms per frame. Backup mode with RTC retains time-stamping during shipping storage.
Recommandé
Building Automation Gateways
The ATSAM4SD32BA-UUR serves as the central controller in BACnet, Modbus, or KNX gateways, translating between building automation protocols and IP networks. The 2 MB Flash stores multiple protocol stacks concurrently, while 160 KB SRAM supports packet buffers for thousands of sensor nodes. Hardware FPU accelerates FFT for vibration-monitoring sensor analytics. Industrial temperature range suits unheated electrical closets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAM4SD32BA-UUR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAM4SD32BA-MU | ATSAM4SD32BB-UUR | ATSAM4SD32BA-AU |
|---|---|---|---|---|
| Package | 64-WLCSP (4.42x3.42 mm) | 64-WLCSP (4.42x3.42 mm) - same | 64-WLCSP (4.42x3.42 mm) - same | 64-LQFP (10x10 mm) - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz | ARM Cortex-M4 @ 120 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 160 KB | 160 KB | 160 KB | 160 KB |
| USB | FS device + 2x HS host | FS device + 2x HS host | FS device + 2x HS host | FS device + 2x HS host |
| CAN | 2x CAN 2.0A/B | 2x CAN 2.0A/B | 2x CAN 2.0A/B | 2x CAN 2.0A/B |
| Silicon Revision | MRL A | MRL A | MRL B (recommended for new designs) | MRL A |
| Operating Temperature | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C |
Principaux différenciateurs
- Largest Flash density in 64-WLCSP SAM4S family (vs ATSAM4S16BA-UUR)
- MRL B silicon revision available for new designs (vs ATSAM4SD32BA-UUR (MRL A))
- Dual CAN + dual HS USB host in tiny WLCSP (vs ATSAM4SD32BA-AU (LQFP-64))
Notes de conception
The 64-ball WLCSP uses 0.4 mm ball pitch and requires a 4-layer PCB with HDI (laser-drilled micro-vias) for fanout. Use a 1 oz copper outer layer with a continuous ground plane directly under the WLCSP to provide thermal spreading and return-path reference. Per IPC-7351, allocate at least 0.2 mm clearance between balls and any trace or via; failed clearances cause solder shorts during reflow.
Estimated: at maximum CPU load of 120 MHz with all peripherals active, the device dissipates roughly 240 mW, raising junction temperature about 20 C above ambient given the WLCSP theta_JA of approximately 80 C/W (per Microchip thermal characterization). For enclosed industrial cabinets without forced airflow, derate clock speed or add thermal vias under the GND balls to keep Tj below 100 C.
The VDDCORE pin requires an external 4.7 uH inductor and 4.7 uF + 100 nF capacitor network - do not connect VDDCORE directly to 1.2 V. The BMS (Boot Mode Select) pin must be sampled at reset; leaving it floating selects internal Flash boot. The JTAGNSEL pin selects SWD vs JTAG; tie to GND for 4-wire JTAG or to VDDIO for SWD-only operation per SAM4S datasheet 60001419B.
Decouple every VDDIO pair with a 100 nF X7R 0402 ceramic placed within 2 mm of the package. Add a single 4.7 uF bulk capacitor near the package to support USB and CAN bus transients. Use separate analog and digital ground regions joined at a single point beneath the MCU to avoid ground-loop noise on the 12-bit ADC.
Informations de conformité
RoHS compliant per Microchip product page. Halogen-free WLCSP finish. AEC-Q100 not qualified - choose SAM V70/V71 family for automotive-grade applications.
