ATSAM4S16BA-UUR - 120MHz Cortex-M4 MCU 1MB Flash | Microchip
MPN: ATSAM4S16BA-UUR β Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $6.84 | $6.84 |
| 10 | $6.5 | $65.00 |
| 100 | $6.15 | $615.00 |
| 500 | $5.9 | $2,950.00 |
| 1,000 | $5.6 | $5,600.00 |
ATSAM4S16BA-UUR Overview
A microcontroller (MCU) integrates a processor core, memory, and peripherals on a single chip, forming the compute backbone of embedded systems within the wider hierarchy of semiconductor devices (MCU -> processor -> integrated circuit -> semiconductor). The SAM4S family, based on the ARM Cortex-M4 RISC core, adds a Memory Protection Unit (MPU), DSP instructions, and the Thumb-2 instruction set, making it a mid-range workhorse between simpler Cortex-M0+ parts and higher-end Cortex-M7 devices.
Key features include the 120 MHz Cortex-M4 core with hardware DSP support, 1024 KB dual-bank Flash with ECC, Security Bit and lock functionality, and a multi-layer bus matrix with multi-channel DMA for high data-rate communication. Atmel's Flash read accelerator with optional cache memory boosts effective execution speed, while power consumption is approximately 200 uA/MHz, and supply operation spans 1.62 V to 3.6 V for battery-friendly designs.
Technically, the dual-bank Flash architecture enables safe in-application firmware updates (bank swap without an external bootloader), while ECC protects against single-bit Flash errors. The MPU supports functional-safety and RTOS memory partitioning. The SAM4S series is pin-to-pin and software compatible with SAM3N, SAM3S, SAM4N, and SAM7S legacy series in matching pin counts, providing a smooth migration path from Cortex-M3 designs.
Typical applications include industrial control and automation nodes, portable and wearable devices where the 4.42 x 3.42 mm WLCSP footprint saves board space, and IoT sensor endpoints requiring DSP capability for signal processing. The industrial temperature rating supports harsh environments.
Design consideration: WLCSP packages require precise PCB land-pattern design and reflow control; a via-in-pad or fanout strategy is needed to route 64 balls on two or more signal layers. Verify Flash wait-state settings at 120 MHz per the SAM4S family datasheet (document 60001419).
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet, combining verified web data from Mouser, DigiKey, LCSC, and Octopart as of 2026-09-20.
Drop-in alternatives for ATSAM4S16BA-UUR β same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAM4S16BA-UUR (same form factor and footprint) β differing in Flash Memory, Package, Mounting Type, Core Size, Series.
Quick Comparison Tool β Select alternative parts for side-by-side comparison:
ATSAM4S16BA-UURR
β Drop-Inπ Reference alternative (not in catalog)
ATSAM4LC8BA-UUR
β Drop-In β οΈ εζ°εΎ ιͺθ―β In Stock
$3.95 / Unit
View Datasheet βATSAM4S16BA-UUR Maximum Ratings & Electrical Characteristics
| Core Processor | ARM Cortex-M4 |
| Core Size | 32-bit single-core |
| Maximum Clock Speed | 120 MHz |
| Flash Memory | 1 MB (1M x 8), dual-bank |
| SRAM | 128 KB |
| Supply Voltage Range | 1.62 V to 3.6 V |
| Power Consumption | 200 uA/MHz |
| DSP Instructions | Yes |
| Memory Protection Unit | Yes (MPU) |
| Instruction Set | Thumb-2 |
| Flash Features | ECC, Security Bit, Lock |
| Package | 64-WLCSP (4.42 x 3.42 mm) |
| Mounting Type | Surface Mount |
| Operating Temperature | -40C to +85C (industrial) |
| Packaging | Tape & Reel (T&R) |
| RoHS / Green | Green, WLCSP, MRL A |
| Series | SAM4S |
ATSAM4S16BA-UUR 64-wlcsp (4.42 x 3.42 mm) Pin Configuration Guide
Pin configuration for ATSAM4S16BA-UUR (64-wlcsp (4.42 x 3.42 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAM4S16BA-UUR.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAM4S16BA-UUR is suitable for 6 applications: Industrial Control and Automation, Portable and Wearable Devices, IoT Sensor Endpoints, Consumer Audio and Signal Processing, Legacy Design Migration (SAM7S / SAM3S Upgrade), Medical and Health Monitoring.
Industrial Control and Automation
The ATSAM4S16BA-UUR fits industrial control nodes that need both processing headroom and deterministic peripherals. Its 120 MHz Cortex-M4 with DSP instructions handles PID loops, digital filtering, and basic condition monitoring, while the 1 MB dual-bank Flash with ECC stores substantial firmware plus logging data and survives noisy electrical environments without single-bit corruption. The multi-layer bus matrix and multi-channel DMA offload data movement between ADCs and communication ports, keeping CPU cycles free for control algorithms. In a PLC expansion module or motor-control board, the MCU typically runs the fieldbus stack while hardware peripherals handle timing-critical PWM generation. The industrial temperature rating of the -UUR ordering code supports cabinet-mounted electronics.
Recommended
Portable and Wearable Devices
The defining advantage of the ATSAM4S16BA-UUR for wearables is its 64-ball WLCSP measuring just 4.42 x 3.42 mm, which consumes only a few tens of square millimeters of board area. Combined with 200 uA/MHz active consumption and a 1.62 V to 3.6 V supply range, it runs directly from Li-ion cells through a small LDO or buck converter. The 1 MB Flash accommodates BLE or sensor-fusion firmware stacks, and the DSP instruction set accelerates pedometer, heart-rate, or gesture algorithms without a secondary DSP. Careful power-domain design using the MCU's low-power modes allows duty-cycled sampling that stretches battery life from days to weeks in fitness bands and medical patches.
Recommended
IoT Sensor Endpoints
IoT endpoints benefit from the ATSAM4S16BA-UUR's balance of memory and efficiency. The 1 MB Flash holds a full TCP/TLS or LoRaWAN stack alongside application logic, while 128 KB SRAM buffers sensor time series before uplink. DSP instructions support local FFT-based vibration or acoustic analysis, transmitting features instead of raw data to cut radio energy. The dual-bank Flash enables secure over-the-air firmware updates: new images download to the inactive bank, pass integrity checks, and the bank swap happens atomically on reboot. Multi-channel DMA moves ADC samples and UART traffic without CPU intervention, keeping the core in sleep modes between events to minimize average current.
Recommended
Consumer Audio and Signal Processing
The Cortex-M4 core in the ATSAM4S16BA-UUR includes single-cycle MAC and SIMD DSP instructions, letting it execute audio codecs, active-noise-cancellation filters, or equalization directly in software at 120 MHz. The SAM4S peripheral set includes I2S-class serial ports and high-speed DMA capable of sustaining continuous audio streams to a DAC or codec without gaps. The 1 MB Flash stores voice-prompt assets and multiple tuning profiles, and 128 KB SRAM provides double-buffered audio frames. In Bluetooth-speaker accessory boards or hearing-assist products where a dedicated audio DSP is cost-prohibitive, the SAM4S16 consolidates control and signal processing in one compact WLCSP device.
Recommended
Legacy Design Migration (SAM7S / SAM3S Upgrade)
The SAM4S series is pin-to-pin and software compatible with the SAM3N, SAM3S (48-, 64- and 100-pin versions), SAM4N, and SAM7S legacy series, per the SAM4S family datasheet. A product built on an aging SAM7S ARM7 or SAM3S Cortex-M3 can therefore move to the ATSAM4S16BA-UUR for 120 MHz performance and 1 MB Flash with minimal PCB change at matching pin counts. The Flash accelerator and optional cache preserve near-zero-wait-state execution, so code written for slower predecessors often meets new timing budgets simply by raising the clock. This makes the -UUR an attractive refresh vehicle for long-lived industrial products whose WLCSP-scale boards cannot be redesigned.
Recommended
Medical and Health Monitoring
Health monitoring devices exploit the ATSAM4S16BA-UUR's combination of DSP capability, memory, and small footprint. Biopotential front-ends feeding the ADC stream into the Cortex-M4's DSP instructions for digital filtering, QRS detection, or motion artifact removal at 120 MHz, well within real-time budgets. The Memory Protection Unit isolates safety-relevant firmware tasks, and dual-bank Flash with ECC protects stored patient configuration data against bit errors over product lifetime. The 4.42 x 3.42 mm WLCSP fits into patch-style monitors and handheld diagnostic instruments alike. Always verify the ordering code temperature grade and obtain Microchip's medical-grade documentation package where regulatory files are required.
Recommended
Recommended Products Summary
Engineering reference data for ATSAM4S16BA-UUR β comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAM4S16BA-UURR | ATSAM4LC8BA-UUR |
|---|---|---|---|
| Package | 64-WLCSP (4.42 x 3.42 mm) | 64-WLCSP - same | 64-WLCSP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Max Speed | ARM Cortex-M4 / 120 MHz | ARM Cortex-M4 / 120 MHz | ARM Cortex-M3 / 120 MHz |
| Flash Memory | 1 MB dual-bank with ECC | 1 MB dual-bank with ECC | 512 KB |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| Software Compatibility | SAM4S (base) | Binary identical | Not binary compatible (SAM4L peripherals) |
Key Differentiators
- Full SAM4S16 feature set in chip-scale footprint (vs ATSAM4S16BA-AU)
- Dual-bank Flash with ECC enables field updates (vs ATSAM4LC8BA-UUR)
- Hardware DSP acceleration (vs ATSAM3S8BA-MUR)
- Trade-off: assembly difficulty (vs ATSAM4S16BA-AU)
Design Notes
The 64-ball WLCSP requires NSMD copper pads sized per Microchip's recommended land pattern in the SAM4S datasheet, with a via-in-pad or buried fanout strategy to escape 0.4 mm-class ball pitch. Plan at least one internal layer for power/ground pour and route decoupling capacitors within 1-2 mm of supply balls. X-ray inspection is recommended post-reflow since solder joints are hidden beneath the die; rework of WLCSP parts is generally impractical, so prototype with extra boards.
Operate the core from a clean 1.62-3.6 V rail; at 120 MHz the core draws roughly 24 mA (200 uA/MHz) before peripherals. Place 100 nF ceramic capacitors at each supply ball pair plus one bulk 4.7-10 uF capacitor nearby. If a switching pre-regulator feeds the MCU, add an LC filter or ferrite because SAM4S ADC accuracy is sensitive to supply ripple. Estimated: a 3.7 V Li-ion feeding a 3.3 V LDO dissipates about (3.7-3.3) x 0.03 A = 12 mW, negligible for battery designs.
Configure Flash wait states correctly for 120 MHz operation per the SAM4S family datasheet (document 60001419); incorrect EEFC settings cause hard faults or corrupted reads at speed. Also review the SAM4S errata sheet before finalizing the clock plan for frequencies above 100 MHz. When using dual-bank firmware updates, never issue a bank swap while code executes from the target bank - boot from a small resident loader or swap from a reset state to avoid bricking the device in the field.
Keep the main crystal within 10-15 mm of the MCU oscillator balls with guard ground pours, and route fast peripheral buses (parallel capture, high-speed SPI) as short as possible on the top layer to limit reflections given the WLCSP's short bond wires. For analog signals, dedicate a quiet quadrant of the board away from switching regulators and use the SAM4S internal PLL sparingly during precision sampling to minimize clock jitter.
Compliance Information
Distributor listings (Mouser, LCSC) describe the part as GREEN with MRL A status, indicating RoHS-compliant lead-free construction. Formal REACH and conflict-minerals documentation should be requested from Microchip.
