ATSAMD20J16B-MNT - ARM Cortex-M0+ MCU 64KB Flash 64-VQFN
Référence : ATSAMD20J16B-MNT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $1.7 | $1,70 |
| 10 | $1.53 | $15,30 |
| 100 | $1.36 | $136,00 |
| 500 | $1.19 | $595,00 |
| 1 000 | $1.02 | $1 020,00 |
ATSAMD20J16B-MNT Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, peripherals, and I/O on one die. The ARM Cortex-M0+ is an energy-efficient 32-bit core designed for deterministic real-time control in deeply embedded systems. Within Microchip's SAM family, the SAM D20 sits at the low-power Cortex-M0+ tier; the broader hierarchy is ARM Cortex-M -> 32-bit MCU -> microcontroller -> semiconductor -> integrated circuit. Engineers choose the SAM D20 line when they need more compute than an 8-bit AVR but tighter power budgets than Cortex-M4/M7 parts.
Key features of the ATSAMD20J16B-MNT include 6 SERCOM channels (each configurable as USART, I2C, or SPI), a 12-bit 350 ksps ADC with up to 20 analog channels, a 10-bit 350 ksps DAC, two analog comparators, a 16-bit timer/counter (TC) block with 8 channels, a 32-bit real-time clock, a 256-channel peripheral touch controller (PTC), and full-speed USB 2.0 device support. The 64KB Flash supports in-application programming through the ROM bootloader, and the 8KB SRAM is sufficient for protocol stacks such as Modbus RTU or BLE controller-link layers with offloaded radio.
Architecturally, the SAM D20 couples the Cortex-M0+ core (Thumb-2 only, single-cycle I/O port) with a multi-layer AHB/APB bus matrix that lets SERCOM, ADC, DAC, and PTC operate concurrently with low CPU intervention. Idle current of a few microamps in STANDBY with RTC running, plus a 5.8 uA typical deep-sleep figure, makes the part suitable for battery-powered endpoints where the MCU must wake on touch, GPIO, or RTC events.
Typical applications include home-automation sensor hubs, smart-metering endpoints, consumer appliances with touch UIs, low-cost industrial sensor nodes, USB HID peripherals, and battery-powered IoT devices. The combination of Cortex-M0+ determinism, generous touch hardware, and USB makes it a strong fit for connected products that need a touch UI plus a tethered debug/update path.
A key design tip is to provide a 32.768 kHz crystal on XIN32/XOUT32 when the RTC must track time over sleep; without it, internal DFLL drift dominates long-term accuracy. Also, route VDDANA and VDDIO from the same 3.3V rail through separate ferrite beads to keep ADC noise low during SERCOM-heavy traffic. This page synthesizes distributor pricing, drop-in alternatives, and design notes that the standalone datasheet does not present in one view.
Alternatives de remplacement direct pour ATSAMD20J16B-MNT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD20J16B-MNT (même facteur de forme et même empreinte) — différant par ADC, Package, DAC, Core Architecture, MSL Level.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD20J16B-MN
✅ Remplacement direct✓ En stock
$1.73 / unité
Voir la fiche technique →ATSAMD20J16A-MNT
✅ Remplacement direct✓ En stock
$2.18 / unité
Voir la fiche technique →ATSAMD20J16A-MUT
✅ Remplacement direct✓ En stock
$1.45 / unité
Voir la fiche technique →ATSAMD20J16B-AN
✅ Remplacement direct✓ En stock
$2.85 / unité
Voir la fiche technique →ATSAMD20J15A-CNT
✅ Remplacement direct✓ En stock
$2.54 / unité
Voir la fiche technique →ATSAMD20J16B-MNT Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M0+ (32-bit, Thumb-2 only) |
| Maximum CPU Frequency | 48 MHz |
| Flash Memory | 64 KB |
| SRAM | 8 KB |
| Operating Voltage Range | 1.62 V to 3.63 V |
| Boîtier | 64-pin VQFN (9x9 mm) with exposed pad |
| I/O Pins | Up to 52 |
| ADC | 12-bit, up to 20 channels, 350 ksps |
| DAC | 10-bit, 1 channel, 350 ksps |
| SERCOM Channels | 6 (configurable USART/I2C/SPI) |
| USB | USB 2.0 Full-Speed Device |
| Touch Channels (PTC) | 256 (mutual- and self-capacitive) |
| Température de fonctionnement | -40 C to +105 C (industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de ATSAMD20J16B-MNT
| Broche 1 | PA00 — General-purpose I/O / XIN32 (32 kHz crystal in) |
| Broche 2 | PA01 — General-purpose I/O / XOUT32 (32 kHz crystal out) |
| Broche 3 | PA02 — General-purpose I/O / AIN0 (ADC input) |
| Broche 4 | PA03 — General-purpose I/O / AIN1 / VREFA reference |
| Broche 5 | GND — Ground |
| Broche 6 | VDDIO — I/O supply (1.62V to 3.63V) |
| Broche 7 | PA04 — General-purpose I/O / AIN2 |
| Broche 8 | PA05 — General-purpose I/O / AIN3 |
| Broche 9 | PA06 — General-purpose I/O / AIN4 |
| Broche 10 | PA07 — General-purpose I/O / AIN5 |
| Broche 11 | PA08 — General-purpose I/O / AIN6 / SERCOM0 PAD0 |
| Broche 12 | PA09 — General-purpose I/O / AIN7 / SERCOM0 PAD1 |
| Broche 13 | PA10 — General-purpose I/O / AIN8 / SERCOM0 PAD2 |
| Broche 14 | PA11 — General-purpose I/O / AIN9 / SERCOM0 PAD3 |
| Broche 15 | VDDANA — Analog supply (1.62V to 3.63V) |
| Broche 16 | GNDANA — Analog ground |
| Broche 17 | PB10 — General-purpose I/O |
| Broche 18 | PB11 — General-purpose I/O |
| Broche 19 | PA12 — General-purpose I/O / SERCOM2 PAD0 |
| Broche 20 | PA13 — General-purpose I/O / SERCOM2 PAD1 |
| Broche 21 | PA14 — General-purpose I/O / SERCOM2 PAD2 |
| Broche 22 | PA15 — General-purpose I/O / SERCOM2 PAD3 |
| Broche 23 | PA16 — General-purpose I/O / SERCOM1 PAD0 / I2S SCK |
| Broche 24 | PA17 — General-purpose I/O / SERCOM1 PAD1 / I2S FS |
| Broche 25 | PA18 — General-purpose I/O / SERCOM1 PAD2 / I2S MCK |
| Broche 26 | PA19 — General-purpose I/O / SERCOM1 PAD3 / I2S SD |
| Broche 27 | PB12 — General-purpose I/O |
| Broche 28 | PB13 — General-purpose I/O |
| Broche 29 | PB14 — General-purpose I/O |
| Broche 30 | PB15 — General-purpose I/O |
| Broche 31 | PA20 — General-purpose I/O / SERCOM3 PAD0 |
| Broche 32 | PA21 — General-purpose I/O / SERCOM3 PAD1 |
| Broche 33 | PA22 — General-purpose I/O / SERCOM3 PAD2 |
| Broche 34 | PA23 — General-purpose I/O / SERCOM3 PAD3 |
| Broche 35 | PA24 — General-purpose I/O / USB_DM |
| Broche 36 | PA25 — General-purpose I/O / USB_DP |
| Broche 37 | GND — Ground |
| Broche 38 | VDDIO — I/O supply |
| Broche 39 | PA26 — General-purpose I/O |
| Broche 40 | PA27 — General-purpose I/O |
| Broche 41 | PA28 — General-purpose I/O |
| Broche 42 | PA29 — General-purpose I/O / TC4 capture |
| Broche 43 | PA30 — General-purpose I/O / SWCLK |
| Broche 44 | PA31 — General-purpose I/O / SWDIO |
| Broche 45 | PB16 — General-purpose I/O |
| Broche 46 | PB17 — General-purpose I/O |
| Broche 47 | PB18 — General-purpose I/O |
| Broche 48 | PB19 — General-purpose I/O |
| Broche 49 | PB20 — General-purpose I/O |
| Broche 50 | PB21 — General-purpose I/O |
| Broche 51 | PB22 — General-purpose I/O |
| Broche 52 | PB23 — General-purpose I/O |
| Broche 53 | PB24 — General-purpose I/O |
| Broche 54 | PB25 — General-purpose I/O |
| Broche 55 | PB26 — General-purpose I/O |
| Broche 56 | PB27 — General-purpose I/O |
| Broche 57 | PB28 — General-purpose I/O |
| Broche 58 | PB29 — General-purpose I/O |
| Broche 59 | PB30 — General-purpose I/O |
| Broche 60 | PB31 — General-purpose I/O |
| Broche 61 | RESETN — Reset input, active low |
| Broche 62 | VDDCORE — Core supply (internal LDO output, decouple to ground) |
| Broche 63 | GND — Ground |
| Broche 64 | EP — Exposed thermal pad, connect to GND |
Applications typiques
ATSAMD20J16B-MNT convient pour 6 applications: Home Automation Sensor Hubs, Smart Metering Endpoints, USB HID Consumer Peripherals, Industrial Sensor Nodes, Battery-Powered Wearable Devices, Touch-Enabled Consumer Appliances.
Home Automation Sensor Hubs
The ATSAMD20J16B-MNT is well-suited for home-automation sensor hubs that aggregate temperature, humidity, occupancy, and air-quality data over multiple I2C/SPI sensor front-ends. Its six SERCOM channels map directly to the typical sensor count of a multi-room hub, and the 256-channel PTC peripheral enables capacitive touch controls without an external touch IC. The Cortex-M0+ runs at 48 MHz, providing headroom for a FreeRTOS-based scheduler with Modbus RTU or MQTT-SN over a sub-GHz radio daughterboard. Estimated deep-sleep current of ~5.8 uA with RTC running allows multi-year battery operation when the hub spends most of its life in standby.
Recommandé
Smart Metering Endpoints
Smart metering endpoints for electricity, gas, and water benefit from the ATSAMD20J16B-MNT's combination of 12-bit ADC, RTC with calendar mode, and industrial temperature range. The ADC can directly digitize current-sensor and voltage-divider outputs at 350 ksps, while the 16-bit TC block handles pulse counting from mechanical meter dials. The -40C to +105C rating suits outdoor enclosures in harsh climates, and the 1.62V to 3.63V supply range tolerates long-life lithium primary cells. SAM D20's STANDBY sleep with RTC wakeup keeps idle current in the single-digit microamp range, which is critical for 10 to 20-year field deployments.
Recommandé
USB HID Consumer Peripherals
The ATSAMD20J16B-MNT's integrated USB 2.0 Full-Speed device controller with on-chip transceiver makes it a natural fit for USB HID peripherals such as keyboards, mice, touchpads, and custom HID-class sensor interfaces. The 64KB Flash holds the Microchip ASF USB HID stack plus application logic, and the 8KB SRAM supports HID report buffers and a small RTOS tick. The 256-channel PTC peripheral supports wake-on-touch key matrices without an external keypad controller. Production testing is straightforward because USB enumeration and HID reports can be validated directly from a PC host.
Recommandé
Industrial Sensor Nodes
Industrial sensor nodes in factories and process plants leverage the ATSAMD20J16B-MNT's 12-bit ADC, 1.62V to 3.63V supply tolerance, and industrial -40C to +105C operating range. The SERCOM set supports RS-485, I2C sensor buses, and SPI ADCs simultaneously, while the 10-bit DAC can drive 4-20 mA loops through an external V/I converter. The Cortex-M0+ deterministic interrupt latency suits simple closed-loop control without an RTOS. SEGGER J-Link and Microchip MPLAB ICD 4 are both supported for field firmware updates over the SWD interface.
Recommandé
Battery-Powered Wearable Devices
Battery-powered wearables such as fitness bands, BLE beacons, and medical patches benefit from the ATSAMD20J16B-MNT's low-power modes, small 64-VQFN footprint, and integrated peripherals that remove external components. STANDBY mode with RTC and RAM retention draws a few microamps; deep-sleep drops further to sub-1 uA figures typical of the family. The PTC peripheral supports gesture or touch inputs on plastic enclosures without mechanical buttons. Pairing the SAM D20 with an external BLE module such as the RN4870 keeps the MCU in low-power states until the radio wakes it on a sensor event.
Recommandé
Touch-Enabled Consumer Appliances
Touch-enabled consumer appliances such as induction cooktops, microwave ovens, and washing machines use the ATSAMD20J16B-MNT's 256-channel PTC to replace mechanical keypads with capacitive sliders and wheels. The 12-bit ADC digitizes additional analog inputs such as temperature sensors and water-level probes, while the SERCOM peripherals drive LED matrices, segment LCDs (via companion chip), or I2C-controlled audio amplifiers. The Cortex-M0+ at 48 MHz handles state-machine firmware plus a small GUI without breaking a sweat. Industrial temperature rating supports the hot environments behind stove control panels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD20J16B-MNT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD20J16B-MN | ATSAMD20J16A-MNT | ATSAMD20J16A-MUT | ATSAMD20J16B-AN | ATSAMD20J15A-CNT |
|---|---|---|---|---|---|---|
| Package | 64-VQFN (9x9 mm) | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-VQFN (9x9 mm) - same | 64-TQFP (different land pattern) | 64-VQFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ |
| Max CPU Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB (-50%) |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB | 4 KB (-50%) |
| Operating Voltage | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V | 1.62 V to 3.63 V |
| Operating Temperature | -40 C to +105 C (industrial) | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C |
| Silicon Revision | B (latest) | B | A | A | B | A |
Principaux différenciateurs
- Latest silicon revision B with documented errata fixes (vs ATSAMD20J16A-MNT)
- Lower cost than the J18 variant when 64KB is sufficient (vs ATSAMD20J18A-MU)
- 256-channel PTC eliminates external touch controller (vs External AT42QT1070 touch IC)
Notes de conception
Estimated: at CPU = 48 MHz, VDDIO = 3.3V, peripherals idle, ATSAMD20J16B-MNT core current is around 7 mA active and ~5.8 uA in STANDBY with RTC. Decouple VDDCORE (pin 62) with a 1 uF X7R ceramic placed within 2 mm of the pin, and bulk-decouple VDDIO/VDDANA rails with at least 4.7 uF plus 100 nF pairs. Separate VDDIO and VDDANA through ferrite beads if analog performance is critical, since digital switching noise on VDDANA degrades ADC SNR.
A common mistake is to leave XIN32/XOUT32 (PA00/PA01) floating when the RTC is used. The SAM D20 requires an external 32.768 kHz crystal or a digital clock source on XIN32 for accurate RTC timing; without it the internal DFLL drifts several percent per hour. Also, the SWD pins PA30 (SWCLK) and PA31 (SWDIO) must not be repurposed as GPIO in production firmware without first disabling the SWD interface in NVMUSERROW, otherwise the device bricks and requires a recovery sequence.
Estimated: at 48 MHz and full I/O toggle, typical power dissipation is below 25 mW, well within the 64-VQFN's thermal envelope. The exposed thermal pad (pin 64 / EP) must be soldered to a ground pour of at least 25 mm^2 to keep theta_JA within the datasheet's 30 C/W range. Forced-air cooling is not required in consumer/industrial deployments, but a continuous ground pour on the top layer above the EP is recommended for double-sided boards to spread heat into the inner plane.
Keep the 32.768 kHz crystal traces short and symmetric, surrounded by a ground guard ring, and route them on the top layer without vias. The USB DP/DM differential pair (PA24/PA25) requires 90-ohm differential impedance and should be length-matched within 150 mil; place the USB connector within 25 mm to meet Full-Speed signal-integrity requirements. Reserve PA30/PA31 as SWD unless you have an explicit plan to disable SWD permanently, since they are also the only factory-programming path.
Informations de conformité
RoHS and REACH compliance per Microchip product page. Lead-free and halogen-free per Microchip material declaration. Not AEC-Q100 qualified; for automotive applications select an AEC-Q100 Grade variant from the SAM DA family.
