ATSAMD51G19A-MF - 120MHz Cortex-M4F MCU, 512KB Flash | Microchip
Référence : ATSAMD51G19A-MF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.85 | $6,85 |
| 10 | $6.16 | $61,60 |
| 100 | $5.48 | $548,00 |
| 500 | $4.93 | $2 465,00 |
| 1 000 | $4.45 | $4 450,00 |
ATSAMD51G19A-MF Présentation
A microcontroller (MCU) is a single-chip computer that combines a processor core, program and data memory, and a rich set of on-chip peripherals. The Cortex-M4F core specifically adds DSP extensions and an FPU so the SAM D51 can execute single-precision floating-point operations in hardware, accelerating signal-processing and control loops. Microcontrollers sit below microprocessors in the embedded hierarchy (MCU -> 32-bit MCU -> ARM Cortex-M -> Cortex-M4F -> SAM D51 family), and above simple digital logic ICs, occupying the "compute + control" tier of the system. The SAM D51 series in particular targets connected, low-power, and human-machine-interface applications.
Key features include a Cortex-M4F core with FPU at 120 MHz, 512 KB dual-bank Flash with error-correction, up to 192 KB SRAM with ECC, a 12-bit 1 MSPS ADC with up to 16 channels, a 12-bit 1 MSPS DAC, USB 2.0 Full-Speed with integrated PHY, up to 6 SERCOM serial interfaces, I2S, CAN-FD, and an on-chip 32 kHz RTC plus multiple timers. The 48-QFN package exposes 38 GPIO, multiple analog and digital peripherals, and operates from 1.71 V to 3.6 V with industrial -40C to +125C temperature range.
Architecturally, the SAM D51 uses Microchip's event system, peripheral touch controller, and configurable SERCOM blocks so that one peripheral can serve UART, SPI, I2C, or LIN on the fly. The dual-panel Flash allows live firmware updates (in-place + simultaneous writes) without external memory, while ECC protects against bit flips in safety-relevant code paths. The integrated USB PHY removes external components, saving BOM cost in connected designs. Together these features let engineers add rich peripherals and connectivity to battery-powered or industrial devices without sacrificing determinism.
Typical applications include USB peripherals (HID, CDC, MIDI), industrial sensor hubs, motor and lighting controllers, IoT edge nodes, low-power audio front-ends, and HMI panels with touch. Designers frequently pair the SAM D51 with QSPI NOR flash for larger buffers, Ethernet controllers for wired connectivity, and MEMS sensors over I2C/SPI for environmental sensing.
When designing with the ATSAMD51G19A-MF, plan the boot sequence: the part supports secure boot, dual-bank OTA via flash overwrite, and configurable brown-out behavior. Use Atmel/Microchip Studio or MPLAB X with the START project generator to pick the right clock tree and pin-mux configuration before committing to PCB layout. Ensure decoupling is placed close to all VDD/VDDIO pins and that the exposed pad of the QFN-48 is tied to a solid ground copper pour for thermal dissipation.
This page synthesizes distributor pricing, drop-in compatible alternatives from the SAM D51 and SAME51 families, and practical design notes not found in the manufacturer datasheet, giving engineers a single reference for sourcing and qualifying the ATSAMD51G19A-MF.
Alternatives de remplacement direct pour ATSAMD51G19A-MF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD51G19A-MF (même facteur de forme et même empreinte) — différant par SRAM, Package, ADC, DAC, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD51G18A-MF
✅ Remplacement direct✓ En stock
$5.11 / unité
Voir la fiche technique →ATSAMD51G19A-MU
✅ Remplacement direct✓ En stock
$5.4 / unité
Voir la fiche technique →ATSAMD51G19A-MFT
✅ Remplacement direct✓ En stock
$4.02 / unité
Voir la fiche technique →ATSAME51G19A-MF
✅ Remplacement direct✓ En stock
$5.35 / unité
Voir la fiche technique →ATSAME51G19A-MUT
✅ Remplacement direct✓ En stock
$5.04 / unité
Voir la fiche technique →ATSAMD51G18A-MFT
✅ Remplacement direct✓ En stock
$3.55 / unité
Voir la fiche technique →ATSAMD51G19A-MF Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4F with FPU and DSP |
| Maximum CPU Frequency | 120 MHz |
| Program Memory | 512 KB Flash (dual-panel, ECC) |
| SRAM | 192 KB |
| Operating Voltage Range | 1.71 V to 3.6 V |
| Boîtier | 48-QFN (7x7 mm) |
| GPIO Count | 38 |
| ADC | 12-bit, up to 1 MSPS, up to 16 channels |
| DAC | 12-bit, 1 MSPS, 2 channels |
| USB | USB 2.0 Full-Speed with integrated PHY |
| Serial Interfaces | Up to 6 SERCOM (UART/SPI/I2C/LIN) |
| CAN | CAN-FD |
| Audio Interface | I2S |
| Timers | Multiple TC, TCC, and 32-bit RTC |
| Température de fonctionnement | -40C to +125C (industrial, "M" grade) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Guide de configuration des broches du ATSAMD51G19A-MF 48-qfn (7x7 mm)
Configuration des broches du ATSAMD51G19A-MF (boîtier 48-qfn (7x7 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAMD51G19A-MF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAMD51G19A-MF convient pour 6 applications: USB HID and CDC Peripherals, Industrial Sensor Hubs and Data Loggers, Motor Control and Lighting Drivers, Low-Power Audio Front-Ends, IoT Edge Nodes with BLE/Wi-Fi Companion, Human-Machine Interface Panels.
USB HID and CDC Peripherals
The ATSAMD51G19A-MF is well suited for USB peripherals such as HID input devices, CDC virtual COM ports, MIDI controllers, and generic USB-to-UART bridges. Its integrated USB 2.0 Full-Speed PHY eliminates the external transceiver usually required, reducing BOM cost and PCB area. With the Cortex-M4F core at 120 MHz, USB enumeration and protocol stacks run with ample headroom, and the 512 KB dual-bank Flash allows full USB stacks (TinyUSB, LUFA, or Microchip ASF) plus application code without external memory.
Recommandé
Industrial Sensor Hubs and Data Loggers
In industrial sensor hubs, the ATSAMD51G19A-MF aggregates data from multiple sensors over SERCOM (I2C, SPI), then transmits over USB, CAN-FD, or UART. The 12-bit 1 MSPS ADC handles analog transducers such as RTDs and load cells, while the 192 KB SRAM buffers large sample windows before transmission. Industrial -40C to +125C temperature range and 1.71-3.6 V supply tolerance allow operation directly from 24 V industrial rails stepped down to 3.3 V.
Recommandé
Motor Control and Lighting Drivers
For stepper, BLDC, and DC motor control, the ATSAMD51G19A-MF provides multiple TCC (Timer/Counter for Control) peripherals with complementary PWM outputs and dead-time insertion, plus 6 SERCOM channels to drive gate drivers and read Hall sensors. In LED lighting controllers, the 12-bit DAC and PWM channels dim channels smoothly while the Cortex-M4F DSP extensions compute color-mixing algorithms in real time. The wide 1.71-3.6 V supply supports battery-powered LED strips and constant-current drivers.
Recommandé
Low-Power Audio Front-Ends
The ATSAMD51G19A-MF's I2S interface and 12-bit dual DAC make it a viable front-end for low-bandwidth audio synthesis or playback in toys, kiosks, and notification devices. The Cortex-M4F FPU accelerates MP3 and AAC decode libraries in software, removing the need for a dedicated audio DSP. Designers can output audio through the on-chip DAC for headphone or line-level amplification, or through I2S to an external codec such as the SGTL5000 for higher fidelity.
Recommandé
IoT Edge Nodes with BLE/Wi-Fi Companion
When paired with an external ATWINC3400 Wi-Fi module or BTLC1000 Bluetooth LE module, the ATSAMD51G19A-MF serves as a powerful IoT edge node computing local analytics before cloud upload. SERCOMs handle the SPI/handshake to the wireless module while the Cortex-M4F runs MQTT-SN, CoAP, or LwM2M stacks on top of FreeRTOS. The dual-bank Flash enables secure over-the-air firmware updates - essential for any IoT device shipped to the field.
Recommandé
Human-Machine Interface Panels
For HMI panels combining touch input, display output, and connectivity, the ATSAMD51G19A-MF drives color TFTs via SPI or parallel interface, reads capacitive touch via the integrated Peripheral Touch Controller (PTC), and communicates with the host PLC or controller via CAN-FD. The 120 MHz Cortex-M4F runs LVGL or TouchGFX GUIs at 60 fps, and the USB and CAN-FD interfaces support simultaneous field-bus and debug channels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD51G19A-MF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD51G18A-MF | ATSAMD51G19A-MU | ATSAMD51G19A-MFT | ATSAME51G19A-MF | ATSAME51G19A-MUT | ATSAMD51G18A-MFT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 48-QFN (7x7 mm) | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same | 48-QFN (7x7 mm) - same |
| Core | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz | Cortex-M4F @ 120 MHz |
| Flash | 512 KB | 256 KB | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB |
| SRAM | 192 KB | 128 KB | 192 KB | 192 KB | 192 KB | 192 KB | 128 KB |
| USB | USB FS with PHY | USB FS with PHY | USB FS with PHY | USB FS with PHY | USB FS with PHY | USB FS with PHY | USB FS with PHY |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +125C |
| Power Profile | Standard SAM D51 | Standard SAM D51 | Standard SAM D51 | Standard SAM D51 | Lower-power SAME51 | Lower-power SAME51 | Standard SAM D51 |
| Packaging Form | Tray | Tray | Tray | Tape & Reel | Tray | Tape & Reel | Tape & Reel |
Principaux différenciateurs
- Higher Flash and SRAM than the G18 sibling in the same footprint (vs ATSAMD51G18A-MF)
- Same-family lower-power variant available as drop-in (vs ATSAME51G19A-MF)
- Industrial-grade temperature variant for harsh environments (vs ATSAMD51G19A-MU)
Notes de conception
The 48-QFN package has an exposed thermal pad (EP) on its underside that MUST be soldered to a continuous ground copper pour on the top layer with at least 9 thermal vias stitching to inner ground planes. Skipping the EP connection causes severe thermal derating and EMI issues. Place 0.1 uF decoupling capacitors within 2 mm of every VDD and VDDIO pin, plus a 4.7 uF bulk capacitor near the supply pin cluster.
Keep the 32.768 kHz crystal traces short and surrounded by a ground guard ring to minimize load capacitance drift. The HSUSB D+/D- traces should be 90 ohm differential and length-matched within 2 mm; route them on the top layer over a continuous ground plane and avoid splitting ground beneath. SERCOM signals are pin-mux flexible - use Microchip START or MPLAB Harmony code generator to assign functions and avoid conflicts with the SWD debug pins (SWDIO, SWCLK).
Do not lock the Cortex-M4F core at 120 MHz without confirming the NVM controller wait-states match the chosen clock frequency - failing this causes Flash read errors and hard-faults. When enabling dual-bank OTA, always set the BODVDD threshold at or above the minimum supply, otherwise a brownout during a Flash swap can brick the device. Finally, do not tie NRST directly to VDD - leave a 10 kohm pull-up and a debug-connector footprint to recover from failed firmware.
Estimated: at 120 MHz active CPU + USB + ADC continuous conversion, the device dissipates approximately 60 mW worst case. The 48-QFN with proper EP soldering yields theta_JA near 30 C/W on a 4-layer JEDEC board, giving roughly 1.8 C rise per 60 mW. Industrial -40C to +125C operation is supported without forced cooling in typical enclosed product enclosures - this is an estimate, not a datasheet figure.
Informations de conformité
RoHS and lead-free per distributor product listings. AEC-Q100 not specifically qualified - choose SAM D51 AEC-Q100 qualified part variants if automotive compliance is required.
