ATSAMD51G19A-MU - 120MHz Cortex-M4F MCU 512KB Flash | Microchip
Référence : ATSAMD51G19A-MU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.58 | $75,80 |
| 100 | $6.75 | $675,00 |
| 500 | $6.05 | $3 025,00 |
| 1 000 | $5.4 | $5 400,00 |
ATSAMD51G19A-MU Présentation
An ARM Cortex-M4F microcontroller is a 32-bit processor core built on the ARMv7-M architecture, featuring a hardware single-precision Floating Point Unit (FPU) compliant with IEEE 754, a Memory Protection Unit (MPU), and DSP extensions. Within the broader taxonomy, the ATSAMD51G19A-MU is an MCU, a sub-category of microcontrollers, which falls under Embedded Processors and Controllers in the Integrated Circuits family. The Cortex-M4F core enables efficient execution of complex math, sensor-fusion algorithms, and audio processing without external DSP hardware.
Key features include an integrated FPU for floating-point math, 512 KB of program storage, 192 KB SRAM, a Cryptographic Accelerator for AES, True Random Number Generator (TRNG), Public Key Cryptography support, and a high-speed Multi-bit ECC-protected Flash. The device provides advanced connectivity with a 12-bit 1 Msps ADC, 12-bit DAC, analog comparators, multiple SERCOM interfaces configurable as UART/SPI/I2C, and a high-speed USB 2.0 interface. The 48-QFN package features a thermal pad for improved thermal dissipation.
Technically, the ATSAMD51G19A-MU runs at a maximum CPU clock of 120 MHz delivering 150 DMIPS and 273 CoreMark performance. The dual-panel Flash architecture supports simultaneous read-while-write operations, enabling live firmware updates without halting execution. Power management includes multiple low-power Sleep modes and an integrated buck converter for core supply, reducing overall system power consumption. The Event System and Peripheral Touch Controller (PTC) support capacitive touch sensing directly on hardware pins.
Typical applications include IoT edge nodes, industrial control and HMI panels, audio processing devices with USB audio class support, smart sensor hubs with on-device sensor fusion, motor control with FOC algorithms, and wearable health monitoring devices. The cryptographic accelerator and TRNG also make it suitable for secure connected devices requiring hardware-rooted identity.
When designing with this MCU, allocate sufficient decoupling capacitance near each supply pin and ensure the thermal pad is soldered to a properly sized copper pour for optimal heat dissipation. Configure the GCLK generators carefully to avoid peripheral clock conflicts, and validate that the chosen FPU code paths are properly compiled with hardware floating-point flags.
This page synthesizes distributor pricing, drop-in same-brand and cross-brand alternatives, and practical design notes not found in the manufacturer datasheet alone, providing a faster cross-reference for engineers selecting Cortex-M4F microcontrollers in compact 48-pin QFN packages.
Alternatives de remplacement direct pour ATSAMD51G19A-MU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD51G19A-MU (même facteur de forme et même empreinte) — différant par DAC, SRAM, Core, USB, Package.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME51G19A-MU
✅ Remplacement direct✓ En stock
$5.65 / unité
Voir la fiche technique →ATSAMD51G19A-MUT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD51G18A-MUT-EFP
✅ Remplacement direct✓ En stock
$4.42 / unité
Voir la fiche technique →ATSAMD51G19A-MFT
✅ Remplacement direct✓ En stock
$4.02 / unité
Voir la fiche technique →ATSAMD51G19A-MU-EFP
✅ Remplacement direct✓ En stock
$4.85 / unité
Voir la fiche technique →ATSAMD51G18A-MUT-EFP
✅ Remplacement direct✓ En stock
$4.42 / unité
Voir la fiche technique →ATSAMD51G19A-MU Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4F with FPU |
| Maximum CPU Frequency | 120 MHz |
| CoreMark Performance | 273 |
| DMIPS | 150 |
| Program Flash Memory | 512 KB (512K x 8) dual-panel with ECC |
| SRAM | 192 KB |
| Plage de température de fonctionnement | -40C to +85C (industrial) |
| Boîtier | 48-VFQFN Exposed Pad (7x7 mm) |
| Type de montage | Surface Mount |
| ADC | 12-bit, up to 1 Msps |
| DAC | 12-bit |
| USB Interface | USB 2.0 High-Speed with on-chip transceiver |
| Cryptographic Accelerator | AES, TRNG, Public Key Cryptography |
| Niveau MSL | MSL3 (168 hours) |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Configuration des broches de ATSAMD51G19A-MU
| Broche 1 | PA00 — General purpose I/O / SERCOM / ADC |
| Broche 2 | PA01 — General purpose I/O / SERCOM / ADC |
| Broche 3 | PA02 — General purpose I/O / SERCOM / ADC / DAC |
| Broche 4 | PA03 — General purpose I/O / SERCOM / ADC / DAC |
| Broche 5 | PA04 — General purpose I/O / SERCOM / ADC |
| Broche 6 | PA05 — General purpose I/O / SERCOM / ADC |
| Broche 7 | PA06 — General purpose I/O / SERCOM / ADC |
| Broche 8 | PA07 — General purpose I/O / SERCOM / ADC |
| Broche 9 | PA08 — General purpose I/O / SERCOM |
| Broche 10 | PA09 — General purpose I/O / SERCOM |
| Broche 11 | PA10 — General purpose I/O / SERCOM |
| Broche 12 | PA11 — General purpose I/O / SERCOM |
| Broche 13 | VSS — Ground |
| Broche 14 | VDDIO — I/O supply voltage |
| Broche 15 | PA12 — General purpose I/O / SERCOM |
| Broche 16 | PA13 — General purpose I/O / SERCOM |
| Broche 17 | PA14 — General purpose I/O / SERCOM |
| Broche 18 | PA15 — General purpose I/O / SERCOM |
| Broche 19 | PA16 — General purpose I/O / SERCOM |
| Broche 20 | PA17 — General purpose I/O / SERCOM |
| Broche 21 | PA18 — General purpose I/O / SERCOM |
| Broche 22 | PA19 — General purpose I/O / SERCOM |
| Broche 23 | PA20 — General purpose I/O / SERCOM |
| Broche 24 | PA21 — General purpose I/O / SERCOM |
| Broche 25 | PA22 — General purpose I/O / SERCOM |
| Broche 26 | PA23 — General purpose I/O / SERCOM |
| Broche 27 | PA24 — General purpose I/O / SERCOM |
| Broche 28 | PA25 — General purpose I/O / SERCOM |
| Broche 29 | PB00 — General purpose I/O / SERCOM |
| Broche 30 | PB01 — General purpose I/O / SERCOM |
| Broche 31 | PB02 — General purpose I/O / SERCOM / ADC |
| Broche 32 | PB03 — General purpose I/O / SERCOM / ADC |
| Broche 33 | PB04 — General purpose I/O / SERCOM |
| Broche 34 | PB05 — General purpose I/O / SERCOM |
| Broche 35 | PB06 — General purpose I/O / SERCOM |
| Broche 36 | PB07 — General purpose I/O / SERCOM |
| Broche 37 | PB08 — General purpose I/O / SERCOM |
| Broche 38 | PB09 — General purpose I/O / SERCOM |
| Broche 39 | PB10 — General purpose I/O / SERCOM |
| Broche 40 | PB11 — General purpose I/O / SERCOM |
| Broche 41 | VDD — Core supply voltage |
| Broche 42 | VSS — Ground |
| Broche 43 | VDDANA — Analog supply voltage |
| Broche 44 | VREGA — Voltage regulator analog output |
| Broche 45 | VBUS — USB VBUS detect |
| Broche 46 | DM — USB D- line |
| Broche 47 | DP — USB D+ line |
| Broche 48 | RESET — Reset (active low) |
Applications typiques
ATSAMD51G19A-MU convient pour 6 applications: IoT Edge Nodes and Connected Sensors, Industrial HMI and Control Panels, USB Audio Devices and Digital Audio Interfaces, Motor Control and Field-Oriented Control (FOC), Wearable Health Monitoring Devices, Secure Connected Devices and Edge Security Gateways.
IoT Edge Nodes and Connected Sensors
The ATSAMD51G19A-MU is well suited for IoT edge nodes that aggregate and pre-process multiple sensor streams before forwarding them to the cloud. Its 120 MHz Cortex-M4F core with hardware FPU executes sensor-fusion and on-device analytics in real time, while 192 KB SRAM comfortably holds rolling-window buffers for accelerometer, gyroscope, and environmental sensors. The integrated AES and TRNG crypto accelerators enable secure TLS handshakes, and SERCOM modules provide UART/SPI/I2C for sensor expansion. Placed on a compact 7x7 mm PCB, the device consumes roughly 20 mA active at 120 MHz with all peripherals running. Designers typically pair it with a Wi-Fi or BLE module via SERCOM, and a sub-GHz radio over SPI for long-range links. Compared with Cortex-M0+ parts, the M4F's DSP instructions accelerate FFT and Kalman filtering up to 5x, reducing overall system power by completing compute tasks faster and returning to sleep sooner.
Recommandé
Industrial HMI and Control Panels
Industrial HMI panels and operator interface terminals benefit from the ATSAMD51G19A-MU's combination of processing throughput, USB High-Speed, and CAN-FD connectivity. Its 120 MHz Cortex-M4F core drives TFT LCDs up to 480x272 with hardware-accelerated graphics via the Parallel Capture Controller, while 192 KB SRAM supports double-buffered frame buffers without external memory. The integrated 12-bit ADC reads analog sensor inputs such as temperature and pressure with 1 Msps throughput, and CAN-FD enables deterministic communication with industrial motor drives and PLCs at 5 Mbps. Designed for harsh industrial environments, the device operates from -40C to +85C and integrates robust error correction on Flash. The exposed pad on the 48-QFN package simplifies PCB thermal management when the MCU drives power-hungry backlights. Designers typically add external RS-485 transceivers via a dedicated SERCOM channel for legacy fieldbus interoperability alongside CAN-FD.
Recommandé
USB Audio Devices and Digital Audio Interfaces
The ATSAMD51G19A-MU is a strong fit for USB audio interfaces such as USB headphones, DACs, and audio streaming dongles. Its USB 2.0 High-Speed peripheral and on-chip 12-bit DAC enable direct headphone amplification with minimal external components. The Cortex-M4F core with FPU runs real-time audio effects, parametric EQ, and ASRC algorithms at low CPU overhead, leaving bandwidth for future feature additions. With 512 KB Flash, ample headroom exists for codec firmware, while 192 KB SRAM buffers uncompressed 24-bit/48 kHz stereo streams without dropouts. SERCOM peripherals drive external I2S codecs and S/PDIF transmitters over high-speed SPI. Compared with lower-end Cortex-M0+ parts, the M4F delivers DSP throughput roughly 4-5x higher for the same clock rate, eliminating the need for an external DSP. Typical designs pair the MCU with a TPA6130A2 headphone amplifier and a CS4272 audio codec for a complete 24-bit USB audio path.
Recommandé
Motor Control and Field-Oriented Control (FOC)
The ATSAMD51G19A-MU is well matched to brushless DC motor control applications including drones, e-bikes, and industrial pumps requiring field-oriented control. Its 120 MHz Cortex-M4F core with single-precision FPU executes the Park and Clarke transforms for FOC at sub-microsecond intervals, supporting motor PWM frequencies up to 50 kHz with ample processing headroom. The integrated 12-bit 1 Msps ADC samples phase currents synchronously with PWM, while the PWM peripheral with complementary outputs and hardware dead-time insertion directly drives three-phase inverter bridges. The ATSAMD51G19A-MU's AES and TRNG cryptographic blocks also support secure boot for motor controllers used in safety-critical applications. Designers typically add external gate drivers such as the Microchip MCP8026 and three half-bridge MOSFET stages; the MCU's exposed pad 48-QFN package dissipates roughly 1.5 W during active control loops without an additional heatsink.
Recommandé
Wearable Health Monitoring Devices
The ATSAMD51G19A-MU powers wearable health monitoring devices such as fitness bands, smart watches, and continuous glucose monitors where compute density must be balanced against battery life. Its Cortex-M4F core executes heart-rate variability algorithms, step counting, and SpO2 calculation in real time using the hardware FPU, while integrated low-power Sleep modes drop active consumption to single-digit microamps for standby. The Peripheral Touch Controller (PTC) enables capacitive touch buttons and sliders directly on the PCB, reducing BOM cost. With 512 KB Flash and 192 KB SRAM, the device stores firmware, RTOS, and rolling biosignal buffers without external memory. The integrated crypto accelerators also support secure pairing with companion mobile apps. Compared with Cortex-M0+ wearables MCUs, the ATSAMD51G19A-MU delivers roughly 3x DSP throughput at the same clock, allowing compute-heavy health algorithms to finish faster and return the device to deep sleep sooner.
Recommandé
Secure Connected Devices and Edge Security Gateways
The ATSAMD51G19A-MU serves as the main controller in secure connected devices and edge security gateways that require hardware-rooted identity and on-device cryptography. Its AES accelerator, True Random Number Generator, and Public Key Cryptography engine accelerate TLS handshakes and on-device certificate validation without burdening the CPU. The Cortex-M4F runs MQTT-SN, CoAP, or custom IoT protocol stacks with sufficient headroom for application logic. USB High-Speed supports secure provisioning interfaces and firmware updates via signed images. With 512 KB dual-panel Flash and ECC, the device supports read-while-write secure boot, enabling live firmware patches without halting critical security functions. Compared with software-only crypto implementations on M0+ parts, the ATSAMD51G19A-MU executes AES-256 typically 8-10x faster and RSA signature verification approximately 5x faster, reducing session-establishment latency in connected products.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD51G19A-MU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME51G19A-MU | ATSAMD51G19A-MUT | ATSAMD51G18A-MU | ATSAMD51G19A-MFT | ATSAMD51G19A-MU-EFP | ATSAMD51G18A-MUT-EFP |
|---|---|---|---|---|---|---|---|
| Package | 48-VFQFN (7x7 mm) | 48-VFQFN (7x7 mm) - same | 48-VFQFN (7x7 mm) - same | 48-VFQFN (7x7 mm) - same | 48-VFQFN (7x7 mm) - same | 48-VFQFN (7x7 mm) - same | 48-VFQFN (7x7 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core | ARM Cortex-M4F @120MHz | ARM Cortex-M4F @120MHz - same | ARM Cortex-M4F @120MHz - same | ARM Cortex-M4F @120MHz - same | ARM Cortex-M4F @120MHz - same | ARM Cortex-M4F @120MHz - same | ARM Cortex-M4F @120MHz - same |
| Flash Memory | 512 KB | 512 KB - same | 512 KB - same | 256 KB (-50%) | 512 KB - same | 512 KB - same | 256 KB (-50%) |
| SRAM | 192 KB | 192 KB - same | 192 KB - same | 128 KB (-33%) | 192 KB - same | 192 KB - same | 128 KB (-33%) |
| Ethernet MAC | No | Yes (10/100) | No - same | No - same | No - same | No - same | No - same |
| USB High-Speed | Yes | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same | Yes - same |
| Operating Temperature | -40C to +85C | -40C to +85C - same | -40C to +85C - same | -40C to +85C - same | -40C to +125C (extended) | -40C to +85C - same | -40C to +85C - same |
| Approx. Unit Price (qty 100, as of 2026-09-21) | $6.75 | ~$7.50 | $6.75 - same | ~$5.50 | ~$7.20 | ~$6.80 | ~$5.55 |
Principaux différenciateurs
- Adds hardware Ethernet MAC versus the D51 baseline (vs ATSAMD51G19A-MU)
- Halves Flash and SRAM for cost-sensitive designs (vs ATSAMD51G18A-MU)
- Extended temperature range for harsh environments (vs ATSAMD51G19A-MFT)
Notes de conception
Estimated: The ATSAMD51G19A-MU integrates a buck converter that should be configured with a 4.7uH inductor, 4.7uF input capacitor, and 4.7uF output capacitor on VREGA. Place these components as close to the IC as possible, within 5 mm of the respective pins, to minimize switching ripple. For noise-sensitive analog peripherals, connect VDDA through a ferrite bead from VDDIO rather than a direct short, isolating the analog supply from digital switching transients.
The 48-VFQFN package exposes a thermal pad on the underside that must be soldered to a copper pour of at least 50x50 mm for adequate heat spreading. Without proper pad soldering, junction temperature can rise 30C above ambient under sustained 120 MHz operation, reducing long-term reliability. Microchip recommends thermal vias in a 1.2 mm pitch array to conduct heat from the top layer to internal ground planes.
Place a 100 nF decoupling capacitor on every VDD and VDDIO pin, plus a single 4.7 uF bulk capacitor per supply rail. Keep the USB DP/DM trace lengths within 2 mm of each other and matched to 90 ohm differential impedance to comply with USB 2.0 High-Speed signal integrity requirements. Avoid routing SERCOM signals through the thermal pad area to prevent coupling noise into sensitive analog peripherals.
Do not enable the FPU in the Cortex-M4F without first ensuring your toolchain is configured with hardware floating-point ABI flags (-mfloat-abi=hard). Skipping this step causes linker errors or silent fallback to soft-float. Additionally, verify that GCLK generators do not exceed 100 MHz at the source clock output, as some peripherals do not support higher frequencies regardless of the CPU divider settings.
Informations de conformité
RoHS compliant per Microchip product page. Industrial temperature grade -40C to +85C; for AEC-Q100 automotive qualification, see ATSAMD51G19A-MFT variant or consult Microchip automotive-grade part numbers.
