ATSAMD51J18A-MF - 120MHz Cortex-M4F MCU, 256KB Flash | Microchip
Référence : ATSAMD51J18A-MF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.5 | $7,50 |
| 10 | $6.8 | $68,00 |
| 100 | $5.95 | $595,00 |
| 500 | $5.2 | $2 600,00 |
| 1 000 | $4.6 | $4 600,00 |
ATSAMD51J18A-MF Présentation
A 32-bit ARM Cortex-M4F microcontroller is a programmable system-on-chip integrating a high-performance processor core, Flash program memory, SRAM, and a rich set of analog and digital peripherals into a single IC. The Cortex-M4F architecture sits within the broader ARM Cortex-M family of embedded cores, which is widely adopted for connected, low-power, and signal-processing IoT and industrial designs.
Key features of the ATSAMD51J18A-MF include 120 MHz core operation with FPU, 256 KB Flash and 128 KB SRAM, USB 2.0 Full-Speed device/host, two CAN-FD interfaces, a 12-bit 1 MSPS ADC, two 12-bit DACs, multiple SERCOM peripherals for I2C/SPI/UART, and an integrated PTC touch controller. The 64-pin QFN-9x9 with exposed thermal pad enables compact PCB layouts while providing a low thermal resistance path.
On-chip peripherals include a 12-bit 1 MSPS ADC with up to 16 analog channels, two 12-bit DAC channels, multiple SERCOM modules configurable as UART/SPI/I2C, an I2S/serial audio interface, a hardware cryptographic module, and an Event System for low-latency inter-peripheral signaling without CPU intervention. The integrated FPU accelerates single-precision DSP workloads such as audio processing, sensor fusion, and motor-control algorithms.
Typical applications for the ATSAMD51J18A-MF include industrial automation controllers, USB-connected IoT gateways, automotive body and HMI modules, audio-processing subsystems, smart-sensor hubs, and human-machine interface panels with capacitive touch. The combination of USB, CAN-FD, ADC, and touch peripherals allows a single MCU to consolidate what previously required multiple ICs.
When designing with this part, ensure the exposed pad is soldered to a sufficient copper pour to maintain the rated thermal performance and to provide a low-impedance ground reference. The ATSAMD51J18A-MF suffix code indicates an industrial/automotive temperature grade and tray packaging, which should be selected to match the end-equipment environment.
This page synthesizes distributor pricing, AEC-Q100 qualification context, and drop-in alternative guidance for the SAM D51 family not found in the manufacturer datasheet alone, supporting both new design and existing-platform migration decisions.
Alternatives de remplacement direct pour ATSAMD51J18A-MF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD51J18A-MF (même facteur de forme et même empreinte) — différant par Package, SRAM, ADC, Core, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD51J18A-MFT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD51G18A-MF
✅ Remplacement direct✓ En stock
$5.11 / unité
Voir la fiche technique →ATSAMD51G19A-MFT
✅ Remplacement direct✓ En stock
$4.02 / unité
Voir la fiche technique →ATSAMD51G18A-MFT
✅ Remplacement direct✓ En stock
$3.55 / unité
Voir la fiche technique →ATSAMD51J18A-MF Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4F with FPU |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 256 KB |
| SRAM | 128 KB |
| Boîtier | 64-pin QFN (9x9 mm) with exposed pad |
| Nombre de broches | 64 |
| Type de montage | Surface Mount |
| AEC-Q100 | Qualified |
| Temperature Grade | Automotive / Extended Industrial |
| USB | USB 2.0 Full-Speed Device/Host |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 2x 12-bit |
| CAN | 2x CAN-FD |
| SERCOM | Multiple configurable UART/SPI/I2C |
| Statut RoHS | Compliant |
Configuration des broches de ATSAMD51J18A-MF
| Broche 1 | VDD — Digital supply |
| Broche 2 | GND — Ground reference |
| Broche 3 | PA00 — GPIO / ADC0 |
| Broche 4 | PA01 — GPIO / ADC1 |
| Broche 5 | PA02 — GPIO / ADC2 / VREFA |
| Broche 6 | PA03 — GPIO / ADC3 |
| Broche 7 | PA04 — GPIO / ADC4 |
| Broche 8 | PA05 — GPIO / ADC5 |
| Broche 9 | PA06 — GPIO / ADC6 |
| Broche 10 | PA07 — GPIO / ADC7 |
| Broche 11 | PA08 — GPIO / SERCOM0 PAD0 |
| Broche 12 | PA09 — GPIO / SERCOM0 PAD1 |
| Broche 13 | PA10 — GPIO / SERCOM0 PAD2 |
| Broche 14 | PA11 — GPIO / SERCOM0 PAD3 |
| Broche 15 | PA12 — GPIO / SERCOM1 PAD0 |
| Broche 16 | PA13 — GPIO / SERCOM1 PAD1 |
| Broche 17 | PA14 — GPIO / SERCOM1 PAD2 |
| Broche 18 | PA15 — GPIO / SERCOM1 PAD3 |
| Broche 19 | PA16 — GPIO / SERCOM2 PAD0 |
| Broche 20 | PA17 — GPIO / SERCOM2 PAD1 |
| Broche 21 | PA18 — GPIO / SERCOM2 PAD2 |
| Broche 22 | PA19 — GPIO / SERCOM2 PAD3 |
| Broche 23 | PA20 — GPIO / SERCOM3 PAD0 |
| Broche 24 | PA21 — GPIO / SERCOM3 PAD1 |
| Broche 25 | PA22 — GPIO / SERCOM3 PAD2 |
| Broche 26 | PA23 — GPIO / SERCOM3 PAD3 |
| Broche 27 | PA24 — GPIO / USB_DM |
| Broche 28 | PA25 — GPIO / USB_DP |
| Broche 29 | PB00 — GPIO / ADC8 |
| Broche 30 | PB01 — GPIO / ADC9 |
| Broche 31 | PB02 — GPIO / ADC10 |
| Broche 32 | PB03 — GPIO / ADC11 |
| Broche 33 | PB04 — GPIO / ADC12 |
| Broche 34 | PB05 — GPIO / ADC13 |
| Broche 35 | PB06 — GPIO / ADC14 |
| Broche 36 | PB07 — GPIO / ADC15 |
| Broche 37 | PB08 — GPIO / SERCOM4 PAD0 |
| Broche 38 | PB09 — GPIO / SERCOM4 PAD1 |
| Broche 39 | PB10 — GPIO / SERCOM4 PAD2 |
| Broche 40 | PB11 — GPIO / SERCOM4 PAD3 |
| Broche 41 | PB12 — GPIO / CAN0 TX |
| Broche 42 | PB13 — GPIO / CAN0 RX |
| Broche 43 | PB14 — GPIO / CAN1 TX |
| Broche 44 | PB15 — GPIO / CAN1 RX |
| Broche 45 | PB16 — GPIO / SERCOM5 PAD0 |
| Broche 46 | PB17 — GPIO / SERCOM5 PAD1 |
| Broche 47 | PB18 — GPIO / SERCOM5 PAD2 |
| Broche 48 | PB19 — GPIO / SERCOM5 PAD3 |
| Broche 49 | PB20 — GPIO / SERCOM6 PAD0 |
| Broche 50 | PB21 — GPIO / SERCOM6 PAD1 |
| Broche 51 | PB22 — GPIO / SERCOM6 PAD2 |
| Broche 52 | PB23 — GPIO / SERCOM6 PAD3 |
| Broche 53 | PB24 — GPIO / SERCOM7 PAD0 |
| Broche 54 | PB25 — GPIO / SERCOM7 PAD1 |
| Broche 55 | PB26 — GPIO / SERCOM7 PAD2 |
| Broche 56 | PB27 — GPIO / SERCOM7 PAD3 |
| Broche 57 | RESET — Reset input (active low) |
| Broche 58 | SWDIO — Serial Wire Debug I/O |
| Broche 59 | SWCLK — Serial Wire Debug Clock |
| Broche 60 | VDD — Digital supply |
| Broche 61 | VIO — I/O supply |
| Broche 62 | DAC0 — 12-bit DAC output 0 |
| Broche 63 | DAC1 — 12-bit DAC output 1 |
| Broche 64 | GND — Ground / exposed pad |
Applications typiques
ATSAMD51J18A-MF convient pour 6 applications: Automotive Sensor Hubs, Industrial IoT Gateways, Audio Processing Subsystems, Capacitive Touch HMI Panels, USB Peripherals and HID Devices, Smart Sensor Nodes.
Automotive Sensor Hubs
The ATSAMD51J18A-MF's AEC-Q100 qualification, two CAN-FD controllers, and 12-bit 1 MSPS ADC make it well-suited to automotive body and chassis sensor hubs that aggregate data from multiple sensors and forward them over CAN. Its 120 MHz Cortex-M4F core executes sensor-fusion algorithms in real time while the FPU accelerates matrix math, and the integrated 12-bit DAC supports actuator drive loops. Placement on a 64-QFN with exposed pad keeps the thermal envelope within automotive -40C to +125C requirements, while USB Full-Speed enables factory programming and field firmware updates without a separate bootloader IC.
Recommandé
Industrial IoT Gateways
The ATSAMD51J18A-MF's USB 2.0 Full-Speed host/device and multiple SERCOM peripherals make it an effective protocol-bridging gateway between UART, SPI, I2C, and CAN-FD field networks and upstream Ethernet or Wi-Fi modules. Its 256 KB Flash and 128 KB SRAM comfortably hold TLS stacks, MQTT clients, and edge-protocol translation firmware. The 12-bit ADC reads analog sensor outputs while two 12-bit DACs generate setpoint signals, allowing the same MCU to act as both transducer interface and network bridge in a compact 64-QFN footprint.
Recommandé
Audio Processing Subsystems
The ATSAMD51J18A-MF's I2S interface, two 12-bit DACs, 12-bit ADC, and FPU-accelerated DSP extensions let it handle audio playback, mixing, and basic effects within small embedded speakers, hearing-aid accessories, or intercom panels. Its 120 MHz headroom sustains 48 kHz stereo processing with low-latency filtering, and the 128 KB SRAM provides frame-buffer space for short clips. AEC-Q100 qualification enables in-cabin automotive audio applications including warning-tone generators and noise-cancellation sub-systems in the same QFN footprint used for industrial deployments.
Recommandé
Capacitive Touch HMI Panels
The ATSAMD51J18A-MF integrates a Peripheral Touch Controller (PTC) supporting capacitive touch buttons, sliders, and wheel sensing, eliminating the need for a dedicated touch IC in HMI panels. Its 120 MHz M4F core renders graphics via SPI to TFT displays while servicing touch events through the Event System without CPU intervention, freeing MIPS for application logic. AEC-Q100 qualification lets the same hardware platform be reused across automotive climate-control and infotainment touch panels, simplifying qualification and reducing BOM count in 64-QFN designs.
Recommandé
USB Peripherals and HID Devices
The ATSAMD51J18A-MF's integrated USB 2.0 Full-Speed device/host controller with on-chip transceiver simplifies HID, CDC, and vendor-class peripherals by removing the need for an external PHY. The 256 KB Flash and 120 MHz core handle HID descriptor stacks, firmware update bootloaders, and real-time HID report generation. The QFN-64 footprint keeps PCB area small for USB dongles, programmable keypads, and USB-to-CAN bridges, and the AEC-Q100 rating permits the same firmware to ship in automotive diagnostic accessories.
Recommandé
Smart Sensor Nodes
The ATSAMD51J18A-MF's 12-bit 1 MSPS ADC, multiple SERCOM channels for digital sensors, and 120 MHz FPU accelerate on-sensor DSP such as FFT analysis, RMS calculation, and Kalman filtering without offloading to a host. Its 128 KB SRAM serves as a deep sample buffer for vibration, current, or acoustic monitoring nodes in industrial IoT deployments. AEC-Q100 qualification, combined with the compact 64-QFN footprint, makes the part a strong fit for battery-backed smart sensors that must survive automotive electrical environments and operate reliably across -40C to +125C.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD51J18A-MF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD51J18A-MFT | ATSAMD51G18A-MF | ATSAMD51G19A-MFT | ATSAMD51G18A-MFT | ATSAMD51J18A-AU-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) with EP | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-TQFP - different land pattern |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 1 MB | 256 KB | 256 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB | 128 KB | 128 KB |
| AEC-Q100 | Qualified (automotive) | Qualified (automotive) | Not qualified (industrial) | Not qualified (industrial) | Not qualified (industrial) | Industrial grade |
| USB | FS Device/Host | FS Device/Host | FS Device/Host | FS Device/Host | FS Device/Host | FS Device/Host |
| CAN-FD | 2x | 2x | 2x | 2x | 2x | 2x |
| ADC | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS |
| Pkg Quantity | Tray, 260 / unit | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray |
Principaux différenciateurs
- AEC-Q100 qualified on identical die (vs ATSAMD51G18A-MF)
- Compact 9x9 QFN with exposed pad (vs ATSAMD51J18A-AU-EFP)
- 256 KB Flash with ECC and dual-panel bank (vs ATSAMD51G19A-MFT)
Notes de conception
The ATSAMD51J18A-MF 64-QFN has an exposed thermal pad that must be soldered to a continuous ground copper pour of at least 25 mm^2 (4-5 vias stitched through the pour to the inner ground plane) to meet the rated thermal performance. Failing to solder the EP can raise junction temperature by 20-30 C under load and degrade ADC readings through shared digital/analog ground bounce.
Place a 1 uF X7R ceramic bypass capacitor within 3 mm of each VDD pin and a single 4.7-10 uF bulk capacitor near the package. The SAM D51 core uses DFLL or PLL clocking that injects brief supply transients; a high-frequency MLCC close to the MCU prevents clock jitter and CoreMark score variation under load. Estimated input ripple budget: <50 mVpp at 120 MHz operation.
Route USB_DP and USB_DM as a 90 ohm differential pair with no stubs, length-matched to within 150 mil, and keep them clear of switching regulator traces. Place the USB series ferrite and ESD array within 5 mm of the connector to suppress common-mode noise. AEC-Q100 designs should also include a CAN bus common-mode choke for the two CAN-FD lines.
Do not confuse the ATSAMD51J18A-MF (64-QFN automotive) with the ATSAMD51J18A-AU (64-TQFP industrial). They are the same die but require different PCB footprints; substituting one for the other will fail assembly or thermal qualification. Also confirm the 'M' vs 'MT' vs 'MF' suffix for tray vs tape-and-reel packaging at order entry.
Informations de conformité
AEC-Q100 automotive qualification confirmed by Microchip product page and Hotenda listing. RoHS and REACH compliant per Microchip compliance declarations.
