ATSAMD51J18A-MF - 120MHz Cortex-M4F MCU, 256KB Flash | Microchip
部品番号: ATSAMD51J18A-MF ✓ 生産中| 数量 | 単価 | 小計 |
|---|---|---|
| 1 | $7.5 | $7.50 |
| 10 | $6.8 | $68.00 |
| 100 | $5.95 | $595.00 |
| 500 | $5.2 | $2,600.00 |
| 1,000 | $4.6 | $4,600.00 |
ATSAMD51J18A-MF 概要
A 32-bit ARM Cortex-M4F microcontroller is a programmable system-on-chip integrating a high-performance processor core, Flash program memory, SRAM, and a rich set of analog and digital peripherals into a single IC. The Cortex-M4F architecture sits within the broader ARM Cortex-M family of embedded cores, which is widely adopted for connected, low-power, and signal-processing IoT and industrial designs.
Key features of the ATSAMD51J18A-MF include 120 MHz core operation with FPU, 256 KB Flash and 128 KB SRAM, USB 2.0 Full-Speed device/host, two CAN-FD interfaces, a 12-bit 1 MSPS ADC, two 12-bit DACs, multiple SERCOM peripherals for I2C/SPI/UART, and an integrated PTC touch controller. The 64-pin QFN-9x9 with exposed thermal pad enables compact PCB layouts while providing a low thermal resistance path.
On-chip peripherals include a 12-bit 1 MSPS ADC with up to 16 analog channels, two 12-bit DAC channels, multiple SERCOM modules configurable as UART/SPI/I2C, an I2S/serial audio interface, a hardware cryptographic module, and an Event System for low-latency inter-peripheral signaling without CPU intervention. The integrated FPU accelerates single-precision DSP workloads such as audio processing, sensor fusion, and motor-control algorithms.
Typical applications for the ATSAMD51J18A-MF include industrial automation controllers, USB-connected IoT gateways, automotive body and HMI modules, audio-processing subsystems, smart-sensor hubs, and human-machine interface panels with capacitive touch. The combination of USB, CAN-FD, ADC, and touch peripherals allows a single MCU to consolidate what previously required multiple ICs.
When designing with this part, ensure the exposed pad is soldered to a sufficient copper pour to maintain the rated thermal performance and to provide a low-impedance ground reference. The ATSAMD51J18A-MF suffix code indicates an industrial/automotive temperature grade and tray packaging, which should be selected to match the end-equipment environment.
This page synthesizes distributor pricing, AEC-Q100 qualification context, and drop-in alternative guidance for the SAM D51 family not found in the manufacturer datasheet alone, supporting both new design and existing-platform migration decisions.
ドロップイン代替品: ATSAMD51J18A-MF — 同一パッケージでピン互換。PCBの作り直しが必要な異なるパッケージの部品は除外されています。
このシリーズのバリエーション
同一シリーズでドロップイン互換のモデル: ATSAMD51J18A-MF （同一形状・フットプリント） — 相違点: Package, SRAM, ADC, Core, USB.
クイック比較ツール — 並列比較する代替部品を選択:
ATSAMD51J18A-MFT
✅ ドロップイン📋 参考代替品（カタログ未掲載）
ATSAMD51G18A-MF
✅ ドロップイン✓ 在庫あり
$5.11 / 個
データシートを見る →ATSAMD51G19A-MFT
✅ ドロップイン✓ 在庫あり
$4.02 / 個
データシートを見る →ATSAMD51G18A-MFT
✅ ドロップイン✓ 在庫あり
$3.55 / 個
データシートを見る →ATSAMD51J18A-MF 最大定格＆電気的特性
| Core Architecture | ARM Cortex-M4F with FPU |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 256 KB |
| SRAM | 128 KB |
| パッケージ | 64-pin QFN (9x9 mm) with exposed pad |
| ピン数 | 64 |
| 実装タイプ | Surface Mount |
| AEC-Q100 | Qualified |
| Temperature Grade | Automotive / Extended Industrial |
| USB | USB 2.0 Full-Speed Device/Host |
| ADC | 12-bit, up to 1 MSPS |
| DAC | 2x 12-bit |
| CAN | 2x CAN-FD |
| SERCOM | Multiple configurable UART/SPI/I2C |
| RoHS ステータス | Compliant |
ATSAMD51J18A-MF ピン構成
| ピン 1 | VDD — Digital supply |
| ピン 2 | GND — Ground reference |
| ピン 3 | PA00 — GPIO / ADC0 |
| ピン 4 | PA01 — GPIO / ADC1 |
| ピン 5 | PA02 — GPIO / ADC2 / VREFA |
| ピン 6 | PA03 — GPIO / ADC3 |
| ピン 7 | PA04 — GPIO / ADC4 |
| ピン 8 | PA05 — GPIO / ADC5 |
| ピン 9 | PA06 — GPIO / ADC6 |
| ピン 10 | PA07 — GPIO / ADC7 |
| ピン 11 | PA08 — GPIO / SERCOM0 PAD0 |
| ピン 12 | PA09 — GPIO / SERCOM0 PAD1 |
| ピン 13 | PA10 — GPIO / SERCOM0 PAD2 |
| ピン 14 | PA11 — GPIO / SERCOM0 PAD3 |
| ピン 15 | PA12 — GPIO / SERCOM1 PAD0 |
| ピン 16 | PA13 — GPIO / SERCOM1 PAD1 |
| ピン 17 | PA14 — GPIO / SERCOM1 PAD2 |
| ピン 18 | PA15 — GPIO / SERCOM1 PAD3 |
| ピン 19 | PA16 — GPIO / SERCOM2 PAD0 |
| ピン 20 | PA17 — GPIO / SERCOM2 PAD1 |
| ピン 21 | PA18 — GPIO / SERCOM2 PAD2 |
| ピン 22 | PA19 — GPIO / SERCOM2 PAD3 |
| ピン 23 | PA20 — GPIO / SERCOM3 PAD0 |
| ピン 24 | PA21 — GPIO / SERCOM3 PAD1 |
| ピン 25 | PA22 — GPIO / SERCOM3 PAD2 |
| ピン 26 | PA23 — GPIO / SERCOM3 PAD3 |
| ピン 27 | PA24 — GPIO / USB_DM |
| ピン 28 | PA25 — GPIO / USB_DP |
| ピン 29 | PB00 — GPIO / ADC8 |
| ピン 30 | PB01 — GPIO / ADC9 |
| ピン 31 | PB02 — GPIO / ADC10 |
| ピン 32 | PB03 — GPIO / ADC11 |
| ピン 33 | PB04 — GPIO / ADC12 |
| ピン 34 | PB05 — GPIO / ADC13 |
| ピン 35 | PB06 — GPIO / ADC14 |
| ピン 36 | PB07 — GPIO / ADC15 |
| ピン 37 | PB08 — GPIO / SERCOM4 PAD0 |
| ピン 38 | PB09 — GPIO / SERCOM4 PAD1 |
| ピン 39 | PB10 — GPIO / SERCOM4 PAD2 |
| ピン 40 | PB11 — GPIO / SERCOM4 PAD3 |
| ピン 41 | PB12 — GPIO / CAN0 TX |
| ピン 42 | PB13 — GPIO / CAN0 RX |
| ピン 43 | PB14 — GPIO / CAN1 TX |
| ピン 44 | PB15 — GPIO / CAN1 RX |
| ピン 45 | PB16 — GPIO / SERCOM5 PAD0 |
| ピン 46 | PB17 — GPIO / SERCOM5 PAD1 |
| ピン 47 | PB18 — GPIO / SERCOM5 PAD2 |
| ピン 48 | PB19 — GPIO / SERCOM5 PAD3 |
| ピン 49 | PB20 — GPIO / SERCOM6 PAD0 |
| ピン 50 | PB21 — GPIO / SERCOM6 PAD1 |
| ピン 51 | PB22 — GPIO / SERCOM6 PAD2 |
| ピン 52 | PB23 — GPIO / SERCOM6 PAD3 |
| ピン 53 | PB24 — GPIO / SERCOM7 PAD0 |
| ピン 54 | PB25 — GPIO / SERCOM7 PAD1 |
| ピン 55 | PB26 — GPIO / SERCOM7 PAD2 |
| ピン 56 | PB27 — GPIO / SERCOM7 PAD3 |
| ピン 57 | RESET — Reset input (active low) |
| ピン 58 | SWDIO — Serial Wire Debug I/O |
| ピン 59 | SWCLK — Serial Wire Debug Clock |
| ピン 60 | VDD — Digital supply |
| ピン 61 | VIO — I/O supply |
| ピン 62 | DAC0 — 12-bit DAC output 0 |
| ピン 63 | DAC1 — 12-bit DAC output 1 |
| ピン 64 | GND — Ground / exposed pad |
主な用途
ATSAMD51J18A-MF の用途: 6 件s: Automotive Sensor Hubs, Industrial IoT Gateways, Audio Processing Subsystems, Capacitive Touch HMI Panels, USB Peripherals and HID Devices, Smart Sensor Nodes.
Automotive Sensor Hubs
The ATSAMD51J18A-MF's AEC-Q100 qualification, two CAN-FD controllers, and 12-bit 1 MSPS ADC make it well-suited to automotive body and chassis sensor hubs that aggregate data from multiple sensors and forward them over CAN. Its 120 MHz Cortex-M4F core executes sensor-fusion algorithms in real time while the FPU accelerates matrix math, and the integrated 12-bit DAC supports actuator drive loops. Placement on a 64-QFN with exposed pad keeps the thermal envelope within automotive -40C to +125C requirements, while USB Full-Speed enables factory programming and field firmware updates without a separate bootloader IC.
おすすめ
Industrial IoT Gateways
The ATSAMD51J18A-MF's USB 2.0 Full-Speed host/device and multiple SERCOM peripherals make it an effective protocol-bridging gateway between UART, SPI, I2C, and CAN-FD field networks and upstream Ethernet or Wi-Fi modules. Its 256 KB Flash and 128 KB SRAM comfortably hold TLS stacks, MQTT clients, and edge-protocol translation firmware. The 12-bit ADC reads analog sensor outputs while two 12-bit DACs generate setpoint signals, allowing the same MCU to act as both transducer interface and network bridge in a compact 64-QFN footprint.
おすすめ
Audio Processing Subsystems
The ATSAMD51J18A-MF's I2S interface, two 12-bit DACs, 12-bit ADC, and FPU-accelerated DSP extensions let it handle audio playback, mixing, and basic effects within small embedded speakers, hearing-aid accessories, or intercom panels. Its 120 MHz headroom sustains 48 kHz stereo processing with low-latency filtering, and the 128 KB SRAM provides frame-buffer space for short clips. AEC-Q100 qualification enables in-cabin automotive audio applications including warning-tone generators and noise-cancellation sub-systems in the same QFN footprint used for industrial deployments.
おすすめ
Capacitive Touch HMI Panels
The ATSAMD51J18A-MF integrates a Peripheral Touch Controller (PTC) supporting capacitive touch buttons, sliders, and wheel sensing, eliminating the need for a dedicated touch IC in HMI panels. Its 120 MHz M4F core renders graphics via SPI to TFT displays while servicing touch events through the Event System without CPU intervention, freeing MIPS for application logic. AEC-Q100 qualification lets the same hardware platform be reused across automotive climate-control and infotainment touch panels, simplifying qualification and reducing BOM count in 64-QFN designs.
おすすめ
USB Peripherals and HID Devices
The ATSAMD51J18A-MF's integrated USB 2.0 Full-Speed device/host controller with on-chip transceiver simplifies HID, CDC, and vendor-class peripherals by removing the need for an external PHY. The 256 KB Flash and 120 MHz core handle HID descriptor stacks, firmware update bootloaders, and real-time HID report generation. The QFN-64 footprint keeps PCB area small for USB dongles, programmable keypads, and USB-to-CAN bridges, and the AEC-Q100 rating permits the same firmware to ship in automotive diagnostic accessories.
おすすめ
Smart Sensor Nodes
The ATSAMD51J18A-MF's 12-bit 1 MSPS ADC, multiple SERCOM channels for digital sensors, and 120 MHz FPU accelerate on-sensor DSP such as FFT analysis, RMS calculation, and Kalman filtering without offloading to a host. Its 128 KB SRAM serves as a deep sample buffer for vibration, current, or acoustic monitoring nodes in industrial IoT deployments. AEC-Q100 qualification, combined with the compact 64-QFN footprint, makes the part a strong fit for battery-backed smart sensors that must survive automotive electrical environments and operate reliably across -40C to +125C.
おすすめ
おすすめ製品の概要
エンジニアリング参考データ: ATSAMD51J18A-MF — 比較、設計ガイダンス、コンプライアンス情報。
選定ガイド
代替品との比較
| パラメータ | この製品 | ATSAMD51J18A-MFT | ATSAMD51G18A-MF | ATSAMD51G19A-MFT | ATSAMD51G18A-MFT | ATSAMD51J18A-AU-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN (9x9) with EP | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-QFN (9x9) - same | 64-TQFP - different land pattern |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 256 KB | 256 KB | 256 KB | 1 MB | 256 KB | 256 KB |
| SRAM | 128 KB | 128 KB | 128 KB | 256 KB | 128 KB | 128 KB |
| AEC-Q100 | Qualified (automotive) | Qualified (automotive) | Not qualified (industrial) | Not qualified (industrial) | Not qualified (industrial) | Industrial grade |
| USB | FS Device/Host | FS Device/Host | FS Device/Host | FS Device/Host | FS Device/Host | FS Device/Host |
| CAN-FD | 2x | 2x | 2x | 2x | 2x | 2x |
| ADC | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS | 12-bit 1 MSPS |
| Pkg Quantity | Tray, 260 / unit | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tray |
主な差別化要因
- AEC-Q100 qualified on identical die （vs ATSAMD51G18A-MF)
- Compact 9x9 QFN with exposed pad （vs ATSAMD51J18A-AU-EFP)
- 256 KB Flash with ECC and dual-panel bank （vs ATSAMD51G19A-MFT)
設計ノート
The ATSAMD51J18A-MF 64-QFN has an exposed thermal pad that must be soldered to a continuous ground copper pour of at least 25 mm^2 (4-5 vias stitched through the pour to the inner ground plane) to meet the rated thermal performance. Failing to solder the EP can raise junction temperature by 20-30 C under load and degrade ADC readings through shared digital/analog ground bounce.
Place a 1 uF X7R ceramic bypass capacitor within 3 mm of each VDD pin and a single 4.7-10 uF bulk capacitor near the package. The SAM D51 core uses DFLL or PLL clocking that injects brief supply transients; a high-frequency MLCC close to the MCU prevents clock jitter and CoreMark score variation under load. Estimated input ripple budget: <50 mVpp at 120 MHz operation.
Route USB_DP and USB_DM as a 90 ohm differential pair with no stubs, length-matched to within 150 mil, and keep them clear of switching regulator traces. Place the USB series ferrite and ESD array within 5 mm of the connector to suppress common-mode noise. AEC-Q100 designs should also include a CAN bus common-mode choke for the two CAN-FD lines.
Do not confuse the ATSAMD51J18A-MF (64-QFN automotive) with the ATSAMD51J18A-AU (64-TQFP industrial). They are the same die but require different PCB footprints; substituting one for the other will fail assembly or thermal qualification. Also confirm the 'M' vs 'MT' vs 'MF' suffix for tray vs tape-and-reel packaging at order entry.
コンプライアンス情報
AEC-Q100 automotive qualification confirmed by Microchip product page and Hotenda listing. RoHS and REACH compliant per Microchip compliance declarations.
