ATSAMD51J20A-MU - 120MHz Cortex-M4F MCU 1MB Flash | Microchip
Référence : ATSAMD51J20A-MU ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.08 | $7,08 |
| 10 | $6.45 | $64,50 |
| 100 | $5.65 | $565,00 |
| 500 | $5.1 | $2 550,00 |
| 1 000 | $4.75 | $4 750,00 |
ATSAMD51J20A-MU Présentation
A microcontroller (MCU) is a system-on-chip that integrates a CPU core, program memory (Flash), data memory (SRAM), and programmable I/O peripherals onto a single silicon die. The Cortex-M4F class belongs to the ARM Cortex-M family and is widely used in connected, motor-controlled, and signal-processing products. Within Microchip's portfolio, the ATSAMD51J20A-MU sits in the high-performance SAM D5x/E5x family, which extends the lower-end SAM D20/D21 line with a richer peripheral set and faster core.
Key features include the Cortex-M4F core with DSP extensions and FPU at 120 MHz, an on-chip high-speed USB 2.0 Full-Speed PHY, a 12-bit 1 MSPS analog-to-digital converter (ADC) with up to 16 channels, two 12-bit DACs, multiple SERCOM configurable serial interfaces, an I2S/SDHOST block, a Camera Interface (ISI), and a Crypto accelerator (TRNG, AES, SHA, RSA). Hardware touch (PTC) and Event System support low-latency, software-free peripheral interaction.
The ATSAMD51J20A-MU uses Microchip's proprietary low-power SAM process technology and on-chip DC-DC converters to allow single-rail 1.71V to 3.6V operation with core voltages generated internally. Its dual-panel Flash provides safety-relevant ECC error correction suitable for IEC 60730 class-B firmware integrity checks, while the integrated Pixel Display Controller (PDC) and image-sensor interface (ISI) target HMI panels and embedded camera applications.
Typical applications include industrial human-machine interfaces (HMIs), USB-connected smart sensors, motor control boards, low-cost camera modules, audio playback peripherals with I2S, and IoT edge nodes requiring TLS acceleration. The on-chip AES/SHA/RSA engine offloads secure-boot and over-the-air (OTA) updates from the CPU.
When designing with this device, ensure the VQFN-9x9 mm exposed pad is soldered to a sufficiently large ground copper pour (>=25 thermal vias) to keep junction temperature within the 85C industrial rating under continuous 120 MHz operation. Use the Atmel Studio / MPLAB X IDE with the ASF4 framework for peripheral drivers and pin-mux configuration.
This page synthesizes distributor pricing, drop-in alternatives, and design notes that are not collated in the manufacturer datasheet alone.
Alternatives de remplacement direct pour ATSAMD51J20A-MU — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMD51J20A-MU (même facteur de forme et même empreinte) — différant par Package, ADC, SRAM, USB, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMD51J20A-MUT
✅ Remplacement direct✓ En stock
$6.2 / unité
Voir la fiche technique →ATSAMD51J20A-MU-EFP
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMD51J19A-MU
✅ Remplacement direct✓ En stock
$6.1 / unité
Voir la fiche technique →ATSAMD51J18A-MU
✅ Remplacement direct✓ En stock
$3.42 / unité
Voir la fiche technique →ATSAMD51G19A-MFT
✅ Remplacement direct✓ En stock
$4.02 / unité
Voir la fiche technique →ATSAMD51G18A-MF
✅ Remplacement direct✓ En stock
$5.11 / unité
Voir la fiche technique →ATSAMD51J20A-AU-EFP
✅ Remplacement direct✓ En stock
$7.5 / unité
Voir la fiche technique →ATSAMD51J19A-AUT-EFP
✅ Remplacement direct✓ En stock
$4.45 / unité
Voir la fiche technique →ATSAMD51J20A-MU Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M4F with FPU and DSP extensions |
| Maximum CPU Frequency | 120 MHz |
| Flash Memory | 1 MB (1024 KB) dual-panel with ECC |
| SRAM | 256 KB with ECC |
| Operating Voltage (VDDIO/VDDANA) | 1.71 V to 3.6 V |
| Boîtier | 64-pin VQFN (9x9 mm) with exposed thermal pad |
| Température de fonctionnement | -40 C to +85 C (industrial) |
| Type de montage | Surface Mount |
| ADC | 12-bit, up to 1 MSPS, up to 16 channels |
| DAC | 2x 12-bit, 1 MSPS |
| USB | USB 2.0 Full-Speed device/host with on-chip PHY |
| SERCOM | Up to 8 configurable serial interfaces (UART/SPI/I2C) |
| Crypto Accelerator | AES, SHA, RSA, TRNG |
| I2S / SDHOST / PDC / ISI | I2S, SD Host, Pixel Display Controller, Image Sensor Interface |
| Touch Support (PTC) | Yes (Peripheral Touch Controller) |
| Statut RoHS | Compliant |
Configuration des broches de ATSAMD51J20A-MU
| Broche 1 | VDDIO — Digital I/O supply voltage (1.71V-3.6V) |
| Broche 2 | PA00 — General-purpose I/O / SERCOM / ADC |
| Broche 3 | PA01 — General-purpose I/O / SERCOM / ADC |
| Broche 4 | PA02 — General-purpose I/O / SERCOM / ADC |
| Broche 5 | PA03 — General-purpose I/O / SERCOM / ADC |
| Broche 6 | PA04 — General-purpose I/O / SERCOM / ADC |
| Broche 7 | PA05 — General-purpose I/O / SERCOM / ADC |
| Broche 8 | PA06 — General-purpose I/O / SERCOM / ADC |
| Broche 9 | PA07 — General-purpose I/O / SERCOM / ADC |
| Broche 10 | PA08 — General-purpose I/O / SERCOM / ADC |
| Broche 11 | PA09 — General-purpose I/O / SERCOM / ADC |
| Broche 12 | PA10 — General-purpose I/O / SERCOM / ADC |
| Broche 13 | PA11 — General-purpose I/O / SERCOM / ADC |
| Broche 14 | VDDIO — Digital I/O supply voltage |
| Broche 15 | GND — Ground |
| Broche 16 | PA12 — General-purpose I/O / SERCOM / ADC |
| Broche 17 | PA13 — General-purpose I/O / SERCOM / ADC |
| Broche 18 | PA14 — General-purpose I/O / SERCOM / ADC |
| Broche 19 | PA15 — General-purpose I/O / SERCOM / ADC |
| Broche 20 | PA16 — General-purpose I/O / SERCOM / ADC |
| Broche 21 | PA17 — General-purpose I/O / SERCOM / ADC |
| Broche 22 | PA18 — General-purpose I/O / SERCOM / ADC |
| Broche 23 | PA19 — General-purpose I/O / SERCOM / ADC |
| Broche 24 | PA20 — General-purpose I/O / SERCOM / ADC |
| Broche 25 | PA21 — General-purpose I/O / SERCOM / ADC |
| Broche 26 | PA22 — General-purpose I/O / SERCOM / ADC |
| Broche 27 | PA23 — General-purpose I/O / SERCOM / ADC |
| Broche 28 | PA24 — General-purpose I/O / SERCOM / ADC |
| Broche 29 | PA25 — General-purpose I/O / SERCOM / ADC |
| Broche 30 | VDDIO — Digital I/O supply voltage |
| Broche 31 | GND — Ground |
| Broche 32 | PB00 — General-purpose I/O / SERCOM / ADC |
| Broche 33 | PB01 — General-purpose I/O / SERCOM / ADC |
| Broche 34 | PB02 — General-purpose I/O / SERCOM / ADC / USB DP |
| Broche 35 | PB03 — General-purpose I/O / SERCOM / ADC / USB DM |
| Broche 36 | PB04 — General-purpose I/O / SERCOM / ADC |
| Broche 37 | PB05 — General-purpose I/O / SERCOM / ADC |
| Broche 38 | PB06 — General-purpose I/O / SERCOM / ADC |
| Broche 39 | PB07 — General-purpose I/O / SERCOM / ADC |
| Broche 40 | PB08 — General-purpose I/O / SERCOM / ADC |
| Broche 41 | PB09 — General-purpose I/O / SERCOM / ADC |
| Broche 42 | PB10 — General-purpose I/O / SERCOM / ADC |
| Broche 43 | PB11 — General-purpose I/O / SERCOM / TC |
| Broche 44 | PB12 — General-purpose I/O / SERCOM / TC |
| Broche 45 | PB13 — General-purpose I/O / SERCOM / TC |
| Broche 46 | PB14 — General-purpose I/O / SERCOM / TC |
| Broche 47 | PB15 — General-purpose I/O / SERCOM / TC |
| Broche 48 | VDDIO — Digital I/O supply voltage |
| Broche 49 | GND — Ground |
| Broche 50 | PC00 — General-purpose I/O / SERCOM |
| Broche 51 | PC01 — General-purpose I/O / SERCOM |
| Broche 52 | PC02 — General-purpose I/O / SERCOM |
| Broche 53 | PC03 — General-purpose I/O / SERCOM |
| Broche 54 | PC04 — General-purpose I/O / SERCOM |
| Broche 55 | PC05 — General-purpose I/O / SERCOM |
| Broche 56 | PC06 — General-purpose I/O / SERCOM |
| Broche 57 | PC07 — General-purpose I/O / SERCOM |
| Broche 58 | PC08 — General-purpose I/O / SERCOM |
| Broche 59 | PC09 — General-purpose I/O / SERCOM |
| Broche 60 | PC10 — General-purpose I/O / SERCOM |
| Broche 61 | PC11 — General-purpose I/O / SERCOM |
| Broche 62 | PC12 — General-purpose I/O / SERCOM |
| Broche 63 | PC13 — General-purpose I/O / SERCOM |
| Broche 64 | EP — Exposed thermal pad - must be soldered to GND |
Applications typiques
ATSAMD51J20A-MU convient pour 6 applications: Industrial HMI Panels, USB Smart Sensor Hubs, Motor Control and Robotics, Embedded Camera Modules, IoT Edge Nodes with TLS, Audio Playback and DSP Peripherals.
Industrial HMI Panels
The ATSAMD51J20A-MU's integrated Pixel Display Controller (PDC) and Image Sensor Interface (ISI) enable direct connection to a parallel TFT-LCD panel and to a small CMOS camera without an external graphics controller. At 120 MHz the Cortex-M4F core can render LVGL-based HMI screens at >30 fps while the FPU accelerates 2D transforms; the 1 MB Flash stores full-color icons and language strings, and the 256 KB SRAM acts as a frame buffer for 320x240x16-bit panels. The 12-bit 1 MSPS ADC supports analog touch overlay reading, while the PTC peripheral supports projected-capacitive touch if a separate ITO sensor is used. The wide 1.71V-3.6V supply range tolerates noisy industrial 24V->5V->3.3V rails with only a small LDO filter.
Recommandé
USB Smart Sensor Hubs
The ATSAMD51J20A-MU integrates a USB 2.0 Full-Speed PHY on-chip, so a CDC / HID / vendor-class sensor hub needs only the MCU, decoupling caps, and a USB-C receptacle - no external transceiver or 5V tolerance required. The 8 SERCOMs let the MCU aggregate UART sensors, I2C IMUs, and SPI flash simultaneously without a port expander; the hardware AES/SHA/TRNG block enables secure boot and TLS 1.2 handshake offload for IoT gateways. The Cortex-M4F DSP extensions handle FFT-based vibration analysis on factory-floor sensors, and the 256 KB SRAM accommodates 8 kHz audio-rate sensor buffers without DMA stall.
Recommandé
Motor Control and Robotics
The ATSAMD51J20A-MU drives brushless DC (BLDC) and stepper motors through its PWM/timer block plus the Cortex-M4F DSP extensions and FPU for field-oriented control (FOC) math. At 120 MHz the core executes a 16 kHz FOC loop with <2 percent CPU utilization per axis, leaving headroom for CAN-FD communication via SERCOM and quadrature encoder inputs. The 12-bit 1 MSPS ADC samples three shunt currents simultaneously in interleaved mode for sensorless control, while the 1.71V-3.6V supply simplifies integration with 3.3V gate drivers. Industrial -40 C to +85 C temperature rating allows deployment in factory-floor robotics enclosures without active cooling.
Recommandé
Embedded Camera Modules
The ATSAMD51J20A-MU's on-chip Image Sensor Interface (ISI) accepts raw Bayer streams from a parallel CMOS sensor up to WVGA resolution, while the FPU performs color-conversion and JPEG compression in software at 30 fps. With 256 KB SRAM and 1 MB Flash, the MCU can host a complete HTTP/JPEG streamer stack plus on-board face-detection preprocessing without external SDRAM. The integrated USB 2.0 Full-Speed PHY exposes the camera as a UVC webcam or HID-based machine-vision device, eliminating external bridge chips. The 64-VQFN 9x9 mm footprint suits small camera PCBs under 30x30 mm.
Recommandé
IoT Edge Nodes with TLS
The ATSAMD51J20A-MU's hardware crypto accelerator (AES, SHA, RSA, TRNG) offloads TLS 1.2 / 1.3 handshakes from the Cortex-M4F core, freeing the 120 MHz CPU for application logic on battery-powered IoT edge devices. With 1 MB Flash the MCU can store both the application firmware and a TLS mbedTLS stack plus certificates, while the 256 KB SRAM accommodates TLS session buffers and LoRaWAN or BLE application payloads. The integrated USB 2.0 FS PHY enables field provisioning via CDC, and the wide 1.71V-3.6V supply range allows direct operation from a 3.6V LiSOCl2 primary cell with no LDO dropout penalty.
Recommandé
Audio Playback and DSP Peripherals
The ATSAMD51J20A-MU's I2S interface connects directly to a Class-D amplifier or external DAC, while the Cortex-M4F DSP extensions execute low-latency audio DSP such as biquad filtering and dynamic-range compression in real time. With 256 KB SRAM the MCU can hold multi-band equalizer coefficients and 100 ms of 48 kHz audio buffering without external memory. The two integrated 12-bit DACs produce analog outputs for tone generation or LED-driver analog control. The 120 MHz CPU clock leaves ample headroom for Bluetooth audio bridge firmware, and the on-chip USB Full-Speed PHY supports USB audio class 1.0 devices for headset applications.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMD51J20A-MU — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMD51J20A-MUT | ATSAMD51J20A-MU-EFP | ATSAMD51J19A-MU | ATSAMD51J18A-MU | ATSAMD51J20A-AU-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Core / Max Frequency | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz |
| Flash / SRAM | 1 MB / 256 KB | 1 MB / 256 KB | 1 MB / 256 KB | 512 KB / 192 KB (-50%) | 256 KB / 128 KB (-75%) | 1 MB / 256 KB |
| Temperature Grade | -40 C to +85 C (industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (extended) |
| Crypto Accelerator | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG |
| USB PHY | USB 2.0 FS on-chip | USB 2.0 FS on-chip | USB 2.0 FS on-chip | USB 2.0 FS on-chip | USB 2.0 FS on-chip | USB 2.0 FS on-chip |
| Unit Price (1 pc, as of 2026-09-21) | $7.08 | approx $7.10 | approx $8.50 | approx $6.40 | approx $5.90 | approx $9.20 |
Principaux différenciateurs
- Largest Flash/SRAM in 64-VQFN SAM D51 family (vs ATSAMD51J19A-MU)
- Integrated USB 2.0 Full-Speed PHY (vs ATSAM3X8C)
- Hardware crypto accelerator (AES/SHA/RSA/TRNG) (vs ATSAMD21J18A-AU)
Notes de conception
Estimated: at 120 MHz CPU clock with all peripherals active in the VQFN-9x9 package, typical junction-to-ambient thermal resistance theta_JA is ~28 C/W on a 4-layer JEDEC PCB. With industrial -40 C to +85 C operation, continuous full-load power dissipation (approx 0.25 W) keeps junction rise below ~7 C, which is well within margin; however, mounting the package on a PCB without the exposed pad soldered to a sufficiently large ground copper pour (>=25 thermal vias to inner ground planes) will push theta_JA above 60 C/W and risk thermal shutdown at elevated ambient temperatures.
Place decoupling capacitors as close to each VDDIO and VDDANA pin as possible - use a 100 nF X7R ceramic per pin plus a bulk 4.7 uF X5R per supply domain. Keep the 32 kHz crystal traces short and guarded by a ground ring; per the SAM D5x/E5x datasheet, the XIN/XOUT load capacitance must match the crystal's CL specification (typically 12 pF) including PCB stray capacitance.
The ATSAMD51J20A-MU integrates DC-DC switching converters that step down VDDIO/VDDANA (1.71V-3.6V) to the internal 1.2V core voltage - this requires an external 4.7 uH inductor between VSW and the regulator input pin. Per Microchip application note AN4437, do not operate the device in 'linear-only' mode by tying VSW open, or power dissipation at 120 MHz will exceed 250 mW. Add a 10 uF bulk cap on the VSW-to-ground node to suppress switching ripple.
Do not skip the BOOT_PROT fuse configuration in NVMUSER row: leaving the BOOT_PROT region unlocked allows arbitrary flash erase by a malicious firmware update and breaks IEC 60730 class-B compliance. Also ensure SERCOM PAD multiplexing is configured before enabling the peripheral clock, or the MCU may drive pins with random outputs. Per errata DS80000978D, the I2S TX underrun behavior requires manual flush before re-enabling the DMA channel.
Informations de conformité
RoHS / REACH compliant per Microchip product page (en-us/product/ATSAMD51J20A). The standard -MU industrial grade is not AEC-Q100 qualified; the -AU extended-temperature variant (ATSAMD51J20A-AU-EFP) is the AEC-Q100-ready part for automotive applications. ECC on Flash and SRAM supports IEC 60730 class-B firmware integrity.
