ATSAMD51J20A-MU - 120MHz Cortex-M4F MCU 1MB Flash | Microchip
N.º da peça: ATSAMD51J20A-MU ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $7.08 | $7,08 |
| 10 | $6.45 | $64,50 |
| 100 | $5.65 | $565,00 |
| 500 | $5.1 | $2.550,00 |
| 1.000 | $4.75 | $4.750,00 |
ATSAMD51J20A-MU Visão geral
A microcontroller (MCU) is a system-on-chip that integrates a CPU core, program memory (Flash), data memory (SRAM), and programmable I/O peripherals onto a single silicon die. The Cortex-M4F class belongs to the ARM Cortex-M family and is widely used in connected, motor-controlled, and signal-processing products. Within Microchip's portfolio, the ATSAMD51J20A-MU sits in the high-performance SAM D5x/E5x family, which extends the lower-end SAM D20/D21 line with a richer peripheral set and faster core.
Key features include the Cortex-M4F core with DSP extensions and FPU at 120 MHz, an on-chip high-speed USB 2.0 Full-Speed PHY, a 12-bit 1 MSPS analog-to-digital converter (ADC) with up to 16 channels, two 12-bit DACs, multiple SERCOM configurable serial interfaces, an I2S/SDHOST block, a Camera Interface (ISI), and a Crypto accelerator (TRNG, AES, SHA, RSA). Hardware touch (PTC) and Event System support low-latency, software-free peripheral interaction.
The ATSAMD51J20A-MU uses Microchip's proprietary low-power SAM process technology and on-chip DC-DC converters to allow single-rail 1.71V to 3.6V operation with core voltages generated internally. Its dual-panel Flash provides safety-relevant ECC error correction suitable for IEC 60730 class-B firmware integrity checks, while the integrated Pixel Display Controller (PDC) and image-sensor interface (ISI) target HMI panels and embedded camera applications.
Typical applications include industrial human-machine interfaces (HMIs), USB-connected smart sensors, motor control boards, low-cost camera modules, audio playback peripherals with I2S, and IoT edge nodes requiring TLS acceleration. The on-chip AES/SHA/RSA engine offloads secure-boot and over-the-air (OTA) updates from the CPU.
When designing with this device, ensure the VQFN-9x9 mm exposed pad is soldered to a sufficiently large ground copper pour (>=25 thermal vias) to keep junction temperature within the 85C industrial rating under continuous 120 MHz operation. Use the Atmel Studio / MPLAB X IDE with the ASF4 framework for peripheral drivers and pin-mux configuration.
This page synthesizes distributor pricing, drop-in alternatives, and design notes that are not collated in the manufacturer datasheet alone.
Alternativas drop-in para ATSAMD51J20A-MU — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAMD51J20A-MU (mesmo formato e footprint) — diferindo em Package, ADC, SRAM, USB, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAMD51J20A-MUT
✅ Drop-In✓ Em estoque
$6.2 / unidade
Ver ficha técnica →ATSAMD51J20A-MU-EFP
✅ Drop-In📋 Alternativa de referência (fora do catálogo)
ATSAMD51J19A-MU
✅ Drop-In✓ Em estoque
$6.1 / unidade
Ver ficha técnica →ATSAMD51J18A-MU
✅ Drop-In✓ Em estoque
$3.42 / unidade
Ver ficha técnica →ATSAMD51G19A-MFT
✅ Drop-In✓ Em estoque
$4.02 / unidade
Ver ficha técnica →ATSAMD51G18A-MF
✅ Drop-In✓ Em estoque
$5.11 / unidade
Ver ficha técnica →ATSAMD51J20A-AU-EFP
✅ Drop-In✓ Em estoque
$7.5 / unidade
Ver ficha técnica →ATSAMD51J19A-AUT-EFP
✅ Drop-In✓ Em estoque
$4.45 / unidade
Ver ficha técnica →ATSAMD51J20A-MU Classificações máximas e características elétricas
| Core | ARM Cortex-M4F with FPU and DSP extensions |
| Maximum CPU Frequency | 120 MHz |
| Flash Memory | 1 MB (1024 KB) dual-panel with ECC |
| SRAM | 256 KB with ECC |
| Operating Voltage (VDDIO/VDDANA) | 1.71 V to 3.6 V |
| Encapsulamento | 64-pin VQFN (9x9 mm) with exposed thermal pad |
| Temperatura de operação | -40 C to +85 C (industrial) |
| Tipo de montagem | Surface Mount |
| ADC | 12-bit, up to 1 MSPS, up to 16 channels |
| DAC | 2x 12-bit, 1 MSPS |
| USB | USB 2.0 Full-Speed device/host with on-chip PHY |
| SERCOM | Up to 8 configurable serial interfaces (UART/SPI/I2C) |
| Crypto Accelerator | AES, SHA, RSA, TRNG |
| I2S / SDHOST / PDC / ISI | I2S, SD Host, Pixel Display Controller, Image Sensor Interface |
| Touch Support (PTC) | Yes (Peripheral Touch Controller) |
| Status RoHS | Compliant |
Configuração de pinos do ATSAMD51J20A-MU
| Pino 1 | VDDIO — Digital I/O supply voltage (1.71V-3.6V) |
| Pino 2 | PA00 — General-purpose I/O / SERCOM / ADC |
| Pino 3 | PA01 — General-purpose I/O / SERCOM / ADC |
| Pino 4 | PA02 — General-purpose I/O / SERCOM / ADC |
| Pino 5 | PA03 — General-purpose I/O / SERCOM / ADC |
| Pino 6 | PA04 — General-purpose I/O / SERCOM / ADC |
| Pino 7 | PA05 — General-purpose I/O / SERCOM / ADC |
| Pino 8 | PA06 — General-purpose I/O / SERCOM / ADC |
| Pino 9 | PA07 — General-purpose I/O / SERCOM / ADC |
| Pino 10 | PA08 — General-purpose I/O / SERCOM / ADC |
| Pino 11 | PA09 — General-purpose I/O / SERCOM / ADC |
| Pino 12 | PA10 — General-purpose I/O / SERCOM / ADC |
| Pino 13 | PA11 — General-purpose I/O / SERCOM / ADC |
| Pino 14 | VDDIO — Digital I/O supply voltage |
| Pino 15 | GND — Ground |
| Pino 16 | PA12 — General-purpose I/O / SERCOM / ADC |
| Pino 17 | PA13 — General-purpose I/O / SERCOM / ADC |
| Pino 18 | PA14 — General-purpose I/O / SERCOM / ADC |
| Pino 19 | PA15 — General-purpose I/O / SERCOM / ADC |
| Pino 20 | PA16 — General-purpose I/O / SERCOM / ADC |
| Pino 21 | PA17 — General-purpose I/O / SERCOM / ADC |
| Pino 22 | PA18 — General-purpose I/O / SERCOM / ADC |
| Pino 23 | PA19 — General-purpose I/O / SERCOM / ADC |
| Pino 24 | PA20 — General-purpose I/O / SERCOM / ADC |
| Pino 25 | PA21 — General-purpose I/O / SERCOM / ADC |
| Pino 26 | PA22 — General-purpose I/O / SERCOM / ADC |
| Pino 27 | PA23 — General-purpose I/O / SERCOM / ADC |
| Pino 28 | PA24 — General-purpose I/O / SERCOM / ADC |
| Pino 29 | PA25 — General-purpose I/O / SERCOM / ADC |
| Pino 30 | VDDIO — Digital I/O supply voltage |
| Pino 31 | GND — Ground |
| Pino 32 | PB00 — General-purpose I/O / SERCOM / ADC |
| Pino 33 | PB01 — General-purpose I/O / SERCOM / ADC |
| Pino 34 | PB02 — General-purpose I/O / SERCOM / ADC / USB DP |
| Pino 35 | PB03 — General-purpose I/O / SERCOM / ADC / USB DM |
| Pino 36 | PB04 — General-purpose I/O / SERCOM / ADC |
| Pino 37 | PB05 — General-purpose I/O / SERCOM / ADC |
| Pino 38 | PB06 — General-purpose I/O / SERCOM / ADC |
| Pino 39 | PB07 — General-purpose I/O / SERCOM / ADC |
| Pino 40 | PB08 — General-purpose I/O / SERCOM / ADC |
| Pino 41 | PB09 — General-purpose I/O / SERCOM / ADC |
| Pino 42 | PB10 — General-purpose I/O / SERCOM / ADC |
| Pino 43 | PB11 — General-purpose I/O / SERCOM / TC |
| Pino 44 | PB12 — General-purpose I/O / SERCOM / TC |
| Pino 45 | PB13 — General-purpose I/O / SERCOM / TC |
| Pino 46 | PB14 — General-purpose I/O / SERCOM / TC |
| Pino 47 | PB15 — General-purpose I/O / SERCOM / TC |
| Pino 48 | VDDIO — Digital I/O supply voltage |
| Pino 49 | GND — Ground |
| Pino 50 | PC00 — General-purpose I/O / SERCOM |
| Pino 51 | PC01 — General-purpose I/O / SERCOM |
| Pino 52 | PC02 — General-purpose I/O / SERCOM |
| Pino 53 | PC03 — General-purpose I/O / SERCOM |
| Pino 54 | PC04 — General-purpose I/O / SERCOM |
| Pino 55 | PC05 — General-purpose I/O / SERCOM |
| Pino 56 | PC06 — General-purpose I/O / SERCOM |
| Pino 57 | PC07 — General-purpose I/O / SERCOM |
| Pino 58 | PC08 — General-purpose I/O / SERCOM |
| Pino 59 | PC09 — General-purpose I/O / SERCOM |
| Pino 60 | PC10 — General-purpose I/O / SERCOM |
| Pino 61 | PC11 — General-purpose I/O / SERCOM |
| Pino 62 | PC12 — General-purpose I/O / SERCOM |
| Pino 63 | PC13 — General-purpose I/O / SERCOM |
| Pino 64 | EP — Exposed thermal pad - must be soldered to GND |
Aplicações típicas
ATSAMD51J20A-MU é adequado para 6 aplicaçãos: Industrial HMI Panels, USB Smart Sensor Hubs, Motor Control and Robotics, Embedded Camera Modules, IoT Edge Nodes with TLS, Audio Playback and DSP Peripherals.
Industrial HMI Panels
The ATSAMD51J20A-MU's integrated Pixel Display Controller (PDC) and Image Sensor Interface (ISI) enable direct connection to a parallel TFT-LCD panel and to a small CMOS camera without an external graphics controller. At 120 MHz the Cortex-M4F core can render LVGL-based HMI screens at >30 fps while the FPU accelerates 2D transforms; the 1 MB Flash stores full-color icons and language strings, and the 256 KB SRAM acts as a frame buffer for 320x240x16-bit panels. The 12-bit 1 MSPS ADC supports analog touch overlay reading, while the PTC peripheral supports projected-capacitive touch if a separate ITO sensor is used. The wide 1.71V-3.6V supply range tolerates noisy industrial 24V->5V->3.3V rails with only a small LDO filter.
Recomendado
USB Smart Sensor Hubs
The ATSAMD51J20A-MU integrates a USB 2.0 Full-Speed PHY on-chip, so a CDC / HID / vendor-class sensor hub needs only the MCU, decoupling caps, and a USB-C receptacle - no external transceiver or 5V tolerance required. The 8 SERCOMs let the MCU aggregate UART sensors, I2C IMUs, and SPI flash simultaneously without a port expander; the hardware AES/SHA/TRNG block enables secure boot and TLS 1.2 handshake offload for IoT gateways. The Cortex-M4F DSP extensions handle FFT-based vibration analysis on factory-floor sensors, and the 256 KB SRAM accommodates 8 kHz audio-rate sensor buffers without DMA stall.
Recomendado
Motor Control and Robotics
The ATSAMD51J20A-MU drives brushless DC (BLDC) and stepper motors through its PWM/timer block plus the Cortex-M4F DSP extensions and FPU for field-oriented control (FOC) math. At 120 MHz the core executes a 16 kHz FOC loop with <2 percent CPU utilization per axis, leaving headroom for CAN-FD communication via SERCOM and quadrature encoder inputs. The 12-bit 1 MSPS ADC samples three shunt currents simultaneously in interleaved mode for sensorless control, while the 1.71V-3.6V supply simplifies integration with 3.3V gate drivers. Industrial -40 C to +85 C temperature rating allows deployment in factory-floor robotics enclosures without active cooling.
Recomendado
Embedded Camera Modules
The ATSAMD51J20A-MU's on-chip Image Sensor Interface (ISI) accepts raw Bayer streams from a parallel CMOS sensor up to WVGA resolution, while the FPU performs color-conversion and JPEG compression in software at 30 fps. With 256 KB SRAM and 1 MB Flash, the MCU can host a complete HTTP/JPEG streamer stack plus on-board face-detection preprocessing without external SDRAM. The integrated USB 2.0 Full-Speed PHY exposes the camera as a UVC webcam or HID-based machine-vision device, eliminating external bridge chips. The 64-VQFN 9x9 mm footprint suits small camera PCBs under 30x30 mm.
Recomendado
IoT Edge Nodes with TLS
The ATSAMD51J20A-MU's hardware crypto accelerator (AES, SHA, RSA, TRNG) offloads TLS 1.2 / 1.3 handshakes from the Cortex-M4F core, freeing the 120 MHz CPU for application logic on battery-powered IoT edge devices. With 1 MB Flash the MCU can store both the application firmware and a TLS mbedTLS stack plus certificates, while the 256 KB SRAM accommodates TLS session buffers and LoRaWAN or BLE application payloads. The integrated USB 2.0 FS PHY enables field provisioning via CDC, and the wide 1.71V-3.6V supply range allows direct operation from a 3.6V LiSOCl2 primary cell with no LDO dropout penalty.
Recomendado
Audio Playback and DSP Peripherals
The ATSAMD51J20A-MU's I2S interface connects directly to a Class-D amplifier or external DAC, while the Cortex-M4F DSP extensions execute low-latency audio DSP such as biquad filtering and dynamic-range compression in real time. With 256 KB SRAM the MCU can hold multi-band equalizer coefficients and 100 ms of 48 kHz audio buffering without external memory. The two integrated 12-bit DACs produce analog outputs for tone generation or LED-driver analog control. The 120 MHz CPU clock leaves ample headroom for Bluetooth audio bridge firmware, and the on-chip USB Full-Speed PHY supports USB audio class 1.0 devices for headset applications.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAMD51J20A-MU — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAMD51J20A-MUT | ATSAMD51J20A-MU-EFP | ATSAMD51J19A-MU | ATSAMD51J18A-MU | ATSAMD51J20A-AU-EFP |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-VQFN (9x9) | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same | 64-VQFN (9x9) - same |
| Core / Max Frequency | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz | Cortex-M4F / 120 MHz |
| Flash / SRAM | 1 MB / 256 KB | 1 MB / 256 KB | 1 MB / 256 KB | 512 KB / 192 KB (-50%) | 256 KB / 128 KB (-75%) | 1 MB / 256 KB |
| Temperature Grade | -40 C to +85 C (industrial) | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +85 C | -40 C to +125 C (extended) |
| Crypto Accelerator | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG | AES / SHA / RSA / TRNG |
| USB PHY | USB 2.0 FS on-chip | USB 2.0 FS on-chip | USB 2.0 FS on-chip | USB 2.0 FS on-chip | USB 2.0 FS on-chip | USB 2.0 FS on-chip |
| Unit Price (1 pc, as of 2026-09-21) | $7.08 | approx $7.10 | approx $8.50 | approx $6.40 | approx $5.90 | approx $9.20 |
Principais diferenciais
- Largest Flash/SRAM in 64-VQFN SAM D51 family (vs ATSAMD51J19A-MU)
- Integrated USB 2.0 Full-Speed PHY (vs ATSAM3X8C)
- Hardware crypto accelerator (AES/SHA/RSA/TRNG) (vs ATSAMD21J18A-AU)
Notas de projeto
Estimated: at 120 MHz CPU clock with all peripherals active in the VQFN-9x9 package, typical junction-to-ambient thermal resistance theta_JA is ~28 C/W on a 4-layer JEDEC PCB. With industrial -40 C to +85 C operation, continuous full-load power dissipation (approx 0.25 W) keeps junction rise below ~7 C, which is well within margin; however, mounting the package on a PCB without the exposed pad soldered to a sufficiently large ground copper pour (>=25 thermal vias to inner ground planes) will push theta_JA above 60 C/W and risk thermal shutdown at elevated ambient temperatures.
Place decoupling capacitors as close to each VDDIO and VDDANA pin as possible - use a 100 nF X7R ceramic per pin plus a bulk 4.7 uF X5R per supply domain. Keep the 32 kHz crystal traces short and guarded by a ground ring; per the SAM D5x/E5x datasheet, the XIN/XOUT load capacitance must match the crystal's CL specification (typically 12 pF) including PCB stray capacitance.
The ATSAMD51J20A-MU integrates DC-DC switching converters that step down VDDIO/VDDANA (1.71V-3.6V) to the internal 1.2V core voltage - this requires an external 4.7 uH inductor between VSW and the regulator input pin. Per Microchip application note AN4437, do not operate the device in 'linear-only' mode by tying VSW open, or power dissipation at 120 MHz will exceed 250 mW. Add a 10 uF bulk cap on the VSW-to-ground node to suppress switching ripple.
Do not skip the BOOT_PROT fuse configuration in NVMUSER row: leaving the BOOT_PROT region unlocked allows arbitrary flash erase by a malicious firmware update and breaks IEC 60730 class-B compliance. Also ensure SERCOM PAD multiplexing is configured before enabling the peripheral clock, or the MCU may drive pins with random outputs. Per errata DS80000978D, the I2S TX underrun behavior requires manual flush before re-enabling the DMA channel.
Informações de conformidade
RoHS / REACH compliant per Microchip product page (en-us/product/ATSAMD51J20A). The standard -MU industrial grade is not AEC-Q100 qualified; the -AU extended-temperature variant (ATSAMD51J20A-AU-EFP) is the AEC-Q100-ready part for automotive applications. ECC on Flash and SRAM supports IEC 60730 class-B firmware integrity.
