PIC24HJ128GP306A-E/MR - 16-bit 40MIPS 128KB Flash MCU | Microchip
Référence : PIC24HJ128GP306A-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.1 | $11,10 |
| 10 | $9.99 | $99,90 |
| 100 | $8.75 | $875,00 |
| 500 | $7.42 | $3 710,00 |
| 1 000 | $6.5 | $6 500,00 |
PIC24HJ128GP306A-E/MR Présentation
A 16-bit microcontroller is a single-chip computer whose data path, registers and ALU are 16 bits wide; PIC24H devices in particular use a modified Harvard architecture with a 24-bit instruction word and a 16-bit data path, sitting in the product hierarchy 8-bit MCU (PIC16/PIC18) -> 16-bit MCU (PIC24) -> 16-bit DSC (dsPIC33) -> 32-bit MCU (PIC32). The PIC24HJ128GP306A is pin-compatible with the dsPIC33F family and offers seamless migration paths to PIC24F, dsPIC30F and dsPIC33F devices, which simplifies both upward (more peripherals / DSP) and downward (lower power) migrations on the same PCB footprint.
Key features include a 40 MIPS execution speed from a 40 MHz oscillator with PLL, hardware multiplier for single-cycle MAC operations, and an enhanced CAN 2.0B module for automotive networking. The 64-pin VQFN (MR) variant offers an exposed thermal pad for improved heat dissipation in space-constrained automotive modules and industrial drives. Code security via program memory write protection and a unique device ID support anti-cloning, while the built-in 16-bit PWM with up to 9 outputs simplifies three-phase motor control and digital power conversion.
Typical applications include automotive body and chassis ECUs, BLDC/PMSM motor drives, industrial control PLCs, sensorless field-oriented motor control, and high-speed digital signal conditioning. The combination of CAN, ample RAM and 12-bit ADC sample-and-hold makes it a strong fit for mechatronic subsystems that must meet AEC-Q100 stress tests.
When designing with this device, follow the datasheet recommended decoupling scheme (100 nF on each VDD/VSS pair plus a bulk 10 µF) and use the exposed pad as the primary ground and thermal path; this part is supplied only in tube packaging per the manufacturer designation (-E = extended temp, /MR = VQFN-64).
Alternatives de remplacement direct pour PIC24HJ128GP306A-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec PIC24HJ128GP306A-E/MR (même facteur de forme et même empreinte) — différant par Package, ADC, Maximum CPU Speed, Operating Temperature, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
PIC24HJ128GP306A-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.24 / unité
Voir la fiche technique →PIC24HJ256GP306A-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33FJ128GP306A-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.2 / unité
Voir la fiche technique →dsPIC33FJ128MC306A-E/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
PIC24HJ128GP306A-E/MR Valeurs maximales et caractéristiques électriques
| Device Family | PIC24H 16-bit MCU |
| Core Architecture | 16-bit modified Harvard |
| Program Memory (Flash) | 128 KB (43K x 24) |
| RAM | 16 KB |
| Maximum CPU Speed | 40 MIPS at 40 MHz |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| Température de fonctionnement | -40 °C to +125 °C (Extended) |
| Boîtier | 64-pin VQFN (9x9 mm) with exposed thermal pad |
| Digital I/O Pins | 53 |
| ADC | 16-channel, 10/12-bit |
| Communication | 2x UART, 2x SPI, 1x I2C, 1x ECAN 2.0B |
| PWM Outputs | Up to 9 (16-bit) |
| AEC-Q100 | Qualified |
| Statut RoHS | Compliant |
| Container Type | Tube |
| Type de montage | Surface Mount |
Guide de configuration des broches du PIC24HJ128GP306A-E/MR 64-pin vqfn (9x9 mm) with exposed thermal pad
Configuration des broches du PIC24HJ128GP306A-E/MR (boîtier 64-pin vqfn (9x9 mm) with exposed thermal pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour PIC24HJ128GP306A-E/MR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
PIC24HJ128GP306A-E/MR convient pour 6 applications: Automotive Body Control Modules (BCM), BLDC / PMSM Motor Drives, Industrial Sensor Conditioning & PLCs, Automotive Sensor Clusters (CAN Nodes), Switch-Mode Power Supply Digital Control, Medical Patient Monitoring Sub-Systems.
Automotive Body Control Modules (BCM)
The PIC24HJ128GP306A-E/MR fits automotive BCM designs thanks to its AEC-Q100 Grade 1 qualification, -40 to +125 °C extended temperature, and 40 MIPS core that services LIN/CAN bus traffic plus body-domain logic. Its 53 digital I/O pins drive LED arrays, door-lock actuators, and wiper relays; the 16-channel 12-bit ADC reads multiplexed switch and sensor inputs at >200 ksps. Built-in ECAN 2.0B handles chassis-CAN messages at 1 Mbit/s without an external transceiver's MCU traffic. The 64-pin VQFN with exposed pad keeps the PCB compact while maintaining Theta-JA near 24 °C/W under hood-compartment ambient, so the BCM stays within automotive thermal budgets without a heatsink.
Recommandé
BLDC / PMSM Motor Drives
The PIC24HJ128GP306A-E/MR is well suited to BLDC and PMSM motor control up to several hundred watts. The 40 MIPS core runs 8 kHz current loops with margin for sensorless back-EMF estimators or Hall-sensor decoding, while the 16-bit PWM module with up to 9 outputs and programmable dead time directly drives a three-phase inverter through gate drivers. The 16-channel 12-bit ADC samples phase currents within the PWM cycle, enabling tight torque control. The exposed-pad VQFN package dissipates the MCU's ~300 mW easily in a sealed drive housing, and AEC-Q100 qualification supports underhood or chassis mounting. Migration to dsPIC33FJ128MC306A-E/MR adds DSP throughput if sensorless FOC is added later.
Recommandé
Industrial Sensor Conditioning & PLCs
Use the PIC24HJ128GP306A-E/MR in industrial PLCs and analog-front-end conditioning boards where 16-bit control loops and high-resolution sensing matter. The 12-bit ADC (with optional 10-bit mode for faster conversion) supports 4-20 mA loop conditioning and RTD / thermocouple cold-junction compensation via the on-chip voltage reference. Its 53 I/Os interface to optocouplers, relays, and HMI displays; ECAN and SPI provide fast backplane links. Running at 40 MIPS the MCU executes IEC 61131-3 logic and PID loops in <2 ms with margin for safety diagnostics. The 64-pin VQFN footprint fits compact PLC slices, and PIC24H to dsPIC33F migration preserves firmware libraries when DSP is added.
Recommandé
Automotive Sensor Clusters (CAN Nodes)
The PIC24HJ128GP306A-E/MR excels as a low-cost CAN sensor node for radar pre-processors, suspension accelerometers, and tire-pressure monitoring transmitter receivers. The 40 MIPS core handles sensor fusion and CRC-protected CAN frame transmission at 500 kbit/s, while the 16 KB RAM buffers outgoing telemetry. With 128 KB Flash, OEMs can implement CANopen or J1939 stacks alongside signal-processing routines. The exposed-pad VQFN dissipates the device's ~250 mW with the PCB ground copper, suitable for sealed IP6K7 enclosures. AEC-Q100 Grade 1 qualification permits deployment in chassis or wheel-well zones where ambient reaches +125 °C.
Recommandé
Switch-Mode Power Supply Digital Control
The PIC24HJ128GP306A-E/MR is a strong candidate for digitally-controlled AC-DC or DC-DC converters where a 16-bit MCU replaces analog PWM controllers. Its 9 PWM outputs at 16-bit resolution and 8 ns PWM duty-cycle granularity regulate multi-rail telecom or industrial power supplies, while the 12-bit ADC samples output voltage and current for voltage-mode / current-mode control loops. High-speed ADC triggering tied to the PWM timer achieves sub-microsecond loop delay, approaching analog controller bandwidth. The 3.0-3.6 V supply can be derived from an internal housekeeping rail; AEC-Q100 qualification supports EV-charging auxiliary supplies.
Recommandé
Medical Patient Monitoring Sub-Systems
In medical sub-systems - infusion pumps, portable pulse oximeters, and bedside monitor front-ends - the PIC24HJ128GP306A-E/MR offers enough MIPS and RAM to run sensor conditioning and a lightweight display stack. The 12-bit ADC reads pulse-oximetry photodiode currents with software IIR filtering; the PWM outputs drive audible alarms with precision; and the SPI links to a graphics OLED or color TFT driver. AEC-Q100 qualification is incidental here but signals robust silicon screening that benefits medical reliability programs. Note: this part is not FDA-recognized for life-support; pair with appropriate isolation and watchdogs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour PIC24HJ128GP306A-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | PIC24HJ128GP306A-I/MR | PIC24HJ256GP306A-E/MR | dsPIC33FJ128GP306A-E/MR | dsPIC33FJ128MC306A-E/MR |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin VQFN (9x9 mm) with exposed pad | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same | 64-pin VQFN (9x9 mm) - same |
| Program Memory (Flash) | 128 KB | 128 KB - same | 256 KB (+100%) | 128 KB - same | 128 KB - same |
| RAM | 16 KB | 16 KB - same | 16 KB - same | 16 KB - same | 16 KB - same |
| Maximum CPU Speed | 40 MIPS | 40 MIPS - same | 40 MIPS - same | 40 MIPS - same | 40 MIPS - same |
| Operating Temperature | -40 °C to +125 °C (Extended, AEC-Q100) | -40 °C to +85 °C (Industrial) | -40 °C to +125 °C - same | -40 °C to +125 °C - same | -40 °C to +125 °C - same |
| DSP Engine | No (PIC24H MCU core only) | No | No | Yes (DSP engine + single-cycle MAC) | Yes (DSP engine + motor-control PWM) |
| Automotive Grade (AEC-Q100) | Yes (Grade 1) | No (industrial only) | Yes (Grade 1) | Yes (Grade 1) | Yes (Grade 1) |
Principaux différenciateurs
- AEC-Q100 Grade 1 qualified in compact VQFN (vs PIC24HJ128GP306A-I/MR)
- Automotive-grade same-footprint memory upgrade path (vs PIC24HJ256GP306A-E/MR)
- Direct upgrade path to DSP without PCB rework (vs dsPIC33FJ128GP306A-E/MR)
Notes de conception
Estimated: total power at 40 MIPS full peripheral load is approximately 70 mW (VDD 3.3 V × I_DD 22 mA typical). Place a 10 µF bulk tantalum or ceramic near the VDD pins and a 0.1 µF X7R ceramic on every VDD/VSS pair, within 3 mm of the lead, per the Microchip PIC24H hardware design checklist. Use a ferrite bead on AVDD if analog and digital supplies share the rail, with a separate 0.1 µF + 10 µF decoupling pair on AVDD and AVSS to preserve ADC SNR.
Estimated: thermal resistance Theta-JA of the 64-pin VQFN (MR) on a JEDEC EIA/JESD51 2s2p test board is approximately 24 °C/W. At 70 mW dissipation the junction rises only ~2 °C above ambient, so no heatsink is needed. Solder the exposed thermal pad to a continuous ground copper pour - this is also the primary electrical ground reference - with 0.3 mm-diameter thermal vias on a 1.2 mm grid under the pad for improved spreading.
Place a low-ESR 4.7 µF to 22 µF bulk capacitor within 5 mm of VDD to absorb inrush during Flash programming. Keep the analog and digital sections of the PCB isolated with separate ground returns that join at a single point near the exposed pad. Route the 40 MHz crystal traces symmetrically within 3 mm of the MCU, with a ground guard ring, and avoid routing high-current switching lines under the crystal.
Configuration bits must be set correctly to enable the PLL and select the primary oscillator before the C runtime initializes; otherwise the MCU may execute at 10 MHz or fail to start at all. The exposed pad is not a no-connect - leaving it floating violates electrical specifications and causes thermal derating. On the ECAN module, ensure the CANI/O pins are reconfigured as digital inputs when CAN is unused to avoid parasitic current draw.
Informations de conformité
AEC-Q100 Grade 1 qualified per Microchip product page. RoHS and REACH compliant. Lead-free reflow profile per JEDEC J-STD-020. Halogen-free status not verified from web data - confirm with Microchip environmental declarations.
