ATSAME53J19A-MUT-EFP - 120MHz ARM Cortex-M4F MCU, 512KB Flash, 64-VQFN | Microchip
N.º da peça: ATSAME53J19A-MUT-EFP ✓ Ativo| Qtd. | Preço unitário | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.21 | $82,10 |
| 100 | $7.48 | $748,00 |
| 500 | $6.79 | $3.395,00 |
| 1.000 | $6.1 | $6.100,00 |
ATSAME53J19A-MUT-EFP Visão geral
What is a Cortex-M4F microcontroller? A 32-bit ARM Cortex-M microcontroller (MCU) is a system-on-chip that integrates a processor core, program and data memory, peripherals, and interconnect fabric into a single device. The Cortex-M4F adds a single-precision Floating-Point Unit (FPU) and DSP extensions to the baseline M4 architecture, allowing efficient execution of fixed-point and floating-point signal-processing algorithms. SAM E53 devices belong to the Cortex-M4F -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processor taxonomy.
Key features of the ATSAME53J19A-MUT-EFP include 512 KB Flash with ECC, 192 KB SRAM with ECC, a 120 MHz Cortex-M4F core with FPU and DSP extensions, and a rich connectivity set: USB 2.0 Full-Speed, 10/100 Mbps Ethernet MAC with IEEE 1588 support, CAN-FD, multiple SERCOM (UART/SPI/I2C), I2S, and SD/MMC host interfaces. Analog peripherals include a 12-bit ADC, 12-bit DAC, and analog comparators. The 64-VQFN package integrates an exposed thermal pad to lower junction-to-PCB thermal resistance.
The device uses a multi-layer AHB/APB bus matrix and tightly-coupled memory regions to keep interrupt latency deterministic; instruction and data caches reduce Flash wait-state penalties at 120 MHz, which is essential for protocol stacks such as Ethernet plus USB running concurrently. The integrated PHY-less Ethernet MAC, when paired with an external 100BASE-TX/FX PHY, delivers deterministic latency suitable for industrial fieldbus and real-time Ethernet. Hardware cryptographic accelerators (AES, True Random Number Generator) support secure-boot and OTA-update schemes.
Typical applications include industrial IoT gateways requiring Ethernet + USB + CAN-FD connectivity, building-automation controllers, smart-energy and metering nodes, graphical HMI panels using the integrated TFT/EBI controller, and connected sensor hubs. The combination of FPU, DSP, and high-speed analog peripherals also targets motor-control and predictive-maintenance endpoints.
Design considerations: route the dual VDDIO supply domains to the correct pin groups, place 100 nF + 1 uF decoupling close to every VDD/VBAT/AVDD pin, and follow Microchip's SAM E53 layout guide for the analog ground island. The 9x9 mm 64-VQFN footprint requires a 4-layer PCB with a continuous thermal-pad copper pour to keep theta_JA within the datasheet envelope. The EFP suffix guarantees Extended Flash Performance across the full -40C to +85C industrial temperature range.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found on Microchip's product page or in the bare datasheet. Cross-brand references are sourced only from verified web data; same-family Microchip variants are explicitly marked.
Alternativas drop-in para ATSAME53J19A-MUT-EFP — mesmo encapsulamento, compatível pino a pino. Peças de encapsulamento diferente que exigem retrabalho na PCB são excluídas.
Variantes desta série
Modelos da mesma série compatíveis como drop-in com ATSAME53J19A-MUT-EFP (mesmo formato e footprint) — diferindo em Package, ADC, SRAM, DAC, Operating Temperature.
Ferramenta de comparação rápida — selecione peças alternativas para comparação lado a lado:
ATSAME51J19A-MUT-EFP
✅ Drop-In✓ Em estoque
$2.43 / unidade
Ver ficha técnica →ATSAME53J19A-MU-EFP
✅ Drop-In✓ Em estoque
$8.05 / unidade
Ver ficha técnica →ATSAME53J18A-MUT-EFP
✅ Drop-In ⚠️ Especificações não verificadas📋 Alternativa de referência (fora do catálogo)
ATSAME53J19A-MFT
✅ Drop-In✓ Em estoque
$6.45 / unidade
Ver ficha técnica →ATSAME51J20A-MUT
✅ Drop-In ⚠️ Especificações não verificadas✓ Em estoque
$6.2 / unidade
Ver ficha técnica →ATSAME53J19A-MUT-EFP Classificações máximas e características elétricas
| Core Architecture | ARM Cortex-M4F with FPU and DSP extensions |
| Maximum CPU Clock | 120 MHz |
| Program Memory (Flash) | 512 KB with ECC |
| Data Memory (SRAM) | 192 KB with ECC |
| Encapsulamento | 64-pin VQFN (9x9 mm) |
| Supply Voltage (VDDCORE) | 1.2 V typical |
| Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Temperatura de operação | -40C to +85C (industrial) |
| Connectivity | USB 2.0 Full-Speed, 10/100 Ethernet MAC, CAN-FD, I2S |
| Serial Interfaces | Up to 6x SERCOM (UART/SPI/I2C) |
| ADC | 12-bit, up to 16 channels |
| DAC | 12-bit, 2 channels |
| External Bus Interface | Yes (EBI for SRAM/SDRAM/NAND) |
| Crypto Acceleration | AES, True Random Number Generator |
| Flash Performance Class | Extended Flash Performance (EFP) |
| Tipo de montagem | Surface Mount |
| Status RoHS | Compliant |
Configuração de pinos do ATSAME53J19A-MUT-EFP
| Pino 1 | VDDIO — I/O supply voltage (1.62 V to 3.6 V) |
| Pino 2 | PA00 — GPIO / SERCOM1.0 / I2S FS0 |
| Pino 3 | PA01 — GPIO / SERCOM1.1 / I2S MCK0 |
| Pino 4 | PA02 — GPIO / SERCOM1.2 / EBI A00 |
| Pino 5 | PA03 — GPIO / SERCOM1.3 / EBI A01 |
| Pino 6 | GND — Ground |
| Pino 7 | PA04 — GPIO / SERCOM0.0 / TCC0.0 |
| Pino 8 | PA05 — GPIO / SERCOM0.1 / TCC0.1 |
| Pino 9 | PA06 — GPIO / SERCOM0.2 / TCC1.0 |
| Pino 10 | PA07 — GPIO / SERCOM0.3 / TCC1.1 |
| Pino 11 | VDDIO — I/O supply voltage |
| Pino 12 | PA08 — GPIO / SERCOM2.0 / I2S SDO |
| Pino 13 | PA09 — GPIO / SERCOM2.1 / I2S SDI |
| Pino 14 | PA10 — GPIO / SERCOM2.2 / I2S FS1 |
| Pino 15 | PA11 — GPIO / SERCOM2.3 / CAN-FD TX |
| Pino 16 | PA12 — GPIO / SERCOM4.0 / CAN-FD RX |
| Pino 17 | PA13 — GPIO / SERCOM4.1 |
| Pino 18 | PA14 — GPIO / SERCOM4.2 / EBI A02 |
| Pino 19 | PA15 — GPIO / SERCOM4.3 / EBI A03 |
| Pino 20 | GND — Ground |
| Pino 21 | PA16 — GPIO / SERCOM3.0 / I2C SDA |
| Pino 22 | PA17 — GPIO / SERCOM3.1 / I2C SCL |
| Pino 23 | PA18 — GPIO / SERCOM3.2 / TCC2.0 |
| Pino 24 | PA19 — GPIO / SERCOM3.3 / TCC2.1 |
| Pino 25 | PA20 — GPIO / SERCOM5.0 / EBI A04 |
| Pino 26 | PA21 — GPIO / SERCOM5.1 / EBI A05 |
| Pino 27 | PA22 — GPIO / SERCOM5.2 / EBI A06 |
| Pino 28 | PA23 — GPIO / SERCOM5.3 / EBI A07 |
| Pino 29 | PA24 — GPIO / USB DM |
| Pino 30 | PA25 — GPIO / USB DP |
| Pino 31 | GND — Ground |
| Pino 32 | PA26 — GPIO / SERCOM3.0 alt |
| Pino 33 | PA27 — GPIO / SERCOM3.1 alt |
| Pino 34 | PA28 — GPIO / EBI A08 |
| Pino 35 | PA29 — GPIO / EBI A09 |
| Pino 36 | PA30 — GPIO / EBI A10 |
| Pino 37 | PA31 — GPIO / EBI A11 |
| Pino 38 | GND — Ground |
| Pino 39 | PB00 — GPIO / EBI A12 |
| Pino 40 | PB01 — GPIO / EBI A13 |
| Pino 41 | PB02 — GPIO / SERCOM5.0 alt / EBI A14 |
| Pino 42 | PB03 — GPIO / SERCOM5.1 alt / EBI A15 |
| Pino 43 | PB04 — GPIO / SERCOM3.2 alt |
| Pino 44 | PB05 — GPIO / SERCOM3.3 alt |
| Pino 45 | PB06 — GPIO / SERCOM4.0 alt |
| Pino 46 | PB07 — GPIO / SERCOM4.1 alt |
| Pino 47 | PB08 — GPIO / SERCOM4.2 alt / I2S MCK1 |
| Pino 48 | PB09 — GPIO / SERCOM4.3 alt / I2S SCK1 |
| Pino 49 | PB10 — GPIO / SERCOM5.2 alt / I2S FS1 |
| Pino 50 | PB11 — GPIO / SERCOM5.3 alt / I2S SDO1 |
| Pino 51 | VDDIO — I/O supply voltage |
| Pino 52 | PB12 — GPIO / SERCOM0.0 alt / EBI NCS0 |
| Pino 53 | PB13 — GPIO / SERCOM0.1 alt / EBI NCS1 |
| Pino 54 | PB14 — GPIO / SERCOM0.2 alt / EBI NWR |
| Pino 55 | PB15 — GPIO / SERCOM0.3 alt / EBI NRD |
| Pino 56 | GND — Ground |
| Pino 57 | PB16 — GPIO / SERCOM1.0 alt / EBI NWE |
| Pino 58 | PB17 — GPIO / SERCOM1.1 alt / EBI NRD |
| Pino 59 | PB18 — GPIO / SERCOM1.2 alt / EBI D00 |
| Pino 60 | PB19 — GPIO / SERCOM1.3 alt / EBI D01 |
| Pino 61 | PB20 — GPIO / SERCOM3.0 alt / EBI D02 |
| Pino 62 | PB21 — GPIO / SERCOM3.1 alt / EBI D03 |
| Pino 63 | PB22 — GPIO / SERCOM3.2 alt / EBI D04 |
| Pino 64 | PB23 — GPIO / SERCOM3.3 alt / EBI D05 / XIN32K |
Aplicações típicas
ATSAME53J19A-MUT-EFP é adequado para 6 aplicaçãos: Industrial IoT Gateway with Ethernet + USB, Building Automation Controller (BACnet/Modbus), Smart Energy Metering and Submetering, Graphical HMI Panel with TFT Display, Connected Sensor Hub for Predictive Maintenance, USB-CDC Field-Programmable Automation Node.
Industrial IoT Gateway with Ethernet + USB
The ATSAME53J19A-MUT-EFP's integrated 10/100 Ethernet MAC with IEEE 1588 hardware timestamping and USB 2.0 Full-Speed device/host make it a strong match for industrial IoT gateways. 192 KB SRAM holds an lwIP TCP/IP stack plus TLS 1.2 handshakes, while the hardware AES accelerator offloads encrypted MQTT or HTTPS sessions. The Cortex-M4F FPU handles JSON parsing and edge analytics without offloading. Place a 100BASE-TX PHY on MII/RMII and route the USB DP/DM pair as a 90-ohm differential - the SAM E53 reference design shows the full BOM and PCB stackup for a typical gateway.
Recomendado
Building Automation Controller (BACnet/Modbus)
Building-automation controllers benefit from the ATSAME53J19A-MUT-EFP's CAN-FD, six SERCOM channels (UART/SPI/I2C), and the Cortex-M4F's deterministic interrupt latency for BACnet MS/TP and Modbus RTU stacks. 512 KB Flash accommodates full protocol plus application logic without external memory, and the 12-bit ADC reads thermistor and 4-20 mA sensor inputs. The EFP industrial temperature grade supports rooftop and basement deployments. Use SERCOM0 as RS-485 transceiver interface, SERCOM2 as I2C sensor bus, and CAN-FD for backbone communication to other controllers.
Recomendado
Smart Energy Metering and Submetering
Smart meters leverage the ATSAME53J19A-MUT-EFP's hardware AES, true random number generator, and 192 KB SRAM for encrypted DLMS/COSEM or Wireless M-Bus stacks. The integrated 12-bit ADC samples current shunts and voltage dividers at 200+ kS/s, sufficient for class 1 energy meters. ECC on Flash and SRAM supports IEC 60730 Class B functional safety requirements common in residential metering. Use the E53's TFT/EBI controller to drive an LCD glass directly, eliminating a secondary display driver.
Recomendado
Graphical HMI Panel with TFT Display
The ATSAME53J19A-MUT-EFPMUT-EFP's integrated TFT/EBI controller drives QVGA/WQVGA LCD glass without an external graphics controller, cutting BOM cost in graphical HMI panels. 192 KB SRAM holds LVGL or emWin framebuffers and widget trees, while 512 KB Flash stores fonts and images. The Cortex-M4F + FPU accelerates anti-aliased text and 2D rendering. Use the EBI bus for 8/16-bit 8080 or 6800-mode displays up to QVGA resolution at 30+ FPS. The 64-VQFN package keeps the PCB compact behind a 3.5-inch touch panel.
Recomendado
Connected Sensor Hub for Predictive Maintenance
Predictive-maintenance sensor hubs benefit from the ATSAME53J19A-MUT-EFP's FPU-enabled CMSIS-DSP library, which computes FFTs and RMS envelopes for vibration analysis at 1-10 kHz sampling rates. 192 KB SRAM holds 1024-point complex FFT buffers with adequate headroom, and the 12-bit ADC + PGA captures IEPE accelerometer outputs directly. Ethernet or USB-CDC streams waveforms to a host PLC, while the hardware AES secures the link. The EFP temperature grade supports factory-floor cabinets, and the 64-VQFN fits on a 30x40 mm sensor module PCB.
Recomendado
USB-CDC Field-Programmable Automation Node
USB-CDC automation nodes use the ATSAME53J19A-MUT-EFP's USB 2.0 Full-Speed device port as a maintenance interface plus a runtime fieldbus (CAN-FD or RS-485). 512 KB Flash accommodates fieldbus protocol stacks plus custom automation logic, and the boot ROM supports firmware update over USB without an external programmer. The Cortex-M4F + DSP handles PID loops for valve and pump control. The 64-VQFN 9x9 mm package integrates an exposed thermal pad to dissipate the MCU's 250 mA active load without a heatsink in a sealed IP67 enclosure.
Recomendado
Resumo dos produtos recomendados
Dados de referência de engenharia para ATSAME53J19A-MUT-EFP — comparação, orientação de projeto e informações de conformidade.
Guia de seleção
Comparação com alternativas
| Parâmetro | Este produto | ATSAME51J19A-MUT-EFP | ATSAME53J19A-MU-EFP | ATSAME53J18A-MUT-EFP | ATSAME53J19A-MFT | ATSAME51J20A-MUT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | VQFN-64 (9x9 mm) | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same | VQFN-64 (9x9 mm) - same |
| Core | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz | ARM Cortex-M4F 120 MHz |
| Flash | 512 KB | 512 KB | 512 KB | 256 KB (-50%) | 512 KB | 1 MB (+100%) |
| SRAM | 192 KB | 192 KB | 192 KB | 128 KB (-33%) | 192 KB | 256 KB (+33%) |
| TFT/EBI Controller | Yes | No | Yes | Yes | Yes | No |
| Packaging Form | Tape & Reel | Tape & Reel | Tray | Tape & Reel | Tape & Reel | Tape & Reel |
| Industrial Temperature (EFP) | Yes (-40C to +85C) | Yes (-40C to +85C) | Yes (-40C to +85C) | Yes (-40C to +85C) | Yes (-40C to +125C) | Yes (-40C to +85C) |
Principais diferenciais
- Integrated TFT/EBI controller and SD/MMC host (vs ATSAME51J19A-MUT-EFP)
- EFP industrial temperature grade with Flash performance guarantee (vs ATSAME53J19A-MFT)
- 192 KB SRAM with ECC (vs ATSAME53J18A-MUT-EFP)
Notas de projeto
The ATSAME53J19A-MUT-EFP requires three supply rails: VDDCORE (1.2 V typical, internal LDO), VDDIO (1.62 V to 3.6 V), and VDDPLL (analog PLL supply, requires a ferrite bead from VDDIO or a filtered 1.2 V). Decouple each VDD/VDDIO pin with a 100 nF X7R 0402 capacitor placed within 2 mm of the pin, and add a single 4.7 uF bulk capacitor on each supply rail. VDDPLL is sensitive to noise: route it through a ferrite bead, place the 100 nF + 1 uF pair within 3 mm of its pin, and avoid routing high-speed digital traces under the ferrite footprint. Reference: Microchip SAM E53 data sheet, section 'Power Considerations'.
Estimated: at 120 MHz active and all peripherals enabled, VDDCORE current is approximately 25 mA and VDDIO current is approximately 35 mA, totaling 1.2 V x 25 mA + 3.3 V x 35 mA = 145 mW. The 64-VQFN package has theta_JA around 28 C/W on a 4-layer JEDEC test board, so a 145 mW load yields a junction-temperature rise of approximately 4.1 C above ambient - well within the -40C to +85C industrial range. Solder the exposed thermal pad to a continuous copper pour with at least 25 thermal vias (0.3 mm drill, 0.6 mm pitch) to keep theta_JA at the datasheet value. If ambient exceeds 70 C and the MCU draws >200 mA, derate VDDCORE frequency or enable peripheral clock gating.
Layout critical zones: (1) USB DP/DM pair (PA24/PA25) requires 90-ohm differential impedance and a 0.1 uF AC-coupling capacitor on the receptacle side; route over a continuous ground plane with no splits. (2) Ethernet RMII traces (PA12-PA17 area) must be length-matched to within 50 mils and routed over an unbroken ground reference plane. (3) Crystal XIN/XOUT (PB22/PB23 alternate) require a guard ring tied to analog ground and should be within 5 mm of the IC. (4) Place the 100 nF + 1 uF + 4.7 uF decoupling array symmetrically around the VQFN's perimeter, not clustered on one side. Reference: Microchip SAM E53 PCB layout checklist (DS60001507 family).
Common pitfalls: (1) The 'EFP' suffix indicates Extended Flash Performance across the industrial temperature range - using a non-EFP variant in -40C outdoor deployments causes Flash read errors after a few thousand cycles; always verify the exact suffix before procurement. (2) SAM E53 boot ROM uses a different BOOTPROT scheme than SAM D51 - if migrating from D51 firmware, re-verify the GPNVM bits before mass production. (3) The 64-VQFN exposed pad must be soldered; a cold or missing solder joint triggers VDDIO undervoltage events that the BOD cannot always detect reliably. (4) When using the TFT/EBI controller, deassert EBI CS lines in firmware before re-entering low-power modes, otherwise current draw remains at ~12 mA even in standby.
Informações de conformidade
RoHS and REACH compliant per Microchip product page; lead-free / halogen-free per SAM E53 family documentation. Not AEC-Q100 qualified - for AEC-Q100 automotive applications, use the SAM E53 AEC-Q100 variants or SAM V71 family. EFP suffix confirms Extended Flash Performance for industrial -40C to +85C operation.
