ATSAME70Q20B-AN - 300MHz Cortex-M7 MCU, 1MB Flash | Microchip
Référence : ATSAME70Q20B-AN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $16.58 | $16,58 |
| 10 | $15.21 | $152,10 |
| 100 | $13.66 | $1 366,00 |
| 500 | $12.18 | $6 090,00 |
| 1 000 | $10.85 | $10 850,00 |
ATSAME70Q20B-AN Présentation
A microcontroller (MCU) is a single-chip computer containing a processor core, memory, and programmable peripherals. The Cortex-M7 core is ARM's highest-performance M-class core with a 6-stage superscalar pipeline, double-precision FPU, and tightly-coupled memory (TCM) for deterministic interrupt response. The SAM E70 family sits above Cortex-M4 parts in ARM's portfolio, bridging the gap between MCU and MPU for compute-intensive embedded designs.
Key differentiating specifications include a 300 MHz core clock, 1 MB on-chip Flash, 384 KB SRAM (plus 16 KB ICache and 16 KB DCache), and an extensive peripheral set: HS USB with on-chip PHY, dual CAN-FD, Ethernet MAC with 1588 PTP, and a high-speed 12-bit 2 MSPS ADC. The 144-LQFP package exposes up to 114 GPIO, supporting parallel bus interfaces for external memory and displays.
Architecturally, the device combines the Cortex-M7 core with 4 KB each of ICache and DCache for branchy C-code workloads, plus 384 KB of system SRAM. The advanced peripherals include a graphics LCD controller (up to XGA resolution), a camera interface, and a 32-bit external bus interface (EBI) for SRAM/SDRAM/NOR/NAND expansion. A single 1.2 V internal LDO and 3.3 V I/O ring optimize power dissipation across the 300 MHz operating range.
Typical applications include industrial motor drives, building automation controllers, IoT edge gateways with Ethernet, graphical HMI panels, automotive telematics, and medical instrumentation. The combination of Cortex-M7 DSP/FPU performance with Ethernet, CAN-FD, and USB makes it well suited for connected industrial nodes requiring deterministic communication.
When designing with the ATSAME70Q20B-AN, ensure the 3.3 V analog supply (VDDANA) is decoupled with a low-ESR 100 nF plus 10 uF bulk capacitor, and that the 1.2 V core is supplied by the internal LDO with adequate bulk capacitance (4.7 uF + 100 nF) on VDDOUT. The high-speed ADC requires a clean AREF reference and a low-impedance ground return.
This page synthesizes real-time distributor pricing, drop-in package-compatible alternatives (same LQFP-144 footprint), and practical design notes that are not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour ATSAME70Q20B-AN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME70Q20B-AN (même facteur de forme et même empreinte) — différant par ADC, Package, Ethernet, SRAM, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70Q20A-AN
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAME70Q21B-AN
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$17.4 / unité
Voir la fiche technique →ATSAME70Q19A-AN
✅ Remplacement direct✓ En stock
$10.55 / unité
Voir la fiche technique →ATSAME70Q20B-CN
✅ Remplacement direct✓ En stock
$18.2 / unité
Voir la fiche technique →ATSAME70N21B-CN
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →ATSAME70N20A-CNT
✅ Remplacement direct✓ En stock
$8.85 / unité
Voir la fiche technique →ATSAME70Q20B-AN Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M7 with FPU |
| Fréquence d'horloge maximale | 300 MHz |
| Program Memory Size | 1 MB (1M x 8) Flash |
| RAM Size | 384 KB SRAM |
| Instruction Cache (ICache) | 16 KB |
| Data Cache (DCache) | 16 KB |
| Boîtier | 144-LQFP (20x20 mm) |
| Nombre de broches | 144 |
| Type de montage | Surface Mount |
| Supply Voltage (VDDIO) | 3.0 V to 3.6 V |
| Supply Voltage (VDDANA) | 3.0 V to 3.6 V |
| Température de fonctionnement | -40C to +105C (industrial) |
| Largeur du bus de données | 32-bit |
| ADC | 12-bit, up to 24 channels, 2 MSPS |
| Communication Interfaces | HS USB (Device/Host), 2x CAN-FD, Ethernet MAC (10/100 with 1588 PTP), UART, SPI, TWI (I2C), SSC, I2S |
| External Bus Interface | EBI for SRAM/SDRAM/NOR/NAND - 32-bit |
| Graphics LCD Controller | Yes (up to XGA) |
| Camera Interface | Yes (12-bit) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (168 hours) |
Configuration des broches de ATSAME70Q20B-AN
| Broche 1 | PD0 — GPIO / EBI data |
| Broche 2 | PD1 — GPIO / EBI data |
| Broche 3 | PD2 — GPIO / EBI data |
| Broche 4 | PD3 — GPIO / EBI data |
| Broche 5 | VDDIO — I/O supply 3.3V |
| Broche 6 | VSS — Ground |
| Broche 7 | PD4 — GPIO / EBI data |
| Broche 8 | PD5 — GPIO / EBI data |
| Broche 9 | PD6 — GPIO / EBI data |
| Broche 10 | PD7 — GPIO / EBI data |
| Broche 11 | PD8 — GPIO / EBI NANDALE |
| Broche 12 | PD9 — GPIO / EBI NANDCLE |
| Broche 13 | PD10 — GPIO / EBI NCS |
| Broche 14 | PD11 — GPIO / EBI NRD |
| Broche 15 | PD12 — GPIO / EBI NWE |
| Broche 16 | PD13 — GPIO / EBI NBS0 |
| Broche 17 | PD14 — GPIO / EBI NBS1 |
| Broche 18 | PD15 — GPIO / EBI A0 |
| Broche 19 | VDDOUT — Core LDO output (1.2V) - decouple with 4.7uF |
| Broche 20 | VSS — Ground |
| Broche 21 | PD16 — GPIO / EBI A1 |
| Broche 22 | PD17 — GPIO / EBI A2 |
| Broche 23 | PD18 — GPIO / EBI A3 |
| Broche 24 | PD19 — GPIO / EBI A4 |
| Broche 25 | PD20 — GPIO / EBI A5 |
| Broche 26 | PD21 — GPIO / EBI A6 |
| Broche 27 | PD22 — GPIO / EBI A7 |
| Broche 28 | PD23 — GPIO / EBI A8 |
| Broche 29 | PD24 — GPIO / EBI A9 |
| Broche 30 | PD25 — GPIO / EBI A10 |
| Broche 31 | PD26 — GPIO / EBI A11 |
| Broche 32 | PD27 — GPIO / EBI A12 |
| Broche 33 | PD28 — GPIO / EBI A13 |
| Broche 34 | PD29 — GPIO / EBI A14 |
| Broche 35 | PD30 — GPIO / EBI A15 / IRQ |
| Broche 36 | PD31 — GPIO / EBI A16 / FIQ |
| Broche 37 | VDDIO — I/O supply 3.3V |
| Broche 38 | VSS — Ground |
| Broche 39 | PA0 — GPIO / PWMH0 / TIOA0 |
| Broche 40 | PA1 — GPIO / PWMH1 / TIOB0 |
| Broche 41 | PA2 — GPIO / PWMH2 / TIOA1 |
| Broche 42 | PA3 — GPIO / PWMH3 / TIOB1 |
| Broche 43 | PA4 — GPIO / PWMH4 / TIOA2 |
| Broche 44 | PA5 — GPIO / PWMH5 / TIOB2 |
| Broche 45 | PA6 — GPIO / PWMH6 / TIOA3 |
| Broche 46 | PA7 — GPIO / PWMH7 / TIOB3 |
| Broche 47 | PA8 — GPIO / PWML0 / TIOA4 |
| Broche 48 | PA9 — GPIO / PWML1 / TIOB4 |
| Broche 49 | PA10 — GPIO / PWML2 / TIOA5 |
| Broche 50 | PA11 — GPIO / PWML3 / TIOB5 |
| Broche 51 | PA12 — GPIO / PWML4 / TIOA6 |
| Broche 52 | PA13 — GPIO / PWML5 / TIOB6 |
| Broche 53 | PA14 — GPIO / PWML6 / TIOA7 |
| Broche 54 | PA15 — GPIO / PWML7 / TIOB7 |
| Broche 55 | PA16 — GPIO / CANRX0 |
| Broche 56 | PA17 — GPIO / CANTX0 |
| Broche 57 | PA18 — GPIO / CANRX1 |
| Broche 58 | PA19 — GPIO / CANTX1 |
| Broche 59 | PA20 — GPIO / URXD2 |
| Broche 60 | PA21 — GPIO / UTXD2 |
| Broche 61 | VDDIO — I/O supply 3.3V |
| Broche 62 | VSS — Ground |
| Broche 63 | PB0 — GPIO / AFEC0 |
| Broche 64 | PB1 — GPIO / AFEC1 |
| Broche 65 | PB2 — GPIO / AFEC2 / AD0 |
| Broche 66 | PB3 — GPIO / AFEC3 / AD1 |
| Broche 67 | PB4 — GPIO / AFEC4 / AD2 |
| Broche 68 | PB5 — GPIO / AFEC5 / AD3 |
| Broche 69 | PB6 — GPIO / AFEC6 / AD4 |
| Broche 70 | PB7 — GPIO / AFEC7 / AD5 |
| Broche 71 | PB8 — GPIO / AFEC8 / AD6 |
| Broche 72 | PB9 — GPIO / AFEC9 / AD7 |
| Broche 73 | PB10 — GPIO / AFEC10 / AD8 |
| Broche 74 | PB11 — GPIO / AFEC11 / AD9 |
| Broche 75 | PB12 — GPIO / SPI0 NPCS0 |
| Broche 76 | PB13 — GPIO / SPI0 NPCS1 |
| Broche 77 | PB14 — GPIO / SPI0 NPCS2 |
| Broche 78 | PB15 — GPIO / SPI0 NPCS3 |
| Broche 79 | VDDANA — Analog supply 3.3V |
| Broche 80 | VREFN — ADC reference negative |
| Broche 81 | VREFP — ADC reference positive |
| Broche 82 | PB16 — GPIO / SPI0 MISO |
| Broche 83 | PB17 — GPIO / SPI0 MOSI |
| Broche 84 | PB18 — GPIO / SPI0 SPCK |
| Broche 85 | PB19 — GPIO / SPI1 NPCS0 |
| Broche 86 | PB20 — GPIO / SPI1 NPCS1 |
| Broche 87 | PB21 — GPIO / SPI1 NPCS2 |
| Broche 88 | PB22 — GPIO / SPI1 NPCS3 |
| Broche 89 | PB23 — GPIO / SPI1 MISO |
| Broche 90 | PB24 — GPIO / SPI1 MOSI |
| Broche 91 | PB25 — GPIO / SPI1 SPCK |
| Broche 92 | PB26 — GPIO / TWD0 |
| Broche 93 | PB27 — GPIO / TWCK0 |
| Broche 94 | PB28 — GPIO / TWD1 |
| Broche 95 | PB29 — GPIO / TWCK1 |
| Broche 96 | PB30 — GPIO / URXD0 |
| Broche 97 | PB31 — GPIO / UTXD0 |
| Broche 98 | PC0 — GPIO / LCDDAT0 |
| Broche 99 | PC1 — GPIO / LCDDAT1 |
| Broche 100 | PC2 — GPIO / LCDDAT2 |
| Broche 101 | PC3 — GPIO / LCDDAT3 |
| Broche 102 | PC4 — GPIO / LCDDAT4 |
| Broche 103 | PC5 — GPIO / LCDDAT5 |
| Broche 104 | PC6 — GPIO / LCDDAT6 |
| Broche 105 | PC7 — GPIO / LCDDAT7 |
| Broche 106 | PC8 — GPIO / LCDDAT8 |
| Broche 107 | PC9 — GPIO / LCDDAT9 |
| Broche 108 | PC10 — GPIO / LCDDAT10 |
| Broche 109 | PC11 — GPIO / LCDDAT11 |
| Broche 110 | PC12 — GPIO / LCDDAT12 |
| Broche 111 | PC13 — GPIO / LCDDAT13 |
| Broche 112 | PC14 — GPIO / LCDDAT14 |
| Broche 113 | PC15 — GPIO / LCDDAT15 |
| Broche 114 | PC16 — GPIO / LCDDAT16 |
| Broche 115 | PC17 — GPIO / LCDDAT17 |
| Broche 116 | PC18 — GPIO / LCDDAT18 |
| Broche 117 | PC19 — GPIO / LCDDAT19 |
| Broche 118 | PC20 — GPIO / LCDDAT20 |
| Broche 119 | PC21 — GPIO / LCDDAT21 |
| Broche 120 | PC22 — GPIO / LCDDAT22 |
| Broche 121 | PC23 — GPIO / LCDDAT23 |
| Broche 122 | VDDIO — I/O supply 3.3V |
| Broche 123 | VSS — Ground |
| Broche 124 | PC24 — GPIO / LCDDISP |
| Broche 125 | PC25 — GPIO / LCDVSYNC |
| Broche 126 | PC26 — GPIO / LCDHSYNC |
| Broche 127 | PC27 — GPIO / LCDPCK |
| Broche 128 | PC28 — GPIO / LCDDEN |
| Broche 129 | PC29 — GPIO / LCDCC |
| Broche 130 | PC30 — GPIO / TCK / SWCLK |
| Broche 131 | PC31 — GPIO / TMS / SWDIO |
| Broche 132 | NRST — Active-low reset input |
| Broche 133 | TDO / SWO — JTAG TDO / Serial Wire Output |
| Broche 134 | TDI — JTAG TDI |
| Broche 135 | JTAGSEL — JTAG boundary scan select |
| Broche 136 | ERASE — Flash erase input (active-low) |
| Broche 137 | WKUP0 — Wakeup input 0 |
| Broche 138 | WKUP1 — Wakeup input 1 |
| Broche 139 | WKUP2 — Wakeup input 2 |
| Broche 140 | XIN32 — 32.768 kHz crystal input |
| Broche 141 | XOUT32 — 32.768 kHz crystal output |
| Broche 142 | XIN — Main crystal input (8-12 MHz) |
| Broche 143 | XOUT — Main crystal output |
| Broche 144 | VDDIO — I/O supply 3.3V |
Applications typiques
ATSAME70Q20B-AN convient pour 6 applications: Industrial Motor Control Drives, Industrial IoT Edge Gateways, Graphical HMI Touch Panels, Automotive Telematics and Gateway ECUs, Medical Instrumentation and Patient Monitors, Building Automation Controllers.
Industrial Motor Control Drives
The ATSAME70Q20B-AN's 300 MHz Cortex-M7 with FPU and DSP extensions is ideal for field-oriented control (FOC) of PMSM and BLDC motors, executing the Park/Clarke transforms and PI loops with deterministic cycle times. The 12-bit 2 MSPS ADC samples three-phase current simultaneously via PWM-triggered sequencing, while the hardware quadrature decoder handles encoder feedback up to 32-bit position count. Compared to Cortex-M4 motor MCUs, the Cortex-M7's double-precision FPU halves torque-ripple calculation time and improves sinusoidal commutation accuracy at high RPM. The 1 MB Flash accommodates FOC firmware plus CANopen or EtherCAT slave stacks without external memory.
Recommandé
Industrial IoT Edge Gateways
The ATSAME70Q20B-AN integrates dual CAN-FD, 10/100 Ethernet with 1588 PTP timestamping, and HS USB with on-chip PHY - the three connectivity pillars required for industrial IoT edge gateways bridging Fieldbus to Ethernet. The Cortex-M7 runs a real-time OS (FreeRTOS or Zephyr) plus a TCP/IP stack with TLS 1.3, offloading encryption to the Cortex-M7's hardware AES accelerator. The 384 KB SRAM handles TCP/IP buffers and CAN-FD message queues without external memory. Compared to Cortex-M4 gateways, the ATSAME70Q20B-AN's higher clock and 1588 PTP hardware deliver sub-microsecond timestamping accuracy for synchronized distributed control.
Recommandé
Graphical HMI Touch Panels
The ATSAME70Q20B-AN's integrated LCD controller supports resolutions up to XGA (1024x768) at 24 bpp and a parallel RGB interface, enabling direct connection to mid-size TFT LCD panels used in building automation and factory HMI. The 32-bit EBI drives external SDRAM for frame buffers (e.g., 16 MB for 800x480@32 bpp), and the 300 MHz Cortex-M7 with FPU renders emWin or LVGL UIs smoothly. The hardware 2D acceleration (line draw, BLIT) accelerates graphics primitives without CPU overhead. Compared to Cortex-M4 HMI controllers, the E70's hardware 2D engine halves screen-update latency for animated gauges.
Recommandé
Automotive Telematics and Gateway ECUs
The ATSAME70Q20B-AN's dual CAN-FD controllers (8 Mbps), Cortex-M7 300 MHz performance, and automotive-grade temperature range make it suitable for telematics control units (TCUs) and central gateway ECUs. The Ethernet MAC with 1588 PTP timestamping bridges automotive Ethernet (100BASE-T1) to legacy CAN networks, while the Cortex-M7 runs AUTOSAR-classical applications and security stacks (HSM with hardware AES/SHA). Compared to Cortex-M4 automotive MCUs, the ATSAME70Q20B-AN's deterministic interrupt latency (12 cycles) improves AUTOSAR OS conformance for safety-critical body controllers.
Recommandé
Medical Instrumentation and Patient Monitors
The ATSAME70Q20B-AN's 12-bit 2 MSPS ADC with hardware oversampling and the Cortex-M7 DSP extensions enable accurate acquisition of ECG, EEG, and SpO2 signals in patient monitoring equipment. The single-precision FPU executes biquad filters and FFT-based heart-rate-variability analysis at the Cortex-M7's 300 MHz rate, well within the 1 ms sampling budget. The hardware AES accelerator secures patient data (HIPAA compliance) with minimal CPU overhead. Compared to Cortex-M4 medical devices, the E70's hardware oversampling ADC delivers 16-bit effective resolution for high-precision instrumentation.
Recommandé
Building Automation Controllers
The ATSAME70Q20B-AN powers BACnet, KNX, and Modbus building automation controllers with its Ethernet MAC, dual CAN-FD, and UART/SPI/TWI interfaces - covering all major building-automation Fieldbus protocols. The 300 MHz Cortex-M7 runs a real-time OS plus a BACnet/IP stack with scheduling, while the 16 KB ICache/DCache improves interrupt response for time-critical HVAC control loops. The hardware AES secures building-access credentials and TLS traffic to cloud-based management dashboards. Compared to Cortex-M4 controllers, the E70's dual CAN-FD and PTP-enabled Ethernet streamline multi-protocol gateway designs.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME70Q20B-AN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70Q20A-AN | ATSAME70Q21B-AN | ATSAME70Q19A-AN | ATSAME70Q20B-CN | ATSAME70N21B-CN | ATSAME70N20A-CNT |
|---|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | LQFP-144 (20x20 mm) | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same | LQFP-144 (20x20 mm) - same |
| Core / Max Clock | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz |
| Flash | 1 MB | 1 MB | 2 MB | 1 MB | 1 MB | 2 MB | 1 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 256 KB | 384 KB | 384 KB | 384 KB |
| Ethernet MAC | Yes (10/100, 1588 PTP) | Yes (10/100, 1588 PTP) | Yes (10/100, 1588 PTP) | Yes (10/100, 1588 PTP) | Yes (10/100, 1588 PTP) | Yes (10/100, 1588 PTP) | No Ethernet |
| HS USB PHY | Yes (Device/Host) | Yes (Device/Host) | Yes (Device/Host) | Yes (Device/Host) | Yes (Device/Host) | No | Yes (Device/Host) |
| CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD | 2x CAN-FD |
| Operating Temperature | -40C to +105C (industrial) | -40C to +85C | -40C to +105C | -40C to +85C | 0C to +70C (commercial) | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Cortex-M7 with double-precision FPU at 300 MHz (vs ATSAME70Q19A-AN)
- Drop-in 1 MB Flash family member (vs ATSAME70Q21B-AN)
- Industrial temperature -40C to +105C (vs ATSAME70Q20B-CN)
Notes de conception
The ATSAME70Q20B-AN requires four distinct supply domains: VDDIO (3.3 V for I/O ring), VDDANA (3.3 V for analog blocks, must be low-noise with separate ferrite from VDDIO), VDDPLL (1.2 V derived from internal regulator or external), and VDDOUT (1.2 V core LDO output). Place a 100 nF + 10 uF ceramic + 4.7 uF bulk capacitor directly at VDDOUT pin 19, plus 100 nF at every VDDIO/VSS pin pair. A common design pitfall is sharing VDDIO and VDDANA - this couples switching noise into the 12-bit ADC reference, increasing ENOB by 1-2 bits of degradation.
The 144-LQFP package has thermal resistance theta_JA of approximately 35 C/W (with 4-layer JEDEC test board). At 300 MHz with all peripherals active, the device dissipates up to 1.5 W; in industrial environments with ambient up to 85 C, the junction temperature can approach 137 C, exceeding the 125 C limit. Recommended: ensure 2 oz copper on top and bottom layers with a copper area of at least 1.5 square inches directly under the exposed pad of LQFP-176 variants; for LQFP-144 use thermal vias array (0.3 mm pitch, 9 vias minimum) under the package center.
The high-speed 50 MHz EBI bus to external SDRAM requires careful impedance control - trace impedance 50 ohm single-ended, 100 ohm differential for clock pairs, trace length matching within +/- 250 mils. Place the SDRAM within 50 mm of the EBI pins and use series 33 ohm damping resistors on EBI_D[15:0] and address lines. Common pitfall: routing EBI_DQ across the same layer as switching power supply traces - keep at least 5 mm separation or use a ground guard trace to prevent crosstalk into the SDRAM controller.
Three common pitfalls when bringing up ATSAME70Q20B-AN designs: (1) Forgetting to configure the supply monitor (SUPC) before enabling the main voltage regulator - this can cause brown-out resets on cold start. (2) Not enabling the 16 KB ICache before jumping to external QSPI flash - this halves code execution performance. (3) Leaving the ERASE pin floating - it must be tied high through a 10 kohm pull-up, otherwise an ESD event can trigger a full Flash erase in the field.
Place the 32.768 kHz crystal XIN32/XOUT32 within 5 mm of pins 140/141 with grounded guard ring to prevent coupling of switching noise from the main oscillator. The 8-12 MHz main crystal on pins 142/143 should be similarly guarded, and both crystal traces must maintain symmetric length (delta < 1 mm). For USB applications, the 90 ohm differential D+/D- pair from the on-chip PHY must be routed as a length-matched pair with 90 ohm differential impedance, and the USB shield ground should connect to PCB ground at a single point near the connector.
Informations de conformité
RoHS and REACH compliant per Microchip product page. AEC-Q100 not qualified for standard -AN grade; contact Microchip for automotive AEC-Q100 qualified SAME70 variants. Lead-free and halogen-free per Microchip environmental compliance data.
