ATSAMG55J19A-MUT - 120MHz Cortex-M4 MCU 512KB Flash | Microchip
Référence : ATSAMG55J19A-MUT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.95 | $6,95 |
| 10 | $6.32 | $63,20 |
| 100 | $5.65 | $565,00 |
| 500 | $5.1 | $2 550,00 |
| 1 000 | $4.58 | $4 580,00 |
ATSAMG55J19A-MUT Présentation
An ARM Cortex-M4 microcontroller is a 32-bit RISC processor core with Thumb-2 instruction set, integrated single-precision IEEE 754 floating-point unit (FPU), and DSP extensions (single-cycle MAC, saturating arithmetic). It belongs to the Cortex-M family of embedded microcontrollers within the broader category of microcontrollers and microprocessors. The Cortex-M4 sits between the Cortex-M3 (no FPU) and Cortex-M7 (higher performance) in ARM's embedded hierarchy.
Key features include 120MHz core clock with single-cycle MAC, hardware FPU for floating-point audio codecs, integrated Class-D amplifier interface support, I2S/TDM digital audio interfaces, and a full-speed USB 2.0 High-Speed PHY. The device supports 1.62V to 3.6V operating voltage and operates across the -40C to +85C industrial temperature range. It includes multiple communication peripherals: up to 7 UART/USART, 3 I2C, 6 SPI, and a high-speed USB port.
The SAM G55 architecture integrates an audio-specific PLL (AUD PLL) for jitter-free I2S clocking, dual 12-bit 1Msps ADC modules with up to 16 channels, and hardware cryptographic accelerators. The 512KB Flash supports in-application programming, while the 176KB SRAM accommodates large audio buffers (WAV/MP3 decoding) without external memory. The 64-QFN package provides excellent thermal performance for the 120MHz operating envelope.
Typical applications include smart speakers and voice assistants, professional audio equipment, headphone amplifiers with DSP, automotive infotainment audio, and industrial control with audio feedback. The integrated FPU enables real-time audio effect processing including EQ, dynamics, and noise suppression without CPU overload.
When designing with this part, allocate the AUD PLL for low-jitter I2S clocking and ensure proper decoupling on VDDCORE pins. For new designs, Microchip recommends the Revision B variant (ATSAMG55J19B) which offers improved errata corrections. The Cortex-M4 DSP extensions (SIMD, MAC) significantly accelerate audio filter operations versus software-only Cortex-M3 designs.
Alternatives de remplacement direct pour ATSAMG55J19A-MUT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMG55J19A-MUT (même facteur de forme et même empreinte) — différant par Package, USB, Operating Temperature, ADC, Audio Interface.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMG55J19A-MU
✅ Remplacement direct✓ En stock
$5.42 / unité
Voir la fiche technique →ATSAMG55J19B-MU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMG55J19B-MUT
✅ Remplacement direct✓ En stock
$5.74 / unité
Voir la fiche technique →ATSAMG55J19B-AU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAME53J19A-MUT
✅ Remplacement direct✓ En stock
$4.95 / unité
Voir la fiche technique →ATSAMDA1J16B-MBT
✅ Remplacement direct✓ En stock
$2.21 / unité
Voir la fiche technique →ATSAMG55J19A-MUT Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M4 with FPU |
| Core Architecture | 32-bit RISC with DSP extensions |
| Maximum Clock Speed | 120 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| RAM Size | 176 KB |
| Supply Voltage (VDDIO) | 1.62 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Boîtier | 64-pin QFN (7.5 x 7.5 mm) |
| Type de montage | Surface Mount |
| Communication Interfaces | I2C, SPI, UART/USART, USB, I2S |
| USB | USB 2.0 High-Speed with on-chip PHY |
| Package Type Code | QFN EP T/R (Tape and Reel) |
| Statut RoHS | Compliant |
Guide de configuration des broches du ATSAMG55J19A-MUT qfn ep t/r (tape and reel)
Configuration des broches du ATSAMG55J19A-MUT (boîtier qfn ep t/r (tape and reel)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour ATSAMG55J19A-MUT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
ATSAMG55J19A-MUT convient pour 6 applications: Smart Speakers and Voice Assistants, Professional Audio Equipment, Headphone Amplifiers with DSP, Automotive Infotainment Audio, Industrial Control with Audio Feedback, USB Audio Interfaces.
Smart Speakers and Voice Assistants
The ATSAMG55J19A-MUT is well-suited for smart speaker and voice assistant designs due to its 120MHz Cortex-M4 with hardware FPU and DSP extensions. According to the SAM G55 family description, the integrated audio PLL provides jitter-free I2S clocking critical for microphone array beamforming and echo cancellation. The 176KB SRAM accommodates multi-microphone audio buffers (typically 16kHz/16-bit PCM for 4-8 channels) without external memory. The hardware FPU accelerates voice processing algorithms like noise suppression (NS), automatic gain control (AGC), and acoustic echo cancellation (AEC) in real time. Compared to Cortex-M0+ alternatives, the G55's single-cycle MAC instructions process audio samples at 4-5x throughput, enabling more sophisticated on-device wake-word detection and audio preprocessing before cloud handoff.
Recommandé
Professional Audio Equipment
For professional audio applications like digital mixers, effects processors, and studio equipment, the ATSAMG55J19A-MUT delivers the DSP horsepower required for multi-channel audio processing. Per Verified Web Data, the 120MHz Cortex-M4 with FPU sustains multiple simultaneous audio effects (EQ, compression, reverb) across 8-16 channels at 48kHz sample rates. The integrated I2S/TDM interfaces support professional multi-channel digital audio formats including TDM8 and TDM16, eliminating external serializer chips. The wide 1.62V to 3.6V supply range simplifies mixed-voltage designs with 1.8V DSP cores and 3.3V analog sections. Compared to Cortex-M3 parts, the G55's floating-point unit reduces audio algorithm code size by 30-50% and eliminates fixed-point scaling bugs.
Recommandé
Headphone Amplifiers with DSP
The ATSAMG55J19A-MUT integrates well into headphone amplifier designs requiring active DSP for crossover management, room correction, and personalized HRTF processing. The SAM G55 family's Class-D amplifier interface and audio PLL provide the timing precision needed for low-jitter PWM generation in Class-D topologies. With 512KB Flash, manufacturers can embed multi-band parametric EQ, dynamic range compression, and limiter algorithms directly in firmware without external DSP chips. The 176KB SRAM supports impulse response convolution for crossfeed circuits and binaural rendering. Industrial temperature rating (-40C to +85C) ensures reliable operation in consumer and prosumer headphone amplifier products deployed across varied environments.
Recommandé
Automotive Infotainment Audio
For automotive infotainment audio subsystems, the ATSAMG55J19A-MUT provides the audio DSP capability needed for in-vehicle sound processing. The Cortex-M4 with FPU handles hands-free Bluetooth audio, active noise cancellation (ANC), and speed-compensated volume control in real time. The integrated USB 2.0 High-Speed PHY enables direct connection to automotive head units for digital audio streaming without external PHY chips. Per Microchip's product specification, the 64-QFN package's compact 7.5x7.5mm footprint suits space-constrained dashboard module designs. While not AEC-Q100 qualified, the industrial temperature grade (-40C to +85C) covers most cabin applications; AEC-Q100 variants should be selected for under-hood or extreme-environment automotive use.
Recommandé
Industrial Control with Audio Feedback
Industrial equipment requiring voice prompts, alarm tones, and audio status feedback benefits from the ATSAMG55J19A-MUT's audio-optimized peripherals and DSP performance. The Cortex-M4 core handles real-time control loops while the FPU and DSP extensions simultaneously generate WAV/MP3 audio for operator prompts and alarm sounds. The integrated I2S interface connects directly to external audio DACs for high-quality audio output. Industrial temperature range (-40C to +85C) ensures reliable operation in factory automation, process control, and building automation equipment. The 512KB Flash supports full audio prompt libraries plus application firmware, while the 176KB SRAM accommodates audio sample buffers without external memory.
Recommandé
USB Audio Interfaces
USB audio interfaces such as USB microphones, USB speakers, and USB audio DACs leverage the ATSAMG55J19A-MUT's integrated USB 2.0 High-Speed PHY and audio PLL for low-latency digital audio streaming. Per Microchip's SAM G55 datasheet, the on-chip USB PHY eliminates external PHY chips reducing BOM cost and PCB area. The audio PLL provides the precise clocking required for isochronous USB audio transfers with minimal jitter. The 120MHz Cortex-M4 with FPU handles USB protocol stack, audio sample buffering, and any on-device DSP processing (noise suppression for headsets, room correction for speakers). The 64-QFN package's compact footprint suits the small form factors of portable USB audio devices.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMG55J19A-MUT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMG55J19A-MU | ATSAMG55J19B-MU | ATSAMG55J19B-MUT | ATSAME53J19A-MUT | ATSAMDA1J16B-MBT |
|---|---|---|---|---|---|---|
| Package | 64-QFN (7.5x7.5mm) | 64-QFN (7.5x7.5mm) - same | 64-QFN (7.5x7.5mm) - same | 64-QFN (7.5x7.5mm) - same | 64-QFN (7.5x7.5mm) - same | 64-QFN - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core Processor | ARM Cortex-M4F @ 120MHz | ARM Cortex-M4F @ 120MHz | ARM Cortex-M4F @ 120MHz (Rev B) | ARM Cortex-M4F @ 120MHz (Rev B) | ARM Cortex-M4F @ 120MHz | ARM Cortex-M0+ @ 48MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 64 KB |
| RAM Size | 176 KB | 176 KB | 176 KB | 176 KB | 192 KB | 8 KB |
| Operating Voltage | 1.62V to 3.6V | 1.62V to 3.6V | 1.62V to 3.6V | 1.62V to 3.6V | 1.62V to 3.6V | 1.62V to 3.6V |
| Temperature Range | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
| Audio PLL | Yes (dedicated) | Yes (dedicated) | Yes (dedicated) | Yes (dedicated) | Generic PLL | Generic PLL |
| USB 2.0 HS PHY | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (integrated) | Yes (Full Speed only) |
Principaux différenciateurs
- Audio-optimized PLL with low jitter for I2S/TDM clocking (vs ATSAMDA1J16B-MBT)
- 120MHz Cortex-M4F vs 48MHz Cortex-M0+ (vs ATSAMDA1J16B-MBT)
- 512KB Flash vs 64KB Flash (vs ATSAMDA1J16B-MBT)
Notes de conception
The ATSAMG55J19A-MUT requires careful power supply design with separate analog and digital supply domains. Per Microchip's SAM G55 datasheet, provide VDDIO (1.62V-3.6V) for I/O and digital logic, and VDDCORE is generated internally by an on-chip LDO. Place 100nF decoupling capacitors close to each VDD pin and add a 4.7uF bulk capacitor near the package. The audio PLL requires a clean, low-noise supply; add a ferrite bead or LC filter between VDDIO and PLL_AVDD to minimize jitter on I2S clocks.
For the 64-QFN (7.5x7.5mm) package, the exposed thermal pad (EP) must be soldered to a PCB thermal land of at least equal size with multiple thermal vias connecting to an internal ground plane. Without proper EP soldering, junction temperature rises rapidly under 120MHz load reducing long-term reliability. Per QFN layout guidelines, use a 5x5 array of 0.3mm thermal vias on 1.0mm pitch under the EP. Trace routing from the outer 64 pads should use 0.1mm/4mil traces with 0.1mm spacing to escape the dense QFN perimeter.
Several pitfalls are common when migrating from Revision A (ATSAMG55J19A) to Revision B (ATSAMG55J19B) silicon. Per Microchip's errata notice, Revision B corrects USB suspend/resume issues and improves ADC accuracy at low sample rates. Engineers must verify bootloader compatibility between revisions and check the SAM G55 errata sheet for any register-level changes affecting firmware. The MUT suffix indicates tape-and-reel packaging while MU indicates tray - both share the same 64-QFN footprint so they are drop-in compatible electrically.
The integrated USB 2.0 High-Speed PHY requires careful PCB layout to maintain signal integrity. Per USB 2.0 layout guidelines, route the DP/DM differential pair with 90-ohm differential impedance, length matching within 0.5mm, and keep the pair away from noisy digital traces. Add 45-ohm series termination resistors at the DP/DM pins only if the trace length exceeds 50mm. The audio PLL filter loop components (typically 1k-ohm resistor and 10nF capacitor) must be placed within 5mm of the PLL filter pins to minimize jitter.
Informations de conformité
Industrial temperature grade per Verified Web Data. Not AEC-Q100 qualified - select automotive-grade variant for AEC-Q100 requirements. RoHS and REACH compliance confirmed by Microchip product page.
