ATSAMG55J19B-MUT - 120MHz Cortex-M4 MCU, 512KB Flash | Microchip
Référence : ATSAMG55J19B-MUT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.95 | $8,95 |
| 10 | $8.06 | $80,60 |
| 100 | $7.16 | $716,00 |
| 500 | $6.45 | $3 225,00 |
| 1 000 | $5.74 | $5 740,00 |
ATSAMG55J19B-MUT Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program memory (Flash), working memory (SRAM), and a rich set of peripherals including timers, communication interfaces, ADC/DAC blocks, and GPIOs. In the taxonomy of embedded semiconductors, the SAM G55 belongs to the Cortex-M4 family (ARMv7-M architecture with FPU and DSP) -> ARM Cortex-M microcontrollers -> 32-bit microcontrollers -> microcontrollers -> embedded processors -> semiconductors. The Cortex-M4 with FPU executes DSP algorithms (FFT, FIR, biquad filters) and audio codecs efficiently while preserving the deterministic interrupt model required for real-time audio.
Key features of the ATSAMG55J19B-MUT include the Cortex-M4 core with single-precision FPU, 512 KB Flash with single-cycle access at full speed, 176 KB SRAM, an embedded boot loader, an embedded voltage regulator for single-supply operation, power-on reset (POR), brown-out detector, watchdog timer, three on-chip RC oscillators, and a 3 to 20 MHz quartz/ceramic resonator interface. It supports USB 2.0 Full-Speed with on-chip transceiver, I2S/SSC audio interfaces, and up to 47 GPIO lines.
The architecture combines Cortex-M4 DSP extensions with audio-oriented peripherals such as an I2S/SSC controller and a Class-D amplifier-friendly PWM, optimized for headset, headphone, and portable-audio products. Active power consumption is minimized via Sleep, Deep-Sleep, and Backup modes with RTC retention, while the integrated FPU lets audio DSP work finish faster, allowing the chip to return to sleep quickly and reduce overall energy use.
Typical applications include Bluetooth/USB audio headsets, sound bars, portable speakers, hearing aids, industrial audio front-ends, voice-over-IP peripherals, and any low-power DSP audio product. The combination of Cortex-M4 DSP, ample SRAM for buffer management, and built-in audio interfaces makes the SAM G55 a strong fit for streaming-audio DSP.
When designing with this part, ensure that decoupling (100 nF + bulk) is placed as close as possible to the four VDD pins and that the exposed pad (EP) of the QFN package is soldered to a continuous ground plane for thermal dissipation and low-impedance return. Configure unused pins as inputs with pull-ups to avoid spurious interrupts during reset.
Alternatives de remplacement direct pour ATSAMG55J19B-MUT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMG55J19B-MUT (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, Audio Interface, Core Processor.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMG55J19B-MU
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMG55J19A-MUT
✅ Remplacement direct✓ En stock
$4.58 / unité
Voir la fiche technique →ATSAMG55J19A-MU
✅ Remplacement direct✓ En stock
$5.42 / unité
Voir la fiche technique →ATSAMG55J19B-AUT
✅ Remplacement direct✓ En stock
$5.42 / unité
Voir la fiche technique →ATSAMG55J19A-AUT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
ATSAMG55J19B-MUT Valeurs maximales et caractéristiques électriques
| Core Architecture | ARM Cortex-M4 with FPU (single-precision) and DSP extensions |
| Maximum CPU Frequency | 120 MHz |
| Program Memory (Flash) | 512 KB (512K x 8) |
| SRAM | 176 KB |
| ROM (Boot Loader) | 8 KB |
| Tension d'alimentation | 1.62 V to 3.6 V (single supply) |
| Température de fonctionnement | -40 C to +85 C (Industrial, MUT suffix) |
| Boîtier | 64-QFN MRLB, 7.5 x 7.5 mm with exposed pad |
| GPIO Count | Up to 47 |
| USB | USB 2.0 Full-Speed Device with on-chip transceiver |
| Audio Interface | I2S / SSC (Synchronous Serial Controller) |
| Oscillators | 3 to 20 MHz crystal/ceramic resonator + 3 internal RC oscillators |
| Boot Loader | Embedded, supports Flash programming |
| Watchdog Timer | Yes |
| Power-on Reset / Brown-out Detector | Yes |
| Type de montage | Surface Mount |
| Niveau MSL | MSL3 (per JEDEC J-STD-020) |
| Statut RoHS | Compliant |
Configuration des broches de ATSAMG55J19B-MUT
| Broche 1 | PA0 — GPIO / peripheral function |
| Broche 2 | PA1 — GPIO / peripheral function |
| Broche 3 | PA2 — GPIO / peripheral function |
| Broche 4 | PA3 — GPIO / peripheral function |
| Broche 5 | PA4 — GPIO / peripheral function |
| Broche 6 | PA5 — GPIO / peripheral function |
| Broche 7 | PA6 — GPIO / peripheral function |
| Broche 8 | PA7 — GPIO / peripheral function |
| Broche 9 | VDDIO — I/O supply voltage |
| Broche 10 | GND — Ground |
| Broche 11 | PB0 — GPIO / peripheral function |
| Broche 12 | PB1 — GPIO / peripheral function |
| Broche 13 | PB2 — GPIO / peripheral function |
| Broche 14 | PB3 — GPIO / peripheral function |
| Broche 15 | PB4 — GPIO / peripheral function |
| Broche 16 | PB5 — GPIO / peripheral function |
| Broche 17 | PB6 — GPIO / peripheral function |
| Broche 18 | PB7 — GPIO / peripheral function |
| Broche 19 | PB8 — GPIO / peripheral function |
| Broche 20 | PB9 — GPIO / peripheral function |
| Broche 21 | PB10 — GPIO / peripheral function |
| Broche 22 | PB11 — GPIO / peripheral function |
| Broche 23 | PB12 — GPIO / peripheral function |
| Broche 24 | PB13 — GPIO / peripheral function |
| Broche 25 | PB14 — GPIO / peripheral function |
| Broche 26 | PB15 — GPIO / peripheral function |
| Broche 27 | VDDCORE — Core supply (regulated internally) |
| Broche 28 | GND — Ground |
| Broche 29 | PC0 — GPIO / peripheral function |
| Broche 30 | PC1 — GPIO / peripheral function |
| Broche 31 | PC2 — GPIO / peripheral function |
| Broche 32 | PC3 — GPIO / peripheral function |
| Broche 33 | PC4 — GPIO / peripheral function |
| Broche 34 | PC5 — GPIO / peripheral function |
| Broche 35 | PC6 — GPIO / peripheral function |
| Broche 36 | PC7 — GPIO / peripheral function |
| Broche 37 | PC8 — GPIO / peripheral function |
| Broche 38 | PC9 — GPIO / peripheral function |
| Broche 39 | PC10 — GPIO / peripheral function |
| Broche 40 | PC11 — GPIO / peripheral function |
| Broche 41 | PC12 — GPIO / peripheral function |
| Broche 42 | PC13 — GPIO / peripheral function |
| Broche 43 | PC14 — GPIO / peripheral function |
| Broche 44 | PC15 — GPIO / peripheral function |
| Broche 45 | PD0 — GPIO / peripheral function |
| Broche 46 | PD1 — GPIO / peripheral function |
| Broche 47 | PD2 — GPIO / peripheral function |
| Broche 48 | PD3 — GPIO / peripheral function |
| Broche 49 | PD4 — GPIO / peripheral function |
| Broche 50 | PD5 — GPIO / peripheral function |
| Broche 51 | PD6 — GPIO / peripheral function |
| Broche 52 | PD7 — GPIO / peripheral function |
| Broche 53 | PD8 — GPIO / peripheral function |
| Broche 54 | PD9 — GPIO / peripheral function |
| Broche 55 | NRST — Reset input (active low) |
| Broche 56 | TDI — JTAG Test Data In |
| Broche 57 | TMS — JTAG Test Mode Select |
| Broche 58 | TCK — JTAG Test Clock |
| Broche 59 | TDO — JTAG Test Data Out |
| Broche 60 | VDDIO — I/O supply voltage |
| Broche 61 | GND — Ground |
| Broche 62 | XIN — Crystal oscillator input (3-20 MHz) |
| Broche 63 | XOUT — Crystal oscillator output |
| Broche 64 | VDDIO — I/O supply voltage |
| Broche 65 | EP — Exposed pad - thermal and ground, must be soldered to PCB ground plane |
Applications typiques
ATSAMG55J19B-MUT convient pour 7 applications: Bluetooth / USB Audio Headsets, Portable Speakers and Sound Bars, Hearing Aids and Personal Audio Amplifiers, Voice over IP Peripherals and USB Headsets, Industrial Audio Front-Ends, Low-Power IoT Audio Edge Nodes, USB Audio Interfaces and DACs.
Bluetooth / USB Audio Headsets
The ATSAMG55J19B-MUT is purpose-built for low-power wireless audio headsets. Its Cortex-M4 with single-precision FPU executes audio DSP (FIR filters, biquad EQ, SBC / AAC decoding) at high throughput, and the 176 KB SRAM holds multiple audio buffers (e.g. 8 kHz mic capture plus 44.1 kHz playback) without external memory. The integrated I2S / SSC controller connects directly to a Bluetooth SoC's PCM/I2S port, while the on-chip USB 2.0 Full-Speed transceiver supports wired USB headsets. Compared with Cortex-M0/M3 designs, the SAM G55 finishes DSP faster and returns to Sleep more quickly, lowering total system energy per audio frame.
Recommandé
Portable Speakers and Sound Bars
Portable speakers and sound bars benefit from the ATSAMG55J19B-MUT's combination of DSP headroom, audio peripherals, and low-power modes. The Cortex-M4 with FPU runs speaker-compensation algorithms (dynamic bass boost, virtual surround) while the I2S/SSC feeds a Class-D amplifier PWM stage. At 120 MHz the device executes a full 8-band parametric EQ and limiter pipeline at <10% CPU load, leaving bandwidth for user-interface and wireless-streaming tasks. Backup mode with RTC retention reduces idle current during standby to single-digit microamps, extending battery life between charge cycles.
Recommandé
Hearing Aids and Personal Audio Amplifiers
The ATSAMG55J19B-MUT's ultra-low-power architecture suits hearing aids, where every microwatt of DSP energy matters. The Cortex-M4 with FPU runs noise-reduction, feedback-cancellation, and multiband compression filters efficiently, while Sleep and Deep-Sleep modes let the chip idle between audio frames. The 176 KB SRAM supports ring-buffer audio with low latency, and the integrated 12-bit ADC and I2S ports handle microphone and receiver chains directly. Industrial temperature grade (-40 C to +85 C) is sufficient for body-worn applications.
Recommandé
Voice over IP Peripherals and USB Headsets
VoIP peripherals and USB headsets use the ATSAMG55J19B-MUT to handle acoustic-echo-cancellation, noise-suppression, and duplex audio routing on-chip. The on-chip USB 2.0 Full-Speed Device with transceiver enumerates as a USB audio class device without an external PHY, reducing BOM cost. The 120 MHz Cortex-M4 with FPU processes AEC and NS algorithms in real time with margin, and the 176 KB SRAM holds echo-reference and voice buffers. Industrial temperature grade supports desk-phone and conference-room hardware environments.
Recommandé
Industrial Audio Front-Ends
Industrial audio front-ends (acoustic-monitoring, condition-monitoring, smart speakers in factories) benefit from the ATSAMG55J19B-MUT's industrial temperature range and DSP throughput. The Cortex-M4 with FPU runs FFT-based acoustic analysis (machine-health monitoring, anomaly detection) at audio sample rates, and the SAM G55's low-power modes suit always-on edge deployments. GPIO count (up to 47) supports multiple microphone arrays and actuator interfaces, while the integrated USB enables field firmware updates and diagnostics.
Recommandé
Low-Power IoT Audio Edge Nodes
The ATSAMG55J19B-MUT fits low-power IoT audio edge nodes (smart-home voice capture, doorbell intercoms, voice-controlled appliances) where it runs keyword-spotting and beamforming DSP at the edge. The Cortex-M4 with FPU accelerates MFCC / neural-network feature extraction, and the 176 KB SRAM supports audio ring buffers for edge analytics. The chip's multiple low-power modes let it spend most of its time in Sleep, waking only on voice activity, which is critical for battery-powered or energy-harvesting nodes.
Recommandé
USB Audio Interfaces and DACs
USB audio interfaces, headphone DACs, and USB-to-I2S bridges can use the ATSAMG55J19B-MUT as the control and DSP core. The on-chip USB 2.0 Full-Speed Device handles audio-class enumeration; the I2S / SSC feeds an external DAC; and the Cortex-M4 with FPU implements volume control, mute, sample-rate conversion, and oversampling filters. With 512 KB Flash there is headroom for USB audio class 1.0/2.0 stacks, while the 176 KB SRAM holds playback buffers and DSP state. Industrial temperature grade supports studio equipment environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMG55J19B-MUT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMG55J19B-MU | ATSAMG55J19A-MUT | ATSAMG55J19A-MU | ATSAMG55J19B-AUT | ATSAMG55J19A-AUT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-QFN MRLB (7.5x7.5 mm) | 64-QFN MRLB (7.5x7.5 mm) - same | 64-QFN MRLB (7.5x7.5 mm) - same | 64-QFN MRLB (7.5x7.5 mm) - same | 64-LQFP - different footprint | 64-LQFP - different footprint |
| Core | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU | ARM Cortex-M4 with FPU |
| Maximum CPU Frequency | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz | 120 MHz |
| Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB |
| SRAM | 176 KB | 176 KB | 176 KB | 176 KB | 176 KB | 176 KB |
| Silicon Revision | B | B | A | A | B | A |
| Operating Temperature | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) | -40 C to +85 C (Industrial) |
| Supply Voltage | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V | 1.62 V to 3.6 V |
| USB 2.0 FS | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) | Yes (on-chip transceiver) |
Principaux différenciateurs
- Audio-optimized Cortex-M4 with FPU and integrated audio peripherals (vs Generic Cortex-M4 MCU without FPU)
- Largest on-chip SRAM in SAM G55 family (176 KB) (vs Cortex-M0+ MCUs in same price tier)
- On-chip USB 2.0 Full-Speed transceiver eliminates external PHY (vs Cortex-M MCUs without USB)
Notes de conception
The 64-QFN MRLB package has an exposed thermal pad (EP) that must be soldered to a continuous ground plane on the PCB. Use a 7.5x7.5 mm land pattern with at least 0.5 mm thermal via array (0.3 mm vias, 1 mm pitch) underneath the EP to provide low-impedance thermal and electrical return. Insufficient EP soldering raises junction temperature and degrades USB signal integrity. Place four 100 nF decoupling capacitors as close as possible to the four VDDIO pins and one bulk 4.7 uF within 5 mm.
The ATSAMG55J19B-MUT integrates a core voltage regulator that derives VDDCORE from VDDIO, so only a single 1.62 V to 3.6 V external supply is required. For low-noise analog peripherals (ADC, audio), add a ferrite bead or pi-filter between the digital VDDIO rail and the analog AVSS-supplied pins, and provide a clean 3.3 V LDO with <30 uVrms noise for AVCC. Backup mode with RTC retention reduces quiescent current to single-digit microamps; the VDDIO rail must remain present for RTC to function.
Do not leave the NRST pin floating - tie it to VDDIO through a 10 kohm pull-up and a 100 nF capacitor to ground for a clean POR behavior. Unused GPIO pins must be configured as inputs with internal pull-ups enabled, or as outputs driving a defined level, to prevent spurious interrupts and extra current draw. The XIN/XOUT pins require a 3-20 MHz crystal or ceramic resonator with proper load capacitors per the datasheet's Crystal Oscillator Characteristics table; incorrect loading will cause start-up failure.
For USB 2.0 Full-Speed signals (D+, D-), route the differential pair with 90-ohm differential impedance, length-matched within 2 mm, and keep the pair away from switching regulator nodes. The on-chip USB transceiver requires a 1.5 kohm pull-up on D+ (or D- for low-speed) selected by software to enumerate as Full-Speed. The I2S / SSC audio bus signals should be length-matched within 5 mm and series-terminated with 33 ohm if the cable or trace exceeds 50 mm to avoid ringing at 3.072 MHz MCLK harmonics.
Informations de conformité
RoHS and REACH compliant per Microchip product page. Lead-free and halogen-free packaging. Tape-and-reel packaging qualified to JEDEC J-STD-020 MSL3 at 260 C peak reflow. Not AEC-Q100 qualified - this is a commercial/industrial grade part.
