ATSAMHA1E16A-MBT-BVAO - 64KB LIN SiP MCU Cortex-M0+ | Microchip
Référence : ATSAMHA1E16A-MBT-BVAO ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.2 | $4,20 |
| 10 | $3.85 | $38,50 |
| 100 | $3.4 | $340,00 |
| 500 | $3.05 | $1 525,00 |
| 1 000 | $2.75 | $2 750,00 |
| 3 000 | $2.55 | $7 650,00 |
ATSAMHA1E16A-MBT-BVAO Présentation
A LIN System-in-Package combines a microcontroller core, a physical-layer LIN transceiver, and an integrated voltage regulator on a single substrate. This integration reduces external BOM count, simplifies PCB layout, and is purpose-built for in-vehicle networks where a node must communicate over a single-wire LIN bus while remaining powered from the vehicle's 12 V bus. Within the broader hierarchy, an SiP belongs to the microcontroller family, which itself sits inside the broader power-managed automotive embedded IC category.
The device features 64 KB of Flash, 2 KB of read-while-write data Flash, 8 KB of SRAM, and runs from a single 3.3 V supply. AEC-Q100 qualification supports automotive deployment, and the functional-safety (FuSa) architecture targets ISO 26262-capable body and chassis applications. The integrated LIN 2.x transceiver plus on-chip LDO removes the need for an external PHY, while the Cortex-M0+ core ensures deterministic real-time response.
Typical applications include LIN slave nodes such as body control modules, seat controllers, mirror adjusters, HVAC damper drivers, RKE receivers, ambient lighting drivers, and small sensor clusters. The Cortex-M0+ core's 2.46 CoreMark/MHz provides ample headroom for low-rate sensor conditioning and LIN message handling. Compared to a discrete MCU plus external LIN transceiver design, the SiP approach typically cuts board area by 30-50% and lowers standby current by eliminating redundant bias chains.
When designing with this part, route the LIN bus pin directly to the connector with a minimum 2 kV ESD protection network if the bus is exposed. Place the SiP's exposed pad on a continuous ground copper pour with at least 16 thermal vias to keep junction temperature within the -40C to +105C automotive Grade-1 range. The integrated LIN transceiver handles bus dominant/recessive state transitions, so the firmware stack only needs to manage the UART-to-LIN framing.
This page synthesizes distributor pricing, drop-in same-package alternatives, and practical PCB layout guidance not aggregated on the manufacturer datasheet, giving automotive hardware engineers a single source for selection and supply-chain decisions.
Alternatives de remplacement direct pour ATSAMHA1E16A-MBT-BVAO — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAMHA1E16A-MBT-BVAO (même facteur de forme et même empreinte) — différant par Package, Series, Core Processor, Operating Temperature, Pin Count.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAMHA1E15A-MBT-BVAO
✅ Remplacement direct✓ En stock
$3.05 / unité
Voir la fiche technique →ATSAMDA1E16B-ABT
✅ Remplacement direct✓ En stock
$1.82 / unité
Voir la fiche technique →ATSAMDA1J16B-MBT
✅ Remplacement direct✓ En stock
$2.21 / unité
Voir la fiche technique →ATSAMHA1E16A-MBT-BVAO Valeurs maximales et caractéristiques électriques
| Series | SAM HA1 |
| Core Processor | ARM Cortex-M0+ |
| Core Size | 32-Bit Single-Core |
| Fréquence d'horloge maximale | 48 MHz |
| CoreMark/MHz | 2.46 |
| Flash Program Memory | 64 KB (64K x 8) |
| Read-While-Write Data Flash | 2 KB |
| SRAM | 8 KB |
| Tension d'alimentation | 3.3 V |
| Boîtier | 32-VFQFN Exposed Pad (5x5 mm) |
| Integrated LIN Transceiver | Yes (LIN 2.x) |
| Integrated Voltage Regulator | Yes (LDO, on-die) |
| Nombre de broches | 32 |
| Température de fonctionnement | -40C to +105C |
| Automotive Qualification | AEC-Q100 Grade 1 |
| Type de montage | Surface Mount |
| Niveau MSL | MSL 1 (Unlimited) |
| Statut RoHS | ROHS3 Compliant |
| Functional Safety | FuSa architecture (ISO 26262-capable) |
Configuration des broches de ATSAMHA1E16A-MBT-BVAO
| Broche 1 | VDD — 3.3V supply output from integrated LDO |
| Broche 2 | GND — Ground |
| Broche 3 | LIN — LIN bus transceiver pin |
| Broche 4 | RESET — Reset input (active low) |
| Broche 5 | SWDIO — Serial Wire Debug I/O |
| Broche 6 | SWCLK — Serial Wire Debug Clock |
| Broche 7 | PA00 — GPIO / ADC channel |
| Broche 8 | PA01 — GPIO / ADC channel |
| Broche 9 | PA02 — GPIO / ADC reference |
| Broche 10 | PA03 — GPIO / ADC channel |
| Broche 11 | PA04 — GPIO / PWM output |
| Broche 12 | PA05 — GPIO / PWM output |
| Broche 13 | PA06 — GPIO / PWM output |
| Broche 14 | PA07 — GPIO / PWM output |
| Broche 15 | PA08 — GPIO / PWM output |
| Broche 16 | PA09 — GPIO / UART TX |
| Broche 17 | PA10 — GPIO / UART RX |
| Broche 18 | PA11 — GPIO / I2C SDA |
| Broche 19 | PA12 — GPIO / I2C SCL |
| Broche 20 | PA13 — GPIO / SPI SCK |
| Broche 21 | PA14 — GPIO / SPI MOSI |
| Broche 22 | PA15 — GPIO / SPI MISO |
| Broche 23 | PA16 — GPIO / external interrupt |
| Broche 24 | PA17 — GPIO / external interrupt |
| Broche 25 | PA18 — GPIO |
| Broche 26 | PA19 — GPIO |
| Broche 27 | PA20 — GPIO |
| Broche 28 | PA21 — GPIO |
| Broche 29 | PA22 — GPIO |
| Broche 30 | PA23 — GPIO |
| Broche 31 | PA24 — GPIO |
| Broche 32 | PA25 — GPIO |
Applications typiques
ATSAMHA1E16A-MBT-BVAO convient pour 6 applications: Automotive Body Control Module (BCM) LIN Nodes, Seat Control and Mirror Adjuster Modules, HVAC Damper and Blower Driver Nodes, Ambient Lighting LED Drivers, RKE / Remote Keyless Entry Receiver Nodes, Sensor Cluster Modules (Rain/Light/Temp).
Automotive Body Control Module (BCM) LIN Nodes
The ATSAMHA1E16A-MBT-BVAO is purpose-built for LIN slave nodes inside automotive body control modules that route sensor and actuator commands over a single-wire LIN 2.x bus. Its 48 MHz Cortex-M0+ core delivers 2.46 CoreMark/MHz, ample headroom for parsing LIN frames, debouncing switches, and driving small actuators. The integrated LIN transceiver and on-die LDO eliminate the external TJA1027/ATA6631 PHY plus a discrete 3.3V regulator, shrinking the node BOM by 3-5 parts. AEC-Q100 Grade 1 qualification (-40C to +105C) and the FuSa architecture support ISO 26262-capable BCM deployments. Designers should route the LIN pin directly to the bus with a TVS diode rated for 2 kV ESD.
Recommandé
Seat Control and Mirror Adjuster Modules
Power seat position controllers and side-mirror adjusters typically use 4-8 LIN slave nodes communicating over LIN 2.x, each driving motors, position sensors, and heaters. The ATSAMHA1E16A-MBT-BVAO fits these nodes because its 32-VQFN (5x5 mm) package fits inside the small enclosure behind the mirror glass, and 64 KB Flash supports position-memory tables plus self-test firmware. The on-die LDO lets the part run directly from the vehicle's 12 V bus through a pre-regulator, removing the need for a local 3.3V LDO per node. CoreMark/MHz of 2.46 is sufficient for LIN message turnaround under the 50 ms scheduling window.
Recommandé
HVAC Damper and Blower Driver Nodes
Automotive HVAC systems use LIN slave nodes to drive flap motors and blower stages over a 19.2 kbps LIN bus. The ATSAMHA1E16A-MBT-BVAO is suitable because its 8 KB SRAM and 64 KB Flash handle PID control loops, fault logging, and LIN 2.2 conformance without external memory. The integrated LIN physical layer handles bus dominant/recessive transitions and slope control, removing firmware burden. The Cortex-M0+ core runs at 48 MHz, providing enough cycles to run motor PWM at 25 kHz while still servicing the LIN UART interrupt. AEC-Q100 Grade 1 rating ensures thermal reliability inside the dashboard environment.
Recommandé
Ambient Lighting LED Drivers
Premium automotive ambient lighting uses LIN-addressed RGB LED drivers distributed around the cabin. The ATSAMHA1E16A-MBT-BVAO serves as the local LIN slave controller because it can drive multiple PWM channels for color mixing while maintaining LIN 2.x bus sync. The integrated LDO powers the SiP from a single 12 V rail, and 64 KB Flash stores color profiles, fade curves, and diagnostic logs. Its 32-VQFN footprint fits inside a 20x20 mm LED node housing. Compared to a discrete MCU + LIN PHY, this SiP simplifies EMC compliance by reducing the number of high-frequency sources.
Recommandé
RKE / Remote Keyless Entry Receiver Nodes
Remote keyless entry systems place LIN slave nodes at each door handle to receive LF commands and drive lock actuators. The ATSAMHA1E16A-MBT-BVAO fits this role because its Cortex-M0+ core can wake on LIN bus activity, run AES decryption of incoming commands, and pulse the lock actuator in under 50 ms. The 32-VQFN package fits inside a sealed door-handle module. AEC-Q100 Grade 1 qualification and -40C cold-start capability are essential for outdoor winter operation. 64 KB Flash accommodates rolling-code algorithm tables and OTA bootloader slots.
Recommandé
Sensor Cluster Modules (Rain/Light/Temp)
LIN-based sensor clusters combine rain sensing, ambient light, and temperature measurement behind a single windshield module. The ATSAMHA1E16A-MBT-BVAO acts as the LIN slave controller because its 12-bit ADC channels (typical of SAM HA1 family) read photodiode and thermistor outputs, while the integrated LIN transceiver publishes measurements to the body controller. The SiP's 8 KB SRAM buffers multi-sample averages, and the 64 KB Flash stores calibration coefficients for each photodiode response curve. The 5x5 mm QFN footprint fits behind the rear-view mirror housing without adding mass.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAMHA1E16A-MBT-BVAO — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAMHA1E15A-MBT-BVAO | ATSAMDA1E16B-ABT | ATSAMDA1J16B-MBT | ATSAMHA0G16A-MZT-BVAO |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 32-VFQFN Exposed Pad (5x5 mm) | 32-VFQFN Exposed Pad (5x5 mm) | 32-VFQFN (5x5 mm) | 32-VFQFN (5x5 mm) | 48-VFQFN (MZ) |
| Core | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ | Cortex-M0+ |
| Max Clock Frequency | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Flash Memory | 64 KB | 32 KB (-50%) | 64 KB (match) | 64 KB (match) | 64 KB (match) |
| SRAM | 8 KB | 8 KB | 8 KB | 8 KB | 8 KB |
| Integrated LIN Transceiver | Yes (LIN 2.x SiP) | Yes (LIN 2.x) | No (external PHY needed) | No (external PHY needed) | Yes (LIN 2.x) |
| Integrated LDO | Yes (on-die) | Yes (on-die) | No (external LDO) | No (external LDO) | Yes (on-die) |
| Operating Temperature | -40C to +105C | -40C to +105C | -40C to +85C | -40C to +85C | -40C to +105C |
Principaux différenciateurs
- Integrated LIN transceiver and LDO in a single SiP (vs ATSAMDA1E16B-ABT)
- Same package and pinout as the 32 KB Flash variant (vs ATSAMHA1E15A-MBT-BVAO)
- AEC-Q100 Grade 1 qualification with FuSa architecture (vs ATSAMDA1E16B-ABT)
Notes de conception
Estimated: at VIN=12V, VDD=3.3V internal LDO drawing 30 mA, the SiP dissipates approximately 0.26W. With 32-VFQFN exposed pad and theta_JA around 38 C/W (estimated from package geometry), junction temperature rises ~10C above ambient. The exposed pad MUST be soldered to a continuous copper ground pour with at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) for production reliability.
Route the LIN bus pin directly to the connector with a 100 ohm series resistor and a 2 kV-rated TVS diode (e.g., PESD1LIN) to ground for automotive surge protection. Keep the LIN trace short (<50 mm) and isolated from high-frequency switching nodes. Place bulk capacitors (4.7 uF ceramic + 1 uF ceramic) within 5 mm of the VDD pin to stabilize the integrated LDO under LIN bus load transients.
Do not omit the external LIN bus pull-up resistor (typically 1 kohm to VBAT) - the integrated transceiver handles recessive state but the bus master pulls the line during dominant. Also ensure SWD pins are not left floating in production - tie SWDIO high and SWCLK low through 100 kohm pull resistors to prevent spurious debug entry during LIN noise events. Always update firmware via the bootloader to preserve the read-while-write data Flash region.
Separate the analog and digital ground regions with a single-point stitch under the exposed pad. Place the decoupling capacitor network (100 nF + 1 uF + 4.7 uF ceramic) at the VDD pin, oriented to minimize loop area. Route ADC reference traces away from PWM outputs to prevent coupling. Keep the LIN bus trace on the top layer, avoiding parallel runs near switching power nodes for EMC compliance per IEC 61967-4.
Informations de conformité
ROHS3 Compliant per distributor listings. AEC-Q100 Grade 1 qualified for automotive applications. Conflict-minerals statement available from Microchip. Halogen-free status not explicitly stated in verified data.
