ATSAMHA1E15A-MBT-BVAO - ARM Cortex-M0+ LIN SiP MCU | Microchip
MPN: ATSAMHA1E15A-MBT-BVAO ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.21 | $42.10 |
| 100 | $3.78 | $378.00 |
| 500 | $3.4 | $1,700.00 |
| 1,000 | $3.05 | $3,050.00 |
ATSAMHA1E15A-MBT-BVAO Overview
A System-in-Package (SiP) is a modular packaging technique that places multiple active die inside one IC package, allowing heterogeneous functions (analog, digital, mixed-signal, power) to coexist on a small footprint. Within the broader microcontroller hierarchy, the ATSAMHA1E15A sits at the intersection of automotive microcontroller -> ARM Cortex-M0+ MCU -> LIN node controller -> system-in-package, and it belongs to the AEC-Q100-qualified SAM HA1 functional-safety family. Integrating the LIN transceiver and VREG eliminates two external ICs that would normally occupy PCB area around a discrete MCU.
Key features include 19 GPIO lines, hardware PWM channels, ADC, DAC, DMA, and an operating voltage range of 2.7 V to 3.63 V (nominal 3.3 V). The device targets automotive body-control and sensor-node applications with industrial temperature grade (-40 °C to +105 °C) and AEC-Q100 / TS 16949 screening. Functional safety (FuSa) documentation is available to support ASIL-classified systems, simplifying ISO 26262 design workflows.
The on-chip LIN transceiver is compliant with LIN 2.x and SAE J2602, supporting master and slave node roles up to 20 kbit/s. The integrated VREG accepts a 5 V to 28 V battery feed and produces a clean 3.3 V rail for the MCU core. This co-integration cuts BOM cost, reduces PCB area by approximately 30-40 % versus discrete designs, and removes the need for an external LIN phy IC.
Typical applications include automotive body-control modules (BCM), HVAC blower and flap controllers, door/window/seat switches, LED lighting nodes, sensor interfaces, and LIN-based actuator drivers. The AEC-Q100 qualification and wide battery-tolerant input make the part drop-in suitable for 12 V automotive systems where LIN is the physical bus.
When designing with this SiP, place the required bypass capacitors within 2 mm of the VREG and MCU supply pins. Use Microchip Studio and Atmel START to generate peripheral drivers; the LIN stack is provided via the Microchip LIN Stack. Verify EMC behavior with the SAM HA1 EMC checklist before finalizing PCB layout.
This page synthesizes current distributor pricing, drop-in alternative candidates, and practical design notes not consolidated in the manufacturer datasheet, accelerating part selection for automotive LIN node designs.
Drop-in alternatives for ATSAMHA1E15A-MBT-BVAO — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with ATSAMHA1E15A-MBT-BVAO (same form factor and footprint) — differing in Package, Operating Temperature, Program Flash, SERCOM Modules, SRAM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
ATSAMHA1G15A-MBT-BVAO
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMHA1E15A-MBT-B
✅ Drop-In📋 Reference alternative (not in catalog)
ATSAMDA1J16B-MBT
✅ Drop-In✓ In Stock
$2.21 / Unit
View Datasheet →ATSAMDA1G15B-MBT
✅ Drop-In✓ In Stock
$1.1 / Unit
View Datasheet →ATSAMDA1G14B-MBT
✅ Drop-In✓ In Stock
$1.78 / Unit
View Datasheet →ATSAMHA1E15A-MBT-BVAO Maximum Ratings & Electrical Characteristics
| Manufacturer | Microchip Technology |
| Series | SAM HA1, Functional Safety (FuSa), Automotive AEC-Q100 |
| Core Processor | ARM Cortex-M0+ (32-bit) |
| Maximum Clock Frequency | 48 MHz |
| CoreMark / MHz | 2.46 |
| Program Memory (Flash) | 32 KB (32K x 8) |
| Read-While-Write Data Flash | 1 KB |
| SRAM | 4 KB |
| Supply Voltage Range | 2.7 V to 3.63 V (nominal 3.3 V) |
| Integrated LIN Transceiver | Yes (LIN 2.x / SAE J2602 compatible) |
| Integrated Voltage Regulator | Yes (battery-tolerant, 5 V to 28 V input, 3.3 V output) |
| GPIO Count | 19 |
| PWM Channels | Yes (hardware) |
| ADC / DAC / DMA | Yes / Yes / Yes |
| Operating Temperature Range | -40 °C to +105 °C (industrial / automotive) |
| Package | 32-VQFN (5x5 mm) |
| Mounting Type | Surface Mount |
| Qualification | AEC-Q100, TS 16949 screening |
| Packaging | Tape & Reel |
ATSAMHA1E15A-MBT-BVAO 32-vqfn (5x5 mm) Pin Configuration Guide
Pin configuration for ATSAMHA1E15A-MBT-BVAO (32-vqfn (5x5 mm) package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for ATSAMHA1E15A-MBT-BVAO.
Refer to the datasheet for full pin configuration.
Typical Applications
ATSAMHA1E15A-MBT-BVAO is suitable for 6 applications: Automotive Body Control Modules (BCM), HVAC Blower and Flap Controllers, Door, Window and Seat Switch Nodes, Automotive LED Lighting Nodes, Automotive Sensor Interfaces, LIN Actuator Drivers.
Automotive Body Control Modules (BCM)
The ATSAMHA1E15A-MBT-BVAO is well suited for automotive BCM nodes because the SiP integrates a 32-bit ARM Cortex-M0+ MCU running at 48 MHz, a LIN 2.x/SAE J2602 transceiver, and a 5-28 V to 3.3 V VREG in one 32-VQFN (5x5 mm) package. The Cortex-M0+ at 2.46 CoreMark/MHz easily handles BCM firmware including LIN scheduling, PWM-driven LED dimming, and ADC-based switch debouncing. AEC-Q100 / TS 16949 screening plus -40 to +105 °C operation removes the burden of component qualification per vehicle program. The wide VBAT tolerance tolerates load-dump transients to 28 V, so the BCM can be powered directly from the 12 V board net without a separate pre-regulator, reducing BOM cost and PCB area by roughly 30-40 % versus discrete MCU + LIN + VREG designs. Recommended companion: ATSAMHA1G15A-MBT-BVAO for memory upgrade; ATSAMDA1J16B-MBT for non-LIN secondary tasks.
Recommended
HVAC Blower and Flap Controllers
HVAC modules typically need one LIN node per blower or air-distribution flap. The ATSAMHA1E15A-MBT-BVAO's 19 GPIO and hardware PWM channels provide enough I/O to drive a BLDC blower FET gate driver, read a position potentiometer via ADC, and report status over LIN to the climate control master. The 4 KB SRAM buffer is sufficient for LIN transport-layer messages plus state-machine history; the 32 KB Flash comfortably fits a LIN 2.x slave stack. AEC-Q100 qualification and the integrated VREG accepting battery feed directly means the HVAC node can be mounted near the blower motor without an external 5 V or 12 V regulator, simplifying harness design. Recommended companion: ATSAMHA1G15A-MBT-BVAO if LIN diagnostics logging is needed; ATSAMDA1G15B-MBT for an adjacent front-panel controller.
Recommended
Door, Window and Seat Switch Nodes
Door-modules, window-lift switches and seat-position switches are typical LIN sub-nodes that benefit from the ATSAMHA1E15A-MBT-BVAO's small footprint and integrated LIN phy. The Cortex-M0+ core at 48 MHz can debounce up to 19 switch inputs, manage LED backlighting via PWM, and answer the LIN master's polling messages with sub-millisecond latency. The 32-VQFN (5x5 mm) package fits inside a sealed switch housing, and the 5-28 V VREG eliminates the local 5 V regulator that discrete designs would otherwise require. AEC-Q100 / TS 16949 screening and -40 to +105 °C operation match the under-hood or in-cabin thermal envelope. The integrated LIN phy removes EMC challenges that come with long harness stubs, reducing radiated emissions versus external LIN ICs. Recommended companion: ATSAMHA1E15A-MBT-B (non-VAO variant) for cost-down where automotive volatile screening is not needed; ATSAMDA1J14B-ABT for low-pin-count secondary switch nodes.
Recommended
Automotive LED Lighting Nodes
LIN-controlled LED tail lamps, daytime running lights and interior ambient lighting each need a small LIN node capable of driving FETs or constant-current LED drivers. The ATSAMHA1E15A-MBT-BVAO fits this role because its hardware PWM can dim LEDs with high resolution, while the integrated LIN phy allows direct connection to the body controller's LIN bus without an external transceiver. The integrated 5-28 V VREG means the LED node can share the 12 V battery feed, simplifying wire harness routing. AEC-Q100 and -40 to +105 °C temperature rating support under-hood and exterior lamp thermal conditions, while the 32-VQFN (5x5 mm) package fits inside a sealed lamp housing. The 4 KB SRAM is more than enough for color-mixing tables and fade sequences in RGB ambient lighting. Recommended companion: ATSAMHA1G15A-MBT-BVAO for ambient lighting with larger color tables; ATSAMDA1G15B-MBT for non-LIN lamp drivers.
Recommended
Automotive Sensor Interfaces
LIN-connected temperature, humidity, current and pressure sensors benefit from the ATSAMHA1E15A-MBT-BVAO's integrated ADC and LIN phy. The Cortex-M0+ at 48 MHz plus DMA can sample sensors at high rates, average the readings, and present calibrated values over LIN to the master ECU. The integrated VREG accepts 5-28 V, so a sensor board can be powered from the same 12 V bus as actuators without adding a local regulator. The 32-VQFN footprint keeps the sensor module small enough to fit inside a sealed transducer housing. AEC-Q100 qualification satisfies automotive OEM sourcing requirements. The 19 GPIO also let the same SiP handle multiple sensor channels on one PCB. Recommended companion: ATSAMDA1J16B-MBT for a low-power co-processor; ATSAMDA1E16B-ABT for higher-pin sensor hub.
Recommended
LIN Actuator Drivers
LIN-driven actuators such as mirror adjusters, headlamp levelers, and small motor controllers each need a LIN node plus PWM/FET gate drive. The ATSAMHA1E15A-MBT-BVAO provides both: the integrated LIN 2.x phy handles bus communication, the hardware PWM drives FET gate drivers, the ADC reads motor current for closed-loop control, and the integrated 5-28 V VREG is powered directly from the 12 V board net. The 32 KB Flash supports LIN slave stacks plus actuator state machines; 4 KB SRAM is enough for current-control loop variables. AEC-Q100 / TS 16949 screening and -40 to +105 °C operation meet automotive under-hood requirements. The 32-VQFN (5x5 mm) footprint fits inside actuator housings that would not accommodate a 3-chip discrete design. Recommended companion: ATSAMHA1G15A-MBT-BVAO for firmware-rich actuators; ATSAMDA1G15B-MBT for low-end LIN motor controllers.
Recommended
Recommended Products Summary
Engineering reference data for ATSAMHA1E15A-MBT-BVAO — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | ATSAMHA1G15A-MBT-BVAO | ATSAMHA1E15A-MBT-B | ATSAMDA1J16B-MBT | ATSAMDA1G15B-MBT | ATSAMDA1G14B-MBT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 32-VQFN (5x5 mm) | 32-VQFN (5x5 mm) - same | 32-VQFN (5x5 mm) - same | QFN (MBT) - same footprint family | QFN (MBT) - same footprint family | QFN (MBT) - same footprint family |
| Core | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ | ARM Cortex-M0+ |
| Flash | 32 KB | 64 KB | 32 KB | 16 KB | 64 KB | 16 KB |
| SRAM | 4 KB | 8 KB | 4 KB | 4 KB | 8 KB | 4 KB |
| Integrated LIN Transceiver | Yes (LIN 2.x / SAE J2602) | Yes (LIN 2.x / SAE J2602) | Yes (LIN 2.x / SAE J2602) | No - external LIN required | No - external LIN required | No - external LIN required |
| Integrated VREG | Yes (5-28 V to 3.3 V) | Yes (5-28 V to 3.3 V) | Yes (5-28 V to 3.3 V) | No | No | No |
| Maximum Clock | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz | 48 MHz |
| Automotive Grade | AEC-Q100 / TS 16949 | AEC-Q100 / TS 16949 | AEC-Q100 | AEC-Q100 | AEC-Q100 | AEC-Q100 |
Key Differentiators
- Single-package integration of MCU + LIN transceiver + VREG (vs ATSAMDA1J16B-MBT)
- Wider LIN bus voltage tolerance than discrete designs (vs NXP TJA1027 (external LIN phy))
- Cost-optimized 32 KB Flash tier within the SAM HA1 family (vs ATSAMHA1G15A-MBT-BVAO)
- AEC-Q100 / TS 16949 screening with full FuSa documentation (vs Industrial-only SAM D variants)
Design Notes
The integrated VREG accepts 5 V to 28 V battery input and produces a regulated 3.3 V rail for the MCU. Place a 10 uF X7R ceramic bulk capacitor within 2 mm of the VREG output pin, plus a 100 nF X7R decoupling capacitor on every VDD pin. Add a TVS diode (e.g. SMAJ28CA) on the VBAT pin to clamp load-dump transients above 28 V - the integrated VREG tolerates up to 28 V continuous but is not designed for ISO 7637-2 pulses alone. Reserve a small RC filter on the VREG sense line if your schematic uses remote sensing.
The 32-VQFN (5x5 mm) package requires a thermal pad on the PCB that must be soldered to a copper pour of at least 25 mm² to keep the junction temperature within the -40 to +105 °C automotive range at full LIN bus load. Connect the thermal pad to the clean digital ground plane, not to VBAT ground, to avoid ground-loop noise coupling into the LIN bus. Keep LIN bus traces short and surrounded by a ground pour to maintain the LIN driver's EMC margin.
Do not assume the LIN bus pin is 5 V tolerant - the integrated LIN transceiver is referenced to VBAT and the LIN bus voltage swings up to 18 V during dominant transmission. Use Microchip Studio or Atmel START to configure the LIN stack; do not enable interrupts before initializing the LIN peripheral or the first LIN message may be lost. The part number suffix 'BVAO' designates the volatile automotive qualifier; choose the standard 'B' suffix for industrial designs to save cost.
Estimated thermal analysis: at full LIN bus load (100 mA into the bus) plus 30 mA MCU consumption from the 3.3 V rail, the SiP dissipates approximately 1.5 W when the VREG drops 5 V to 3.3 V at 28 V input. With a 25 mm² copper pour on a 2-layer 1 oz board, theta_JA is roughly 35 C/W, producing about 53 °C rise above ambient - well within the 105 °C upper limit. If you stack high-current actuators on the same PCB, increase the copper pour to 100 mm² or add a thermal via array under the exposed pad.
Compliance Information
AEC-Q100 / TS 16949 qualified per Microchip product page. RoHS compliant, lead-free, halogen-free. Functional-safety (FuSa) documentation available for ISO 26262 workflows.
