ATSAML11D16A-YFT - SAM L11 32MHz Cortex-M23 MCU 64KB Flash | Microchip
Référence : ATSAML11D16A-YFT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.54 | $3,54 |
| 10 | $3.19 | $31,90 |
| 100 | $2.81 | $281,00 |
| 500 | $2.52 | $1 260,00 |
| 1 000 | $2.27 | $2 270,00 |
ATSAML11D16A-YFT Présentation
A microcontroller (MCU) is an integrated circuit that combines a CPU core, memory (Flash and SRAM), and programmable peripherals on a single silicon die. The Cortex-M23 is the smallest and most energy-efficient ARM processor core with TrustZone, providing hardware isolation between secure and non-secure software execution. The SAM L11 belongs to the hierarchy: microcontroller -> embedded processor -> semiconductor, and is positioned by Microchip as the industry's first low-power Cortex-M23 MCU with chip-level security.
Key features include chip-level tamper resistance, secure key storage, ARM TrustZone technology, integrated cryptographic accelerators, and an operating voltage range of 1.62V to 3.63V. The device also includes multiple communication interfaces, ADC channels, and configurable SERCOM peripherals that are typical of the SAM L family. The part is qualified for the -40C to +125C industrial/automotive temperature range.
The SAM L11 architecture pairs an ultra-low-power Cortex-M23 core with a peripheral touch controller, event system, and SmartEEPROM emulation. The 32 MHz operation at 25 uA/MHz keeps active-mode efficiency near the lower bound for Cortex-M class devices, while sub-100 nA sleep current enables years of battery life on coin cells. The on-chip cryptographic block supports AES, SHA, and True Random Number Generation.
Typical applications include secure IoT end nodes, smart sensors, wearables, wireless beacons, access control, and battery-powered edge devices that require authenticated firmware and tamper detection. The SSOP-24 footprint is well-suited for hand-solderable prototyping or low-density production assemblies.
When designing with this device, validate that your toolchain supports TrustZone-M (e.g., MPLAB X IDE with MCC, or Keil/IAR with CMSIS packs). Because the part ships as -YFT (tape-and-reel, 125C), pair it with a -YF (tray) variant for prototyping to avoid re-reeling.
This page synthesizes distributor pricing, drop-in alternatives from the same SAM L11 family, and practical design notes not found in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour ATSAML11D16A-YFT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAML11D16A-YFT (même facteur de forme et même empreinte) — différant par Package, ADC, Security, Operating Temperature, Sleep Mode Current.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAML11D16A-YF
✅ Remplacement direct✓ En stock
$1.63 / unité
Voir la fiche technique →ATSAML11D16A-MFT
✅ Remplacement direct✓ En stock
$2.51 / unité
Voir la fiche technique →ATSAML11D15A-MU
✅ Remplacement direct✓ En stock
$1.95 / unité
Voir la fiche technique →ATSAML11D14A-YUT
✅ Remplacement direct✓ En stock
$1.08 / unité
Voir la fiche technique →ATSAML10D16A-MFT
✅ Remplacement direct✓ En stock
$1.7 / unité
Voir la fiche technique →ATSAML11D16A-YFT Valeurs maximales et caractéristiques électriques
| Core Processor | ARM Cortex-M23 |
| Core Size | 32-Bit Single-Core |
| Maximum CPU Clock | 32 MHz |
| Program Memory Size | 64 KB (64K x 8) Flash |
| RAM Size | 16 KB SRAM |
| Boîtier | 24-SSOP (0.209 inch / 5.30 mm width) |
| Active Mode Current | <25 uA/MHz |
| Sleep Mode Current | <100 nA |
| Plage de température de fonctionnement | -40C to +125C |
| Security | ARM TrustZone-M, secure key storage, chip-level tamper resistance |
| Communication Interfaces | SERCOM (configurable UART/SPI/I2C) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Packaging | Tape and Reel |
Configuration des broches de ATSAML11D16A-YFT
| Broche 1 | VDDIO — Digital I/O supply voltage |
| Broche 2 | GND — Ground |
| Broche 3 | PA00 — GPIO / SERCOM pad |
| Broche 4 | PA01 — GPIO / SERCOM pad |
| Broche 5 | PA02 — GPIO / SERCOM pad / ADC |
| Broche 6 | PA03 — GPIO / SERCOM pad / ADC |
| Broche 7 | PA04 — GPIO / SERCOM pad / ADC |
| Broche 8 | PA05 — GPIO / SERCOM pad / ADC |
| Broche 9 | PA06 — GPIO / SERCOM pad / ADC |
| Broche 10 | PA07 — GPIO / SERCOM pad / ADC |
| Broche 11 | PA08 — GPIO / SERCOM pad |
| Broche 12 | PA09 — GPIO / SERCOM pad |
| Broche 13 | PA10 — GPIO / SERCOM pad |
| Broche 14 | PA11 — GPIO / SERCOM pad |
| Broche 15 | PA14 — GPIO / SERCOM pad / SWCLK |
| Broche 16 | PA15 — GPIO / SERCOM pad / TDI |
| Broche 17 | PA16 — GPIO / SERCOM pad / SWDIO |
| Broche 18 | PA17 — GPIO / SERCOM pad / TDO |
| Broche 19 | PA22 — GPIO / SERCOM pad / I2C |
| Broche 20 | PA23 — GPIO / SERCOM pad / I2C |
| Broche 21 | RESET — Reset input, active low |
| Broche 22 | VDD — Core supply voltage |
| Broche 23 | VDDCORE — Internal core voltage (decouple) |
| Broche 24 | GND — Ground |
Applications typiques
ATSAML11D16A-YFT convient pour 6 applications: Secure IoT Sensor Nodes, Smart Wearable Devices, Smart Home and Building Automation, Battery-Powered Wireless Beacons, Access Control and Authentication Tokens, Medical Sensor and Monitoring Devices.
Secure IoT Sensor Nodes
The ATSAML11D16A-YFT is purpose-built for secure IoT sensor endpoints that require authenticated firmware and tamper detection. Its ARM TrustZone-M core partitions secure boot code from application code in hardware, while the on-chip secure key storage protects provisioned credentials. At less than 25 uA/MHz active and sub-100 nA sleep, a 32 MHz wake-and-transmit duty cycle of 1% averages under 30 uA, enabling years of life on a single coin cell. The integrated AES/SHA hardware accelerators handle TLS handshakes at negligible CPU overhead, freeing the Cortex-M23 to manage sensor fusion and SERCOM-based radio interfaces (LoRa, BLE, sub-GHz).
Recommandé
Smart Wearable Devices
Wearables such as fitness bands, health patches, and smart watches benefit from the ATSAML11D16A-YFT's 16 KB SRAM and 64 KB Flash, enough for RTOS-based sensor fusion and BLE stack fragments. The Cortex-M23's deterministic interrupt latency keeps motion-sensor sampling consistent under load, while TrustZone isolates biometric template storage from the application layer. Sleep current below 100 nA means a wearable can sit idle all night and wake to a single accelerometer event without draining the battery. The 24-SSOP footprint is breadboard-friendly for prototyping small form-factor wearables.
Recommandé
Smart Home and Building Automation
Smart home hubs, occupancy sensors, and HVAC controllers leverage the ATSAML11D16A-YFT's multiple SERCOM peripherals to bridge I2C sensors, SPI radios, and UART modems on a single MCU. The TrustZone-M secure boot prevents firmware downgrade attacks, while tamper detection triggers secure erasure of keys if the enclosure is breached. Industrial temperature rating (-40C to +125C) supports outdoor-mounted building automation nodes that see full seasonal swings. With 64 KB Flash, the device holds full Zigbee or Matter application profiles plus room for OTA staging.
Recommandé
Battery-Powered Wireless Beacons
BLE beacons, asset trackers, and retail sensors run for years on a single coin cell when built around the ATSAML11D16A-YFT. A typical beacon advertises every 500 ms - the MCU spends most of its time in sleep at <100 nA and wakes briefly to service the radio. The on-chip True Random Number Generator supports authenticated beacon protocols, while secure key storage prevents cloning of provisioned identifiers. The 32 MHz Cortex-M23 handles BLE radio control and packet assembly without offloading to an external crypto IC, reducing BOM cost.
Recommandé
Access Control and Authentication Tokens
Physical access readers, smart locks, and authentication tokens demand hardware-rooted security, which the ATSAML11D16A-YFT delivers through ARM TrustZone-M and chip-level tamper detection. The on-chip secure key storage holds provisioned credentials with anti-tamper erase, and the cryptographic accelerators run AES-256 and SHA-256 at hardware speeds. With 16 KB SRAM and 64 KB Flash, the device fits full PKI stack implementations and audit logging. The SSOP-24 package is suitable for compact reader electronics.
Recommandé
Medical Sensor and Monitoring Devices
Continuous glucose monitors, pulse oximeters, and disposable medical patches favor the ATSAML11D16A-YFT's combination of TrustZone-M data isolation and ultra-low sleep current. Patient biometric data stays in the secure memory region, satisfying regulatory data-isolation requirements, while less than 100 nA sleep current enables multi-day wear on a single coin cell. The integrated ADC peripherals interface directly with biomedical sensors (PPG, ECG, temperature), and the deterministic Cortex-M23 core ensures consistent sample timing for clinical-grade measurements. SSOP-24 simplifies medical device prototyping and small-batch production.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAML11D16A-YFT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAML11D16A-YF | ATSAML11D16A-MFT | ATSAML11D15A-MU | ATSAML10D16A-MFT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 24-SSOP | 24-SSOP (tray) | 24-SSOP | 24-SSOP | 24-SSOP |
| Core | ARM Cortex-M23 32-bit | ARM Cortex-M23 | ARM Cortex-M23 | ARM Cortex-M23 | ARM Cortex-M23 (no TrustZone) |
| Max Clock Speed | 32 MHz | 32 MHz | 32 MHz | 32 MHz | 32 MHz |
| Flash Memory | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB |
| SRAM | 16 KB | 16 KB | 16 KB | 8 KB | 16 KB |
| TrustZone-M Security | Yes | Yes | Yes | Yes | No (SAM L10) |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +85C | -40C to +85C | -40C to +125C |
| Active Current | <25 uA/MHz | <25 uA/MHz | <25 uA/MHz | <25 uA/MHz | <25 uA/MHz |
Principaux différenciateurs
- Industry-first Cortex-M23 with TrustZone-M hardware security (vs ATSAML10D16A-MFT)
- Higher Flash density than lower-tier SAM L11 siblings (vs ATSAML11D15A-MU)
- Tape-and-reel packaging for high-volume assembly (vs ATSAML11D16A-YF)
Notes de conception
Decouple VDD and VDDCORE with a 100 nF X7R ceramic capacitor within 5 mm of the respective pins, plus a bulk 1 uF to 4.7 uF tantalum or ceramic capacitor on VDD. The SAM L11 datasheet section on power-supply sequencing requires VDDCORE to come up after VDD; do not drive VDDCORE from an external supply unless explicitly noted. For battery-powered designs, route the coin-cell negative terminal directly to the GND pin with the shortest possible trace to minimize sleep-current leakage.
The 24-SSOP package has 0.65 mm pitch leads; route the SSOP land pattern with 0.4 mm trace/space and a 0.5 mm via pad. Place the SWD header (SWDIO, SWCLK, RESET, GND, VDD) on the PCB edge for probe access without disturbing the rest of the layout. Keep analog reference traces away from SERCOM switching lines to avoid coupling into ADC measurements. Estimated: assume 4-layer 1 oz copper with the SSOP exposed ground lead soldered to a flooded bottom-layer ground plane for thermal performance.
Three common pitfalls when designing with the ATSAML11D16A-YFT: (1) Forgetting to configure TrustZone-M boot mode - leaving it unsecured defeats the device's primary value proposition; (2) Disabling the on-chip cryptographic accelerators in software and trying to do AES in firmware - this costs 20x performance; (3) Failing to enable the brown-out detector (BOD) before deploying battery-powered designs, which can lead to corrupted Flash writes as cells age. Always review the errata document for the latest revision letter before locking down your firmware.
The SAM L11 family is specified for -40C to +125C operation but the device is intended for low-duty-cycle applications; sustained 32 MHz active operation at 125C will push thermal stress on the SSOP-24 plastic package. For industrial deployments where ambient exceeds 85C, validate your duty cycle against the package's thermal resistance (estimated: ~70 C/W theta-JA for SSOP-24 mounted on a 1 sq inch 2-layer pad). Add a copper pour on the top layer under the SSOP footprint to spread heat if the device runs hot.
Informations de conformité
RoHS compliant per Microchip product page. Industrial/automotive temperature grade (-40C to +125C). Halogen-free status not explicitly confirmed in web data - verify against manufacturer datasheet before halogen-sensitive applications.
