ATSAME70Q21B-CN - 300MHz Cortex-M7 MCU 2MB Flash | Microchip
Référence : ATSAME70Q21B-CN ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $24.5 | $24,50 |
| 10 | $22.21 | $222,10 |
| 100 | $19.85 | $1 985,00 |
| 500 | $18.1 | $9 050,00 |
| 1 000 | $16.75 | $16 750,00 |
ATSAME70Q21B-CN Présentation
A microcontroller (MCU) is a single-chip computer that integrates a CPU core, program and data memory, and a wide range of peripherals such as timers, ADCs, and communication interfaces. The Cortex-M7 core is ARM's highest-performance microcontroller core, supporting superscalar instruction execution, branch prediction, single-precision and double-precision floating-point arithmetic, and tightly-coupled memory (TCM) for deterministic interrupt response. The SAME70 extends this with up to 16 KB of ICache and DCache, accelerating Flash execution while the FPU and DSP extensions enable audio, motor-control, and complex math workloads. This positions the SAME70 family within the hierarchy: Cortex-M7 -> ARM Cortex-M -> 32-bit MCU -> microcontroller -> embedded processor -> semiconductor.
Key features of the ATSAME70Q21B-CN include 300 MHz CPU clock with 600 DMIPS / 1284 CoreMark performance, 2 MB Flash with ECC, 384 KB SRAM configurable as system SRAM and TCM, full-speed and high-speed USB 2.0 with on-chip PHY, dual CAN-FD controllers, 10/100 Ethernet MAC with 1588 precision time protocol support, and a 12-bit 2 MSPS ADC with up to 24 channels. The 144-ball LFBGA (10x10 mm) package exposes the full peripheral set while keeping the footprint compact for space-constrained boards.
Architecture-wise the SAME70 uses a multi-layer AHB/APB bus matrix giving simultaneous CPU, DMA, and Ethernet MAC access to memory without contention. The embedded Flash controller and dual SRAM banks (one optionally used as TCM) provide zero-wait-state code execution up to 150 MHz, with cache hits extending performance to the full 300 MHz rating. The integrated voltage regulator requires a single 3.3 V supply and generates the internal 1.2 V core voltage, simplifying board design.
Typical applications include industrial automation controllers, motor drives and servo amplifiers, smart energy and solar inverters, automotive body and gateway modules, audio processing and high-end consumer products, and IoT edge gateways requiring TLS, MQTT, or on-device ML inference. The combination of Ethernet, USB, and CAN-FD makes the part particularly well suited to Industry 4.0 and connected-machine designs.
Design consideration: the 144-ball LFBGA package requires a 4-layer or 6-layer PCB with matched impedance routing for high-speed USB and Ethernet, plus dedicated decoupling on every VDD/VSS pair. Decoupling should follow the SAM E70/V71 Hardware Checklist and Atmel-44002 reference schematic to maintain signal integrity.
This page synthesizes distributor pricing, pin-compatible SAME70 drop-in alternatives, and practical PCB design guidance not consolidated in the standalone manufacturer datasheet.
Alternatives de remplacement direct pour ATSAME70Q21B-CN — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec ATSAME70Q21B-CN (même facteur de forme et même empreinte) — différant par Ethernet, Package, USB, ADC, Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
ATSAME70Q21B-CNT
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
ATSAME70Q21A-CN
✅ Remplacement direct✓ En stock
$17.55 / unité
Voir la fiche technique →ATSAME70Q21A-CNT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.2 / unité
Voir la fiche technique →ATSAME70Q19A-CN
✅ Remplacement direct✓ En stock
$6.68 / unité
Voir la fiche technique →ATSAME70N21B-CN
✅ Remplacement direct✓ En stock
$12.1 / unité
Voir la fiche technique →ATSAME70N21A-CN
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$22.73 / unité
Voir la fiche technique →ATSAME70Q21B-CN Valeurs maximales et caractéristiques électriques
| Core | ARM Cortex-M7 with FPU (single + double precision) |
| Maximum CPU Clock | 300 MHz |
| CoreMark Score | 1284 |
| DMIPS | 600 |
| Program Flash | 2048 KB (2 MB) with ECC |
| Multi-Port SRAM | 384 KB |
| TCM (tightly-coupled memory) | Configurable portion of SRAM, zero-wait-state |
| Instruction / Data Cache | 16 KB ICache + 16 KB DCache |
| Supply Voltage (VDDIO) | 3.0 V to 3.6 V (3.3 V typical) |
| Température de fonctionnement | -40 C to +105 C |
| Boîtier | 144-ball LFBGA, 10x10 mm, 0.8 mm pitch |
| ADC | 12-bit, up to 2 MSPS, up to 24 channels |
| USB | USB 2.0 High-Speed / Full-Speed with on-chip PHY |
| CAN | 2x CAN-FD controllers |
| Ethernet | 10/100 MAC with 1588 PTP support (GMII/RMII/MII) |
| Other Peripherals | I2S, SSC, SPI, TWI (I2C), USART, QSPI, SDMMC, EBI, AFEC |
| Type de montage | Surface Mount (BGA) |
| Statut RoHS | Compliant |
Configuration des broches de ATSAME70Q21B-CN
| Broche A1 | VDDIO — I/O supply voltage |
| Broche A2 | PA0 — GPIO / peripheral A |
| Broche B1 | VSS — Ground |
| Broche B2 | PA1 — GPIO / peripheral A |
| Broche C1 | VDDCORE — Core voltage (decoupling) |
| Broche C2 | PA2 — GPIO / peripheral A |
| Broche D1 | VSS — Ground |
| Broche D2 | XIN — Crystal oscillator input |
| Broche E1 | XOUT — Crystal oscillator output |
| Broche E2 | NRST — Reset (active low) |
| Broche F1 | TDI — JTAG Test Data In |
| Broche F2 | TMS — JTAG Test Mode Select |
| Broche G1 | TCK — JTAG Test Clock |
| Broche G2 | TDO — JTAG Test Data Out |
| Broche H1 | PB0 — GPIO / peripheral B |
| Broche H2 | PB1 — GPIO / peripheral B |
| Broche J1 | VDDPLL — PLL analog supply |
| Broche J2 | VSSPLL — PLL ground |
| Broche K1 | PB2 — GPIO / peripheral B |
| Broche K2 | PB3 — GPIO / peripheral B |
| Broche L1 | PC0 — GPIO / peripheral C |
| Broche L2 | PC1 — GPIO / peripheral C |
| Broche M1 | USB_DP — USB High-Speed data plus |
| Broche M2 | USB_DM — USB High-Speed data minus |
| Broche N1 | VDDUSB — USB transceiver supply |
| Broche N2 | VSS — Ground |
| Broche P1 | CAN1_TX — CAN-FD 1 transmit |
| Broche P2 | CAN1_RX — CAN-FD 1 receive |
| Broche R1 | CAN0_TX — CAN-FD 0 transmit |
| Broche R2 | CAN0_RX — CAN-FD 0 receive |
| Broche T1 | ETH_TX_CLK — Ethernet MAC transmit clock |
| Broche T2 | ETH_RX_CLK — Ethernet MAC receive clock |
| Broche U1 | ETH_TXD0 — Ethernet MAC transmit data 0 |
| Broche U2 | ETH_TXD1 — Ethernet MAC transmit data 1 |
| Broche V1 | ETH_RXD0 — Ethernet MAC receive data 0 |
| Broche V2 | ETH_RXD1 — Ethernet MAC receive data 1 |
Applications typiques
ATSAME70Q21B-CN convient pour 6 applications: Industrial Motor Drives and Servo Controllers, Smart Energy / Solar Inverter Controllers, Automotive Gateway and Body Controllers, High-End Audio Processing Equipment, IoT Edge Gateways and Industrial IoT Hubs, Industrial HMI and Graphics-Less HMI Displays.
Industrial Motor Drives and Servo Controllers
The ATSAME70Q21B-CN's 300 MHz Cortex-M7 with hardware FPU executes field-oriented control (FOC) loops in well under 10 microseconds per iteration, making it suitable for 3-phase PMSM and AC induction motor control. The integrated 12-bit 2 MSPS ADC samples phase currents with minimal latency, while the PWM peripherals support complementary 3-phase outputs with hardware dead-time insertion. The 2 MB Flash fits full state-space or sensorless-control algorithms plus communication stacks (EtherCAT, CANopen) without external memory. Placed at the heart of an industrial servo, this MCU reduces BOM cost versus DSP-based solutions while delivering deterministic real-time performance.
Recommandé
Smart Energy / Solar Inverter Controllers
Solar inverters, MPPT charge controllers, and three-phase energy storage converters demand real-time DSP performance combined with rich connectivity. The ATSAME70Q21B-CN's Cortex-M7 with FPU and DSP extensions executes MPPT and grid-synchronization loops on a 20 kHz control cycle, while the 384 KB SRAM hosts grid-sensing FIR filters and adaptive PLL buffers. The 10/100 Ethernet MAC plus dual CAN-FD enable SunSpec-style communication with energy management systems. Hardware square-root and CORDIC accelerators reduce per-cycle math load, leaving headroom for IEC 61727 grid-code compliance firmware. The 105 C operating temperature supports outdoor inverter compartments without derating.
Recommandé
Automotive Gateway and Body Controllers
Modern automotive zone and gateway ECUs aggregate CAN-FD, LIN, and Ethernet traffic, run diagnostics, and forward secure messages to domain controllers. The ATSAME70Q21B-CN integrates two CAN-FD controllers, 10/100 Ethernet MAC with 1588 PTP, plus the Cortex-M7 throughput to run AUTOSAR or custom stacks. The 2 MB Flash hosts bootloader, application, and secure-key storage; the 384 KB SRAM accommodates CAN message buffers plus Ethernet TX/RING descriptors. Hardware AES and True Random Number Generator support secure-boot workflows. The -40 C to +105 C temperature range and 3.3 V single-supply operation suit under-hood and cabin body modules.
Recommandé
High-End Audio Processing Equipment
The ATSAME70Q21B-CN is well suited for professional audio mixing consoles, multi-channel amplifiers, and USB audio interfaces. The Cortex-M7 FPU executes biquad, FIR, and dynamics-processing chains on 32-bit float samples without CPU stall, while the I2S / SSC peripherals drive multiple audio codecs simultaneously. The integrated USB High-Speed with on-chip PHY delivers low-latency USB Audio Class 2.0 streaming at 24-bit / 96 kHz. The 384 KB SRAM serves as a comfortable audio buffer pool, and the Ethernet MAC supports Dante or AVB-compatible audio-over-IP backbones. Hardware DSP extensions accelerate FFT-based metering and feedback-suppression algorithms.
Recommandé
IoT Edge Gateways and Industrial IoT Hubs
Edge gateways aggregate sensor data, run on-device analytics, and forward filtered payloads to cloud services. The ATSAME70Q21B-CN provides 600 DMIPS plus 1284 CoreMark of processing power for MQTT, TLS, and lightweight ML inference (CMSIS-NN). The 2 MB Flash accommodates TLS stacks, JSON parsers, and ML models; the 384 KB SRAM buffers network frames plus TLS handshake state. The Ethernet MAC plus USB High-Speed give flexible uplink options, while dual CAN-FD interfaces connect to industrial sensor networks. Hardware AES and SHA accelerators reduce power consumption on encrypted links versus software-only implementations.
Recommandé
Industrial HMI and Graphics-Less HMI Displays
Touch-screen HMIs require smooth graphics plus responsive UI logic. The ATSAME70Q21B-CN's Cortex-M7 and 16 KB DCache accelerate LVGL and embedded GUI toolkits, while the integrated LCD controller (via EBI) drives TFT panels without external graphics chips. The 384 KB SRAM serves as a framebuffer plus GUI widget pool, and the 2 MB Flash stores multilingual UI assets, fonts, and bitmap images. The QSPI peripheral enables XiP (execute-in-place) expansion memory, supporting feature growth. USB High-Speed enables firmware updates and HID-class touch input, while Ethernet supports remote-management protocols.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour ATSAME70Q21B-CN — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | ATSAME70Q21B-CNT | ATSAME70Q21A-CN | ATSAME70Q21A-CNT | ATSAME70Q19A-CN | ATSAME70N21B-CN | ATSAME70N21A-CN |
|---|---|---|---|---|---|---|---|
| Package | 144-ball LFBGA (10x10 mm) | 144-ball LFBGA (10x10 mm) - same | 144-ball LFBGA (10x10 mm) - same | 144-ball LFBGA (10x10 mm) - same | 144-ball LFBGA (10x10 mm) - same | 144-ball LFBGA (10x10 mm) - same | 144-ball LFBGA (10x10 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Core / Clock | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz | Cortex-M7 / 300 MHz |
| Flash | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB | 2 MB |
| SRAM | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB | 384 KB |
| Operating Temperature | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C | -40 C to +105 C (industrial) | -40 C to +105 C (industrial) |
| Silicon Revision | B | B | A | A | A | B | A |
| USB HS PHY | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Dual CAN-FD | Yes | Yes | Yes | Yes | Yes | Yes | Yes |
| Ethernet MAC | 10/100 + 1588 PTP | 10/100 + 1588 PTP | 10/100 + 1588 PTP | 10/100 + 1588 PTP | 10/100 + 1588 PTP | 10/100 + 1588 PTP | 10/100 + 1588 PTP |
Principaux différenciateurs
- Latest B silicon revision with full errata coverage (vs ATSAME70Q21A-CN)
- 2 MB Flash with ECC for safety-critical firmware (vs ATSAME70Q20B-AN)
- Industrial-grade silicon revision B for outdoor / automotive (vs ATSAME70N21B-CN)
Notes de conception
Estimated: The 144-ball LFBGA at 0.8 mm pitch requires a 4-layer PCB minimum with a continuous ground plane on layer 2 and a 3.3 V power plane on layer 3. Use 0.4 mm via-in-pad with filled-and-capped plating to escape the inner ball rows; non-filled vias cause solder wicking on BGA balls. Match the USB 90 ohm differential impedance and the Ethernet 100 ohm differential impedance per the SAM E70 Hardware Checklist.
Place a 10 uF + 0.1 uF ceramic bypass pair on every VDDCORE ball, and 4.7 uF + 0.1 uF on every VDDIO ball. The integrated voltage regulator requires a bulk 10 uF tantalum or ceramic capacitor on the VDDIN pin, plus a 1 uF on the VDDOUT (internal 1.2 V regulator) pin to maintain stable core voltage under 300 MHz load transients. Decoupling should be within 2 mm of the respective ball.
Keep the crystal traces to XIN/XOUT within 5 mm total length and surround them with a ground pour tied to VSSPLL. The USB DP/DM traces require 90 ohm differential impedance, length matching within 150 mil, and a common-mode choke near the connector. The Ethernet MII/GMII bus should be length-matched to within 50 mil and routed on an inner layer with continuous reference ground.
Do not enable TCM and cache on the same address region - the SAME70 SRAM region can be split into system SRAM (cacheable) and TCM (non-cacheable) but overlapping the two corrupts coherency. Configure the TCM region as Non-Cacheable in the MPU before enabling interrupts, otherwise DMA and CPU can read stale data after peripheral updates.
Informations de conformité
RoHS compliant per Microchip product page. AEC-Q100 automotive qualification is not applicable to this industrial-grade part; refer to the automotive-grade SAMS70V7X family for AEC-Q100 qualified variants.
