CY8C20132-LQXI - CapSense Express Microcontroller | Infineon Technologies
Référence : CY8C20132-LQXI ✗ Fin de vie| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
CY8C20132-LQXI Présentation
What is a CapSense Express microcontroller? It is an embedded microcontroller category designed to support capacitive-touch user interfaces together with digital control functions. In the broader hierarchy, a microcontroller is a programmable semiconductor containing a processor core, memory, peripherals, and I/O; a CapSense device adds touch-sensing capabilities intended for buttons, sliders, trackpads, and similar interfaces. This makes the part relevant to human-interface and control designs where touch sensing and embedded logic are consolidated rather than implemented as separate components.
The most reliable package information available from the supplied results is 24-QFN. The exact body dimensions, pin assignments, exposed-pad arrangement, and recommended land pattern were not provided, so those values remain datasheet-dependent. The verified sources identify Infineon Technologies and Cypress Semiconductor Corp. in different distributor records, reflecting the product’s manufacturer and legacy branding history. Firmware compatibility, peripheral availability, memory size, and lifecycle status should be checked against the current manufacturer documentation.
Typical design uses include capacitive touch controls, human-interface modules, industrial panels, consumer controls, and embedded products requiring a compact sensing-and-control solution. The part should not be selected solely from the distributor category label; engineers should verify the required touch channels, scan method, ADC or comparator resources, communication peripherals, memory, and GPIO count in the datasheet. Those missing parameters are especially important when replacing an existing Cypress or PSoC-family design.
For robust implementation, preserve the manufacturer-recommended decoupling, exposed-pad thermal layout, and pin-specific routing guidance. Confirm the exact suffix interpretation before ordering, because the LQXI package and ordering code may encode qualification, temperature, and production options that are not visible in the supplied search results. This page distinguishes verified listing data from specification fields that require manufacturer-documentation confirmation.
Alternatives de remplacement direct pour CY8C20132-LQXI — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
Aucune alternative de remplacement direct disponible pour ce produit.
Demander des alternativesCY8C20132-LQXI Valeurs maximales et caractéristiques électriques
| Device Type | Embedded microcontroller IC |
| Product Designation | CapSense Express |
| Manufacturer | Infineon Technologies |
| Legacy Manufacturer | Cypress Semiconductor Corp. |
| Boîtier | 24-QFN |
| Type de montage | Surface Mount |
Guide de configuration des broches du CY8C20132-LQXI 24-qfn
Configuration des broches du CY8C20132-LQXI (boîtier 24-qfn). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour CY8C20132-LQXI.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
CY8C20132-LQXI convient pour 6 applications: Capacitive Touch Control Panel, Industrial Human-Interface Module, Consumer Appliance Touch Interface, Embedded Touch-and-Control Module, Low-Power Sensor Node, Programmable User Interface.
Capacitive Touch Control Panel
CY8C20132-LQXI is associated with the CapSense Express category, making it a candidate for compact capacitive-touch interfaces. The verified data does not state the number of sensing channels, electrode drive method, or acquisition performance, so those details must be confirmed before layout. Design the PCB with short, controlled sensor traces, adequate grounding, and the manufacturer-recommended shield and guard techniques. Firmware should be tested with the intended electrode geometry, connector arrangement, humidity, and noise environment.
Recommandé
Industrial Human-Interface Module
A CapSense Express microcontroller can fit an industrial HMI when a product combines touch input, local control, and embedded decision logic. CY8C20132-LQXI’s verified 24-QFN package is useful for space-constrained board layouts, but the supplied records do not confirm operating temperature, communication peripherals, or digital I/O count. Validate those requirements against the manufacturer datasheet and apply the specified decoupling and exposed-pad thermal layout. Consider industrial EMC, ESD, and long-cable sensor-node requirements during system qualification.
Recommandé
Consumer Appliance Touch Interface
The target’s CapSense Express positioning makes it relevant to appliance controls, feature buttons, and compact user interfaces. The verified evidence does not provide the touch-channel count or control-performance limits, so engineers should size the sensor array only after reviewing the datasheet. Use the specified sensor grounding and filtering arrangement to preserve sensing stability, and verify the controller’s available I/O for LEDs, relays, displays, and safety-related signals. Firmware validation should cover wet-finger, object-proximity, and power-transient conditions.
Recommandé
Embedded Touch-and-Control Module
CY8C20132-LQXI can be evaluated for compact products that combine a capacitive interface with local control logic. Because the verified records identify the category and package but not the CPU core, memory, or peripheral list, system partitioning cannot be finalized from distributor data alone. Confirm whether the required control functions, communication links, and firmware update method are supported. Keep the sensor section physically separated from noisy switching and high-current paths, and follow the manufacturer’s recommended power and grounding arrangement.
Recommandé
Low-Power Sensor Node
A capacitive-sensing microcontroller may be considered for a small sensor node that needs touch input, local thresholding, and control output. The supplied data does not provide sleep current, active current, ADC resources, or wake-up timing for CY8C20132-LQXI. Those values are essential for battery-life calculations and must be obtained from the manufacturer datasheet. Prototype the sensor electrode, compare measured baseline drift with the specified limits, and verify that the selected package and thermal design meet the product’s environmental requirements.
Recommandé
Programmable User Interface
The device can be considered for programmable touch controls where a fixed mechanical switch is replaced by capacitive sensing. The verified data confirms the CapSense Express identity but does not specify debouncing, scanning, gesture, or noise-immunity parameters. Confirm the supported sensing resources and define calibration flow before committing to a production user experience. PCB sensor traces should be routed according to the datasheet, and mechanical enclosure materials, coatings, and grounding should be included in validation because they affect capacitive coupling and sensitivity.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour CY8C20132-LQXI — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit |
|---|---|
| Package | 24-QFN |
| Brand | Infineon Technologies |
| Device Type | Embedded microcontroller IC |
| Product Designation | CapSense Express |
Principaux différenciateurs
- CapSense Express product identity (vs CY8C20224-12LKXI)
- Verified package family (vs CY8C20224-12LKXI)
- Manufacturer ecosystem (vs CY8C20224-12LKXI)
Notes de conception
Use the manufacturer’s exact 24-QFN pin assignment and land pattern when routing the PCB. The supplied data confirms the package family but does not provide body dimensions, pin numbering, or exposed-pad details, so these values must come from the official package drawing. Keep sensor traces short and isolated from switching nodes, and provide a continuous ground reference where the capacitive-sensing implementation requires it.
Confirm the device’s operating voltage, decoupling requirements, and exposed-pad connection from the manufacturer datasheet before power-up. Do not infer the voltage rail or capacitor values from the distributor listing. Validate startup sequencing, supply ripple, and current limits with the intended sensor and communication peripherals, because those functions were not specified in the supplied verified records.
A similar CapSense or microcontroller name is not proof of replacement compatibility. Verify pin mapping, package dimensions, memory, capacitive-sensing resources, voltage, clocking, and peripheral functions before changing the MPN. The supplied cross-reference results identify CY8C20224-12LKXI as a comparison item but do not establish a drop-in relationship.
Informations de conformité
The supplied distributor results do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Confirm current compliance and qualification documents with Infineon Technologies.
