CY8C20132-LQXI - CapSense Express Microcontroller | Infineon Technologies
MPN: CY8C20132-LQXI ✗ End of Life| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $0 | $0.00 |
| 10 | $0 | $0.00 |
| 100 | $0 | $0.00 |
| 500 | $0 | $0.00 |
| 1,000 | $0 | $0.00 |
CY8C20132-LQXI Overview
What is a CapSense Express microcontroller? It is an embedded microcontroller category designed to support capacitive-touch user interfaces together with digital control functions. In the broader hierarchy, a microcontroller is a programmable semiconductor containing a processor core, memory, peripherals, and I/O; a CapSense device adds touch-sensing capabilities intended for buttons, sliders, trackpads, and similar interfaces. This makes the part relevant to human-interface and control designs where touch sensing and embedded logic are consolidated rather than implemented as separate components.
The most reliable package information available from the supplied results is 24-QFN. The exact body dimensions, pin assignments, exposed-pad arrangement, and recommended land pattern were not provided, so those values remain datasheet-dependent. The verified sources identify Infineon Technologies and Cypress Semiconductor Corp. in different distributor records, reflecting the product’s manufacturer and legacy branding history. Firmware compatibility, peripheral availability, memory size, and lifecycle status should be checked against the current manufacturer documentation.
Typical design uses include capacitive touch controls, human-interface modules, industrial panels, consumer controls, and embedded products requiring a compact sensing-and-control solution. The part should not be selected solely from the distributor category label; engineers should verify the required touch channels, scan method, ADC or comparator resources, communication peripherals, memory, and GPIO count in the datasheet. Those missing parameters are especially important when replacing an existing Cypress or PSoC-family design.
For robust implementation, preserve the manufacturer-recommended decoupling, exposed-pad thermal layout, and pin-specific routing guidance. Confirm the exact suffix interpretation before ordering, because the LQXI package and ordering code may encode qualification, temperature, and production options that are not visible in the supplied search results. This page distinguishes verified listing data from specification fields that require manufacturer-documentation confirmation.
Drop-in alternatives for CY8C20132-LQXI — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
No drop-in alternatives available for this product.
Request AlternativesCY8C20132-LQXI Maximum Ratings & Electrical Characteristics
| Device Type | Embedded microcontroller IC |
| Product Designation | CapSense Express |
| Manufacturer | Infineon Technologies |
| Legacy Manufacturer | Cypress Semiconductor Corp. |
| Package | 24-QFN |
| Mounting Type | Surface Mount |
CY8C20132-LQXI 24-qfn Pin Configuration Guide
Pin configuration for CY8C20132-LQXI (24-qfn package). This digital IC includes GPIO, communication interfaces (UART, SPI, I2C), and power pins. Refer to the manufacturer datasheet for alternate pin functions and configuration options. Essential for embedded system design and PCB layout.
No detailed pinout data available for CY8C20132-LQXI.
Refer to the datasheet for full pin configuration.
Typical Applications
CY8C20132-LQXI is suitable for 6 applications: Capacitive Touch Control Panel, Industrial Human-Interface Module, Consumer Appliance Touch Interface, Embedded Touch-and-Control Module, Low-Power Sensor Node, Programmable User Interface.
Capacitive Touch Control Panel
CY8C20132-LQXI is associated with the CapSense Express category, making it a candidate for compact capacitive-touch interfaces. The verified data does not state the number of sensing channels, electrode drive method, or acquisition performance, so those details must be confirmed before layout. Design the PCB with short, controlled sensor traces, adequate grounding, and the manufacturer-recommended shield and guard techniques. Firmware should be tested with the intended electrode geometry, connector arrangement, humidity, and noise environment.
Recommended
Industrial Human-Interface Module
A CapSense Express microcontroller can fit an industrial HMI when a product combines touch input, local control, and embedded decision logic. CY8C20132-LQXI’s verified 24-QFN package is useful for space-constrained board layouts, but the supplied records do not confirm operating temperature, communication peripherals, or digital I/O count. Validate those requirements against the manufacturer datasheet and apply the specified decoupling and exposed-pad thermal layout. Consider industrial EMC, ESD, and long-cable sensor-node requirements during system qualification.
Recommended
Consumer Appliance Touch Interface
The target’s CapSense Express positioning makes it relevant to appliance controls, feature buttons, and compact user interfaces. The verified evidence does not provide the touch-channel count or control-performance limits, so engineers should size the sensor array only after reviewing the datasheet. Use the specified sensor grounding and filtering arrangement to preserve sensing stability, and verify the controller’s available I/O for LEDs, relays, displays, and safety-related signals. Firmware validation should cover wet-finger, object-proximity, and power-transient conditions.
Recommended
Embedded Touch-and-Control Module
CY8C20132-LQXI can be evaluated for compact products that combine a capacitive interface with local control logic. Because the verified records identify the category and package but not the CPU core, memory, or peripheral list, system partitioning cannot be finalized from distributor data alone. Confirm whether the required control functions, communication links, and firmware update method are supported. Keep the sensor section physically separated from noisy switching and high-current paths, and follow the manufacturer’s recommended power and grounding arrangement.
Recommended
Low-Power Sensor Node
A capacitive-sensing microcontroller may be considered for a small sensor node that needs touch input, local thresholding, and control output. The supplied data does not provide sleep current, active current, ADC resources, or wake-up timing for CY8C20132-LQXI. Those values are essential for battery-life calculations and must be obtained from the manufacturer datasheet. Prototype the sensor electrode, compare measured baseline drift with the specified limits, and verify that the selected package and thermal design meet the product’s environmental requirements.
Recommended
Programmable User Interface
The device can be considered for programmable touch controls where a fixed mechanical switch is replaced by capacitive sensing. The verified data confirms the CapSense Express identity but does not specify debouncing, scanning, gesture, or noise-immunity parameters. Confirm the supported sensing resources and define calibration flow before committing to a production user experience. PCB sensor traces should be routed according to the datasheet, and mechanical enclosure materials, coatings, and grounding should be included in validation because they affect capacitive coupling and sensitivity.
Recommended
Recommended Products Summary
Engineering reference data for CY8C20132-LQXI — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product |
|---|---|
| Package | 24-QFN |
| Brand | Infineon Technologies |
| Device Type | Embedded microcontroller IC |
| Product Designation | CapSense Express |
Key Differentiators
- CapSense Express product identity (vs CY8C20224-12LKXI)
- Verified package family (vs CY8C20224-12LKXI)
- Manufacturer ecosystem (vs CY8C20224-12LKXI)
Design Notes
Use the manufacturer’s exact 24-QFN pin assignment and land pattern when routing the PCB. The supplied data confirms the package family but does not provide body dimensions, pin numbering, or exposed-pad details, so these values must come from the official package drawing. Keep sensor traces short and isolated from switching nodes, and provide a continuous ground reference where the capacitive-sensing implementation requires it.
Confirm the device’s operating voltage, decoupling requirements, and exposed-pad connection from the manufacturer datasheet before power-up. Do not infer the voltage rail or capacitor values from the distributor listing. Validate startup sequencing, supply ripple, and current limits with the intended sensor and communication peripherals, because those functions were not specified in the supplied verified records.
A similar CapSense or microcontroller name is not proof of replacement compatibility. Verify pin mapping, package dimensions, memory, capacitive-sensing resources, voltage, clocking, and peripheral functions before changing the MPN. The supplied cross-reference results identify CY8C20224-12LKXI as a comparison item but do not establish a drop-in relationship.
Compliance Information
The supplied distributor results do not provide verified RoHS, REACH, AEC-Q100, lead-free, halogen-free, or conflict-minerals statements. Confirm current compliance and qualification documents with Infineon Technologies.
