DSPB56364AF100 - 24-bit Audio DSP, 100MHz, 100-LQFP | NXP
Référence : DSPB56364AF100 ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $10.65 | $10,65 |
| 10 | $10.22 | $102,20 |
| 100 | $9.59 | $959,00 |
| 500 | $8.95 | $4 475,00 |
| 1 000 | $8.32 | $8 320,00 |
DSPB56364AF100 Présentation
An audio DSP is a specialized microprocessor that performs mathematical operations on digitized audio signals in real time. Audio DSPs sit in a hierarchy of audio processing ICs, bridging general-purpose DSPs and application-specific audio SoCs. The DSP56364 supports decoding of multi-channel audio algorithms used in A/V receivers, televisions, and automotive head units.
Key features include 100 MHz core clock, 24-bit fixed-point data width, an on-chip enhanced filter coprocessor (EFCO) for sample-rate conversion, six DMA channels, and integrated memory suitable for program and data storage. The 100-LQFP (14x14 mm) footprint gives a generous thermal pad and easy PCB routing for audio boards that mix analog and digital sections.
The DSP56364 uses a single-issue, three-stage pipeline Harvard architecture with dual memory buses and an internal address generation unit that supports modulo, reverse-carry, and bit-reversed addressing for FFT kernels. The on-chip Phase-Locked Loop (PLL) multiplies the external clock to the 100 MHz internal rate, and the enhanced filter coprocessor accelerates MAC-intensive kernels such as Dolby Pro Logic decode, MP3/AAC playback, and acoustic echo cancellation.
Typical applications include Dolby Pro Logic A/V receivers, television and mini-system audio decoding, automotive head-unit audio processing, portable audio docks, and effects processors. The combination of EFCO hardware acceleration and on-chip memory makes the DSP56364 a drop-in DSP engine for cost-driven consumer products that need 24-bit processing headroom.
When designing with this device, allocate the PCB top layer for clean analog supplies because the LQFP package does not provide a dedicated thermal/ground slug. Place a 0.1 uF decoupling cap on each adjacent VCC/VDD pair, and keep the crystal trace shorter than 10 mm to meet the 100 MHz timing margin.
This page synthesizes distributor pricing, drop-in same-family alternatives, and practical audio-board design notes that supplement the manufacturer datasheet.
Alternatives de remplacement direct pour DSPB56364AF100 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPB56364AF100 (même facteur de forme et même empreinte) — différant par Package, Core Clock Frequency, Data Bus Width, Audio Interfaces, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPB56374AF180
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPB56362AG120
✅ Remplacement direct✓ En stock
$17.9 / unité
Voir la fiche technique →DSPB56303AG100
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPB56321AF180
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPB56371AF150
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$13.9 / unité
Voir la fiche technique →DSPB56364AF100 Spécifications
| Part Number | DSPB56364AF100 |
| Manufacturer | NXP Semiconductors |
| Part Family | DSP56300 family (DSP56364) |
| Product Type | Audio Digital Signal Processor (DSP) |
| Core Architecture | 24-bit fixed-point Harvard, single-issue 3-stage pipeline |
| Largeur du bus de données | 24 bit |
| Program Memory Width | 24 bit |
| Core Clock Frequency | 100 MHz |
| On-chip Memory | Program and data RAM/ROM (per datasheet) |
| DMA Channels | 6 |
| Coprocessors | Enhanced Filter Coprocessor (EFCO) |
| Boîtier | 100-LQFP (14x14 mm) |
| Type de montage | Surface Mount |
| Lead Finish | Pb-Free |
| Target Applications | Dolby Pro Logic A/V receivers, TV/mini-system audio, automotive audio, portable audio |
| Instruction Set | DSP56000/DSP56300 family ISA |
| Addressing Modes | Modulo, reverse-carry, bit-reversed (for FFT) |
Configuration des broches de DSPB56364AF100
| Broche 1 | [DATA_NEEDED: pin 1 function] — Per the datasheet pinout table - consult the manufacturer datasheet for the exact function assigned to physical pin 1 of the 100-LQFP |
| Broche 2 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 3 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 4 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 5 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 6 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 7 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 8 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 9 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 10 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 11 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 12 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 13 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 14 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 15 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 16 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 17 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 18 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 19 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 20 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 21 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 22 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 23 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 24 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 25 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 26 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 27 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 28 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 29 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 30 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 31 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 32 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 33 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 34 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 35 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 36 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 37 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 38 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 39 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 40 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 41 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 42 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 43 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 44 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 45 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 46 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 47 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 48 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 49 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 50 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 51 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 52 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 53 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 54 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 55 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 56 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 57 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 58 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 59 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 60 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 61 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 62 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 63 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 64 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 65 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 66 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 67 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 68 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 69 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 70 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 71 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 72 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 73 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 74 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 75 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 76 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 77 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 78 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 79 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 80 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 81 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 82 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 83 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 84 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 85 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 86 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 87 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 88 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 89 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 90 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 91 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 92 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 93 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 94 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 95 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 96 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 97 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 98 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 99 | [DATA_NEEDED] — Per the datasheet pinout table |
| Broche 100 | [DATA_NEEDED] — Per the datasheet pinout table |
Applications typiques
DSPB56364AF100 convient pour 6 applications: Dolby Pro Logic A/V Receiver, Television and Mini-System Audio Decoding, Automotive Head-Unit Audio Processing, Portable Audio Dock, Effects Processor / Karaoke Mixer, Industrial Audio Annunciator.
Dolby Pro Logic A/V Receiver
The DSPB56364AF100 is a strong fit for Dolby Pro Logic decoding in mid-range A/V receivers. Its 100 MHz 24-bit core runs the Pro Logic matrix and surround delays in real time, while the on-chip Enhanced Filter Coprocessor (EFCO) offloads the heavy MAC work for bass management and crossover filters. The 100-LQFP (14x14 mm) gives clean routing for a multi-channel DAC array. Compared with a software-only MCU solution, the DSP56364 sustains 5.1-channel decode with margin for room-correction or virtualization. Placed between the HDMI audio output and the multi-channel DAC, it accepts an I2S/TDM input and produces a synchronized multi-channel output stream. Trade-off: at 100 MHz it has less headroom than the 120 MHz DSP56362 variant, so it is best for Pro Logic rather than full Dolby Digital/Plus.
Recommandé
Television and Mini-System Audio Decoding
The DSPB56364AF100 decodes compressed and surround audio in cost-sensitive TV and mini-system chassis. Its on-chip program/data memory holds the codecs without external DRAM, and the 6 DMA channels feed decoded audio buffers to the DAC at low CPU overhead. The 100-LQFP package sits on a single-layer or two-layer main board next to the audio DAC, keeping BOM cost low. Engineers commonly pair it with an HDMI receiver or DSP front-end and let the EFCO handle bass management. Performance benefit versus a general-purpose DSP at the same MHz is the dedicated hardware multiply-accumulate path, which sustains more filter taps per second. The 100 MHz clock is the right balance for 2-channel or Pro Logic workloads without overprovisioning.
Recommandé
Automotive Head-Unit Audio Processing
The DSPB56364AF100 is well-matched to entry-level automotive head units that need 24-bit audio processing with AEC-Q100-style robustness. Its 24-bit data path preserves SNR through the noisy automotive power environment, and the 6 DMA channels service multiple audio sources (radio, Bluetooth, USB, AUX) simultaneously. The 100-LQFP package offers wide, robust gull-wing leads that survive automotive thermal cycling better than fine-pitch BGAs. In the head-unit signal chain the DSP56364 runs ANC, time alignment, and EQ in parallel with codec playback. Compared with the older DSPB56321, the 56364 adds EFCO hardware for sample-rate conversion that simplifies the asynchronous-sample-rate handling common in automotive audio. The limitation is operating-temperature grade - verify the specific 'AF' suffix range in the datasheet before deploying above +85C ambient.
Recommandé
Portable Audio Dock
The DSPB56364AF100 enables cost-effective portable audio docks that decode Bluetooth audio and apply DSP enhancement. Its on-chip memory lets the dock decode AAC/SBC and run graphic EQ without external SRAM, lowering BOM count. The 100-LQFP with the integrated PLL multiplies a low-cost 10 MHz crystal to the 100 MHz internal rate, saving the BOM cost of a high-frequency crystal. In a portable dock the DSP56364 sits between the BT module's I2S output and the speaker amplifier. Performance benefit versus a microcontroller-only design is dedicated hardware MAC throughput, which sustains more EQ bands at lower MHz and battery current. The trade-off is the larger LQFP footprint versus tiny QFN audio SoCs, so it suits dock-style products more than in-ear wearables.
Recommandé
Effects Processor / Karaoke Mixer
The DSPB56364AF100 is a natural fit for karaoke mixers and effects units that need real-time reverb, echo, and pitch-shift on multiple voice channels. The EFCO accelerates FIR/IIR taps for reverb tails, leaving the CPU free to mix microphone inputs with backing tracks. The 6 DMA channels let the engineer overlap mic ADC reads and DAC outputs without glitching. In a mixer the DSP56364 sits after the mic preamps and ahead of the line-level output stage. Performance benefit versus a software-only MCU implementation is sustained tap density - reverb algorithms that would starve a Cortex-M at 100 MHz run with margin on the DSP56364. The 100-LQFP package exposes all four edges for easy hand-prototyping and rework, useful in boutique music gear.
Recommandé
Industrial Audio Annunciator
The DSPB56364AF100 services industrial annunciator and paging systems that decode compressed audio prompts and apply loudness compensation. Its 24-bit fixed-point math preserves headroom in paging announcements that may chain multiple compressors, and the EFCO handles the multiband limiter in hardware. The wide 100-LQFP body handles the higher ambient temperatures of industrial enclosures. In the signal chain the DSP56364 receives prompt audio from a network or storage controller and outputs a level-matched signal to the amplifier. The benefit over a software MCU is deterministic audio latency, important for synchronized paging. The limitation is no extended-temperature grade in the captured snippet - confirm the 'A' suffix qualification before deploying in -40C to +85C industrial environments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPB56364AF100 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPB56374AF180 | DSPB56362AG120 | DSPB56303AG100 | DSPB56321AF180 | DSPB56371AF150 |
|---|---|---|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 100-LQFP (14x14 mm) | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same | 100-LQFP (14x14 mm) - same |
| Core Clock Frequency | 100 MHz | 180 MHz | 120 MHz | 100 MHz | 180 MHz | 150 MHz |
| Data Bus Width | 24 bit | 24 bit | 24 bit | 24 bit | 24 bit | 24 bit |
| Core Architecture | DSP56300 Harvard 3-stage | DSP56300 Harvard 3-stage | DSP56300 Harvard 3-stage | DSP56300 Harvard 3-stage | DSP56300 Harvard 3-stage | DSP56300 Harvard 3-stage |
| Lead Finish | Pb-Free | Pb-Free | Pb-Free (R2: tape & reel) | Pb-Free | Pb-Free | Pb-Free |
Principaux différenciateurs
- EFCO hardware filter coprocessor (vs General-purpose DSP at the same MHz)
- Six independent DMA channels (vs DSPB56303AG100 (fewer DMA channels))
- 100-LQFP package with robust gull-wing leads (vs Fine-pitch BGA audio SoCs)
- On-chip program and data memory sized for audio codecs (vs DSPs requiring external SRAM/Flash)
Notes de conception
Place a 0.1 uF decoupling capacitor on every adjacent VDD/VSS pair within 5 mm of the LQFP pads. The 100-LQFP exposes power and ground around all four edges, so build a four-layer PCB with a dedicated ground plane to keep the address and data buses impedance-controlled. Estimated: with the DSP56364 averaging 150-200 mA internal current at 100 MHz with all peripherals active, a four-layer 1 oz copper ground plane is sufficient for thermal dissipation in a 60C ambient without additional heatsinking.
Keep the external crystal or clock-oscillator trace shorter than 10 mm, and route the EXTAL and XTAL pair with matched length to within 2 mm. The on-chip PLL multiplies this reference up to 100 MHz, so any skew shows up directly as jitter on the audio clocks derived from the DSP. Guard the crystal traces with grounded copper pour on both sides of the PCB and avoid routing any digital signals across the crystal area.
Do not assume the 'AF' suffix automatically qualifies the part for the full automotive -40C to +125C range - confirm the exact A vs AF operating temperature band in the manufacturer datasheet before deploying in automotive applications. Also note that migrating to the DSPB56362 (120 MHz) requires verifying the PLL configuration registers in the boot code, since the higher core frequency changes the wait-state programming for external memory.
Estimated: at 100 MHz with all DMA channels active and EFCO running a 512-tap FIR, internal core current approaches 200 mA on the 1.8 V rail (typical) and external I/O draws an additional 30-50 mA on the 3.3 V rail. Star-route the two rails from a single LDO pair with at least 100 uF bulk capacitance at the regulator output. Avoid sharing the digital 3.3 V rail with the audio DAC's analog 3.3 V to keep digital switching noise out of the analog path.
The 100-LQFP package has roughly 0.5 nH lead inductance per pin, which is acceptable for 100 MHz core operation but limits edge rates above 50 MHz on the external memory bus. Add 33 ohm series termination on the address and data buses that fan out to external SRAM/Flash. The Alldatasheet listing references an IBIS model in the manufacturer's design package - use it for SI simulation before committing to a layout.
Informations de conformité
Per the NXP product page the DSPB56364AF100 ships as a Pb-Free (lead-free) part. Specific RoHS, REACH, halogen-free, and conflict-minerals declarations were not explicitly returned in the verified web snippets and are marked unknown - confirm on the manufacturer's datasheet or compliance certificate before volume procurement.
