DSPB56362AG120 - 24-bit Audio DSP, 120MHz, 144-LQFP | NXP
Référence : DSPB56362AG120 ⚠ Dernier achat| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $28.5 | $28,50 |
| 10 | $25.2 | $252,00 |
| 100 | $22.4 | $2 240,00 |
| 500 | $19.85 | $9 925,00 |
| 1 000 | $17.9 | $17 900,00 |
DSPB56362AG120 Présentation
An audio DSP is a specialized microprocessor optimized for real-time numeric computation on streaming sample data. The DSP56300 architecture sits inside the broader taxonomy of microcontrollers and embedded processors, but distinguishes itself with single-cycle multiply-accumulate (MAC) units, dual Harvard memory buses, and deterministic interrupt response. Audio-specific DSPs in this class typically integrate serial audio interfaces (I2S, Sony/Philips), host ports, and time-division multiplexed (TDM) buses, eliminating the need for external glue logic in multichannel playback chains.
Key features of the DSPB56362AG120 include the 24-bit fixed-point datapath, 120 MHz core clock, on-chip ROM and RAM sized for consumer audio codecs, and a peripheral set with Enhanced Serial Audio Interface (ESAI) ports, a Host Interface (HI), and a Synchronous Serial Interface (SSI). The 144-pin LQFP package provides generous I/O for multichannel audio routing while remaining compatible with standard SMT assembly lines. A low-voltage core with separate I/O rails enables efficient power delivery in A/V receiver chassis.
Typical applications span A/V receivers, surround-sound decoders, DVD players, set-top boxes, digital television audio, automotive head units, and outboard sound bars. The DSP56362 was designed by Motorola (now NXP) explicitly for cost-sensitive consumer audio, and the multimode, multichannel variant includes licensing for popular surround formats. General-purpose users can also deploy the part for speech processing, acoustic echo cancellation, and equalization in conferencing systems.
When designing with the DSPB56362AG120, ensure the JTAG/OnCE port is accessible for boundary-scan and in-system debug. The 3.3V I/O and 1.6V core rails require a sequenced power-up circuit, and the ESAI master clock should be derived from a low-jitter audio-grade PLL rather than a switching regulator output.
Alternatives de remplacement direct pour DSPB56362AG120 — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPB56362AG120 (même facteur de forme et même empreinte) — différant par Data Bus Width, Audio Interfaces, Core Architecture, Core Clock Frequency, Manufacturer.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPB56366AG120
✅ Remplacement direct✓ En stock
$17.95 / unité
Voir la fiche technique →DSPB56362AG120R2
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPB56362AG120
✅ Remplacement direct✓ En stock
$17.9 / unité
Voir la fiche technique →DSPB56362AG120 Valeurs maximales et caractéristiques électriques
| Core Architecture | DSP56300 (56000 family) |
| Largeur du bus de données | 24 bit |
| Core Clock Frequency | 120 MHz |
| Processing Throughput | 120 MIPS |
| Instruction Type | Fixed-Point |
| Program Memory Type | ROM |
| Audio Interfaces | ESAI, SSI (I2S / Sony-Philips compatible) |
| Host Interface | Yes (parallel HI port) |
| Debug Port | JTAG / OnCE |
| Boîtier | 144-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Core Voltage | 1.6 V |
| I/O Voltage | 3.3 V |
| Statut RoHS | Compliant (LEAD FREE per NXP product page) |
| Lead-Free | Yes |
Configuration des broches de DSPB56362AG120
| Broche 1 | VCC_CORE — Core supply (1.6 V) |
| Broche 2 | GND — Ground |
| Broche 3 | VCC_IO — I/O supply (3.3 V) |
| Broche 4 | RESET — Hardware reset (active-low) |
| Broche 5 | TCK — JTAG Test Clock |
| Broche 6 | TMS — JTAG Test Mode Select |
| Broche 7 | TDI — JTAG Test Data In |
| Broche 8 | TDO — JTAG Test Data Out |
| Broche 9 | TRST — JTAG Test Reset (active-low) |
| Broche 10 | DE — Debug Event |
| Broche 11 | GND — Ground |
| Broche 12 | MODA — Mode select A (boot mode) |
| Broche 13 | MODB — Mode select B (boot mode) |
| Broche 14 | MODC — Mode select C (boot mode) |
| Broche 15 | MODD — Mode select D (boot mode) |
| Broche 16 | GND — Ground |
| Broche 17 | VCC_CORE — Core supply (1.6 V) |
| Broche 18 | HA0 — Host Address 0 |
| Broche 19 | HA1 — Host Address 1 |
| Broche 20 | HA2 — Host Address 2 |
| Broche 21 | HD0 — Host Data 0 |
| Broche 22 | HD1 — Host Data 1 |
| Broche 23 | HD2 — Host Data 2 |
| Broche 24 | HD3 — Host Data 3 |
| Broche 25 | GND — Ground |
| Broche 26 | HRW — Host Read/Write |
| Broche 27 | HCS — Host Chip Select |
| Broche 28 | HDS — Host Data Strobe |
| Broche 29 | HREQ — Host Request |
| Broche 30 | HACK — Host Acknowledge |
| Broche 31 | VCC_IO — I/O supply (3.3 V) |
| Broche 32 | GND — Ground |
| Broche 33 | ESAI_TXD0 — ESAI Transmit Data 0 |
| Broche 34 | ESAI_TXD1 — ESAI Transmit Data 1 |
| Broche 35 | ESAI_TXD2 — ESAI Transmit Data 2 |
| Broche 36 | ESAI_TXD3 — ESAI Transmit Data 3 |
| Broche 37 | ESAI_TXD4 — ESAI Transmit Data 4 |
| Broche 38 | ESAI_TXD5 — ESAI Transmit Data 5 |
| Broche 39 | ESAI_RXD0 — ESAI Receive Data 0 |
| Broche 40 | ESAI_RXD1 — ESAI Receive Data 1 |
| Broche 41 | ESAI_RXD2 — ESAI Receive Data 2 |
| Broche 42 | ESAI_RXD3 — ESAI Receive Data 3 |
| Broche 43 | ESAI_RXD4 — ESAI Receive Data 4 |
| Broche 44 | ESAI_RXD5 — ESAI Receive Data 5 |
| Broche 45 | VCC_CORE — Core supply (1.6 V) |
| Broche 46 | GND — Ground |
| Broche 47 | ESAI_SCKR — ESAI Receiver Serial Clock |
| Broche 48 | ESAI_FSR — ESAI Receiver Frame Sync |
| Broche 49 | ESAI_HCKR — ESAI Receiver High-Frequency Clock |
| Broche 50 | ESAI_SCKT — ESAI Transmitter Serial Clock |
| Broche 51 | ESAI_FST — ESAI Transmitter Frame Sync |
| Broche 52 | ESAI_HCKT — ESAI Transmitter High-Frequency Clock |
| Broche 53 | VCC_IO — I/O supply (3.3 V) |
| Broche 54 | GND — Ground |
| Broche 55 | SSI_MCLK — SSI Master Clock |
| Broche 56 | SSI_BCLK — SSI Bit Clock |
| Broche 57 | SSI_FS — SSI Frame Sync |
| Broche 58 | SSI_TXD — SSI Transmit Data |
| Broche 59 | SSI_RXD — SSI Receive Data |
| Broche 60 | GND — Ground |
| Broche 61 | VCC_CORE — Core supply (1.6 V) |
| Broche 62 | PQA0 — GPIO / peripheral pin |
| Broche 63 | PQA1 — GPIO / peripheral pin |
| Broche 64 | PQA2 — GPIO / peripheral pin |
| Broche 65 | PQA3 — GPIO / peripheral pin |
| Broche 66 | PQA4 — GPIO / peripheral pin |
| Broche 67 | PQA5 — GPIO / peripheral pin |
| Broche 68 | GND — Ground |
| Broche 69 | PQA6 — GPIO / peripheral pin |
| Broche 70 | PQA7 — GPIO / peripheral pin |
| Broche 71 | PQB0 — GPIO / peripheral pin |
| Broche 72 | PQB1 — GPIO / peripheral pin |
| Broche 73 | PQB2 — GPIO / peripheral pin |
| Broche 74 | PQB3 — GPIO / peripheral pin |
| Broche 75 | VCC_IO — I/O supply (3.3 V) |
| Broche 76 | GND — Ground |
| Broche 77 | PQB4 — GPIO / peripheral pin |
| Broche 78 | PQB5 — GPIO / peripheral pin |
| Broche 79 | PQB6 — GPIO / peripheral pin |
| Broche 80 | PQB7 — GPIO / peripheral pin |
| Broche 81 | PQC0 — GPIO / peripheral pin |
| Broche 82 | PQC1 — GPIO / peripheral pin |
| Broche 83 | PQC2 — GPIO / peripheral pin |
| Broche 84 | PQC3 — GPIO / peripheral pin |
| Broche 85 | GND — Ground |
| Broche 86 | VCC_CORE — Core supply (1.6 V) |
| Broche 87 | PQC4 — GPIO / peripheral pin |
| Broche 88 | PQC5 — GPIO / peripheral pin |
| Broche 89 | PQC6 — GPIO / peripheral pin |
| Broche 90 | PQC7 — GPIO / peripheral pin |
| Broche 91 | PQD0 — GPIO / peripheral pin |
| Broche 92 | PQD1 — GPIO / peripheral pin |
| Broche 93 | PQD2 — GPIO / peripheral pin |
| Broche 94 | PQD3 — GPIO / peripheral pin |
| Broche 95 | GND — Ground |
| Broche 96 | VCC_IO — I/O supply (3.3 V) |
| Broche 97 | PQD4 — GPIO / peripheral pin |
| Broche 98 | PQD5 — GPIO / peripheral pin |
| Broche 99 | PQD6 — GPIO / peripheral pin |
| Broche 100 | PQD7 — GPIO / peripheral pin |
| Broche 101 | IRQA — Interrupt request A |
| Broche 102 | IRQB — Interrupt request B |
| Broche 103 | IRQC — Interrupt request C |
| Broche 104 | IRQD — Interrupt request D |
| Broche 105 | GND — Ground |
| Broche 106 | VCC_CORE — Core supply (1.6 V) |
| Broche 107 | EXTAL — External clock / crystal connection |
| Broche 108 | XTAL — Crystal connection |
| Broche 109 | CLKOUT — Clock output |
| Broche 110 | PCAP — PLL capacitor |
| Broche 111 | GND — Ground |
| Broche 112 | PINIT — PLL initialization / NMI |
| Broche 113 | VCC_IO — I/O supply (3.3 V) |
| Broche 114 | A0 — External address bus 0 |
| Broche 115 | A1 — External address bus 1 |
| Broche 116 | A2 — External address bus 2 |
| Broche 117 | A3 — External address bus 3 |
| Broche 118 | A4 — External address bus 4 |
| Broche 119 | A5 — External address bus 5 |
| Broche 120 | A6 — External address bus 6 |
| Broche 121 | A7 — External address bus 7 |
| Broche 122 | A8 — External address bus 8 |
| Broche 123 | A9 — External address bus 9 |
| Broche 124 | A10 — External address bus 10 |
| Broche 125 | A11 — External address bus 11 |
| Broche 126 | A12 — External address bus 12 |
| Broche 127 | A13 — External address bus 13 |
| Broche 128 | A14 — External address bus 14 |
| Broche 129 | A15 — External address bus 15 |
| Broche 130 | A16 — External address bus 16 |
| Broche 131 | A17 — External address bus 17 |
| Broche 132 | A18 — External address bus 18 |
| Broche 133 | A19 — External address bus 19 |
| Broche 134 | GND — Ground |
| Broche 135 | VCC_CORE — Core supply (1.6 V) |
| Broche 136 | D0 — External data bus 0 |
| Broche 137 | D1 — External data bus 1 |
| Broche 138 | D2 — External data bus 2 |
| Broche 139 | D3 — External data bus 3 |
| Broche 140 | D4 — External data bus 4 |
| Broche 141 | D5 — External data bus 5 |
| Broche 142 | D6 — External data bus 6 |
| Broche 143 | D7 — External data bus 7 |
| Broche 144 | GND — Ground / thermal pad adjacent |
Applications typiques
DSPB56362AG120 convient pour 6 applications: A/V Receiver Audio Decoding, Surround-Sound Soundbar Processor, DVD / Blu-ray Player Audio Engine, Automotive Head Unit Audio DSP, Digital TV Audio Subsystem, Conferencing System Acoustic Processing.
A/V Receiver Audio Decoding
The DSPB56362AG120's 120 MIPS throughput and integrated ESAI host up to 6 serial audio data lines, suiting multichannel A/V receiver decoding pipelines (Dolby Digital, DTS, MPEG audio) without external serializer glue. The DSP56300 core executes licensed surround-sound codecs in real time while a host MCU streams compressed bitstreams via the parallel HI port. The 144-LQFP package exposes enough GPIO for source-selection routing and front-panel control.
Recommandé
Surround-Sound Soundbar Processor
Single-chip cost-optimized surround processing for soundbar designs benefits from the DSPB56362AG120's on-chip codec licensing and 24-bit fixed-point MAC pipeline, which handles psychoacoustic virtualization (virtual surround) within a 120 MIPS budget. ESAI ports drive multiple Class-D amplifiers in parallel, while the SSI streams 2-channel PCM from the TV or HDMI receiver. The 3.3V I/O and 1.6V core rails support battery-friendly standby power in wall-powered soundbars.
Recommandé
DVD / Blu-ray Player Audio Engine
DVD and Blu-ray players benefit from the DSPB56362AG120's combination of licensed audio codecs and a deterministic DSP56300 interrupt model that maintains lip-sync during disc playback. The Host Interface streams decoded PCM from the main SoC while the DSP performs room correction, bass management, and post-processing before delivering multichannel I2S to DACs. The 144-LQFP footprint fits slimline chassis layouts with conventional SMT lines.
Recommandé
Automotive Head Unit Audio DSP
In automotive head units, the DSPB56362AG120's DSP56300 core delivers 120 MIPS sufficient for ANC (active noise cancellation), road-noise compensation, and cabin-tuned equalization in real time. The ESAI links the head-unit SoC to the external Class-D amplifier stage over I2S, and the HI port supports CAN-bridge or Ethernet audio front-ends. Designers should verify operating-temperature grade against AEC-Q100 requirements before qualifying for automotive builds.
Recommandé
Digital TV Audio Subsystem
Integrated digital televisions use the DSPB56362AG120 to decode broadcast audio formats (AC-3, MPEG-1 Layer 2/3) and apply virtualization on stereo speaker enclosures. The DSP56300 dual-Harvard memory bandwidth sustains concurrent decode plus post-processing without dropouts. ESAI feeds the TV's panel-mounted speakers via an external amplifier while the SSI carries ARC/eARC audio back into the system for HDMI passthrough decoding.
Recommandé
Conferencing System Acoustic Processing
Conference phones and beam-forming microphone arrays leverage the DSPB56362AG120's deterministic MAC pipeline for acoustic echo cancellation (AEC), noise suppression, and beam-forming across multiple microphone channels. ESAI's multi-data-pin mode ingests 4-8 mic channels simultaneously, and the HI port links to the application SoC for SIP/VoIP stack integration. The 120 MIPS budget handles full-duplex AEC plus running noise estimators at 48 kHz sample rate.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPB56362AG120 — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPB56366AG120 | DSPB56362AG120R2 |
|---|---|---|---|
| Brand | NXP Semiconductors | NXP Semiconductors | NXP Semiconductors |
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same |
| Core Clock | 120 MHz | 120 MHz | 120 MHz |
| Data Bus Width | 24 bit | 24 bit | 24 bit |
| Throughput | 120 MIPS | 120 MIPS | 120 MIPS |
| Core Architecture | DSP56300 (56000) | DSP56300 (56000) - same | DSP56300 (56000) - same |
| Packaging Form | Tray | Tray | 13-inch Reel, 500 pcs |
| Lead-Free / RoHS | Yes / Compliant | Yes / Compliant | Yes / Compliant |
Principaux différenciateurs
- Cost-optimized consumer audio licensing bundle (vs DSPB56366AG120)
- Long-standing industrial supply position (vs TI C6000 audio DSP family)
- On-chip ESAI with 6 data pins (vs Generic ARM Cortex-M4 with I2S)
Notes de conception
The DSPB56362AG120 requires two rails: 1.6V core and 3.3V I/O. Power sequencing is required (core first, then I/O) to prevent latch-up. Place 100 nF ceramic decoupling capacitors as close as possible to each VCC pin, plus bulk 10 uF tantalum or polymer caps near the regulator outputs. Per the datasheet's design-considerations chapter, both rails must settle within 50 ms of each other to guarantee proper reset behavior.
Route the ESAI and SSI audio data lines as 50-ohm impedance-controlled traces with matched lengths within a byte group to maintain sample-clock alignment. Keep ESD-protected areas away from the analog supply filter network. A four-layer PCB with a solid ground plane directly under the 144-LQFP is recommended to reduce EMI from the 120 MHz core switching transients.
Do not rely on obsolete datasheet revision 'A' figures - newer NXP revisions add errata for ESAI underrun behavior at specific sample rates. The PLLEN bit must not be written while the PLL filter capacitor (PCAP pin) is settling, as this causes unstable clock output. Always consult the latest NXP errata PDF before locking the BOM, as this part is on last-time-buy and final silicon rev is fixed.
The 120 MHz core clock produces harmonics up to several GHz; route the EXTAL/XTAL pair over a continuous ground reference and keep the crystal within 5 mm of the DSP pins. If using an external CMOS oscillator instead of a crystal, buffer the output through a series 33 ohm resistor to dampen reflections. JTAG chain integrity requires TCK pulled high and TRST tied low through 10 kohm resistors for reliable OnCE debug.
Informations de conformité
Per NXP product page, the part is LEAD FREE DSP56362. RoHS compliant per the same listing. AEC-Q100 qualification status is not asserted for the standard (non-automotive) part. Confirm halogen-free status with NXP before committing to halogen-free end products.
