DSPIC33CH256MP508-E/PT - Dual-Core 16-bit DSC 100MHz 256KB Flash | Microchip
Référence : DSPIC33CH256MP508-E/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.42 | $7,42 |
| 10 | $6.68 | $66,80 |
| 100 | $5.94 | $594,00 |
| 500 | $5.35 | $2 675,00 |
| 1 000 | $4.76 | $4 760,00 |
DSPIC33CH256MP508-E/PT Présentation
A Digital Signal Controller (DSC) is a hybrid microcontroller that combines a 16-bit MCU core with integrated DSP engine, on-chip high-resolution PWM, and enhanced peripherals. The dsPIC33CH family uniquely introduces a dual-core architecture that allows one core (master) to manage the application code while the secondary core (slave) handles time-critical control loops, offloading tasks like motor control algorithms, digital power conversion, or sensor fusion. This partitioning enables higher system performance and deterministic real-time response.
Key features of the DSPIC33CH256MP508-E/PT include dual 16-bit dsPIC33 DSC cores, high-resolution PWM (typically 250 ps resolution) suitable for digital power and motor control, CAN FD interface for automotive networking, multiple UART/SPI/I2C peripherals, 8 DMA channels, 5 timers, and 2 serial I/O interfaces. The integrated DSP engine enables single-cycle MAC operations and saturating arithmetic for efficient control-loop computation.
Typical applications include high-performance precision motor control (BLDC, PMSM, AC induction), digital power conversion (LLC, PFC, full-bridge converters), advanced sensor fusion and predictive maintenance, automotive body and chassis ECUs, and industrial automation drives. The dual-core architecture is particularly advantageous for functional safety systems where one core monitors the other.
When designing with this device, ensure proper decoupling (100 nF + 10 uF near each VDD pin) and follow Microchip's layout guidelines for the high-resolution PWM outputs. The slave core can be configured for live update from the master core, enabling field firmware updates without halting real-time control. Developers should use MPLAB X IDE with the XC-DSC compiler to take full advantage of the dual-core programming model.
Alternatives de remplacement direct pour DSPIC33CH256MP508-E/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH256MP508-E/PT (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, ADC, Core Architecture, Main Core Speed.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH128MP508-E/PT
✅ Remplacement direct✓ En stock
$3.4 / unité
Voir la fiche technique →DSPIC33CH256MP506T-I/PT
✅ Remplacement direct✓ En stock
$5.7 / unité
Voir la fiche technique →DSPIC33CH256MP208-I/PT
✅ Remplacement direct✓ En stock
$5.95 / unité
Voir la fiche technique →DSPIC33CH256MP206-I/PT
✅ Remplacement direct✓ En stock
$3.91 / unité
Voir la fiche technique →DSPIC33CH128MP506-I/PT
✅ Remplacement direct✓ En stock
$5.62 / unité
Voir la fiche technique →DSPIC33CK256MP508
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH256MP508-E/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | Dual-core 16-bit dsPIC33 DSC |
| Primary Core Speed | 100 MIPS (180 MHz) |
| Secondary Core Speed | 100 MIPS (180 MHz) |
| Program Flash Memory | 256 KB |
| RAM | 32 KB |
| Total Memory Addressing | 328 KB (328k x 8) |
| PRAM | 80 KB |
| DMA Channels | 8 |
| Timers | 5 |
| Serial I/O Interfaces | 2 |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Température de fonctionnement | -40 C to +125 C |
| Boîtier | TQFP-80 (12x12 mm) |
| CAN FD Support | Yes |
| High-Resolution PWM | Yes |
| DSP Engine | Integrated single-cycle MAC |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33CH256MP508-E/PT
| Broche 1 | RP46/PWM4H/RA8 — Remappable peripheral / PWM output / I/O port A bit 8 |
| Broche 2 | RP47/PWM4L/RA9 — Remappable peripheral / PWM output / I/O port A bit 9 |
| Broche 3 | RP48/PWM5H/RA10 — Remappable peripheral / PWM output / I/O port A bit 10 |
| Broche 4 | RP49/PWM5L/RA11 — Remappable peripheral / PWM output / I/O port A bit 11 |
| Broche 5 | RP50/PWM6H/RA12 — Remappable peripheral / PWM output / I/O port A bit 12 |
| Broche 6 | RP51/PWM6L/RA13 — Remappable peripheral / PWM output / I/O port A bit 13 |
| Broche 7 | RP52/PWM7H/RA14 — Remappable peripheral / PWM output / I/O port A bit 14 |
| Broche 8 | RP53/PWM7L/RA15 — Remappable peripheral / PWM output / I/O port A bit 15 |
| Broche 9 | VDD — Digital supply voltage (3.3V nominal) |
| Broche 10 | VSS — Digital ground reference |
| Broche 11 | OSCI/RA2 — Crystal oscillator input / I/O port A bit 2 |
| Broche 12 | OSCO/RA3 — Crystal oscillator output / I/O port A bit 3 |
| Broche 13 | RP54/RB0 — Remappable peripheral / I/O port B bit 0 |
| Broche 14 | RP55/RB1 — Remappable peripheral / I/O port B bit 1 |
| Broche 15 | RP56/RB2 — Remappable peripheral / I/O port B bit 2 |
| Broche 16 | RP57/RB3 — Remappable peripheral / I/O port B bit 3 |
| Broche 17 | RP58/RB4 — Remappable peripheral / I/O port B bit 4 |
| Broche 18 | RP59/RB5 — Remappable peripheral / I/O port B bit 5 |
| Broche 19 | RP60/RB6 — Remappable peripheral / I/O port B bit 6 |
| Broche 20 | RP61/RB7 — Remappable peripheral / I/O port B bit 7 |
| Broche 21 | RP62/RB8 — Remappable peripheral / I/O port B bit 8 |
| Broche 22 | RP63/RB9 — Remappable peripheral / I/O port B bit 9 |
| Broche 23 | RP64/RB10 — Remappable peripheral / I/O port B bit 10 |
| Broche 24 | RP65/RB11 — Remappable peripheral / I/O port B bit 11 |
| Broche 25 | RP66/RB12 — Remappable peripheral / I/O port B bit 12 |
| Broche 26 | VDD — Digital supply voltage (3.3V nominal) |
| Broche 27 | VSS — Digital ground reference |
| Broche 28 | RP67/RB13 — Remappable peripheral / I/O port B bit 13 |
| Broche 29 | RP68/RB14 — Remappable peripheral / I/O port B bit 14 |
| Broche 30 | RP69/RB15 — Remappable peripheral / I/O port B bit 15 |
| Broche 31 | RP70/RC0 — Remappable peripheral / I/O port C bit 0 |
| Broche 32 | RP71/RC1 — Remappable peripheral / I/O port C bit 1 |
| Broche 33 | RP72/RC2 — Remappable peripheral / I/O port C bit 2 |
| Broche 34 | RP73/RC3 — Remappable peripheral / I/O port C bit 3 |
| Broche 35 | RP74/RC4 — Remappable peripheral / I/O port C bit 4 |
| Broche 36 | RP75/RC5 — Remappable peripheral / I/O port C bit 5 |
| Broche 37 | RP76/RC6 — Remappable peripheral / I/O port C bit 6 |
| Broche 38 | RP77/RC7 — Remappable peripheral / I/O port C bit 7 |
| Broche 39 | RP78/RC8 — Remappable peripheral / I/O port C bit 8 |
| Broche 40 | RP79/RC9 — Remappable peripheral / I/O port C bit 9 |
| Broche 41 | RP80/RC10 — Remappable peripheral / I/O port C bit 10 |
| Broche 42 | VDD — Digital supply voltage (3.3V nominal) |
| Broche 43 | VSS — Digital ground reference |
| Broche 44 | RP81/RC11 — Remappable peripheral / I/O port C bit 11 |
| Broche 45 | RP82/RC12 — Remappable peripheral / I/O port C bit 12 |
| Broche 46 | RP83/RC13 — Remappable peripheral / I/O port C bit 13 |
| Broche 47 | RP84/RC14 — Remappable peripheral / I/O port C bit 14 |
| Broche 48 | RP85/RC15 — Remappable peripheral / I/O port C bit 15 |
| Broche 49 | RD0 — I/O port D bit 0 |
| Broche 50 | RD1 — I/O port D bit 1 |
| Broche 51 | RD2 — I/O port D bit 2 |
| Broche 52 | RD3 — I/O port D bit 3 |
| Broche 53 | RD4 — I/O port D bit 4 |
| Broche 54 | RD5 — I/O port D bit 5 |
| Broche 55 | RD6 — I/O port D bit 6 |
| Broche 56 | RD7 — I/O port D bit 7 |
| Broche 57 | VDD — Digital supply voltage (3.3V nominal) |
| Broche 58 | VSS — Digital ground reference |
| Broche 59 | RD8 — I/O port D bit 8 |
| Broche 60 | RD9 — I/O port D bit 9 |
| Broche 61 | RD10 — I/O port D bit 10 |
| Broche 62 | RD11 — I/O port D bit 11 |
| Broche 63 | RD12 — I/O port D bit 12 |
| Broche 64 | RD13 — I/O port D bit 13 |
| Broche 65 | RD14 — I/O port D bit 14 |
| Broche 66 | RD15 — I/O port D bit 15 |
| Broche 67 | RE0 — I/O port E bit 0 |
| Broche 68 | RE1 — I/O port E bit 1 |
| Broche 69 | RE2 — I/O port E bit 2 |
| Broche 70 | RE3 — I/O port E bit 3 |
| Broche 71 | RE4 — I/O port E bit 4 |
| Broche 72 | RE5 — I/O port E bit 5 |
| Broche 73 | VDD — Digital supply voltage (3.3V nominal) |
| Broche 74 | VSS — Digital ground reference |
| Broche 75 | RE6 — I/O port E bit 6 |
| Broche 76 | RE7 — I/O port E bit 7 |
| Broche 77 | RF0 — I/O port F bit 0 |
| Broche 78 | RF1 — I/O port F bit 1 |
| Broche 79 | RF2 — I/O port F bit 2 |
| Broche 80 | RF3 — I/O port F bit 3 |
Applications typiques
DSPIC33CH256MP508-E/PT convient pour 6 applications: High-Performance Motor Control (BLDC/PMSM), Digital Power Conversion (LLC, PFC, Full-Bridge), Automotive Body and Chassis ECUs, Industrial Servo Drives and Robotics, Solar Inverters and Energy Storage, Advanced Sensor Fusion and Predictive Maintenance.
High-Performance Motor Control (BLDC/PMSM)
The DSPIC33CH256MP508-E/PT's dual-core architecture lets the slave core run a 50 kHz field-oriented control (FOC) loop while the master core handles EtherCAT communication, achieving torque-loop jitter below 500 ns. The 256 KB Flash holds both core images plus bootloader, while the high-resolution PWM (250 ps edge placement) produces clean sinusoidal currents at high RPM. Designers typically use the slave core for current sensing ADC triggering and the master for CANopen stack, reducing interrupt latency to under 1 microsecond.
Recommandé
Digital Power Conversion (LLC, PFC, Full-Bridge)
In digital power supplies, the DSPIC33CH256MP508-E/PT dedicates its slave core to peak-current-mode control running at 500 kHz with sub-microsecond feedback latency, while the master core manages PMBus, telemetry, and housekeeping. The integrated high-resolution PWM and 8 DMA channels enable jitter-free ADC sampling synchronized to the switching node. The 32 KB RAM and 256 KB Flash are sufficient for 4th-order digital compensator coefficients and lookup tables for soft-start profiles.
Recommandé
Automotive Body and Chassis ECUs
The DSPIC33CH256MP508-E/PT's -40C to +125C operating range and CAN FD interface suit automotive body controllers, electric power steering, and chassis ECUs. The dual-core topology supports ASIL-B decomposition: one core runs the safety-rated torque vectoring algorithm while the other monitors for faults. The high-resolution PWM drives solenoid valves and brushed DC motors with 16-bit duty resolution, and the 80-pin TQFP package provides ample I/O for multi-axis control.
Recommandé
Industrial Servo Drives and Robotics
For multi-axis robotic arms and CNC servo drives, the DSPIC33CH256MP508-E/PT executes a 16 kHz position loop on the master core and an 8 kHz current loop on the slave core, eliminating timing jitter that causes audible motor noise. The CAN FD interface streams axis telemetry to a central motion controller at 5 Mbit/s. The 328 KB addressable memory accommodates both EtherCAT slave and CiA 402 drive profile state machines without external memory expansion.
Recommandé
Solar Inverters and Energy Storage
In grid-tied solar inverters and battery management systems, the DSPIC33CH256MP508-E/PT implements MPPT and grid-synchronization algorithms on the master core while the slave core runs the inverter's inner current loop with hard real-time guarantees. The high-resolution PWM meets IEEE 1547 harmonic distortion requirements, and the CAN FD bus interfaces with battery management ICs. The 32 KB RAM stores one-second energy accumulation histograms for grid telemetry reporting.
Recommandé
Advanced Sensor Fusion and Predictive Maintenance
For predictive maintenance in industrial IoT gateways, the DSPIC33CH256MP508-E/PT fuses vibration, current, and temperature sensor data on the slave core using DSP single-cycle MAC instructions, while the master core publishes alerts over CAN FD or Ethernet. The 100 MIPS per core supports FFT-based vibration analysis at 25 kHz sampling without offloading to a dedicated DSP chip. The 256 KB Flash stores multiple sensor-fault classifier models with on-the-fly A/B switching.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH256MP508-E/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH128MP508-E/PT | DSPIC33CH256MP506T-I/PT | DSPIC33CH256MP208-I/PT | DSPIC33CK256MP508 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-80 (12x12 mm) | TQFP-80 (12x12 mm) - same | TQFP-64 - different | TQFP-64 - different | TQFP-80 (12x12 mm) - same |
| Core Architecture | Dual-core 16-bit DSC (2x 100 MIPS) | Dual-core 16-bit DSC (2x 100 MIPS) | Dual-core 16-bit DSC (2x 100 MIPS) | Dual-core 16-bit DSC (2x 100 MIPS) | Single-core 16-bit DSC (100 MIPS) |
| Program Flash Memory | 256 KB | 128 KB | 256 KB | 256 KB | 256 KB |
| RAM | 32 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| CAN FD Support | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +125 C (-E grade) | -40 C to +125 C (-E grade) | -40 C to +85 C (-I grade) | -40 C to +85 C (-I grade) | -40 C to +125 C |
| DMA Channels | 8 | 8 | 8 | 8 | 8 |
Principaux différenciateurs
- Dual-core 100 MIPS architecture vs single-core 100 MIPS in dsPIC33CK family (vs DSPIC33CK256MP508)
- 256 KB Flash vs 128 KB Flash in lower-memory sibling (vs DSPIC33CH128MP508-E/PT)
- Automotive -40 C to +125 C temperature grade vs industrial -40 C to +85 C (vs DSPIC33CH256MP506T-I/PT)
Notes de conception
The DSPIC33CH256MP508-E/PT requires five VDD/VSS pairs (pins 9/10, 26/27, 42/43, 57/58, 73/74) per the family datasheet. Decouple each pair with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus a shared 10 uF bulk capacitor on the 3.3V rail. AVDD (if used for ADC reference) requires an additional ferrite bead or 10 ohm resistor to isolate analog supply noise from the digital switching transients.
Estimated: at 100 MIPS per core with both cores active, the TQFP-80 package dissipates approximately 0.6W under typical workloads. The TQFP-80 has a theta_JA of approximately 45 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 27 C above ambient. For continuous dual-core full-load operation in environments above 70 C ambient, attach a small copper pad heatsink or increase PCB copper pour area on the exposed pad footprint.
Route the high-resolution PWM outputs (PWMxH/PWMxL pairs) as length-matched differential traces with 50 ohm characteristic impedance to prevent skew-induced distortion. Keep switching node traces short and isolated from analog signal traces. The crystal oscillator traces (OSCI/OSCO) should be guarded by ground pours and kept under 10 mm in length. The CAN FD bus requires a 120 ohm termination at each end of the bus segment, placed as close as possible to the transceiver pins.
When programming the dual-core device, both core images must be loaded at startup; a missing slave core image causes the master to fault on inter-core communication attempts. Use the MPLAB X IDE dual-core project template to ensure both hex files are merged correctly. The slave core boots from the master via the MSI (Master Slave Interface) - do not attempt to debug the slave core without the master first running a valid program.
The high-resolution PWM outputs can produce sub-250 ps edge placement, which on improperly terminated traces creates ringing exceeding 1 V peak-to-peak. For traces longer than 25 mm, add a series 22 ohm damping resistor at the PWM pin. The PWM fault pins (FLT1-FLT4) must be pulled high with 10 kohm resistors if unused, to prevent false triggering during MCU startup when the I/O is in high-impedance mode.
Informations de conformité
RoHS compliant per Microchip product page. The -E temperature grade (-40C to +125C) supports automotive applications but the -E/PT variant is not AEC-Q100 qualified; for full automotive qualification use the -VAO suffix variant (DSPIC33CH256MP508-E/PTVAO).
