DSPIC33CH256MP508-E/PT - Dual-Core 16-bit DSC 100MHz 256KB Flash | Microchip
MPN: DSPIC33CH256MP508-E/PT ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $7.42 | $7.42 |
| 10 | $6.68 | $66.80 |
| 100 | $5.94 | $594.00 |
| 500 | $5.35 | $2,675.00 |
| 1,000 | $4.76 | $4,760.00 |
DSPIC33CH256MP508-E/PT Overview
A Digital Signal Controller (DSC) is a hybrid microcontroller that combines a 16-bit MCU core with integrated DSP engine, on-chip high-resolution PWM, and enhanced peripherals. The dsPIC33CH family uniquely introduces a dual-core architecture that allows one core (master) to manage the application code while the secondary core (slave) handles time-critical control loops, offloading tasks like motor control algorithms, digital power conversion, or sensor fusion. This partitioning enables higher system performance and deterministic real-time response.
Key features of the DSPIC33CH256MP508-E/PT include dual 16-bit dsPIC33 DSC cores, high-resolution PWM (typically 250 ps resolution) suitable for digital power and motor control, CAN FD interface for automotive networking, multiple UART/SPI/I2C peripherals, 8 DMA channels, 5 timers, and 2 serial I/O interfaces. The integrated DSP engine enables single-cycle MAC operations and saturating arithmetic for efficient control-loop computation.
Typical applications include high-performance precision motor control (BLDC, PMSM, AC induction), digital power conversion (LLC, PFC, full-bridge converters), advanced sensor fusion and predictive maintenance, automotive body and chassis ECUs, and industrial automation drives. The dual-core architecture is particularly advantageous for functional safety systems where one core monitors the other.
When designing with this device, ensure proper decoupling (100 nF + 10 uF near each VDD pin) and follow Microchip's layout guidelines for the high-resolution PWM outputs. The slave core can be configured for live update from the master core, enabling field firmware updates without halting real-time control. Developers should use MPLAB X IDE with the XC-DSC compiler to take full advantage of the dual-core programming model.
Drop-in alternatives for DSPIC33CH256MP508-E/PT — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH256MP508-E/PT (same form factor and footprint) — differing in Package, Operating Temperature, ADC, Core Architecture, Main Core Speed.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH128MP508-E/PT
✅ Drop-In✓ In Stock
$3.4 / Unit
View Datasheet →DSPIC33CH256MP506T-I/PT
✅ Drop-In✓ In Stock
$5.7 / Unit
View Datasheet →DSPIC33CH256MP208-I/PT
✅ Drop-In✓ In Stock
$5.95 / Unit
View Datasheet →DSPIC33CH256MP206-I/PT
✅ Drop-In✓ In Stock
$3.91 / Unit
View Datasheet →DSPIC33CH128MP506-I/PT
✅ Drop-In✓ In Stock
$5.62 / Unit
View Datasheet →DSPIC33CK256MP508
✅ Drop-In📋 Reference alternative (not in catalog)
DSPIC33CH256MP508-E/PT Maximum Ratings & Electrical Characteristics
| Core Architecture | Dual-core 16-bit dsPIC33 DSC |
| Primary Core Speed | 100 MIPS (180 MHz) |
| Secondary Core Speed | 100 MIPS (180 MHz) |
| Program Flash Memory | 256 KB |
| RAM | 32 KB |
| Total Memory Addressing | 328 KB (328k x 8) |
| PRAM | 80 KB |
| DMA Channels | 8 |
| Timers | 5 |
| Serial I/O Interfaces | 2 |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Operating Temperature | -40 C to +125 C |
| Package | TQFP-80 (12x12 mm) |
| CAN FD Support | Yes |
| High-Resolution PWM | Yes |
| DSP Engine | Integrated single-cycle MAC |
| Mounting Type | Surface Mount |
| RoHS Status | Compliant |
DSPIC33CH256MP508-E/PT Pin Configuration
| Pin 1 | RP46/PWM4H/RA8 — Remappable peripheral / PWM output / I/O port A bit 8 |
| Pin 2 | RP47/PWM4L/RA9 — Remappable peripheral / PWM output / I/O port A bit 9 |
| Pin 3 | RP48/PWM5H/RA10 — Remappable peripheral / PWM output / I/O port A bit 10 |
| Pin 4 | RP49/PWM5L/RA11 — Remappable peripheral / PWM output / I/O port A bit 11 |
| Pin 5 | RP50/PWM6H/RA12 — Remappable peripheral / PWM output / I/O port A bit 12 |
| Pin 6 | RP51/PWM6L/RA13 — Remappable peripheral / PWM output / I/O port A bit 13 |
| Pin 7 | RP52/PWM7H/RA14 — Remappable peripheral / PWM output / I/O port A bit 14 |
| Pin 8 | RP53/PWM7L/RA15 — Remappable peripheral / PWM output / I/O port A bit 15 |
| Pin 9 | VDD — Digital supply voltage (3.3V nominal) |
| Pin 10 | VSS — Digital ground reference |
| Pin 11 | OSCI/RA2 — Crystal oscillator input / I/O port A bit 2 |
| Pin 12 | OSCO/RA3 — Crystal oscillator output / I/O port A bit 3 |
| Pin 13 | RP54/RB0 — Remappable peripheral / I/O port B bit 0 |
| Pin 14 | RP55/RB1 — Remappable peripheral / I/O port B bit 1 |
| Pin 15 | RP56/RB2 — Remappable peripheral / I/O port B bit 2 |
| Pin 16 | RP57/RB3 — Remappable peripheral / I/O port B bit 3 |
| Pin 17 | RP58/RB4 — Remappable peripheral / I/O port B bit 4 |
| Pin 18 | RP59/RB5 — Remappable peripheral / I/O port B bit 5 |
| Pin 19 | RP60/RB6 — Remappable peripheral / I/O port B bit 6 |
| Pin 20 | RP61/RB7 — Remappable peripheral / I/O port B bit 7 |
| Pin 21 | RP62/RB8 — Remappable peripheral / I/O port B bit 8 |
| Pin 22 | RP63/RB9 — Remappable peripheral / I/O port B bit 9 |
| Pin 23 | RP64/RB10 — Remappable peripheral / I/O port B bit 10 |
| Pin 24 | RP65/RB11 — Remappable peripheral / I/O port B bit 11 |
| Pin 25 | RP66/RB12 — Remappable peripheral / I/O port B bit 12 |
| Pin 26 | VDD — Digital supply voltage (3.3V nominal) |
| Pin 27 | VSS — Digital ground reference |
| Pin 28 | RP67/RB13 — Remappable peripheral / I/O port B bit 13 |
| Pin 29 | RP68/RB14 — Remappable peripheral / I/O port B bit 14 |
| Pin 30 | RP69/RB15 — Remappable peripheral / I/O port B bit 15 |
| Pin 31 | RP70/RC0 — Remappable peripheral / I/O port C bit 0 |
| Pin 32 | RP71/RC1 — Remappable peripheral / I/O port C bit 1 |
| Pin 33 | RP72/RC2 — Remappable peripheral / I/O port C bit 2 |
| Pin 34 | RP73/RC3 — Remappable peripheral / I/O port C bit 3 |
| Pin 35 | RP74/RC4 — Remappable peripheral / I/O port C bit 4 |
| Pin 36 | RP75/RC5 — Remappable peripheral / I/O port C bit 5 |
| Pin 37 | RP76/RC6 — Remappable peripheral / I/O port C bit 6 |
| Pin 38 | RP77/RC7 — Remappable peripheral / I/O port C bit 7 |
| Pin 39 | RP78/RC8 — Remappable peripheral / I/O port C bit 8 |
| Pin 40 | RP79/RC9 — Remappable peripheral / I/O port C bit 9 |
| Pin 41 | RP80/RC10 — Remappable peripheral / I/O port C bit 10 |
| Pin 42 | VDD — Digital supply voltage (3.3V nominal) |
| Pin 43 | VSS — Digital ground reference |
| Pin 44 | RP81/RC11 — Remappable peripheral / I/O port C bit 11 |
| Pin 45 | RP82/RC12 — Remappable peripheral / I/O port C bit 12 |
| Pin 46 | RP83/RC13 — Remappable peripheral / I/O port C bit 13 |
| Pin 47 | RP84/RC14 — Remappable peripheral / I/O port C bit 14 |
| Pin 48 | RP85/RC15 — Remappable peripheral / I/O port C bit 15 |
| Pin 49 | RD0 — I/O port D bit 0 |
| Pin 50 | RD1 — I/O port D bit 1 |
| Pin 51 | RD2 — I/O port D bit 2 |
| Pin 52 | RD3 — I/O port D bit 3 |
| Pin 53 | RD4 — I/O port D bit 4 |
| Pin 54 | RD5 — I/O port D bit 5 |
| Pin 55 | RD6 — I/O port D bit 6 |
| Pin 56 | RD7 — I/O port D bit 7 |
| Pin 57 | VDD — Digital supply voltage (3.3V nominal) |
| Pin 58 | VSS — Digital ground reference |
| Pin 59 | RD8 — I/O port D bit 8 |
| Pin 60 | RD9 — I/O port D bit 9 |
| Pin 61 | RD10 — I/O port D bit 10 |
| Pin 62 | RD11 — I/O port D bit 11 |
| Pin 63 | RD12 — I/O port D bit 12 |
| Pin 64 | RD13 — I/O port D bit 13 |
| Pin 65 | RD14 — I/O port D bit 14 |
| Pin 66 | RD15 — I/O port D bit 15 |
| Pin 67 | RE0 — I/O port E bit 0 |
| Pin 68 | RE1 — I/O port E bit 1 |
| Pin 69 | RE2 — I/O port E bit 2 |
| Pin 70 | RE3 — I/O port E bit 3 |
| Pin 71 | RE4 — I/O port E bit 4 |
| Pin 72 | RE5 — I/O port E bit 5 |
| Pin 73 | VDD — Digital supply voltage (3.3V nominal) |
| Pin 74 | VSS — Digital ground reference |
| Pin 75 | RE6 — I/O port E bit 6 |
| Pin 76 | RE7 — I/O port E bit 7 |
| Pin 77 | RF0 — I/O port F bit 0 |
| Pin 78 | RF1 — I/O port F bit 1 |
| Pin 79 | RF2 — I/O port F bit 2 |
| Pin 80 | RF3 — I/O port F bit 3 |
Typical Applications
DSPIC33CH256MP508-E/PT is suitable for 6 applications: High-Performance Motor Control (BLDC/PMSM), Digital Power Conversion (LLC, PFC, Full-Bridge), Automotive Body and Chassis ECUs, Industrial Servo Drives and Robotics, Solar Inverters and Energy Storage, Advanced Sensor Fusion and Predictive Maintenance.
High-Performance Motor Control (BLDC/PMSM)
The DSPIC33CH256MP508-E/PT's dual-core architecture lets the slave core run a 50 kHz field-oriented control (FOC) loop while the master core handles EtherCAT communication, achieving torque-loop jitter below 500 ns. The 256 KB Flash holds both core images plus bootloader, while the high-resolution PWM (250 ps edge placement) produces clean sinusoidal currents at high RPM. Designers typically use the slave core for current sensing ADC triggering and the master for CANopen stack, reducing interrupt latency to under 1 microsecond.
Recommended
Digital Power Conversion (LLC, PFC, Full-Bridge)
In digital power supplies, the DSPIC33CH256MP508-E/PT dedicates its slave core to peak-current-mode control running at 500 kHz with sub-microsecond feedback latency, while the master core manages PMBus, telemetry, and housekeeping. The integrated high-resolution PWM and 8 DMA channels enable jitter-free ADC sampling synchronized to the switching node. The 32 KB RAM and 256 KB Flash are sufficient for 4th-order digital compensator coefficients and lookup tables for soft-start profiles.
Recommended
Automotive Body and Chassis ECUs
The DSPIC33CH256MP508-E/PT's -40C to +125C operating range and CAN FD interface suit automotive body controllers, electric power steering, and chassis ECUs. The dual-core topology supports ASIL-B decomposition: one core runs the safety-rated torque vectoring algorithm while the other monitors for faults. The high-resolution PWM drives solenoid valves and brushed DC motors with 16-bit duty resolution, and the 80-pin TQFP package provides ample I/O for multi-axis control.
Recommended
Industrial Servo Drives and Robotics
For multi-axis robotic arms and CNC servo drives, the DSPIC33CH256MP508-E/PT executes a 16 kHz position loop on the master core and an 8 kHz current loop on the slave core, eliminating timing jitter that causes audible motor noise. The CAN FD interface streams axis telemetry to a central motion controller at 5 Mbit/s. The 328 KB addressable memory accommodates both EtherCAT slave and CiA 402 drive profile state machines without external memory expansion.
Recommended
Solar Inverters and Energy Storage
In grid-tied solar inverters and battery management systems, the DSPIC33CH256MP508-E/PT implements MPPT and grid-synchronization algorithms on the master core while the slave core runs the inverter's inner current loop with hard real-time guarantees. The high-resolution PWM meets IEEE 1547 harmonic distortion requirements, and the CAN FD bus interfaces with battery management ICs. The 32 KB RAM stores one-second energy accumulation histograms for grid telemetry reporting.
Recommended
Advanced Sensor Fusion and Predictive Maintenance
For predictive maintenance in industrial IoT gateways, the DSPIC33CH256MP508-E/PT fuses vibration, current, and temperature sensor data on the slave core using DSP single-cycle MAC instructions, while the master core publishes alerts over CAN FD or Ethernet. The 100 MIPS per core supports FFT-based vibration analysis at 25 kHz sampling without offloading to a dedicated DSP chip. The 256 KB Flash stores multiple sensor-fault classifier models with on-the-fly A/B switching.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH256MP508-E/PT — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH128MP508-E/PT | DSPIC33CH256MP506T-I/PT | DSPIC33CH256MP208-I/PT | DSPIC33CK256MP508 |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | TQFP-80 (12x12 mm) | TQFP-80 (12x12 mm) - same | TQFP-64 - different | TQFP-64 - different | TQFP-80 (12x12 mm) - same |
| Core Architecture | Dual-core 16-bit DSC (2x 100 MIPS) | Dual-core 16-bit DSC (2x 100 MIPS) | Dual-core 16-bit DSC (2x 100 MIPS) | Dual-core 16-bit DSC (2x 100 MIPS) | Single-core 16-bit DSC (100 MIPS) |
| Program Flash Memory | 256 KB | 128 KB | 256 KB | 256 KB | 256 KB |
| RAM | 32 KB | 16 KB | 32 KB | 32 KB | 32 KB |
| CAN FD Support | Yes | Yes | Yes | Yes | Yes |
| Operating Temperature | -40 C to +125 C (-E grade) | -40 C to +125 C (-E grade) | -40 C to +85 C (-I grade) | -40 C to +85 C (-I grade) | -40 C to +125 C |
| DMA Channels | 8 | 8 | 8 | 8 | 8 |
Key Differentiators
- Dual-core 100 MIPS architecture vs single-core 100 MIPS in dsPIC33CK family (vs DSPIC33CK256MP508)
- 256 KB Flash vs 128 KB Flash in lower-memory sibling (vs DSPIC33CH128MP508-E/PT)
- Automotive -40 C to +125 C temperature grade vs industrial -40 C to +85 C (vs DSPIC33CH256MP506T-I/PT)
Design Notes
The DSPIC33CH256MP508-E/PT requires five VDD/VSS pairs (pins 9/10, 26/27, 42/43, 57/58, 73/74) per the family datasheet. Decouple each pair with a 100 nF ceramic capacitor placed within 3 mm of the pin, plus a shared 10 uF bulk capacitor on the 3.3V rail. AVDD (if used for ADC reference) requires an additional ferrite bead or 10 ohm resistor to isolate analog supply noise from the digital switching transients.
Estimated: at 100 MIPS per core with both cores active, the TQFP-80 package dissipates approximately 0.6W under typical workloads. The TQFP-80 has a theta_JA of approximately 45 C/W on a 4-layer JEDEC test board, yielding a junction temperature rise of 27 C above ambient. For continuous dual-core full-load operation in environments above 70 C ambient, attach a small copper pad heatsink or increase PCB copper pour area on the exposed pad footprint.
Route the high-resolution PWM outputs (PWMxH/PWMxL pairs) as length-matched differential traces with 50 ohm characteristic impedance to prevent skew-induced distortion. Keep switching node traces short and isolated from analog signal traces. The crystal oscillator traces (OSCI/OSCO) should be guarded by ground pours and kept under 10 mm in length. The CAN FD bus requires a 120 ohm termination at each end of the bus segment, placed as close as possible to the transceiver pins.
When programming the dual-core device, both core images must be loaded at startup; a missing slave core image causes the master to fault on inter-core communication attempts. Use the MPLAB X IDE dual-core project template to ensure both hex files are merged correctly. The slave core boots from the master via the MSI (Master Slave Interface) - do not attempt to debug the slave core without the master first running a valid program.
The high-resolution PWM outputs can produce sub-250 ps edge placement, which on improperly terminated traces creates ringing exceeding 1 V peak-to-peak. For traces longer than 25 mm, add a series 22 ohm damping resistor at the PWM pin. The PWM fault pins (FLT1-FLT4) must be pulled high with 10 kohm resistors if unused, to prevent false triggering during MCU startup when the I/O is in high-impedance mode.
Compliance Information
RoHS compliant per Microchip product page. The -E temperature grade (-40C to +125C) supports automotive applications but the -E/PT variant is not AEC-Q100 qualified; for full automotive qualification use the -VAO suffix variant (DSPIC33CH256MP508-E/PTVAO).
