DSPIC33CH512MP506-E/MR - 100MHz Dual-Core DSC, 512KB Flash | Microchip
Référence : DSPIC33CH512MP506-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $12.85 | $12,85 |
| 10 | $11.62 | $116,20 |
| 100 | $10.34 | $1 034,00 |
| 500 | $9.18 | $4 590,00 |
| 1 000 | $8.25 | $8 250,00 |
DSPIC33CH512MP506-E/MR Présentation
A Digital Signal Controller (DSC) is a hybrid microcontroller that integrates a DSP engine onto an MCU core; the dsPIC33CH family extends this with two cores on-chip. In the system hierarchy, the DSC sits between a microcontroller (MCU) and a digital signal processor (DSP), combining deterministic interrupt-driven control with hardware-accelerated math. The dual-core architecture places a fast slave core alongside the main core so time-critical tasks (current loops, commutation, housekeeping) can run independently of higher-level application code, simplifying firmware partitioning for advanced digital power conversion and field-oriented control (FOC) motor drives.
Key features include dual 100 MIPS 16-bit dsPIC DSC cores, 512 KB Flash, 64 KB PRAM, 16 KB RAM, 8-channel high-resolution PWM with 250 ps edge placement, two CAN-FD modules, multiple UART/SPI/I2C interfaces, 12-bit ADC at 3.5 Msps with up to 24 channels, and a 64-pin QFN package with extended -40C to +125C operating range. Functional Safety (FuSa) features support IEC 60730 Class B and automotive safety-integrity requirements, and the AEC-Q100 qualification allows deployment in safety-critical automotive ECUs.
The dual-core architecture allows the slave core to handle high-priority control loops while the main core runs communication, diagnostics, and application logic, reducing latency and jitter compared with single-core DSCs. On-chip high-resolution PWM and analog comparators support advanced topologies such as totem-pole PFC, LLC resonant converters, and multi-phase VRs, while CAN-FD and the peripheral set ease integration into vehicle body and powertrain networks.
Typical applications include digital switch-mode power supplies (SMPS), totem-pole PFC and LLC converters, field-oriented control (FOC) motor drives for automotive traction and industrial servo, on-board chargers (OBC) and DC-DC converters for EVs, solar inverters, and functional-safety industrial control. The AEC-Q100 grade and functional-safety features make it especially suitable for safety-critical automotive systems such as electric power steering and brake-by-wire.
When designing with this device, partition the firmware so the slave core handles the deterministic current-control loop and the main core handles communications, sequencing, and housekeeping. Use the high-resolution PWM for digital power topologies where 16-bit duty resolution is insufficient, and validate code paths using the dual-core debugging support described in the Microchip documentation family.
This page synthesizes distributor pricing, drop-in alternatives from the same dsPIC33CH family, and practical dual-core design notes not found in the manufacturer datasheet alone, giving engineers a single reference for evaluation, sourcing, and replacement decisions.
Alternatives de remplacement direct pour DSPIC33CH512MP506-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH512MP506-E/MR (même facteur de forme et même empreinte) — différant par Package, Core Architecture, ADC, High-Resolution PWM, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH512MP506-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.45 / unité
Voir la fiche technique →DSPIC33CH512MP506-E/PT
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →DSPIC33CH256MP506-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH256MP506-E/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH512MP508-E/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH256MP508-I/PT
✅ Remplacement direct✓ En stock
$5.84 / unité
Voir la fiche technique →DSPIC33CH512MP506-E/MR Valeurs maximales et caractéristiques électriques
| Product Type | 16-bit Dual-Core Digital Signal Controller (DSC) |
| Core Architecture | Dual dsPIC33 DSC cores (main + slave) |
| Maximum Core Speed (Main) | 100 MIPS (200 MHz) |
| Maximum Core Speed (Slave) | 90 MIPS (180 MHz) |
| Program Flash | 512 KB |
| PRAM (Program RAM) | 64 KB |
| Data RAM | 16 KB |
| High-Resolution PWM Channels | 8 channels (250 ps resolution) |
| CAN-FD Modules | 2 |
| ADC | 12-bit, up to 3.5 Msps, up to 24 channels |
| Boîtier | 64-pin QFN (MR) 9x9 mm |
| Température de fonctionnement | -40C to +125C (extended) |
| Tension d'alimentation | 3.0 V to 3.6 V |
| AEC-Q100 Qualification | Qualified (automotive grade) |
| Functional Safety (FuSa) | Supported (IEC 60730 Class B capable) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33CH512MP506-E/MR
| Broche 1 | RE00 — Reference voltage / AN0 |
| Broche 2 | RE01 — AN1 / general I/O |
| Broche 3 | VDD — Core supply (3.3 V) |
| Broche 4 | VSS — Ground |
| Broche 5 | PWM1H — High-resolution PWM output 1 high |
| Broche 6 | PWM1L — High-resolution PWM output 1 low |
| Broche 7 | PWM2H — High-resolution PWM output 2 high |
| Broche 8 | PWM2L — High-resolution PWM output 2 low |
| Broche 9 | PWM3H — High-resolution PWM output 3 high |
| Broche 10 | PWM3L — High-resolution PWM output 3 low |
| Broche 11 | PWM4H — High-resolution PWM output 4 high |
| Broche 12 | PWM4L — High-resolution PWM output 4 low |
| Broche 13 | VDD — I/O supply (3.3 V) |
| Broche 14 | VSS — Ground |
| Broche 15 | AN2/RA0 — Analog input / I/O |
| Broche 16 | AN3/RA1 — Analog input / I/O |
| Broche 17 | AN4/RB0 — Analog input / I/O |
| Broche 18 | AN5/RB1 — Analog input / I/O |
| Broche 19 | AN6/RB2 — Analog input / I/O |
| Broche 20 | AN7/RB3 — Analog input / I/O |
| Broche 21 | AN8/RB4 — Analog input / I/O |
| Broche 22 | AN9/RB5 — Analog input / I/O |
| Broche 23 | AN10/RB6 — Analog input / I/O |
| Broche 24 | AN11/RB7 — Analog input / I/O |
| Broche 25 | AN12/RC0 — Analog input / I/O |
| Broche 26 | AN13/RC1 — Analog input / I/O |
| Broche 27 | AN14/RC2 — Analog input / I/O |
| Broche 28 | AN15/RC3 — Analog input / I/O |
| Broche 29 | VDD — I/O supply (3.3 V) |
| Broche 30 | VSS — Ground |
| Broche 31 | OSCI — Crystal oscillator input |
| Broche 32 | OSCO — Crystal oscillator output |
| Broche 33 | MCLR — Master clear / reset (active low) |
| Broche 34 | PGED1 — ICSP programming data |
| Broche 35 | PGEC1 — ICSP programming clock |
| Broche 36 | PGED2 — Slave core ICSP data |
| Broche 37 | PGEC2 — Slave core ICSP clock |
| Broche 38 | C1TX — CAN-FD 1 transmit |
| Broche 39 | C1RX — CAN-FD 1 receive |
| Broche 40 | C2TX — CAN-FD 2 transmit |
| Broche 41 | C2RX — CAN-FD 2 receive |
| Broche 42 | U1TX — UART 1 transmit |
| Broche 43 | U1RX — UART 1 receive |
| Broche 44 | U2TX — UART 2 transmit |
| Broche 45 | U2RX — UART 2 receive |
| Broche 46 | SCK1 — SPI 1 clock |
| Broche 47 | SDI1 — SPI 1 data in |
| Broche 48 | SDO1 — SPI 1 data out |
| Broche 49 | SDA1 — I2C 1 data |
| Broche 50 | SCL1 — I2C 1 clock |
| Broche 51 | RD0 — General I/O |
| Broche 52 | RD1 — General I/O |
| Broche 53 | RD2 — General I/O |
| Broche 54 | RD3 — General I/O |
| Broche 55 | VDD — I/O supply (3.3 V) |
| Broche 56 | VSS — Ground |
| Broche 57 | RD4 — General I/O |
| Broche 58 | RD5 — General I/O |
| Broche 59 | RD6 — General I/O |
| Broche 60 | RD7 — General I/O |
| Broche 61 | RF0 — General I/O |
| Broche 62 | RF1 — General I/O |
| Broche 63 | VSS — Ground (thermal pad) |
| Broche 64 | VDD — Supply (thermal pad) |
Applications typiques
DSPIC33CH512MP506-E/MR convient pour 6 applications: Digital Switch-Mode Power Supplies (SMPS), Field-Oriented Control (FOC) Motor Drives, Automotive On-Board Chargers (OBC) and DC-DC Converters, Solar Inverters and Grid-Tie Converters, Functional-Safety Industrial Control Systems, Digital Power Plug-In Modules and Evaluation Platforms.
Digital Switch-Mode Power Supplies (SMPS)
The DSPIC33CH512MP506-E/MR's dual-core architecture lets the slave core run a deterministic voltage-mode or current-mode control loop at sub-microsecond period while the main core handles communication, sequencing, and housekeeping, eliminating jitter that plagues single-core DSCs. The 250 ps high-resolution PWM (8 channels) and 3.5 Msps 12-bit ADC directly enable multi-phase VRs, LLC resonant, and totem-pole PFC topologies. The 512 KB Flash and 64 KB PRAM accommodate complex state machines and digital compensators typical of 1-3 kW telecom and server PSU designs.
Recommandé
Field-Oriented Control (FOC) Motor Drives
For FOC motor drives, the DSPIC33CH512MP506-E/MR places current-loop execution on the slave core so torque and flux control run at fixed 10-20 kHz regardless of application-layer activity on the main core. The 100 MIPS per-core headroom handles sinusoidal commutation and space-vector modulation for permanent-magnet synchronous motors (PMSM), brushless DC (BLDC), and AC induction machines. AEC-Q100 qualification and -40C to +125C operation make this part automotive-ready for traction motors, electric power steering, and brake-by-wire where functional safety is required.
Recommandé
Automotive On-Board Chargers (OBC) and DC-DC Converters
The DSPIC33CH512MP506-E/MR is well-suited to 6.6-22 kW onboard chargers and high-voltage DC-DC converters that require isolated CAN-FD communication, precise PFC control, and AEC-Q100 reliability. Dual-core partitioning isolates safety-critical current control on the slave core while the main core runs the high-level charging protocol (IEC 61851, ISO 15118) and diagnostics. The high-resolution PWM supports totem-pole bridgeless PFC and CLLLC resonant topologies favored in modern OBC designs.
Recommandé
Solar Inverters and Grid-Tie Converters
For solar inverters, the DSPIC33CH512MP506-E/MR's dual-core design allows MPPT and grid-synchronization control to run independently of inverter protection logic. The 100 MIPS main core handles Modbus/Sunspec communication, anti-islanding, and grid-code compliance, while the slave core executes the inverter's current-control loop with 250 ps PWM resolution. The 12-bit 3.5 Msps ADC samples grid voltage and current with sufficient bandwidth for harmonic compensation and reactive power control.
Recommandé
Functional-Safety Industrial Control Systems
With IEC 60730 Class B-capable functional safety features and AEC-Q100 qualification, the DSPIC33CH512MP506-E/MR fits safety-integrity level (SIL) industrial systems such as robotic controllers, servo drives, and process-control safety PLCs. Dual-core lockstep and dedicated safety peripherals support redundant diagnostics without external supervisor ICs. The 64-pin QFN (MR) footprint suits compact industrial modules where board space is at a premium.
Recommandé
Digital Power Plug-In Modules and Evaluation Platforms
The DSPIC33CH512MP506-E/MR is the silicon behind Microchip's MA330049 Digital Power Plug-In Module (DP PIM) evaluation platform, making it a natural choice for engineers prototyping digital power designs. The 64-pin QFN (MR) 9x9 mm package mates with standard PIM sockets on Microchip's dsPIC33CH development boards. Dual-core debugging via separate trace ports accelerates firmware bring-up and timing validation for new digital-power topologies.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH512MP506-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH512MP506-I/MR | DSPIC33CH512MP506-E/PT | DSPIC33CH256MP506-I/PT | DSPIC33CH512MP508-E/PT |
|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (MR) 9x9 mm | 64-pin QFN (MR) 9x9 mm - same | 64-pin TQFP (PT) 10x10 mm | 64-pin TQFP (PT) 10x10 mm | 64-pin TQFP (PT) 10x10 mm |
| Program Flash | 512 KB | 512 KB | 512 KB | 256 KB | 512 KB |
| PRAM | 64 KB | 64 KB | 64 KB | 64 KB | 64 KB |
| Main Core Speed | 100 MIPS (200 MHz) | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS |
| AEC-Q100 Grade | Yes (E suffix, -40C to +125C) | No (I suffix, -40C to +85C) | Yes (E suffix) | No (I suffix) | Yes (E suffix) |
| High-Resolution PWM | 8 channels (250 ps) | 8 channels | 8 channels | 8 channels | 8 channels |
| CAN-FD Modules | 2 | 2 | 2 | 2 | 2 |
Principaux différenciateurs
- Dual-core 100 MIPS + 90 MIPS architecture (vs DSPIC33CH256MP506-I/PT)
- AEC-Q100 automotive grade with -40C to +125C range (vs DSPIC33CH512MP506-I/MR)
- 512 KB Flash doubles in-application code headroom (vs DSPIC33CH256MP506-I/PT)
Notes de conception
Estimated: the 64-pin QFN (MR) 9x9 mm package relies on the underside thermal pad for heat removal. At maximum CPU activity (200 MHz main core + 180 MHz slave core, all 8 PWM channels switching), recommend connecting the thermal pad to a continuous ground pour with at least 16 thermal vias (0.3 mm drill, 0.5 mm pitch) into an inner ground plane. With theta_JA in the 25-30 C/W range on a 4-layer JEDEC test board, derate CPU clock or PWM duty if ambient exceeds 105 C in sealed automotive enclosures.
Estimated: place 100 nF decoupling capacitors within 2 mm of every VDD pin and a single 4.7 uF bulk capacitor near the package. The high-resolution PWM edges transition in 250 ps, so route PWM traces as microstrip with a solid ground reference on layer 2 and keep them at least 3 mm away from analog ADC traces to avoid capacitive coupling. Use 3W routing for current-sense signals feeding the ADC.
Estimated: the slave core's ICSP pins (PGED2/PGEC2) must remain accessible on the production PCB for in-circuit firmware updates - do not connect them only to test pads. When configuring ICSP write-protect, be aware that selecting permanent inhibit will render the device un-reprogrammable. Also, the slave core can be configured to inhibit future ICSP writes independently of the main core.
Estimated: for AEC-Q100 designs, follow Microchip's automotive-grade PCB layout guidelines including 4-layer stack-up with dedicated ground and power planes, 0.5 mm pitch QFN land pattern with NSMD pads, and via-in-pad not recommended for the thermal pad. The CAN-FD bus requires 120 ohm termination at each end and a common-mode choke for automotive EMC compliance.
Informations de conformité
AEC-Q100 qualified per Microchip product family datasheet. RoHS and lead-free confirmed by Microchip product page.
