DSPIC33CH512MP506-I/MR - Dual-Core 100MHz DSC, 512KB Flash | Microchip
MPN: DSPIC33CH512MP506-I/MR ✓ Active| Qty | Unit Price | Extended |
|---|---|---|
| 1 | $8.5 | $8.50 |
| 10 | $7.65 | $76.50 |
| 100 | $6.8 | $680.00 |
| 500 | $6.1 | $3,050.00 |
| 1,000 | $5.45 | $5,450.00 |
DSPIC33CH512MP506-I/MR Overview
What is a Digital Signal Controller (DSC)? A DSC is a hybrid microcontroller that integrates a DSP engine with a microcontroller core, optimized for real-time control loops where deterministic latency and high-throughput math are required simultaneously. Within the broader hierarchy, a DSC sits between a microcontroller (MCU) and a full DSP, targeting power conversion, motor control, and signal-conditioning applications. The dsPIC33CH family specifically introduces a dual-core architecture where the slave core can offload time-critical tasks (e.g., control-loop computation, housekeeping) from the master core, freeing it to handle communication stacks, user interfaces, and supervisory functions.
Key features include 100 MIPS master / 90 MIPS slave performance, 512 KB Flash with live-update dual-partition support, integrated CAN-FD controllers, high-resolution PWM with 250 ps resolution, a 12-bit 3.5 Msps ADC with up to 24 channels, and a Functional Safety (FuSa) feature set targeting IEC 61508 SIL 2 capable systems. The slave core can independently run user code and exchange data with the master through shared memory and hardware semaphores.
The device uses a 5V tolerant I/O design with separate analog and digital supply domains, supports trace and JTAG debugging on both cores simultaneously, and integrates dual partition Flash for over-the-air firmware updates without service interruption.
Typical applications include digital power conversion (AC/DC, DC/DC, PFC, LLC, wireless charging), high-performance motor control (field-oriented control for PMSM, BLDC), and functional safety systems. The QFN-64 footprint is footprint-compatible with the related dsPIC33CH256MP506 and dsPIC33CH128MP506 variants, allowing scalable platform designs.
When designing with this DSC, allocate boot, code, and data memory regions carefully between the two cores and follow the dsPIC33CH Dual-Core Programming Guide for shared resource arbitration to avoid race conditions on peripheral access.
This page synthesizes distributor pricing, drop-in package-compatible alternatives, and practical dual-core design notes not aggregated on any single manufacturer or distributor page.
Drop-in alternatives for DSPIC33CH512MP506-I/MR — same package, pin-to-pin compatible. Different-package parts requiring PCB rework are excluded.
Variants in this series
Same-series models that are drop-in compatible with DSPIC33CH512MP506-I/MR (same form factor and footprint) — differing in ADC, Core Architecture, Package, Functional Safety, High-Resolution PWM.
Quick Comparison Tool — Select alternative parts for side-by-side comparison:
DSPIC33CH512MP506-E/PT
✅ Drop-In✓ In Stock
$7.65 / Unit
View Datasheet →DSPIC33CH512MP206-I/MR
✅ Drop-In✓ In Stock
$3.96 / Unit
View Datasheet →DSPIC33CH512MP506-I/PT
✅ Drop-In✓ In Stock
$7.8 / Unit
View Datasheet →DSPIC33CH512MP506-I/MR Maximum Ratings & Electrical Characteristics
| Core Architecture | Dual-core 16-bit dsPIC33 DSC (master + slave) |
| Master Core Speed | 100 MIPS (50 MHz) |
| Slave Core Speed | 90 MIPS (45 MHz) |
| Program Memory (Flash) | 512 KB dual-partition |
| RAM | 72 KB (including slave-core RAM) |
| Package | 64-pin QFN (9x9 mm) |
| Operating Temperature | -40C to +85C (industrial) |
| Supply Voltage | 3.0 V to 3.6 V (core), 3.0 V to 5.5 V (I/O tolerant) |
| ADC | 12-bit, up to 3.5 Msps |
| High-Resolution PWM | Yes, 250 ps resolution |
| CAN-FD | Yes |
| Functional Safety | FuSa feature set, IEC 61508 capable |
| Mounting Type | Surface Mount |
| MSL Level | 3 (168 hours) |
| RoHS Status | Compliant |
DSPIC33CH512MP506-I/MR Pin Configuration
| Pin 1 | RP46/PWM4H/RA8 — Remappable I/O / PWM / Port A |
| Pin 2 | RP47/PWM4L/RA9 — Remappable I/O / PWM / Port A |
| Pin 3 | RP48/PWM5H/RA10 — Remappable I/O / PWM / Port A |
| Pin 4 | RP49/PWM5L/RA11 — Remappable I/O / PWM / Port A |
| Pin 5 | VDD — Digital supply voltage (3.3V) |
| Pin 6 | VSS — Digital ground |
| Pin 7 | OSCI/CLKI/RA2 — Crystal oscillator input / Port A |
| Pin 8 | OSCO/CLKO/RA3 — Crystal oscillator output / Port A |
| Pin 9 | PGED3/RP50/RA0 — Programming data / Remappable I/O / Port A |
| Pin 10 | PGEC3/RP51/RA1 — Programming clock / Remappable I/O / Port A |
| Pin 11 | PGED1/AN18/RP52/RB0 — Programming / Analog / Remappable I/O / Port B |
| Pin 12 | PGEC1/AN19/RP53/RB1 — Programming / Analog / Remappable I/O / Port B |
| Pin 13 | AN20/RP54/RB2 — Analog input / Remappable I/O / Port B |
| Pin 14 | AN21/RP55/RB3 — Analog input / Remappable I/O / Port B |
| Pin 15 | AN22/RP56/RB4 — Analog input / Remappable I/O / Port B |
| Pin 16 | AN23/RP57/RB5 — Analog input / Remappable I/O / Port B |
| Pin 17 | VDD — Digital supply voltage (3.3V) |
| Pin 18 | VSS — Digital ground |
| Pin 19 | AN24/RP58/RB6 — Analog input / Remappable I/O / Port B |
| Pin 20 | AN25/RP59/RB7 — Analog input / Remappable I/O / Port B |
| Pin 21 | AN26/RP60/RB8 — Analog input / Remappable I/O / Port B |
| Pin 22 | AN27/RP61/RB9 — Analog input / Remappable I/O / Port B |
| Pin 23 | AN28/RP62/RB10 — Analog input / Remappable I/O / Port B |
| Pin 24 | AN29/RP63/RB11 — Analog input / Remappable I/O / Port B |
| Pin 25 | AN30/RP64/RB12 — Analog input / Remappable I/O / Port B |
| Pin 26 | AN31/RP65/RB13 — Analog input / Remappable I/O / Port B |
| Pin 27 | AN32/RP66/RB14 — Analog input / Remappable I/O / Port B |
| Pin 28 | AN33/RP67/RB15 — Analog input / Remappable I/O / Port B |
| Pin 29 | AVDD — Analog supply voltage |
| Pin 30 | AVSS — Analog ground |
| Pin 31 | RP68/PWM6H/RC0 — Remappable I/O / PWM / Port C |
| Pin 32 | RP69/PWM6L/RC1 — Remappable I/O / PWM / Port C |
| Pin 33 | RP70/PWM7H/RC2 — Remappable I/O / PWM / Port C |
| Pin 34 | RP71/PWM7L/RC3 — Remappable I/O / PWM / Port C |
| Pin 35 | RP72/PWM8H/RC4 — Remappable I/O / PWM / Port C |
| Pin 36 | RP73/PWM8L/RC5 — Remappable I/O / PWM / Port C |
| Pin 37 | RP74/PWM9H/RC6 — Remappable I/O / PWM / Port C |
| Pin 38 | RP75/PWM9L/RC7 — Remappable I/O / PWM / Port C |
| Pin 39 | RP76/SCL1/RC8 — Remappable I/O / I2C clock / Port C |
| Pin 40 | RP77/SDA1/RC9 — Remappable I/O / I2C data / Port C |
| Pin 41 | RP78/RC10 — Remappable I/O / Port C |
| Pin 42 | RP79/RC11 — Remappable I/O / Port C |
| Pin 43 | RP80/RC12 — Remappable I/O / Port C |
| Pin 44 | RP81/RC13 — Remappable I/O / Port C |
| Pin 45 | RP82/RC14 — Remappable I/O / Port C |
| Pin 46 | RP83/RC15 — Remappable I/O / Port C |
| Pin 47 | VDD — Digital supply voltage (3.3V) |
| Pin 48 | VSS — Digital ground |
| Pin 49 | RP84/PWM10H/RD0 — Remappable I/O / PWM / Port D |
| Pin 50 | RP85/PWM10L/RD1 — Remappable I/O / PWM / Port D |
| Pin 51 | RP86/PWM11H/RD2 — Remappable I/O / PWM / Port D |
| Pin 52 | RP87/PWM11L/RD3 — Remappable I/O / PWM / Port D |
| Pin 53 | RP88/C1RX/RD4 — Remappable I/O / CAN-FD receive / Port D |
| Pin 54 | RP89/C1TX/RD5 — Remappable I/O / CAN-FD transmit / Port D |
| Pin 55 | RP90/RD6 — Remappable I/O / Port D |
| Pin 56 | RP91/RD7 — Remappable I/O / Port D |
| Pin 57 | RP92/RD8 — Remappable I/O / Port D |
| Pin 58 | RP93/RD9 — Remappable I/O / Port D |
| Pin 59 | RP94/RD10 — Remappable I/O / Port D |
| Pin 60 | RP95/RD11 — Remappable I/O / Port D |
| Pin 61 | RP96/RD12 — Remappable I/O / Port D |
| Pin 62 | RP97/RD13 — Remappable I/O / Port D |
| Pin 63 | RP98/RD14 — Remappable I/O / Port D |
| Pin 64 | RP99/RD15 — Remappable I/O / Port D |
Typical Applications
DSPIC33CH512MP506-I/MR is suitable for 6 applications: Digital Power Conversion (PFC + LLC), Field-Oriented Control (FOC) Motor Drives, Wireless Charging Transmitter Control, Solar Inverter Control, Functional Safety (IEC 61508) Industrial Control, Automotive Auxiliary Motor Control.
Digital Power Conversion (PFC + LLC)
The DSPIC33CH512MP506-I/MR is purpose-built for digital power conversion, particularly totem-pole PFC and LLC resonant converter topologies. The dual-core architecture lets the master core run the high-level PFC loop at line frequency (50/60 Hz) while the slave core executes the high-bandwidth LLC control loop at switching frequencies up to 1 MHz, keeping each control period deterministic. The 250 ps high-resolution PWM provides fine duty-cycle control needed for soft-switching transitions, while the 3.5 Msps 12-bit ADC samples current and voltage with adequate headroom for 100 kHz+ control bandwidth. The 512 KB dual-partition Flash enables in-field firmware updates without service interruption.
Recommended
Field-Oriented Control (FOC) Motor Drives
Field-oriented control of PMSM and BLDC motors requires simultaneous execution of the Park/Clarke transforms, the current PI loops, and the SVPWM modulator, typically within 10-20 us. On the DSPIC33CH512MP506-I/MR, the slave core is dedicated to the current control loop (running at 20-50 kHz) while the master core handles the slower speed/torque loop, CAN-FD communication, and supervisory diagnostics. The dedicated QEI and 250 ps PWM peripherals eliminate interrupt jitter on commutation edges. Industrial servo drives benefit from the Functional Safety (FuSa) feature set, which supports IEC 61508 SIL 2 architectures with dual-core lockstep.
Recommended
Wireless Charging Transmitter Control
Wireless charging transmitters (Qi, AirFuel) require precise inverter control, foreign object detection (FOD), and real-time communication protocol stacks. The DSPIC33CH512MP506-I/MR's slave core handles the resonant inverter control loop at 100-200 kHz with deterministic latency, while the master core runs the Qi state machine, FOD algorithm, and CAN-FD link to the vehicle bus. The high-resolution PWM enables clean zero-voltage switching (ZVS) transitions critical for EMI compliance. The 512 KB Flash is ample for both the inverter firmware and the Qi library.
Recommended
Solar Inverter Control
String solar inverters require MPPT, grid-synchronization PLL, anti-islanding protection, and reactive power control, all under IEC 62116 and UL 1741 compliance constraints. The dual-core DSPIC33CH512MP506-I/MR partitions the work cleanly: the slave core runs the 16-32 kHz inverter control loop while the master handles the 50/60 Hz grid-synchronization PLL, MPPT algorithm, and CAN-FD or RS-485 communication to the data logger. The Functional Safety (FuSa) feature set is essential for grid-tied inverters that must meet IEC 62109 safety standards. Industrial temperature grade supports outdoor enclosure operation.
Recommended
Functional Safety (IEC 61508) Industrial Control
The DSPIC33CH512MP506-I/MR's dual-core architecture with the Functional Safety (FuSa) feature set enables IEC 61508 SIL 2 and IEC 60730 Class B safety implementations for industrial machinery, elevators, and process control. The slave core can run lockstep with the master for diagnostic coverage, and dedicated hardware self-test routines cover the Flash, RAM, and clock subsystems. Combined with CAN-FD safety protocols (CANopen Safety, J1939), the device is suited to safety-critical distributed control systems. Industrial -40C to +85C operation supports typical control cabinet environments.
Recommended
Automotive Auxiliary Motor Control
Automotive auxiliary loads (water pumps, oil pumps, HVAC blowers, e-compressors) increasingly use BLDC motors with FOC, requiring both functional safety (ISO 26262) and high efficiency. While the -I/MR is industrial-grade (-40C to +85C), the same silicon is used on automotive-grade QFN variants in the dsPIC33CH family. The DSPIC33CH512MP506-I/MR provides the same dual-core FOC architecture at industrial pricing for off-road vehicles, agricultural equipment, and two-wheelers where industrial temperature grade is sufficient. The CAN-FD interface integrates with vehicle body-domain controllers.
Recommended
Recommended Products Summary
Engineering reference data for DSPIC33CH512MP506-I/MR — comparison, design guidance, and compliance information.
Selection Guide
Comparison with Alternatives
| Parameter | This Product | DSPIC33CH512MP506-E/PT | DSPIC33CH512MP206-I/MR | DSPIC33CH512MP506-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin QFN (9x9 mm) | 64-pin TQFP (10x10 mm) - different footprint | 64-pin QFN (9x9 mm) - same footprint | 64-pin TQFP (10x10 mm) - different footprint |
| Flash Memory | 512 KB dual-partition | 512 KB dual-partition | 256 KB (-50%) | 512 KB dual-partition |
| Master Core Speed | 100 MIPS | 100 MIPS | 100 MIPS | 100 MIPS |
| Slave Core Speed | 90 MIPS | 90 MIPS | 90 MIPS | 90 MIPS |
| Operating Temperature | -40C to +85C (industrial) | -40C to +125C (extended) | -40C to +85C (industrial) | -40C to +85C (industrial) |
| CAN-FD | Yes | Yes | Yes | Yes |
| High-Resolution PWM | Yes (250 ps) | Yes (250 ps) | Yes (250 ps) | Yes (250 ps) |
Key Differentiators
- Dual-core architecture with shared memory (vs Single-core dsPIC33EP512MC506)
- 512 KB dual-partition Flash with live update (vs DSPIC33CH256MP206-I/MR)
- Functional Safety (FuSa) feature set (vs Standard dsPIC33CK64MC105)
- Industrial -40C to +85C temperature grade (vs DSPIC33CH512MP506-E/PT (extended -40C to +125C))
Design Notes
The QFN-64 package has an exposed thermal pad (EP) on the underside that must be soldered to a corresponding PCB land pattern to meet thermal specifications. Connect the EP to a clean analog or digital ground plane with at least 8 thermal vias (0.3 mm drill, 1 mm pitch) to provide both electrical connection and a heat dissipation path. Per Microchip AN1078 (QFN PCB layout), missing or insufficient EP soldering can raise junction temperature by 20-30 C in typical motor-control applications.
Place the 3.3V AVDD and VDD pins with separate decoupling networks: a 10 uF bulk capacitor, a 100 nF ceramic close to each VDD pin, and a 100 nF plus 10 nF pair close to each AVDD pin. According to the dsPIC33CH family datasheet, AVDD and VDD should ideally be driven from separate LDO regulators (or at least filtered separately) to prevent digital switching noise from coupling into the ADC measurements. For ADC sampling accuracy better than 1 LSB at 3.5 Msps, hold AVDD ripple below 10 mVpp.
When using the dual-core feature, always initialize the slave core from the master core's startup code before entering the application's main loop, and configure the MSI (Master Slave Interface) mailbox and semaphore peripherals before either core accesses shared memory. Per the dsPIC33CH Dual-Core Programming Guide, accessing shared peripherals (e.g., a single ADC or PWM generator used by both cores) without proper arbitration can cause data corruption or reset. Use the dedicated MSI1IRQ/S1MSIAIRQ interrupt lines rather than polling for inter-core messages.
For PWM signals driving high-current MOSFET or SiC gate drivers, place the dsPIC33CH as close as possible to the gate drivers and use controlled-impedance traces with series damping resistors (22-33 ohm) within 5 mm of the dsPIC pin. According to Microchip AN2390, traces longer than 25 mm should be treated as transmission lines. For switching nodes above 100 V/ns slew rate, keep the high-dV/dt loop area (drain-source-gate-driver-ground) below 1 cm^2 to minimize EMI.
Compliance Information
RoHS compliant per Microchip product page. Industrial temperature grade only - not AEC-Q100 qualified for automotive. For automotive applications, choose dsPIC33CH AEC-Q100 variants in the same family.
