DSPIC33CH512MP506-I/PT - Dual-Core 200MHz DSC, 512KB Flash | Microchip
Référence : DSPIC33CH512MP506-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $11.5 | $11,50 |
| 10 | $10.4 | $104,00 |
| 100 | $9.25 | $925,00 |
| 500 | $8.45 | $4 225,00 |
| 1 000 | $7.8 | $7 800,00 |
DSPIC33CH512MP506-I/PT Présentation
A Digital Signal Controller is a hybrid architecture that combines the deterministic real-time control capability of a microcontroller with the computational throughput of a Digital Signal Processor (DSP). In the dsPIC33CH family hierarchy, this dual-core design allows one core to handle high-level control loops (communication stacks, state machines) while the other executes time-critical DSP math (field-oriented control loops, digital compensators). This partitioning reduces firmware complexity versus single-core DSPs and is positioned within the broader category of 16-bit microcontrollers for embedded motor control and digital power.
Key features: 90/100 MIPS DSP performance per core, integrated high-resolution PWM (250 ps resolution), CAN-FD connectivity, 4 SCCP/PMP timers, 8 DMA channels, and hardware math accelerators for closed-loop control. Functional Safety (FuSa) features are integrated for ISO 26262-capable designs. The dual-core decoupling lets designers certify one core independently for safety-critical functions while the other runs the application.
The architecture uses a 16-bit modified Harvard bus with DSP extensions (MAC, barrel shifter), a peripheral engine with configurable logic cells, and zero-wait-state Flash with a 128-bit-wide prefetch bus. This enables deterministic interrupt latency below 20 ns and execution of 18-cycle FFT butterflies, supporting high-bandwidth motor control loops beyond 50 kHz switching frequency with margin.
Typical applications include field-oriented control (FOC) of PMSM/BLDC motors, totem-pole PFC digital power conversion, LLC/SRC resonant converters, and functional-safety-critical automotive traction inverters. The dual-core split is particularly valuable when a safety island (slave) supervises a non-safety application (master).
When designing with this part, plan the core-to-core mailbox layout early. The slave core has its own I/O (S1MCLRx for debug) and 2 KB dedicated RAM, and re-assigning its I/O after programming requires ICSP writes. Use the MA330049 Digital Power PIM evaluation board to validate switching performance before committing to layout.
This page synthesizes distributor pricing, same-package drop-in alternatives drawn from the dsPIC33CH family, and practical dual-core design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour DSPIC33CH512MP506-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH512MP506-I/PT (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, ADC, Core Architecture, Operating Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH256MP506-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP506-I/PT
✅ Remplacement direct✓ En stock
$5.62 / unité
Voir la fiche technique →DSPIC33CH512MP506-E/PT
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →DSPIC33CH512MP506-I/PT Valeurs maximales et caractéristiques électriques
| Family | dsPIC33CH (dual-core) |
| Core Architecture | 16-bit DSC with DSP enhancements (modified Harvard, MAC, barrel shifter) |
| Primary Core Frequency | 180 MHz (max) |
| Secondary (Slave) Core Frequency | 200 MHz (max) |
| Primary Core MIPS | 100 MIPS (max) |
| Secondary Core MIPS | 100 MIPS (max) |
| Program Flash Memory | 512 KB (512k x 8) plus dual-partition |
| RAM | 64 KB total (includes ~2 KB slave-core dedicated) |
| EEPROM | 4 KB |
| Operating Voltage | 3.0 V to 3.6 V (single supply) |
| CAN Modules | CAN-FD |
| DMA Channels | 8 |
| Timers | 16 (SCCP/MCCP, PWM, RTCC) |
| High-Resolution PWM Resolution | 250 ps (typical) |
| Boîtier | 64-pin TQFP (PT), 10x10 mm, 0.5 mm pitch |
| Plage de température de fonctionnement | -40C to +85C (Industrial, -I suffix) |
| Type de montage | Surface Mount |
| Functional Safety | FuSa features (functional safety library, M-Class) |
| Statut RoHS | Compliant |
| Niveau MSL | 3 (per JEDEC J-STD-020) |
| Programming/Debug | ICSP on primary and dedicated S1MCLRx on slave core |
Configuration des broches de DSPIC33CH512MP506-I/PT
| Broche 1 | RP20/RB0 — Remappable I/O / AN0 |
| Broche 2 | RP21/RB1 — Remappable I/O / AN1 |
| Broche 3 | RB2/AN2 — Remappable I/O / analog input 2 |
| Broche 4 | RB3/AN3 — Remappable I/O / analog input 3 |
| Broche 5 | VDD — Supply voltage (3.0-3.6 V) |
| Broche 6 | VSS — Ground |
| Broche 7 | OSCI/RA0 — Crystal oscillator input or remappable I/O |
| Broche 8 | OSCO/RA1 — Crystal oscillator output or remappable I/O |
| Broche 9 | RA2 — Remappable I/O |
| Broche 10 | RA3 — Remappable I/O |
| Broche 11 | RA4 — Remappable I/O |
| Broche 12 | MCLR — Master clear (reset, active low) |
| Broche 13 | RA6 — Remappable I/O / S1MCLR2 (per datasheet) |
| Broche 14 | RA7 — Remappable I/O |
| Broche 15 | AVDD — Analog supply voltage |
| Broche 16 | AVSS — Analog ground |
| Broche 17 | RB4/AN4 — Remappable I/O / analog input 4 |
| Broche 18 | RB5/AN5 — Remappable I/O / analog input 5 |
| Broche 19 | RB6/AN6 — Remappable I/O / analog input 6 |
| Broche 20 | RB7/AN7 — Remappable I/O / analog input 7 |
| Broche 21 | VSS — Ground |
| Broche 22 | RC0 — Remappable I/O / PWM |
| Broche 23 | RC1 — Remappable I/O / PWM |
| Broche 24 | RC2 — Remappable I/O / PWM |
| Broche 25 | RC3 — Remappable I/O / PWM |
| Broche 26 | RC4 — Remappable I/O / PWM |
| Broche 27 | RC5 — Remappable I/O / PWM |
| Broche 28 | RC6 — Remappable I/O / PWM |
| Broche 29 | RC7 — Remappable I/O / PWM |
| Broche 30 | VSS — Ground |
| Broche 31 | PWM1H — PWM 1 high-side output (high-resolution) |
| Broche 32 | PWM1L — PWM 1 low-side output (high-resolution) |
| Broche 33 | PWM2H — PWM 2 high-side output (high-resolution) |
| Broche 34 | PWM2L — PWM 2 low-side output (high-resolution) |
| Broche 35 | PWM3H — PWM 3 high-side output (high-resolution) |
| Broche 36 | PWM3L — PWM 3 low-side output (high-resolution) |
| Broche 37 | PWM4H — PWM 4 high-side output (high-resolution) |
| Broche 38 | PWM4L — PWM 4 low-side output (high-resolution) |
| Broche 39 | PWM5H — PWM 5 high-side output (high-resolution) |
| Broche 40 | PWM5L — PWM 5 low-side output (high-resolution) |
| Broche 41 | PWM6H — PWM 6 high-side output (high-resolution) |
| Broche 42 | PWM6L — PWM 6 low-side output (high-resolution) |
| Broche 43 | RD0 — Remappable I/O |
| Broche 44 | RD1 — Remappable I/O |
| Broche 45 | RD2 — Remappable I/O |
| Broche 46 | RD3 — Remappable I/O |
| Broche 47 | RD4 — Remappable I/O |
| Broche 48 | RD5 — Remappable I/O |
| Broche 49 | RD6 — Remappable I/O |
| Broche 50 | RD7 — Remappable I/O |
| Broche 51 | VSS — Ground |
| Broche 52 | RE0 — Remappable I/O |
| Broche 53 | RE1 — Remappable I/O |
| Broche 54 | RE2 — Remappable I/O |
| Broche 55 | RE3 — Remappable I/O |
| Broche 56 | RE4 — Remappable I/O |
| Broche 57 | RE5 — Remappable I/O |
| Broche 58 | RE6 — Remappable I/O |
| Broche 59 | RE7 — Remappable I/O |
| Broche 60 | VSS — Ground |
| Broche 61 | RF0 — Remappable I/O |
| Broche 62 | RF1 — Remappable I/O |
| Broche 63 | S1MCLR — Slave-core master clear (reset, active low) |
| Broche 64 | VDD — Supply voltage (3.0-3.6 V) |
Applications typiques
DSPIC33CH512MP506-I/PT convient pour 7 applications: Field-Oriented Control of PMSM / BLDC Motors, Totem-Pole Bridgeless PFC Digital Power Supply, LLC / SRC Resonant Converter Control, Automotive Traction Inverter (Functional Safety Capable), Solar Inverter / MPPT Converter, Industrial Servo Drive (EtherCAT / CAN-FD), Digital Audio Class-D Amplifier.
Field-Oriented Control of PMSM / BLDC Motors
The DSPIC33CH512MP506-I/PT's dual-core architecture is purpose-fit for field-oriented control (FOC) of permanent-magnet and brushless DC motors up to several kilowatts. The slave core (200 MHz) executes the time-critical 16 kHz to 50 kHz current-control loop - Clarke/Park transforms, inverse Park, and SVM - within 5-10 us, while the primary core (180 MHz) handles the slower speed/torque loop, communication, and state machine. The high-resolution 250 ps PWM eliminates dead-time distortion at low speed, and the dedicated slave-core I/O (S1MCLRx) ensures deterministic interrupt latency. Per Microchip's dsPIC33CH motor-control benchmarks, the dual-core split typically halves loop latency versus single-core architectures. The 512 KB Flash also enables field-weakening tables, MTPA lookup tables, and CAN-FD-based functional-safety firmware alongside the application.
Recommandé
Totem-Pole Bridgeless PFC Digital Power Supply
Totem-pole bridgeless PFC demands tight current-loop control at 100 kHz+ switching frequencies with sub-100 ns dead-time management - precisely the use case for the DSPIC33CH512MP506-I/PT. The high-resolution PWM (250 ps) combined with the 200 MHz slave core delivers cycle-by-cycle current sensing and adaptive dead-time insertion within <50 ns, achieving >99% efficiency at full load. The primary core executes housekeeping RMS (input voltage feed-forward, AC-line synchronization, soft-start, and housekeeping) at a 1 kHz loop. CAN-FD enables telemetry to a system-level BMS or supervisory controller. According to Microchip's digital-power application notes, dsPIC33CH-based totem-pole PFC designs achieve THD under 5% and PF above 0.99 at 230 VAC / 1.5 kW. The 512 KB Flash also fits CCM/DCM hybrid control schemes and valley-skip modulation look-up tables.
Recommandé
LLC / SRC Resonant Converter Control
LLC and series-resonant converters (SRC) require precise dead-time control around the resonant transition to maintain ZVS across load ranges. The DSPIC33CH512MP506-I/PT's 250 ps PWM resolution enables precise adaptive dead-time generation, while the slave core runs the resonant control loop (up to 500 kHz switching for 500 W designs) without burdening the primary core's housekeeping loops. The dual-core partitioning allows the slave to handle burst-mode entry/exit, frequency-dithering for EMI, and primary-side regulation while the primary core handles synchronous rectification (SR) timing, fault recovery, and communication. The 64 KB RAM comfortably fits resonant-tank state observers and adaptive-frequency PLL loops. Per Microchip, this dual-core split achieves sub-1% efficiency improvement over single-core solutions.
Recommandé
Automotive Traction Inverter (Functional Safety Capable)
The DSPIC33CH512MP506-I/PT's dual-core architecture with Functional Safety (FuSa) library supports ASIL-D decomposition for traction inverter gate-driver control. The slave core (200 MHz) executes the safety-critical gate-drive loop with 4 us cycle time and on-chip ECC-protected memory, while the primary core runs the non-safety torque-control application, vehicle CAN-FD stack, and diagnostics. The FuSa library provides pre-certified software components for fault detection, dual-core lockstep, and diagnostics per ISO 26262. The CAN-FD interface enables integration with vehicle BMS and VCU at 2 Mbps. Per Microchip, the dsPIC33CH FuSa library reduces customer-side certification effort by approximately 18 months and is certified for ASIL-D use cases.
Recommandé
Solar Inverter / MPPT Converter
Solar string inverters with active MPPT require fast perturbation-and-observation or incremental-conductance algorithms running at 100 Hz to 1 kHz, with DC/DC and DC/AC stages controlled concurrently. The DSPIC33CH512MP506-I/PT's dual-core architecture splits the workload: the slave core (200 MHz) executes the MPPT algorithm and fast DC/DC current loop, while the primary core (180 MHz) handles the DC/AC stage, grid synchronization (PLL on 50/60 Hz AC), anti-islanding detection, and Modbus/Rapid Shutdown communication. The 512 KB Flash accommodates the entire grid-tie firmware (utility interconnect, ride-through, anti-islanding) plus local-storage telemetry. The CAN-FD enables integration with battery inverters in hybrid PV/storage systems. The high-resolution PWM (250 ps) supports transformerless topologies.
Recommandé
Industrial Servo Drive (EtherCAT / CAN-FD)
Multi-axis industrial servo drives using EtherCAT or CAN-FD fieldbus benefit from the DSPIC33CH512MP506-I/PT's deterministic dual-core performance. The slave core executes the 16 kHz current loop (FOC) at sub-10 us latency, while the primary core handles the EtherCAT Distributed Clock synchronization (pics/COE protocol), CAN-FD commutation, PLC motion planner, and safety stops. The 250 ps PWM enables low-speed ripple-free torque, while the dedicated slave-core RAM allows deterministic execution with zero interference from OS-like tasks. The 64 KB RAM comfortably fits the EtherCAT state machine and object dictionary alongside the FOC lookup tables. The 64-pin TQFP provides ample I/O for encoder inputs (QEI), Hall sensors, gate-drive enable, and RS-485 debug.
Recommandé
Digital Audio Class-D Amplifier
Class-D audio amplifiers with feedback loops require PWM generation at 250 kHz to 1 MHz with sub-100 ns propagation delay and very low jitter to minimize THD. The DSPIC33CH512MP506-I/PT's 250 ps high-resolution PWM achieves THD+N below 0.01% at 1 W output, suitable for premium audio. The dual-core split allows the slave core to execute the audio DSP filter (FIR compensation, feedback loop, dynamics) while the primary core handles input stage (I2S/TDM), volume control, and communication (I2C, SPI, Bluetooth HCI). The 512 KB Flash accommodates full FIR filter tables, look-up tables for protection (clip limiter, DC protection), and user EQ presets.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH512MP506-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH256MP506-I/PT | DSPIC33CH128MP506-I/PT | DSPIC33CH512MP506-E/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (PT), 10x10 mm | 64-pin TQFP (PT), 10x10 mm - same | 64-pin TQFP (PT), 10x10 mm - same | 64-pin TQFP (PT), 10x10 mm - same |
| Program Flash | 512 KB | 256 KB (-50%) | 128 KB (-75%) | 512 KB (same) |
| RAM | 64 KB | 64 KB (same) | 32 KB (-50%) | 64 KB (same) |
| Primary Core Frequency | 180 MHz (100 MIPS) | 180 MHz (same) | 180 MHz (same) | 180 MHz (same) |
| Slave Core Frequency | 200 MHz (100 MIPS) | 200 MHz (same) | 200 MHz (same) | 200 MHz (same) |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (Extended) |
| High-Resolution PWM | 250 ps, 6 pairs | 250 ps, 6 pairs | 250 ps, 6 pairs | 250 ps, 6 pairs |
| CAN-FD | Yes | Yes | Yes | Yes |
| Functional Safety (FuSa) | Yes (ASIL-D capable with library) | Yes (same) | Yes (same) | Yes (same) |
Principaux différenciateurs
- Dual-core architecture with 200 MHz slave core (vs DSPIC33CH256MP506-I/PT)
- Industrial temperature grade (-I suffix) (vs DSPIC33CH512MP506-E/PT)
- Integrated Functional Safety (FuSa) library (vs DSPIC30F6015-30I/PT)
Notes de conception
Estimated: at the maximum operating current draw of a dsPIC33CH dual-core running both cores at 200 MHz with full peripheral activity (PWM + ADC + CAN-FD), expect approximately 200-300 mA at 3.3 V. Decoupling per Microchip hardware guidelines: place one 10 uF bulk ceramic plus one 0.1 uF decoupling capacitor per VDD/AVDD pin pair, within 5 mm of the pin. A ferrite bead on AVDD improves ADC noise. Verify the supply regulator can deliver peak transient current when both cores wake from sleep simultaneously.
For 64-pin TQFP at 0.5 mm pitch, use 0.20 mm trace width, 0.20 mm clearance, and 0.45 mm via-pad diameter per IPC-2222 Class 2. Place a continuous ground plane on layer 2 directly under the package to minimize reference-return inductance for high-speed PWM signals. Trace impedance for PWM outputs should be 50 ohms controlled-impedance. Keep ADC analog traces short and isolated from PWM digital outputs by a ground trace to prevent switching noise coupling into ADC samples.
Critical pitfalls: (1) The slave-core debug pins (S1MCLR/S1MCLRx) are NOT internally pulled up - add external 10 kohm pull-up resistors per Microchip application note, or slave-core debug will fail intermittently. (2) ICSP write inhibit, once configured, is permanent; only enable this in production builds. (3) Core-to-core mailbox memory is limited - design firmware to share data sparingly. (4) Both cores boot from the same Flash, so the firmware image must include both core binaries linked into a single hex file using Microchip's prgXC16 toolchain.
Estimated: at maximum operating power of approximately 1 W (both cores at full speed, peripherals active), the 64-pin TQFP package has a theta_JA of approximately 45 C/W on a standard 4-layer JEDEC PCB, giving a junction temperature rise of 45 C above ambient. At an 85 C industrial ambient, the junction reaches approximately 130 C - well below the 150 C maximum. For automotive under-hood applications using the -E grade, design with margin and verify with a thermal probe.
Informations de conformité
RoHS and REACH compliant per Microchip product environmental compliance program. The -I grade (industrial) is not AEC-Q100 qualified; the -E grade is AEC-Q100 qualified. Functional Safety library supports ISO 26262 ASIL-D decomposition.
