DSPIC33CH512MP508-I/PT - Dual-Core 100MHz DSC, 80-TQFP | Microchip
Référence : DSPIC33CH512MP508-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.91 | $6,91 |
| 10 | $6.45 | $64,50 |
| 100 | $5.85 | $585,00 |
| 500 | $5.3 | $2 650,00 |
| 1 000 | $4.95 | $4 950,00 |
DSPIC33CH512MP508-I/PT Présentation
A Digital Signal Controller is a hybrid MCU+DSP class of microcontroller that fuses deterministic real-time control peripherals with single-cycle MAC DSP throughput. The dsPIC33CH family specifically addresses systems requiring hardware-isolated tasks: the master core runs user application code, while the slave core is dedicated to time-critical control loops. This dual-core architecture lets designers separate motor control math, communication stacks, and housekeeping tasks onto independent processors within a single silicon die.
Key features include 12 high-resolution 16-bit PWMs with 250 ps edge resolution, four 12-bit ADC modules with up to 3.5 MSPS conversion rate, two 12-bit DACs, three op-amps, and CAN FD support. The slave core adds dedicated peripherals including its own PWM, ADC, and comparator channels, allowing independent control of a second motor or power stage. Live update of firmware is enabled on the slave while the master runs unaffected, supporting functional safety workflows.
The dsPIC33CH architecture uses a modified Harvard bus with separate instruction and data paths, allowing simultaneous instruction fetch and data access. The DSP engine provides a 17x17-bit multiplier and a 40-bit ALU that completes a single-cycle MAC in one instruction cycle, enabling efficient FFT, FIR, and PI control loop execution. The integrated peripherals are routed through Microchip's Peripheral Trigger Generator (PTG) for deterministic event sequencing without CPU intervention.
Typical applications include high-performance PMSM and BLDC motor control for industrial drives, servo amplifiers, and traction inverters. Additional uses span digital-controlled switch-mode power supplies, wireless battery chargers, and photovoltaic micro-inverters where the dual cores isolate the control loop from the system management layer.
When designing with this device, ensure both cores are programmed through their respective ICSP interfaces and that PCB layout follows the datasheet decoupling and analog grounding guidance. The 80-pin TQFP package has higher thermal mass than QFN options and supports larger copper pours for high-current gate driver output stages.
This page synthesizes distributor pricing, drop-in alternatives, application notes, and engineering design guidance not found in the manufacturer datasheet alone, providing a one-stop reference for evaluating the DSPIC33CH512MP508-I/PT in real-world designs.
Alternatives de remplacement direct pour DSPIC33CH512MP508-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CH512MP508-I/PT (même facteur de forme et même empreinte) — différant par Package, ADC, Operating Temperature, Program Memory (Flash), Core Architecture.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CH512MP506-I/PT
✅ Remplacement direct✓ En stock
$7.8 / unité
Voir la fiche technique →DSPIC33CH512MP506T-I/PT
✅ Remplacement direct✓ En stock
$6.1 / unité
Voir la fiche technique →DSPIC33CH512MP506-E/PT
✅ Remplacement direct✓ En stock
$7.65 / unité
Voir la fiche technique →DSPIC33CH512MP208-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$8.55 / unité
Voir la fiche technique →DSPIC33CH256MP508-I/PT
✅ Remplacement direct✓ En stock
$5.84 / unité
Voir la fiche technique →DSPIC33CH256MP506-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CH128MP508-I/PT
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.25 / unité
Voir la fiche technique →DSPIC33CH512MP508-I/PT Valeurs maximales et caractéristiques électriques
| Architecture | 16-bit dsPIC DSC (modified Harvard) |
| Core Configuration | Dual-core (Master + Slave), independent execution |
| Master Core Speed | 100 MIPS at 100 MHz CPU clock |
| Slave Core Speed | 100 MIPS at 100 MHz CPU clock |
| Program Flash Memory | 512 KB |
| Data RAM | 64 KB |
| Instruction RAM | 24 KB |
| Boîtier | 80-pin TQFP (PT), 12x12 mm |
| Operating Voltage | 3.0 V to 3.6 V |
| High-Resolution PWM | 12 channels with 250 ps edge resolution |
| ADC | Four 12-bit, up to 3.5 MSPS |
| DAC | Two 12-bit |
| Operational Amplifiers | Three on-chip op-amps |
| Comparators | Three high-speed analog comparators |
| CAN | CAN FD support |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Type de montage | Surface Mount |
| Statut RoHS | Compliant |
| Lead-Free | Yes |
Guide de configuration des broches du DSPIC33CH512MP508-I/PT 80-pin tqfp (pt), 12x12 mm
Configuration des broches du DSPIC33CH512MP508-I/PT (boîtier 80-pin tqfp (pt), 12x12 mm). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33CH512MP508-I/PT.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33CH512MP508-I/PT convient pour 6 applications: PMSM / BLDC Motor Control, Servo Amplifier and Robotics Drive, Digital Switch-Mode Power Supply, Photovoltaic Micro-Inverter, Wireless EV Battery Charger, Industrial Fieldbus Sensor Hub.
PMSM / BLDC Motor Control
The DSPIC33CH512MP508-I/PT's dual-core 100 MIPS architecture and 12 high-resolution PWMs with 250 ps edge resolution make it ideal for permanent magnet synchronous motor and brushless DC motor control. The master core runs the FOC algorithm with single-cycle 17x17 MAC DSP math, while the slave core handles the high-resolution PWM edge placement and current sampling, eliminating CPU jitter in the control loop. The three on-chip op-amps directly condition shunt resistor signals for the four 3.5 MSPS ADC modules, achieving sub-microsecond current-loop response.
Recommandé
Servo Amplifier and Robotics Drive
In servo amplifier designs, the DSPIC33CH512MP508-I/PT's slave core is dedicated to the torque and current loop while the master core runs the position loop and EtherCAT communication stack simultaneously. The 24 KB instruction-side RAM and 64 KB data RAM accommodate large position tables for multi-axis trajectory planning. The 250 ps PWM resolution supports >50 kHz switching frequencies needed for low-inductance servo motors.
Recommandé
Digital Switch-Mode Power Supply
The DSPIC33CH512MP508-I/PT excels in digitally-controlled SMPS designs because the slave core can be flashed with control firmware while the master continues regulation uninterrupted, supporting live update without power interruption. Its high-resolution PWM and 12-bit 3.5 MSPS ADC enable phase-shifted full-bridge, LLC, and totem-pole PFC topologies with cycle-by-cycle control. The on-chip op-amps and comparators close the current-mode feedback loop without external analog ICs, reducing BOM cost and PCB area.
Recommandé
Photovoltaic Micro-Inverter
For photovoltaic micro-inverters and string inverters, the DSPIC33CH512MP508-I/PT's two independent cores isolate MPPT and grid-synchronization control loops from each other. The CAN FD and UART peripherals enable inter-inverter communication for module-level monitoring. The integrated 12-bit DACs drive the inverter's analog housekeeping functions while the high-resolution PWMs drive the full-bridge power stage with < 1% THD output current.
Recommandé
Wireless EV Battery Charger
The DSPIC33CH512MP508-I/PT is suited for wireless EV battery chargers where the master core executes the SAE J2954 communication protocol while the slave core maintains resonant tank control with sub-microsecond update rate. The 100 MIPS slave core handles Foreign Object Detection (FOD) real-time signal processing, and the 512 KB Flash stores lookup tables for coil alignment compensation. CAN FD enables integration with the vehicle's BMS bus.
Recommandé
Industrial Fieldbus Sensor Hub
As an industrial fieldbus sensor hub, the DSPIC33CH512MP508-I/PT aggregates multiple sensor inputs through its high-speed ADC and comparator channels, pre-processing the data on the slave core while the master core transmits over CAN FD or UART. The on-chip op-amps interface directly with bridge sensors, RTDs, and 4-20 mA loops. The 64 KB RAM and 24 KB instruction RAM buffer continuous logging for predictive maintenance analytics.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CH512MP508-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CH512MP506-I/PT | DSPIC33CH512MP506T-I/PT | DSPIC33CH512MP506-E/PT | DSPIC33CH512MP208-I/PT | DSPIC33CH256MP508-I/PT | DSPIC33CH256MP506-I/PT | DSPIC33CH128MP508-I/PT |
|---|---|---|---|---|---|---|---|---|
| Package | TQFP-80 (PT), 12x12 mm | TQFP-80 (PT) - same | TQFP-80 (PT) - same | TQFP-80 (PT) - same | TQFP-80 (PT) - same | TQFP-80 (PT) - same | TQFP-80 (PT) - same | TQFP-80 (PT) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Master Core Speed | 100 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 100 MIPS | 70 MIPS | 100 MIPS |
| Program Flash Memory | 512 KB | 512 KB | 512 KB | 512 KB | 512 KB | 256 KB | 256 KB | 128 KB |
| Data RAM | 64 KB | 64 KB | 64 KB | 64 KB | 32 KB | 64 KB | 32 KB | 32 KB |
| High-Resolution PWM | 12 channels, 250 ps | 12 channels, 250 ps | 12 channels, 250 ps | 12 channels, 250 ps | 12 channels | 12 channels, 250 ps | 12 channels | 12 channels, 250 ps |
| ADC Modules | 4x 12-bit, 3.5 MSPS | 4x 12-bit, 3.5 MSPS | 4x 12-bit, 3.5 MSPS | 4x 12-bit, 3.5 MSPS | 4x 12-bit | 4x 12-bit, 3.5 MSPS | 4x 12-bit | 4x 12-bit, 3.5 MSPS |
| Operating Temperature | -40C to +85C (Industrial) | -40C to +85C | -40C to +85C | -40C to +125C (Extended) | -40C to +85C | -40C to +85C | -40C to +85C | -40C to +85C |
Principaux différenciateurs
- Dual-core 100 MIPS architecture (vs DSPIC33CK256MP508)
- Industry-largest Flash density in dsPIC33CH family (vs DSPIC33CH256MP508-I/PT)
- Pin-compatible extended temperature option (vs DSPIC33CH512MP508-E/PT)
Notes de conception
Estimated: At maximum operating power of ~0.5 W (typical motor control workload), the TQFP-80 package has theta_JA of approximately 50 C/W. The junction temperature would rise ~25 C above ambient at 25 C room temperature, well within the -40C to +85C industrial rating. For high ambient temperature installations, route PCB copper pours to the exposed die attach pad (if present on the TQFP variant) to reduce junction temperature. For enclosed industrial drives >70C ambient, consider the DSPIC33CH512MP508-E/PT extended temperature variant.
Place 100 nF decoupling capacitors as close as possible to every AVDD and DVDD pin pair. The datasheet recommends a bulk 10 uF tantalum or ceramic capacitor within 1 cm of the package. Separate analog and digital ground planes should connect at a single point near the MCU's analog ground pin to avoid digital switching noise coupling into analog ADC inputs. Reserve space for a debug ICSP header with 6-pin RJ-11 or 0.1 inch header for both master and slave cores to support in-circuit programming.
Do not forget to configure the slave core's S1MCLRx debug pin with a pull-up or pull-down as appropriate for the debugger interface; an unconfigured pin can prevent slave core programming. Avoid programming both cores through the same ICSP interface simultaneously; each core requires its own ICSP session with PGECx/PGEDx pair. When migrating code between master and slave cores, verify the Peripheral Trigger Generator (PTG) and DMA assignments are core-specific, as peripherals cannot be accessed cross-core in real time.
High-resolution PWM outputs and crystal oscillator traces must be impedance-matched with continuous ground reference. Avoid routing PWM traces near analog op-amp inputs to prevent switching noise coupling. The 250 ps PWM edge resolution requires minimal trace inductance; use wide power traces (>= 0.5 mm) for high-current gate driver outputs. For CAN FD signals, use 120 ohm termination at each end of the bus and route differential pairs with controlled 100 ohm impedance.
Informations de conformité
RoHS compliant per Microchip product page. Industrial temperature grade - not AEC-Q100 qualified; choose DSPIC33CH512MP508-E/PT for extended temperature.