DSPIC33CK128MP502-E/2N - 100MHz 128KB CAN-FD DSC | Microchip
Référence : DSPIC33CK128MP502-E/2N ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.62 | $4,62 |
| 10 | $4.16 | $41,60 |
| 100 | $3.71 | $371,00 |
| 500 | $3.35 | $1 675,00 |
| 1 000 | $3.02 | $3 020,00 |
DSPIC33CK128MP502-E/2N Présentation
A digital signal controller is a hybrid of a microcontroller (MCU) and a digital signal processor (DSP): it combines the deterministic control peripherals and interrupt architecture of an MCU with the multiply-accumulate (MAC) DSP engine needed for fast control-loop mathematics. In the embedded-systems hierarchy, the dsPIC33CK family sits within Microchip's 16-bit DSC portfolio, bridging general-purpose PIC microcontrollers and high-performance 32-bit MCUs, and is purpose-built for digital power, motor control and advanced sensing.
Key features of this device include the dsPIC33CK core executing up to 100 MIPS (DC to 100 MIPS), AEC-Q100 qualification for automotive use, an extended operating temperature range of -40C to +150C, and a supply range of 3.0V to 3.6V. The dual-panel flash architecture supports live field firmware updates, while ECC protects program memory integrity.
Architecturally, the modified Harvard core provides separate program and data buses, a hardware DSP engine with single-cycle MAC, and tightly coupled peripherals including high-resolution PWM for switching power stages, 12-bit ADCs for current and voltage sensing, and CAN FD for robust in-vehicle or industrial networking. The -E/2N suffix denotes the extended temperature grade in the 28-pin UQFN package with exposed thermal pad.
Typical applications include digital power supplies and PFC stages, BLDC/PMSM motor control, automotive subsystems requiring CAN FD, and high-performance sensing front-ends that leverage the integrated op-amps and fast ADCs.
A key design consideration: the 3.0V to 3.6V supply window means 5V systems require level shifting or a regulator, and the exposed pad must be soldered to a ground pour for thermal and signal-integrity performance.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33CK128MP502-E/2N — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CK128MP502-E/2N (même facteur de forme et même empreinte) — différant par Package, Architecture, Operating Temperature, CAN Interface, Core.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CK128MP502-I/2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.05 / unité
Voir la fiche technique →DSPIC33CK128MP502-H/2N
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CK256MP502-E/2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33CK64MP502-E/2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →DSPIC33CK128MP202-I/2N
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.05 / unité
Voir la fiche technique →DSPIC33CK128MP502-E/2N Valeurs maximales et caractéristiques électriques
| Core | dsPIC33CK 16-bit DSC core |
| Fréquence d'horloge maximale | 100 MHz (100 MIPS) |
| Program Flash Memory | 128 KB (dual-partition with ECC and Live Update) |
| Data SRAM | 16 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| Plage de température de fonctionnement | -40C to +150C |
| Boîtier | 28-UQFN (6x6), exposed pad, 0.65 mm terminal pitch |
| Type de montage | Surface Mount |
| CAN Interface | CAN Flexible Data (CAN FD) |
| ADC | 12-bit ADCs |
| PWM | High-Resolution PWM |
| Analog Peripherals | Integrated op-amps |
| Qualification | AEC-Q100, Automotive |
| Architecture | Modified Harvard, single-core, integrated DSP engine |
| Series | dsPIC33CK (dsPIC 33CK) |
Guide de configuration des broches du DSPIC33CK128MP502-E/2N 28-uqfn (6x6), exposed pad, 0.65 mm terminal pitch
Configuration des broches du DSPIC33CK128MP502-E/2N (boîtier 28-uqfn (6x6), exposed pad, 0.65 mm terminal pitch). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33CK128MP502-E/2N.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33CK128MP502-E/2N convient pour 6 applications: Digital Power Supplies and PFC, BLDC/PMSM Motor Control, Automotive CAN FD Networked Nodes, Advanced Sensing and Signal Conditioning, Industrial Control and Automation, High-Performance Embedded Systems.
Digital Power Supplies and PFC
The DSPIC33CK128MP502-E/2N fits digital power designs because its 100 MIPS dsPIC33CK core executes compensation-loop math fast enough for switching frequencies in the hundreds of kHz, while the high-resolution PWM delivers fine duty-cycle granularity for precise regulation. The 12-bit ADCs sample voltage and current feedback synchronously with the PWM, minimizing control-latency jitter, and integrated op-amps condition shunt or current-transformer signals without external amplifiers. In a typical topology, the DSC runs the control loop in an ADC interrupt at each PWM cycle, outputs duty via the high-resolution PWM, and reports telemetry over UART or CAN FD. Unlike purely analog controllers, firmware allows soft-start profiles, adaptive limits and field updates via dual-partition Live Update flash.
Recommandé
BLDC/PMSM Motor Control
For motor control, the DSPIC33CK128MP502-E/2N offers the core speed and peripheral set that field-oriented control (FOC) demands: a 100 MHz core performing Clarke/Park transforms and PI current loops at PWM frequency, high-resolution PWM driving a three-phase inverter with programmable dead time, and fast 12-bit ADCs triggered at the PWM center for low-noise phase-current sampling. Integrated op-amps amplify shunt currents on-chip, cutting external component count. The 28-UQFN (6x6) exposed-pad package keeps the controller compact on inverter boards, and the -40C to +150C range suits thermally demanding drive environments. Dual-partition flash with Live Update allows field firmware upgrades on deployed drives without interrupting motor operation.
Recommandé
Automotive CAN FD Networked Nodes
The DSPIC33CK128MP502-E/2N is AEC-Q100 qualified and operates from -40C to +150C, meeting the environmental requirements of automotive subsystems, and its integrated CAN FD module provides the higher bandwidth and 64-byte payloads needed on modern in-vehicle networks. Typical nodes include actuator control, sensor hubs and small power converters that bridge CAN FD with local PWM control loops. The 3.0V to 3.6V supply integrates with standard automotive 3.3V rails behind a transient-protected regulator, and ECC on the 128 KB dual-partition flash safeguards program memory against bit upsets. Firmware can implement functional-safety-style memory self-tests supported by the family's MBIST features, while the DSP engine handles filtering of raw sensor data.
Recommandé
Advanced Sensing and Signal Conditioning
The DSPIC33CK128MP502-E/2N serves advanced sensing nodes because its integrated op-amps, 12-bit ADCs and hardware DSP engine form a complete analog-signal chain on one chip: op-amps amplify sensor outputs, ADCs digitize them synchronously, and the single-cycle MAC accelerates digital filtering (IIR/FIR) and FFT analysis at up to 100 MIPS. This makes the part effective for high-performance sensing such as precision current monitoring, vibration analysis and ultrasonic processing. The 16 KB SRAM buffers sample windows while the 128 KB ECC flash stores calibration tables. At the same time, CAN FD or UART exports processed results to a host, offloading the main controller in distributed measurement architectures.
Recommandé
Industrial Control and Automation
In industrial automation, the DSPIC33CK128MP502-E/2N acts as a compact real-time controller combining deterministic loop execution (100 MIPS core with low interrupt latency), robust communication (CAN FD for fieldbus interconnect), and configurable analog I/O (12-bit ADCs and op-amps for process-variable measurement). Typical deployments include pump and fan control, power monitoring nodes, and small PLC peripheral modules mounted close to actuators. The extended -40C to +150C operating range tolerates cabinet and motor-junction temperature extremes, while the 28-UQFN (6x6) footprint fits dense control boards. Dual-partition flash with ECC and Live Update permits firmware maintenance windows without full board downtime, reducing service cost across installed industrial equipment.
Recommandé
High-Performance Embedded Systems
As a general high-performance embedded controller, the DSPIC33CK128MP502-E/2N balances DSP throughput and MCU-style peripheral integration: 100 MIPS execution, 128 KB ECC dual-partition flash and 16 KB RAM host demanding firmware, while CAN FD, UART/SPI/I2C serial engines and high-resolution PWM cover most connectivity and actuation needs. Applications include dense instrumentation boards, robotics subcontrollers, and signal-processing front-ends where a 32-bit application processor handles user interfaces but delegates hard-real-time loops to a DSC. The 6x6 mm UQFN package with 0.65 mm pitch suits space-constrained designs, and Microchip's MPLAB X + XC16 toolchain with family code reuse shortens the development cycle for new embedded products.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CK128MP502-E/2N — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CK128MP502-I/2N | DSPIC33CK128MP502-H/2N | DSPIC33CK256MP502-E/2N | DSPIC33CK64MP502-E/2N | DSPIC33CK128MP202-I/2N |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (6x6), exposed pad | 28-UQFN (6x6) - same | 28-UQFN/28-PQCC - same footprint | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB | 128 KB | 128 KB | 256 KB | 64 KB | 128 KB |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Temperature Range | -40C to +150C | -40C to +85C | -40C to +150C | -40C to +150C | -40C to +150C | -40C to +85C |
| CAN FD | Yes | Yes | Yes | Yes | Yes | Yes (MP-series peripheral set) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
Principaux différenciateurs
- Extended temperature range to +150C (vs DSPIC33CK128MP502-I/2N)
- Integrated op-amps and CAN FD in 28 pins (vs DSPIC33CK128MP202-I/2N)
- Dual-partition ECC flash with Live Update (vs DSPIC33CK64MP502-E/2N)
Notes de conception
The 28-UQFN (6x6) package has an exposed pad on the underside that must be soldered to a ground pour, not left floating. Design the PCB land pattern per Microchip's package outline drawing with a solder-mask-defined window array over the pad to control solder volume, and add multiple thermal vias (0.3 mm diameter, filled or tented) connecting to inner ground planes. This exposed pad is the primary ground return and heat path; an unsoldered pad causes unreliable operation at 100 MHz and poor thermal performance near the +150C rating.
The device operates only from 3.0V to 3.6V, so generate the core supply with a low-noise LDO or buck from the system rail. Estimated: at 100 MIPS with CMOS I/O toggling, core current is typically tens of mA (consult the datasheet electrical characteristics chapter for exact ICC figures); a 300 mA LDO provides ample margin. Place a 0.1 uF ceramic capacitor at each VDD pin within 2 mm, plus a bulk 10 uF capacitor per power domain. In automotive 12V systems, add reverse-polarity and load-dump protection upstream of the regulator.
The dual-partition flash with Live Update is a major advantage, but branching between partitions requires careful linker-script configuration and a valid boot sequence; test the swap path thoroughly including power-loss during erase. Also note the temperature-suffix distinction: the -E grade covers -40C to +150C, while -I parts stop at +85C - substituting an -I part in an automotive near-engine location will violate its ratings. Finally, confirm 5V tolerance of I/O pins in the datasheet before interfacing with 5V logic, since the supply window is 3.3V only.
Informations de conformité
Listed as Automotive, AEC-Q100 by distributor product data (Hotenda). RoHS/lead-free status per standard Microchip ecompliance; verify exact certificates on Microchip's Green/RoHS pages.
