DSPIC33CK128MP502-E/2N - 100MHz 128KB CAN-FD DSC | Microchip
부품 번호: DSPIC33CK128MP502-E/2N ✓ 활성| 수량 | 단가 | 합계 |
|---|---|---|
| 1 | $4.62 | $4.62 |
| 10 | $4.16 | $41.60 |
| 100 | $3.71 | $371.00 |
| 500 | $3.35 | $1,675.00 |
| 1,000 | $3.02 | $3,020.00 |
DSPIC33CK128MP502-E/2N 개요
A digital signal controller is a hybrid of a microcontroller (MCU) and a digital signal processor (DSP): it combines the deterministic control peripherals and interrupt architecture of an MCU with the multiply-accumulate (MAC) DSP engine needed for fast control-loop mathematics. In the embedded-systems hierarchy, the dsPIC33CK family sits within Microchip's 16-bit DSC portfolio, bridging general-purpose PIC microcontrollers and high-performance 32-bit MCUs, and is purpose-built for digital power, motor control and advanced sensing.
Key features of this device include the dsPIC33CK core executing up to 100 MIPS (DC to 100 MIPS), AEC-Q100 qualification for automotive use, an extended operating temperature range of -40C to +150C, and a supply range of 3.0V to 3.6V. The dual-panel flash architecture supports live field firmware updates, while ECC protects program memory integrity.
Architecturally, the modified Harvard core provides separate program and data buses, a hardware DSP engine with single-cycle MAC, and tightly coupled peripherals including high-resolution PWM for switching power stages, 12-bit ADCs for current and voltage sensing, and CAN FD for robust in-vehicle or industrial networking. The -E/2N suffix denotes the extended temperature grade in the 28-pin UQFN package with exposed thermal pad.
Typical applications include digital power supplies and PFC stages, BLDC/PMSM motor control, automotive subsystems requiring CAN FD, and high-performance sensing front-ends that leverage the integrated op-amps and fast ADCs.
A key design consideration: the 3.0V to 3.6V supply window means 5V systems require level shifting or a regulator, and the exposed pad must be soldered to a ground pour for thermal and signal-integrity performance.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
드롭인 대체품: DSPIC33CK128MP502-E/2N — 동일 패키지, 핀 호환. PCB 재작업이 필요한 다른 패키지 부품은 제외됩니다.
이 시리즈의 변형
다음과 드롭인 호환되는 동일 시리즈 모델: DSPIC33CK128MP502-E/2N (동일 폼 팩터 및 풋프린트) — 차이점: Package, Architecture, Operating Temperature, CAN Interface, Core.
빠른 비교 도구 — 나란히 비교할 대체 부품을 선택하십시오:
DSPIC33CK128MP502-I/2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.05 / 개
데이터시트 보기 →DSPIC33CK128MP502-H/2N
✅ 드롭인📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK256MP502-E/2N
✅ 드롭인 ⚠️ 사양 미검증📋 참조 대체품 (카탈로그에 없음)
DSPIC33CK64MP502-E/2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
가격 문의
데이터시트 보기 →DSPIC33CK128MP202-I/2N
✅ 드롭인 ⚠️ 사양 미검증✓ 재고 있음
$3.05 / 개
데이터시트 보기 →DSPIC33CK128MP502-E/2N 최대 정격 & 전기적 특성
| Core | dsPIC33CK 16-bit DSC core |
| 최대 클록 주파수 | 100 MHz (100 MIPS) |
| Program Flash Memory | 128 KB (dual-partition with ECC and Live Update) |
| Data SRAM | 16 KB |
| Supply Voltage Range | 3.0 V to 3.6 V |
| 동작 온도 범위 | -40C to +150C |
| 패키지 | 28-UQFN (6x6), exposed pad, 0.65 mm terminal pitch |
| 실장 유형 | Surface Mount |
| CAN Interface | CAN Flexible Data (CAN FD) |
| ADC | 12-bit ADCs |
| PWM | High-Resolution PWM |
| Analog Peripherals | Integrated op-amps |
| Qualification | AEC-Q100, Automotive |
| Architecture | Modified Harvard, single-core, integrated DSP engine |
| Series | dsPIC33CK (dsPIC 33CK) |
DSPIC33CK128MP502-E/2N 28-uqfn (6x6), exposed pad, 0.65 mm terminal pitch 핀 구성 가이드
DSPIC33CK128MP502-E/2N(28-uqfn (6x6), exposed pad, 0.65 mm terminal pitch 패키지)의 핀 구성입니다. 이 디지털 IC에는 GPIO, 통신 인터페이스(UART, SPI, I2C), 전원 핀이 포함되어 있습니다. 대체 핀 기능과 구성 옵션은 제조사 데이터시트를 참조하십시오. 임베디드 시스템 설계와 PCB 레이아웃에 필수적입니다.
다음에 대한 상세 핀아웃 데이터 없음: DSPIC33CK128MP502-E/2N.
다음을 참조하십시오: 데이터시트 전체 핀 구성은 다음을 참조하십시오.
일반적인 애플리케이션
DSPIC33CK128MP502-E/2N 적합 용도: 6 애플리케이션s: Digital Power Supplies and PFC, BLDC/PMSM Motor Control, Automotive CAN FD Networked Nodes, Advanced Sensing and Signal Conditioning, Industrial Control and Automation, High-Performance Embedded Systems.
Digital Power Supplies and PFC
The DSPIC33CK128MP502-E/2N fits digital power designs because its 100 MIPS dsPIC33CK core executes compensation-loop math fast enough for switching frequencies in the hundreds of kHz, while the high-resolution PWM delivers fine duty-cycle granularity for precise regulation. The 12-bit ADCs sample voltage and current feedback synchronously with the PWM, minimizing control-latency jitter, and integrated op-amps condition shunt or current-transformer signals without external amplifiers. In a typical topology, the DSC runs the control loop in an ADC interrupt at each PWM cycle, outputs duty via the high-resolution PWM, and reports telemetry over UART or CAN FD. Unlike purely analog controllers, firmware allows soft-start profiles, adaptive limits and field updates via dual-partition Live Update flash.
추천
BLDC/PMSM Motor Control
For motor control, the DSPIC33CK128MP502-E/2N offers the core speed and peripheral set that field-oriented control (FOC) demands: a 100 MHz core performing Clarke/Park transforms and PI current loops at PWM frequency, high-resolution PWM driving a three-phase inverter with programmable dead time, and fast 12-bit ADCs triggered at the PWM center for low-noise phase-current sampling. Integrated op-amps amplify shunt currents on-chip, cutting external component count. The 28-UQFN (6x6) exposed-pad package keeps the controller compact on inverter boards, and the -40C to +150C range suits thermally demanding drive environments. Dual-partition flash with Live Update allows field firmware upgrades on deployed drives without interrupting motor operation.
추천
Automotive CAN FD Networked Nodes
The DSPIC33CK128MP502-E/2N is AEC-Q100 qualified and operates from -40C to +150C, meeting the environmental requirements of automotive subsystems, and its integrated CAN FD module provides the higher bandwidth and 64-byte payloads needed on modern in-vehicle networks. Typical nodes include actuator control, sensor hubs and small power converters that bridge CAN FD with local PWM control loops. The 3.0V to 3.6V supply integrates with standard automotive 3.3V rails behind a transient-protected regulator, and ECC on the 128 KB dual-partition flash safeguards program memory against bit upsets. Firmware can implement functional-safety-style memory self-tests supported by the family's MBIST features, while the DSP engine handles filtering of raw sensor data.
추천
Advanced Sensing and Signal Conditioning
The DSPIC33CK128MP502-E/2N serves advanced sensing nodes because its integrated op-amps, 12-bit ADCs and hardware DSP engine form a complete analog-signal chain on one chip: op-amps amplify sensor outputs, ADCs digitize them synchronously, and the single-cycle MAC accelerates digital filtering (IIR/FIR) and FFT analysis at up to 100 MIPS. This makes the part effective for high-performance sensing such as precision current monitoring, vibration analysis and ultrasonic processing. The 16 KB SRAM buffers sample windows while the 128 KB ECC flash stores calibration tables. At the same time, CAN FD or UART exports processed results to a host, offloading the main controller in distributed measurement architectures.
추천
Industrial Control and Automation
In industrial automation, the DSPIC33CK128MP502-E/2N acts as a compact real-time controller combining deterministic loop execution (100 MIPS core with low interrupt latency), robust communication (CAN FD for fieldbus interconnect), and configurable analog I/O (12-bit ADCs and op-amps for process-variable measurement). Typical deployments include pump and fan control, power monitoring nodes, and small PLC peripheral modules mounted close to actuators. The extended -40C to +150C operating range tolerates cabinet and motor-junction temperature extremes, while the 28-UQFN (6x6) footprint fits dense control boards. Dual-partition flash with ECC and Live Update permits firmware maintenance windows without full board downtime, reducing service cost across installed industrial equipment.
추천
High-Performance Embedded Systems
As a general high-performance embedded controller, the DSPIC33CK128MP502-E/2N balances DSP throughput and MCU-style peripheral integration: 100 MIPS execution, 128 KB ECC dual-partition flash and 16 KB RAM host demanding firmware, while CAN FD, UART/SPI/I2C serial engines and high-resolution PWM cover most connectivity and actuation needs. Applications include dense instrumentation boards, robotics subcontrollers, and signal-processing front-ends where a 32-bit application processor handles user interfaces but delegates hard-real-time loops to a DSC. The 6x6 mm UQFN package with 0.65 mm pitch suits space-constrained designs, and Microchip's MPLAB X + XC16 toolchain with family code reuse shortens the development cycle for new embedded products.
추천
추천 제품 요약
엔지니어링 참조 데이터: DSPIC33CK128MP502-E/2N — 비교, 설계 지침 및 규정 준수 정보.
선택 가이드
대체품과의 비교
| 파라미터 | 이 제품 | DSPIC33CK128MP502-I/2N | DSPIC33CK128MP502-H/2N | DSPIC33CK256MP502-E/2N | DSPIC33CK64MP502-E/2N | DSPIC33CK128MP202-I/2N |
|---|---|---|---|---|---|---|
| Package | 28-UQFN (6x6), exposed pad | 28-UQFN (6x6) - same | 28-UQFN/28-PQCC - same footprint | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same | 28-UQFN (6x6) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 128 KB | 128 KB | 128 KB | 256 KB | 64 KB | 128 KB |
| Core Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Temperature Range | -40C to +150C | -40C to +85C | -40C to +150C | -40C to +150C | -40C to +150C | -40C to +85C |
| CAN FD | Yes | Yes | Yes | Yes | Yes | Yes (MP-series peripheral set) |
| Supply Voltage | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V | 3.0 V to 3.6 V |
주요 차별점
- Extended temperature range to +150C (vs DSPIC33CK128MP502-I/2N)
- Integrated op-amps and CAN FD in 28 pins (vs DSPIC33CK128MP202-I/2N)
- Dual-partition ECC flash with Live Update (vs DSPIC33CK64MP502-E/2N)
설계 노트
The 28-UQFN (6x6) package has an exposed pad on the underside that must be soldered to a ground pour, not left floating. Design the PCB land pattern per Microchip's package outline drawing with a solder-mask-defined window array over the pad to control solder volume, and add multiple thermal vias (0.3 mm diameter, filled or tented) connecting to inner ground planes. This exposed pad is the primary ground return and heat path; an unsoldered pad causes unreliable operation at 100 MHz and poor thermal performance near the +150C rating.
The device operates only from 3.0V to 3.6V, so generate the core supply with a low-noise LDO or buck from the system rail. Estimated: at 100 MIPS with CMOS I/O toggling, core current is typically tens of mA (consult the datasheet electrical characteristics chapter for exact ICC figures); a 300 mA LDO provides ample margin. Place a 0.1 uF ceramic capacitor at each VDD pin within 2 mm, plus a bulk 10 uF capacitor per power domain. In automotive 12V systems, add reverse-polarity and load-dump protection upstream of the regulator.
The dual-partition flash with Live Update is a major advantage, but branching between partitions requires careful linker-script configuration and a valid boot sequence; test the swap path thoroughly including power-loss during erase. Also note the temperature-suffix distinction: the -E grade covers -40C to +150C, while -I parts stop at +85C - substituting an -I part in an automotive near-engine location will violate its ratings. Finally, confirm 5V tolerance of I/O pins in the datasheet before interfacing with 5V logic, since the supply window is 3.3V only.
규정 준수 정보
Listed as Automotive, AEC-Q100 by distributor product data (Hotenda). RoHS/lead-free status per standard Microchip ecompliance; verify exact certificates on Microchip's Green/RoHS pages.
