DSPIC33CK32MP506-E/MR - 100MHz 16-bit DSC 64-QFN | Microchip
Référence : DSPIC33CK32MP506-E/MR ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $5.2 | $5,20 |
| 10 | $4.75 | $47,50 |
| 100 | $4.2 | $420,00 |
| 500 | $3.85 | $1 925,00 |
| 1 000 | $3.55 | $3 550,00 |
DSPIC33CK32MP506-E/MR Présentation
A digital signal controller combines the compute throughput of a digital signal processor with the peripheral integration and deterministic control of a microcontroller. Within the power-management hierarchy, the dsPIC33CK family sits alongside 32-bit MCUs and DSPs, targeting closed-loop control loops such as digital power conversion, motor control, and advanced sensing, where cycle-accurate PWM and fast ADC sampling dominate system performance.
Key features include the 100 MHz dsPIC33CK DSC core with DSP instruction extensions (dual 40-bit accumulators, single-cycle MAC), high-resolution PWM (HRPWM) with fine edge resolution, CAN Flexible Data (CAN FD) networking, three integrated operational amplifiers and three comparators that reduce external analog component count, and dual-partition Flash enabling Live Update firmware switching.
Technically, the dsPIC33CK32MP506 uses a Modified Harvard architecture with 24-bit instruction words, ECC on program Flash for functional-safety designs (the -E/MR variant is positioned for Functional Safety, FuSa), Memory Built-In Self-Test (MBIST) on SRAM, and a Peripheral Trigger Generator (PTG) for hardware-sequenced operation. Operating supply range is 3.0V to 3.6V per the dsPIC33CK family datasheet.
Typical applications include digital switch-mode power supplies (totem-pole PFC, LLC), brushless DC and PMSM motor drives, power-factor-correction stages, and automotive or industrial control nodes that must communicate over CAN FD. The 150C rated -E temperature option allows mounting close to heat-generating power stages.
Design consideration: at 100 MHz, keep the linear regulator feeding the 3.3V rail well decoupled and route the HRPWM outputs away from analog feedback lines; use the built-in op amps for current-sense amplification to shorten feedback loops.
This page synthesizes distributor availability, same-package drop-in family alternatives, and practical design notes not found in the manufacturer datasheet alone.
Alternatives de remplacement direct pour DSPIC33CK32MP506-E/MR — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33CK32MP506-E/MR (même facteur de forme et même empreinte) — différant par Package, Core, Operating Temperature, CAN Interface, Program Memory Size.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33CK32MP506-I/MR
✅ Remplacement direct✓ En stock
$3.1 / unité
Voir la fiche technique →DSPIC33CK128MP506-E/MR
✅ Remplacement direct✓ En stock
$4.42 / unité
Voir la fiche technique →DSPIC33CK32MP506T-E/MR
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33CK64MP506-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$1.58 / unité
Voir la fiche technique →DSPIC33CK16MP506-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33CK256MP506-I/MR
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.3 / unité
Voir la fiche technique →DSPIC33CK32MP506-E/MR Valeurs maximales et caractéristiques électriques
| Core | dsPIC33CK 16-bit DSC |
| Maximum CPU Speed | 100 MHz (100 MIPS) |
| Program Flash | 32 KB (with ECC, dual-partition Live Update) |
| Data SRAM | 8 KB (with MBIST) |
| Tension d'alimentation | 3.0 V to 3.6 V |
| Température de fonctionnement | -40C to +150C (E grade) |
| Boîtier | 64-QFN (9x9 mm), MR suffix |
| CAN | CAN Flexible Data (CAN FD) |
| Op Amps On-Chip | 3 |
| Comparators On-Chip | 3 |
| PWM | High-Resolution PWM (HRPWM) |
| Peripheral Trigger Generator | Yes (PTG) |
| Architecture | Modified Harvard, 24-bit instruction word |
| Functional Safety | FuSa capable (ECC Flash, MBIST) |
| Type de montage | Surface Mount |
| Maximum Supply Current | 42.5 mA |
| Statut RoHS | Compliant |
Guide de configuration des broches du DSPIC33CK32MP506-E/MR 64-qfn (9x9 mm), mr suffix
Configuration des broches du DSPIC33CK32MP506-E/MR (boîtier 64-qfn (9x9 mm), mr suffix). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33CK32MP506-E/MR.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33CK32MP506-E/MR convient pour 6 applications: Digital Switch-Mode Power Supplies, BLDC and PMSM Motor Control, CAN FD Industrial Networking Nodes, High-Temperature Automotive and Industrial Sensing, LED Lighting and Electronic Ballasts, Portable Instrumentation and Advanced Sensing.
Digital Switch-Mode Power Supplies
The DSPIC33CK32MP506-E/MR fits digital power conversion because its high-resolution PWM delivers fine duty-cycle and phase resolution needed by LLC, half-bridge, and totem-pole PFC topologies, while the 100 MHz DSP core closes voltage and current loops in well under one switching period. The three on-chip op amps amplify current-shunt signals without external ICs, and the comparators implement cycle-by-cycle overcurrent protection in hardware, independent of firmware latency. Placed as the controller between the feedback dividers and gate-driver inputs, the DSC replaces analog control chips and adds programmable compensation, telemetry, and CAN FD diagnostics; the trade-off is the need to budget firmware worst-case loop latency against the analog alternative's fixed response.
Recommandé
BLDC and PMSM Motor Control
For brushless DC and permanent-magnet synchronous motor drives, the DSPIC33CK32MP506-E/MR executes field-oriented control at 100 MHz with single-cycle MAC DSP instructions, keeping the current-loop sample-to-PWM-update path deterministic. Its high-resolution PWM produces low-current-ripple phase voltages that reduce audible noise and torque ripple, while integrated op amps buffer low-side shunt currents and comparators provide hardware fault cutoff. In a typical servo or e-bike drive, the DSC reads resolver or encoder inputs, computes Park/Clarke transforms, and drives a three-phase inverter through external gate drivers; the 150C-rated E grade permits mounting inside sealed motor housings. The constraint is 32 KB Flash, which comfortably holds FOC plus CAN FD but limits room for extensive protocol stacks.
Recommandé
CAN FD Industrial Networking Nodes
The integrated CAN Flexible Data module makes the DSPIC33CK32MP506-E/MR a strong fit for industrial nodes that must exchange larger payloads than classical CAN allows, such as battery telemetry, predictive-maintenance sensor frames, or firmware-over-CAN updates. CAN FD's 64-byte data field and bit-rate switching preserve determinism on the arbitration phase while boosting throughput during data phases, and the 100 MHz core handles framing, CRC, and application logic without a separate communication co-processor. In a factory automation cell, one DSC can simultaneously run a local control loop (using HRPWM and op amps) and bridge measurements onto the plant CAN FD backbone; ECC Flash and MBIST support functional-safety documentation demands for such nodes.
Recommandé
High-Temperature Automotive and Industrial Sensing
With a -40C to +150C operating rating, the E-grade DSPIC33CK32MP506-E/MR suits sensing and control modules located near engines, motor windings, power modules, or brake systems where conventional 85C parts cannot survive. The 32 KB ECC-protected Flash guards against bit corruption in high-radiation and high-vibration environments, and Memory Built-In Self-Test supports periodic diagnostics demanded by functional-safety assessments. A representative design uses the integrated op amps to condition thermocouple or shunt signals, the 12-bit ADC pipeline to sample them, and CAN FD to report results to the vehicle or machine ECU. Engineers should derate clock speed and verify AC timing parameters at the 150C extreme per the family datasheet electrical tables.
Recommandé
LED Lighting and Electronic Ballasts
Digitally controlled LED drivers and HID ballasts benefit from the DSPIC33CK32MP506-E/MR's high-resolution PWM, which achieves the fine dimming granularity and phase management that 8-bit MCU PWM peripherals lack. The 100 MHz core runs power-factor-correction plus constant-current loops on one chip, the comparators protect against output shorts cycle-by-cycle in hardware, and the op amps sense LED current without external amplifiers. In a tunable industrial luminaire, the DSC can simultaneously regulate the boost-PFC front end and the buck LED stage, while CAN FD (or an added transceiver) accepts dimming scenes and reports fault status. The 150C E grade suits drivers sealed inside fixtures with limited airflow, where ambient temperatures regularly exceed 85C.
Recommandé
Portable Instrumentation and Advanced Sensing
The DSPIC33CK32MP506-E/MR serves battery-powered and bench instruments by combining a DSP-class 100 MHz core for FFT, filtering, and sensor-fusion math with low peripheral-count analog integration: three op amps and three comparators remove discrete front-end parts that inflate BOM cost in handheld designs. The Peripheral Trigger Generator sequences ADC conversions against PWM timing in hardware, reducing jitter in impedance-measurement or ultrasonic-sensing applications. Its 3.0V to 3.6V single-supply operation matches standard Li-ion and USB rails through a simple LDO, and 8 KB MBIST-backed SRAM provides reliable scratch memory for calibration data. Designers should note the 42.5 mA maximum supply current and size the power budget accordingly for battery-operated instruments.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33CK32MP506-E/MR — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33CK32MP506-I/MR | DSPIC33CK128MP506-E/MR | DSPIC33CK32MP506T-E/MR | DSPIC33CK64MP506-I/MR |
|---|---|---|---|---|---|
| Package | 64-QFN (9x9 mm) MR | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same | 64-QFN (9x9 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 32 KB (ECC) | 32 KB (ECC) | 128 KB (ECC) | 32 KB (ECC) | 64 KB (ECC) |
| Data SRAM | 8 KB (MBIST) | 8 KB (MBIST) | 8 KB (MBIST) | 8 KB (MBIST) | 8 KB (MBIST) |
| CPU Speed | 100 MHz (100 MIPS) | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
| Operating Temperature | -40C to +150C (E grade) | -40C to +85C (I grade) | -40C to +150C (E grade) | -40C to +150C (E grade) | -40C to +85C (I grade) |
| CAN FD | Yes | Yes | Yes | Yes | Yes |
| Op Amps / Comparators | 3 / 3 | 3 / 3 | 3 / 3 | 3 / 3 | 3 / 3 |
Principaux différenciateurs
- 150C extended temperature rating (vs DSPIC33CK32MP506-I/MR)
- Integrated analog front end (vs Generic DSP or external-ADC solutions)
- In-family Flash upgrade path in the same footprint (vs DSPIC33CK128MP506-E/MR)
Notes de conception
The 64-QFN (9x9 mm) MR package uses a large exposed thermal pad that must be soldered to a ground array of thermal vias (typically 4x4 via grid) to achieve the datasheet thermal resistance and to carry the die's ground return. The -E/MR 150C rating depends on good pad soldering: a voided thermal pad can add tens of degrees C/W and void the extended-temperature margin. Follow the Microchip QFN land-pattern guidelines and inspect the pad with X-ray for high-reliability builds.
The dsPIC33CK core requires a 3.0V to 3.6V supply; provide a local 1uF plus 0.1uF decoupling pair at each VDD pin pair and an dedicated bulk capacitor near the package. The 42.5 mA maximum supply current (distributor-listed figure) does not include I/O and gate-drive loads, so size the regulator for peak switching activity. Use the on-chip LDO configuration options per the family datasheet and avoid long shared traces that couple HRPWM switching noise into the analog rails.
At 100 MHz, keep high-resolution PWM outputs on short, ground-guarded traces to gate drivers, and route current-sense feedback (routed through the internal op amps) on an analog island away from the PWM bank. Use the Peripheral Trigger Generator and ADC simultaneous sampling to minimize loop-latency jitter rather than software-triggered sampling, and enable the internal op amp bandwidth settings appropriate to your shunt values. Improperly shielded sense lines are the most common cause of noisy FOC current measurements in dsPIC33CK motor-control designs.
Do not substitute the -I/MR (85C) grade into sockets where the -E/MR (150C) was specified - ambient near power stages frequently exceeds 85C. Also remember the T (tape-and-reel) and non-T variants differ only in packaging, but reorder codes must match the assembler's feeder setup. Finally, 32 KB Flash fills quickly once CAN FD stacks and compensation libraries are linked; reserve headroom or choose the DSPIC33CK128MP506-E/MR same-footprint upgrade early in the project.
Informations de conformité
RoHS compliance inferred from Microchip standard product page and DigiKey listing; REACH and halogen-free status not stated in the provided web data - verify on Microchip's official environmental page.
