DSPIC33EP16GS502-I/MM - 16-Bit DSC 70MIPS Digital Power | Microchip
Référence : DSPIC33EP16GS502-I/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $3.95 | $3,95 |
| 10 | $3.55 | $35,50 |
| 100 | $3.12 | $312,00 |
| 500 | $2.78 | $1 390,00 |
| 1 000 | $2.45 | $2 450,00 |
DSPIC33EP16GS502-I/MM Présentation
A Digital Signal Controller combines the computational throughput of a digital signal processor with the peripheral integration and control-oriented architecture of a microcontroller. Within the power-management hierarchy, a DSC sits at the heart of digitally controlled switched-mode power supplies (SMPS), replacing analog control loops with firmware-executed compensation, making it the central element of a digital power conversion system.
Key features include the dsPIC33EP core running at 70 MIPS, 16KB (16K x 8) of on-chip FLASH, and the interconnected high-speed PWM module designed specifically for power topologies such as buck, boost, PFC, and full-bridge converters. The controller is part of the dsPIC 33EP series and is designated as a Functional Safety (FuSa) capable device per Microchip product documentation.
Technically, the GS50x family integrates high-resolution PWM peripherals interconnected with analog comparators and a programmable gain amplifier (PGA), enabling sub-microsecond current-mode control loops without CPU intervention in the fastest path. This architecture offloads cycle-by-cycle current limiting and fault response from software to hardware, which is critical for switch-mode power stages where fault propagation must occur within a single switching period.
Typical applications include AC-DC power factor correction (PFC), LLC and full-bridge DC-DC converters, and digital lighting power supplies. Microchip reference designs built on this device include an interleaved PFC design producing up to 350W from universal AC input and a 750W semi-bridgeless PFC plus ZVS full-bridge design.
Design consideration: select the -I temperature grade (-40C to +85C) for industrial environments or the -E grade (-40C to +125C, DSPIC33EP16GS502-E/MM) for high-ambient enclosures; both share the same 28-QFN-S footprint.
This page synthesizes verified distributor data, drop-in alternatives within the same 28-QFN-S footprint, and practical design guidance not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP16GS502-I/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP16GS502-I/MM (même facteur de forme et même empreinte) — différant par Package, Core, Functional Safety, Operating Temperature, Program Memory (Flash).
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP32GS502-I/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS502-I/MM
✅ Remplacement direct✓ En stock
$5.1 / unité
Voir la fiche technique →DSPIC33EP16GS502-E/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP32GS502-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.25 / unité
Voir la fiche technique →DSPIC33EP16GS502-I/MM Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33EP DSC |
| Maximum Performance | 70 MIPS |
| Program Memory (FLASH) | 16KB (16K x 8) |
| Boîtier | 28-QFN-S (6x6 mm) |
| Plage de température de fonctionnement | -40C to +85C (I grade) |
| Product Family | dsPIC33EPXXGS50X (Digital Power) |
| Key Peripherals | Interconnected High-Speed PWM, ADC, PGA, Comparators |
| Target Application Domain | SMPS and Digital Power Conversion |
| Functional Safety | FuSa capable (per Microchip product page) |
| Type de montage | Surface Mount |
Guide de configuration des broches du DSPIC33EP16GS502-I/MM 28-qfn-s (6x6 mm)
Configuration des broches du DSPIC33EP16GS502-I/MM (boîtier 28-qfn-s (6x6 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP16GS502-I/MM.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP16GS502-I/MM convient pour 6 applications: Interleaved Power Factor Correction (PFC), ZVS Full-Bridge DC-DC Converters, Digital LED Driver Power Supplies, Battery Chargers and DC-DC Modules, Solar MPPT Converters, Industrial Motor Control Assist and Auxiliary Power.
Interleaved Power Factor Correction (PFC)
The DSPIC33EP16GS502-I/MM is a proven controller for interleaved PFC stages, as demonstrated by Microchip's official interleaved PFC reference design built on this exact device, which operates from a universal AC input range and delivers up to 350W at a single high-voltage DC output. The interconnected high-speed PWM generates phase-shifted drive for two boost legs while on-chip comparators handle cycle-by-cycle current limiting without CPU latency. The 70 MIPS core executes average-current-mode compensation and input-voltage feedforward in firmware. Using this validated reference design shortens time-to-market for AC-DC front ends in adapters, LED drivers, and server power supplies, while the digital control loop enables adaptive tuning across the universal input range.
Recommandé
ZVS Full-Bridge DC-DC Converters
Microchip's 750W AC-DC reference design pairs a semi-bridgeless PFC with a peak-current-controlled zero-voltage-switching (ZVS) full-bridge converter controlled by the dsPIC33EP16GS502, achieving very high conversion efficiency with digital slope compensation. The high-speed PWM module supports complementary outputs with adjustable dead time, essential for ZVS operation, while the interconnected comparator path responds to overcurrent events within a single switching cycle. The 70 MIPS dsPIC33EP core handles phase-shift computation and burst-mode control for light-load efficiency. Digital slope compensation implemented in firmware eliminates subharmonic oscillation in peak current mode without the analog RC networks required in purely analog controllers.
Recommandé
Digital LED Driver Power Supplies
Smart LED drivers benefit from the DSPIC33EP16GS502's ability to combine constant-current regulation with PWM or analog dimming interfaces in one 16-bit controller. The interconnected high-speed PWM switches the power stage at hundreds of kilohertz with nanosecond-resolution dead-time control, while the on-chip PGA amplifies current-shunt signals for precise output-current regulation. The 16KB FLASH accommodates dimming curves, DALI- or DMX-style protocol handling in simplified form, and fault management. Its 28-QFN-S 6x6 mm footprint suits compact driver boards in industrial and architectural lighting. For drivers mounted in hot enclosures, the DSPIC33EP16GS502-E/MM variant rated to +125C keeps thermal margins safe without heatsinking the controller.
Recommandé
Battery Chargers and DC-DC Modules
Multi-chemistry battery chargers require state machines, current/voltage control loops, and safety cutoffs - all natural fits for the DSPIC33EP16GS502-I/MM. The 70 MIPS core executes CC/CV transition logic and coulomb-counting while the high-speed PWM with integrated comparators enforces hardware current limits independent of software, meeting critical fault-response requirements. The ADC with PGA samples battery current and voltage with sufficient resolution for termination decisions. Its 16KB FLASH is adequate for complete charger firmware including fault logging. In telecom and industrial DC-DC bricks, the digital architecture allows field-updatable charging profiles, and the pin-compatible 32KB and 64KB family members provide a seamless upgrade path when feature sets grow.
Recommandé
Solar MPPT Converters
Maximum power point tracking demands fast, accurate sampling of panel voltage and current combined with efficient buck/boost control - a combination the DSPIC33EP16GS502 delivers in a single 28-QFN-S device. The interconnected ADC and PWM architecture synchronizes sampling to the PWM period, minimizing switching ripple in MPPT decisions, while the 70 MIPS core runs perturb-and-observe or incremental-conductance algorithms with headroom for panel diagnostics and communication. The hardware comparator path protects against panel-side overcurrent within one switching cycle. Microchip's digital power software libraries accelerate MPPT firmware development, and the family's shared pinout lets designers scale FLASH from 16KB to 64KB without PCB respins.
Recommandé
Industrial Motor Control Assist and Auxiliary Power
In industrial drives and automation cabinets, the DSPIC33EP16GS502-I/MM controls auxiliary power converters such as flyback and half-bridge bias supplies, PFC front ends, and small motor drives. Its -40C to +85C industrial temperature grade matches cabinet environments, and the FuSa-capable dsPIC33EP platform designation supports safety-conscious system architectures per Microchip documentation. The high-speed PWM with fault inputs enables hardware-level shutdown on trip conditions, a key requirement around motor drive stages. Firmware-based control allows one controller design to serve multiple power ratings by changing firmware constants, reducing inventory. For cabinets reaching higher ambient temperatures, the 125C-rated DSPIC33EP16GS502-E/MM provides the same footprint with greater thermal margin.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP16GS502-I/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP32GS502-I/MM | DSPIC33EP64GS502-I/MM | DSPIC33EP16GS502-E/MM | DSPIC33EP32GS502-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Program Memory | 16KB (16K x 8) | 32KB | 64KB | 16KB | 32KB |
| Core Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +85C | -40C to +125C | -40C to +125C |
| Core Family / Peripherals | dsPIC33EP GS50x, interconnected high-speed PWM, ADC, PGA, comparators | Identical GS50x peripherals | Identical GS50x peripherals | Identical GS50x peripherals | Identical GS50x peripherals |
| PCB Redesign Required | N/A (reference) | None - pin-to-pin drop-in | None - pin-to-pin drop-in | None - pin-to-pin drop-in | None - pin-to-pin drop-in |
| Application Fit | Standard industrial digital power | Larger control firmware | Complex multi-stage firmware | High-ambient power stages | High-ambient plus large firmware |
Principaux différenciateurs
- Lowest-cost entry into the GS50x digital power family (vs DSPIC33EP32GS502-I/MM)
- Proven reference designs available (vs DSPIC33EP64GS502-I/MM)
- Industrial temperature grade for standard environments (vs DSPIC33EP16GS502-E/MM)
Notes de conception
The 28-QFN-S (6x6 mm) package has a central exposed thermal pad that must be soldered to a grounded copper pour on the PCB. Use an array of thermal vias (typically 4x4 or 5x5, 0.3 mm drill, filled or tented) under the pad to tie it to internal ground planes; this provides both heat dissipation and a low-inductance ground return for the fast PWM switching currents. Follow the land pattern and stencil recommendations in the dsPIC33EPXXGS50X family datasheet (document 70005127) to avoid voiding under the pad, which degrades thermal and EMI performance.
Decouple the dsPIC33EP supply pins with 0.1 uF ceramic capacitors placed within 2 mm of each VDD/VSS pin pair, plus a bulk 4.7 uF to 10 uF capacitor near the controller. In digital power converters the controller shares ground proximity with the power stage; route the analog ground references for the ADC and comparators as a quiet island connected at a single point to avoid switching ripple corrupting current-sense samples. Consult Microchip's GS50x family datasheet power and grounding sections for exact decoupling pin assignments.
Verify the temperature suffix before layout release: -I (this part) is rated -40C to +85C, while the -E variant extends to +125C. Using the -I grade in a hot enclosure near a power stage can exceed its rating and trigger field failures. Additionally, confirm firmware size fits 16KB FLASH before finalizing the BOM - if the control firmware plus communication stack approaches the limit, the pin-compatible DSPIC33EP32GS502-I/MM avoids a respin later.
Informations de conformité
Compliance status was not stated in the provided verified web data; consult the Microchip product page or MicrochipDirect environmental declarations for current RoHS/REACH status.
