DSPIC33EP64GS502-I/MM - 16-bit 70 MIPS DSC 64KB Flash | Microchip
Référence : DSPIC33EP64GS502-I/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.8 | $6,80 |
| 10 | $6.4 | $64,00 |
| 100 | $5.9 | $590,00 |
| 500 | $5.5 | $2 750,00 |
| 1 000 | $5.1 | $5 100,00 |
DSPIC33EP64GS502-I/MM Présentation
A digital signal controller combines the compute throughput of a DSP with the peripheral integration and deterministic interrupt structure of a microcontroller. Within the power-management hierarchy, a DSC sits between a general-purpose MCU and a dedicated power-control ASIC, providing real-time closed-loop control of switch-mode power supplies.
Key features include 70 MIPS execution at 140 MHz internal clock, 21 general-purpose I/O lines, and serial communication via I2C, SPI, and UART peripherals. The GS50x family integrates high-speed analog peripherals - ADC and DAC resources - targeted at power-conversion feedback loops, and the device is offered with Functional Safety (FuSa) support per Microchip product documentation.
Architecturally, the dsPIC33EP core uses a modified Harvard pipeline with DSP multiply-accumulate instructions, enabling cycle-efficient execution of Proportional-Integral-Derivative (PID) compensators and predictive control algorithms common in digital power supplies. Boot partitioning allows the 64KB program memory to operate unpartitioned or split into two bootable partitions for field updates.
Typical applications include AC-to-DC converters, DC-to-DC converters (including 48V-to-12V brick modules as shown in Microchip reference designs), multi-loop SMPS control, power-factor-correction stages, and solar inverter control.
Design consideration: operate from a 3.3V supply within the 1.8V to 3.6V permissible range, and verify the QFN exposed-pad thermal connection to ground for reliable ADC accuracy and heat dissipation.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design guidance not consolidated in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP64GS502-I/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP64GS502-I/MM (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Supply Voltage, Core Architecture, Communication Interfaces.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP128GS502-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS502-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.78 / unité
Voir la fiche technique →DSPIC33EP64GP502-I/MM
✅ Remplacement direct✓ En stock
$2.2 / unité
Voir la fiche technique →DSPIC33EP32GS502-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP32GP502-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS502-I/MM Valeurs maximales et caractéristiques électriques
| Core | dsPIC33EP 16-bit |
| Max MIPS | 70 MIPS |
| Internal Clock | 140 MHz |
| Program Memory Size | 64KB (64K x 8) FLASH |
| Tension d'alimentation | 3.3 V (1.8 V to 3.6 V range) |
| Number of I/O | 21 |
| Communications Peripherals | I2C, SPI, UART |
| Analog Peripherals | High Speed ADC, DAC |
| Target Application Family | Digital Power SMPS / Power Conversion |
| Boîtier | 28-QFN-S (6x6 mm) Exposed Pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (I grade) |
| Functional Safety Support | Yes (FuSa) |
Guide de configuration des broches du DSPIC33EP64GS502-I/MM 28-qfn-s (6x6 mm) exposed pad
Configuration des broches du DSPIC33EP64GS502-I/MM (boîtier 28-qfn-s (6x6 mm) exposed pad). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP64GS502-I/MM.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP64GS502-I/MM convient pour 6 applications: Digital SMPS Control (AC/DC), 48V to 12V DC/DC Brick Converters, Power Factor Correction (PFC), Solar Inverter and MPPT Control, Battery Chargers and BMS, LED Drivers and Lighting Power.
Digital SMPS Control (AC/DC)
The DSPIC33EP64GS502-I/MM closes control loops in AC-to-DC switch-mode power supplies, sampling output voltage and current via its high-speed ADC and driving power-stage PWM at 70 MIPS. Microchip states the dsPIC33EPXXGS50X family is built for common multi-loop digital SMPS topologies. The deterministic dsPIC33EP core services per-switching-cycle PID or predictive compensation without missing interrupts. Place the controller so ADC inputs sit close to feedback dividers and use the DAC comparators for fast cycle-by-cycle current limiting in offline converters.
Recommandé
48V to 12V DC/DC Brick Converters
Microchip's EPC9143 1/16th-brick power-module reference design (33 x 22.9 mm, 48V-to-12V, developed with Efficient Power Conversion Corp) demonstrates dsPIC33-class control in compact high-density bricks. The DSPIC33EP64GS502-I/MM fits this role with its 140 MHz core clock, high-speed ADC for fast current sharing, and DSP multiply-accumulate instructions for efficient compensator execution. In brick designs, use the exposed-pad QFN for solid ground returns and leverage boot partitioning to field-update converter firmware without hardware change.
Recommandé
Power Factor Correction (PFC)
In continuous-conduction-mode PFC stages, the DSPIC33EP64GS502-I/MM executes inner current-loop and outer voltage-loop compensation every switching cycle at 70 MIPS. Its high-speed ADC captures instantaneous inductor current, while DSP MAC instructions compute average-current-mode control efficiently. The 21 I/O pins drive gate circuitry and auxiliary relays. Sampling must be synchronized to PWM to avoid switching-noise aliasing - use the ADC trigger sources tied to the PWM module rather than free-running sampling for best THD in the line-current waveform.
Recommandé
Solar Inverter and MPPT Control
Microchip identifies solar inverters among the target applications of the dsPIC33EPXXGS50X family. The DSPIC33EP64GS502-I/MM performs maximum-power-point-tracking algorithms on its 70 MIPS core while simultaneously managing DC/DC boost and DC/AC inverter loops via its ADC/DAC peripheral set. The 64KB FLASH accommodates MPPT search algorithms, grid monitoring, and a bootloader in a single partitioned image. Use the UART for inverter-to-host communication and reserve the DAC outputs for analog fault thresholds independent of firmware latency.
Recommandé
Battery Chargers and BMS
Multi-chemistry battery charging benefits from the DSPIC33EP64GS502-I/MM's fast feedback loop: constant-current and constant-voltage phases transition on high-speed ADC readings, while cycle-by-cycle protection via DAC comparators guards against overcurrent between firmware decisions. The 3.3V I/O interfaces cleanly with external gauge ICs over I2C and a host over UART. The -40C to +85C industrial temperature grade (I suffix) suits vehicle and industrial charging environments; select the -E variant for extended-temperature enclosures.
Recommandé
LED Drivers and Lighting Power
Digitally controlled LED drivers use the DSPIC33EP64GS502-I/MM to regulate LED current with its high-speed ADC and to dim via PWM resolution that a hardware-only controller cannot offer. At 70 MIPS the core sustains flicker-free dimming curves, thermal-foldback calculations, and communication (I2C/UART) for smart-lighting networks. The 28-QFN-S 6x6 mm footprint keeps the controller compact within driver enclosures. Synchronize ADC sampling away from gate-drive edges to keep current measurements clean for accurate regulation at low dimming levels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP64GS502-I/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP128GS502-I/MM | DSPIC33EP64GS502-E/MM | DSPIC33EP64GP502-I/MM | DSPIC33EP32GS502-I/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| FLASH Memory | 64KB (64K x 8) | 128KB | 64KB | 64KB | 32KB |
| Max MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Target Family Focus | SMPS / Digital Power (GS) | SMPS / Digital Power (GS) | SMPS / Digital Power (GS) | General Purpose (GP) | SMPS / Digital Power (GS) |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +125C (E grade) | -40C to +85C | -40C to +85C |
| Supply Voltage | 3.3 V (1.8-3.6 V) | 3.3 V (1.8-3.6 V) | 3.3 V (1.8-3.6 V) | 3.3 V (1.8-3.6 V) | 3.3 V (1.8-3.6 V) |
| Peripherals | High-speed ADC/DAC, I2C, SPI, UART | High-speed ADC/DAC, I2C, SPI, UART | High-speed ADC/DAC, I2C, SPI, UART | ADC, I2C, SPI, UART (GP analog set) | High-speed ADC/DAC, I2C, SPI, UART |
Principaux différenciateurs
- Doubled program memory without PCB change (vs DSPIC33EP64GS502-I/MM baseline)
- Extended temperature capability (vs DSPIC33EP64GS502-E/MM)
- SMPS-optimized analog peripheral set (vs DSPIC33EP64GP502-I/MM)
Notes de conception
Run the DSPIC33EP64GS502-I/MM from a well-decoupled 3.3V rail within its 1.8V-3.6V range. Use 100 nF ceramics directly at each VDD/VDDCORE pin plus a 10 uF bulk capacitor near the package. In digital-power designs the controller shares a board with noisy switching nodes; separate the analog supply feed with an RC or ferrite filter to preserve high-speed ADC accuracy on feedback channels.
The 28-QFN-S 6x6 mm exposed pad must be soldered to a grounded thermal landing with an array of vias to the ground plane. This connection is both the primary thermal path and the low-inductance ground reference the ADC and PWM peripherals depend on. Keep gate-drive traces short and route ADC feedback traces away from switch nodes; Microchip's EPC9143 brick reference design provides a proven layout example.
Sample feedback signals synchronized to the PWM cycle, not free-running, to prevent aliasing of switching ripple into control-loop measurements. When using boot partitioning of the 64KB FLASH for dual-image updates, verify both partitions leave headroom for the bootloader - each partition is smaller than the full memory. Confirm the I-grade temperature limit (-40C to +85C) against enclosure thermal measurements; choose the -E/MM variant for hotter environments.
Informations de conformité
Compliance details were not present in the provided web data; verify on the Microchip product page or distributor compliance documents before production use.
