DSPIC33EP512MC202T-E/MM - 60 MIPS 16-bit DSC 512KB Flash | Microchip
Référence : DSPIC33EP512MC202T-E/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $6.35 | $6,35 |
| 10 | $5.72 | $57,20 |
| 100 | $5.1 | $510,00 |
| 500 | $4.65 | $2 325,00 |
| 1 000 | $4.25 | $4 250,00 |
DSPIC33EP512MC202T-E/MM Présentation
A digital signal controller combines the compute power of a DSP (single-cycle MAC, DSP instruction set, hardware multipliers) with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy, DSCs occupy the top tier of the dsPIC33 family, positioned as microcontroller units (MCUs) optimized for closed-loop control loops such as field-oriented motor control and digital power conversion.
Key features include the 16-bit dsPIC core at 60 MIPS, 512KB self-programming FLASH, DMA controller for peripheral-to-memory transfers, Motor Control PWM (MCPWM) with complementary outputs and dead-time insertion, quadrature encoder interface (QEI), input capture/output compare channels, and integrated op-amps and comparators that reduce external BOM cost in analog front ends.
The dsPIC33EP architecture adds a user-programmable PTG (Pulse Train Generator), watchdog timer, power-on reset, and in-circuit/in-application programming with JTAG boundary scan (IEEE 1149.2 compatible) for production test. Two program and two complex data breakpoints support real-time debugging via the standard Microchip debugger ecosystem (PICkit, ICD, REAL ICE).
Typical applications include brushless DC (BLDC) and permanent-magnet synchronous motor (PMSM) drives, digital power supplies (PFC, LLC), solar inverters, and industrial sensor interfaces. The MCPWM and QEI peripherals are purpose-built for precision motor control where 16-bit DSP math executes each control loop within microseconds.
Design consideration: the extended-temperature E suffix (-40C to +125C) is essential for automotive bays and industrial enclosures; derate maximum MIPS versus junction temperature per the manufacturer datasheet, and place low-ESR decoupling on all VDD pairs of the QFN exposed pad.
This page synthesizes distributor pricing, drop-in alternatives, pinout, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP512MC202T-E/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512MC202T-E/MM (même facteur de forme et même empreinte) — différant par Package, Core, Program Memory Size, RAM Size, Operating Temperature.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512MC202T-I/MM
✅ Remplacement direct✓ En stock
$3.18 / unité
Voir la fiche technique →DSPIC33EP512MC202-E/MM
✅ Remplacement direct✓ En stock
$5.07 / unité
Voir la fiche technique →DSPIC33EP256MC202T-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP128MC202T-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.41 / unité
Voir la fiche technique →DSPIC33EP64MC202T-E/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.64 / unité
Voir la fiche technique →DSPIC33EP512MC202T-E/MM Valeurs maximales et caractéristiques électriques
| Core | 16-bit dsPIC DSC |
| Maximum CPU Speed | 60 MIPS |
| Program Memory Size | 512 KB (170K x 24) FLASH |
| RAM Size | 24 KB |
| Supply Voltage Range | 3 V to 3.6 V |
| Température de fonctionnement | -40C to +125C (E grade) |
| Boîtier | 28-QFN-S (6x6 mm) |
| Peripherals | Motor Control PWM, QEI, DMA, PTG, OpAmps, Comparators |
| DMA Channels | Yes |
| Debug Support | JTAG (IEEE 1149.2 compatible), ICSP, IAP |
| Watchdog Timer | Yes (WDT) |
| Power-On Reset | Yes (POR) |
| Type de montage | Surface Mount |
| Packaging | Tape & Reel (T suffix) |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33EP512MC202T-E/MM
| Broche 1 | MCLR — Master clear reset (external reset input / programming voltage) |
| Broche 2 | AN0/VREF+/CN3/RB0 — Analog input 0 / positive voltage reference / change notification / port B |
| Broche 3 | AN1/VREF-/CN2/RB1 — Analog input 1 / negative voltage reference / change notification / port B |
| Broche 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI slave select 1 / port B |
| Broche 5 | AN3/INDX/CN5/RB3 — Analog input 3 / QEA index input / port B |
| Broche 6 | VSS — Ground reference |
| Broche 7 | VDD — Positive supply (3.0V-3.6V) |
| Broche 8 | AN4/C1IN-/RA2 — Analog input 4 / comparator 1 inverting input / port A |
| Broche 9 | AN5/C1IN+/RA3 — Analog input 5 / comparator 1 non-inverting input / port A |
| Broche 10 | OSC1/CLKI/CN7/RA2 — Oscillator input / external clock input |
| Broche 11 | OSC2/CLKO/RC15 — Oscillator output / clock output |
| Broche 12 | RB4 — General purpose I/O with change notification |
| Broche 13 | RB5 — General purpose I/O with change notification |
| Broche 14 | VSS — Ground reference |
| Broche 15 | VDD — Positive supply (3.0V-3.6V) |
| Broche 16 | PGD/EMUD/RP40/RB6 — In-circuit debug data / remappable peripheral pin / port B |
| Broche 17 | PGC/EMUC/RP41/RB7 — In-circuit debug clock / remappable peripheral pin / port B |
| Broche 18 | RP42/RB8 — Remappable peripheral pin / port B |
| Broche 19 | RP43/RB9 — Remappable peripheral pin / port B |
| Broche 20 | TCK/RP44/RB10 — JTAG test clock / remappable peripheral pin / port B |
| Broche 21 | TMS/RP45/RB11 — JTAG test mode select / remappable peripheral pin / port B |
| Broche 22 | C2IN-/RP46/RB12 — Comparator 2 inverting input / remappable pin / port B |
| Broche 23 | C2IN+/RP47/RB13 — Comparator 2 non-inverting input / remappable pin / port B |
| Broche 24 | AN12/CVREF/RB14 — Analog input 12 / comparator voltage reference output / port B |
| Broche 25 | AN13/RB15 — Analog input 13 / port B |
| Broche 26 | AVSS — Analog ground reference |
| Broche 27 | AVDD — Analog positive supply |
| Broche 28 | VCAP/VDDCORE — Core voltage regulator capacitor connection |
Applications typiques
DSPIC33EP512MC202T-E/MM convient pour 6 applications: BLDC / PMSM Motor Control, Digital Power Supplies (PFC / LLC), Industrial Automation and Sensor Interfaces, Solar Inverters and Energy Systems, Automotive and E-Mobility Auxiliary Systems, Audio Signal Processing and Embedded DSP.
BLDC / PMSM Motor Control
The DSPIC33EP512MC202T-E/MM is purpose-built by Microchip for precision motor control: its 60 MIPS 16-bit DSP core executes single-cycle MAC instructions fast enough for field-oriented control (FOC) loops at 10-20 kHz PWM frequencies. The Motor Control PWM module provides complementary outputs with programmable dead-time insertion, while the quadrature encoder interface reads position feedback directly. Integrated op-amps and comparators condition shunt-resistor current sensing on-chip, reducing external component count in the 28-QFN-S 6x6 footprint. Firmware for commutation, PI current loops, and speed loops fits comfortably in 512KB FLASH with 24KB RAM leaving headroom for fieldbus protocols. Use 10uF bulk plus 0.1uF ceramic decoupling on every VDD pin pair to keep the analog front end clean during PWM switching edges.
Recommandé
Digital Power Supplies (PFC / LLC)
Digital power conversion demands deterministic loop latency, and the DSPIC33EP512MC202T-E/MM delivers it: the 60 MIPS core plus DMA offload services ADC results and updates MCPWM duty cycles within microseconds of each switching period. The high-speed 10/12-bit ADC pipeline samples input/output voltage and inductor current, while comparators support cycle-by-cycle overcurrent protection in hardware independent of firmware. The PTG (Pulse Train Generator) can autonomously generate auxiliary switching patterns, freeing CPU bandwidth for housekeeping tasks such as telemetry and fault logging. With -40C to +125C qualification, the E grade survives power-supply enclosures where ambient temperatures regularly exceed 85C. Use the exposed pad of the QFN as a low-inductance ground return for the ADC reference.
Recommandé
Industrial Automation and Sensor Interfaces
In factory automation nodes, the DSPIC33EP512MC202T-E/MM combines a 60 MIPS control core with remappable UART/SPI/I2C via Peripheral Pin Select, letting one 28-pin device adapt to heterogeneous sensor buses without hardware changes. The 512KB FLASH accommodates protocol stacks (Modbus, CANopen application layers) alongside control firmware, and the DMA controller streams ADC samples into RAM without CPU intervention, preserving loop timing. On-chip op-amps scale mV-level sensor signals to the ADC range, and integrated comparators provide threshold alarms with microsecond response. The extended -40C to +125C range covers panel-mounted enclosures near heat-generating drives. Debug via JTAG and two program breakpoints speeds commissioning of closed-loop sequences on the production floor.
Recommandé
Solar Inverters and Energy Systems
Grid-tied and off-grid solar electronics require simultaneous MPPT algorithms, DC-DC control, and grid synchronization - workloads the DSPIC33EP512MC202T-E/MM handles with its 60 MIPS DSP core and 512KB of firmware space. The MCPWM module generates the phase-shifted or complementary switching patterns for boost and inverter stages, while the high-speed ADC tracks PV voltage/current for maximum-power-point tracking at millisecond cadence. Hardware comparators implement fast overcurrent shutdown between firmware cycles, an essential safety layer for power conversion. The E temperature grade tolerates rooftop combiner-box environments. The 24KB RAM supports averaging filters and fault logs needed for energy-yield analytics and service diagnostics over the product lifetime.
Recommandé
Automotive and E-Mobility Auxiliary Systems
Auxiliary automotive subsystems - pumps, fans, actuators, and small traction assists - benefit from the DSPIC33EP512MC202T-E/MM's extended -40C to +125C qualification and 60 MIPS control throughput. The MCPWM with dead-time insertion drives three-phase bridges for brushless pumps and blowers, while the QEI processes encoder feedback for position-critical actuators. Integrated comparators support hardware-level fault interlocks demanded by functional-safety design reviews. With 512KB FLASH, firmware can include diagnostic routines, DTC storage, and LIN/CAN application layers alongside the control loop. Note: verify the specific automotive qualification level required by your program against Microchip documentation, as the -E suffix denotes extended commercial temperature range rather than a specific AEC-Q100 grade designation.
Recommandé
Audio Signal Processing and Embedded DSP
The DSP instruction set of the dsPIC33EP core - single-cycle MAC, dual operand fetch, hardware modulo addressing - makes the DSPIC33EP512MC202T-E/MM a compact choice for embedded audio: active crossover filters, acoustic echo cancellation stages, and tone/equalization processing in appliances and industrial annunciators. At 60 MIPS the core sustains multi-biquad IIR chains at 48 kHz sample rates with ample margin, and 24KB RAM buffers audio blocks for FFT-based analysis. The 512KB FLASH holds coefficient tables and multiple product voice profiles. Its 3.0-3.6V single-supply operation suits battery-powered designs, and the 6x6 mm QFN fits space-constrained control boards. Route the analog supply pins with separate LC filtering for best effective-number-of-bits from the on-chip ADC.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512MC202T-E/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512MC202T-I/MM | DSPIC33EP512MC202-E/MM | DSPIC33EP256MC202T-E/MM | DSPIC33EP128MC202T-E/MM | DSPIC33EP64MC202T-E/MM |
|---|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| CPU Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| FLASH Memory | 512 KB (170K x 24) | 512 KB | 512 KB | 256 KB | 128 KB | 64 KB |
| Operating Temperature | -40C to +125C | -40C to +85C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
| Motor Control PWM / QEI | Yes | Yes | Yes | Yes | Yes | Yes |
| Pin-to-Pin Compatibility | Reference | Pin-to-pin identical | Pin-to-pin identical | Pin-to-pin identical | Pin-to-pin identical | Pin-to-pin identical |
Principaux différenciateurs
- Extended temperature range with full memory (vs DSPIC33EP512MC202T-I/MM)
- Largest FLASH in the pin-compatible footprint (vs DSPIC33EP256MC202T-E/MM)
- Motor-control peripheral integration on 28 pins (vs General-purpose MCUs such as STM32F103 (functional comparison, not drop-in))
Notes de conception
The dsPIC33EP core is fed by an internal LDO: connect VCAP/VDDCORE (pin 28) to a low-ESR ceramic capacitor (per manufacturer datasheet recommendation, typically ~10 uF) to ground and never drive this pin externally. Supply VDD/AVDD from a single 3.0-3.6V rail; estimated current draw at 60 MIPS is on the order of 60-70 mA plus I/O load, so budget the 3.3V regulator accordingly. Isolate AVDD with an LC or RC filter from the digital rail to preserve ADC accuracy in motor-control designs where PWM switching noise is significant.
Solder the QFN exposed pad (ePAD) to a grounded copper pour with an array of thermal vias - it provides both the primary heat path for -40C to +125C operation at 60 MIPS and a low-inductance ground return for the ADC and PWM drivers. Place 0.1 uF ceramic decoupling within 2 mm of each VDD/AVDD pin pair plus one 4.7-10 uF bulk capacitor. Keep the oscillator traces short and guard them with ground; use the crystal's load capacitors per the crystal vendor specification to guarantee start-up across the full temperature range.
Do not assume peripheral pin positions from older dsPIC30/dsPIC33F designs - the dsPIC33EP uses Peripheral Pin Select (PPS), and most digital peripherals must be explicitly mapped to RPn pins in firmware before use; an unmapped pin silently stays GPIO. Second, the MCLR pin doubles as the high-voltage programming input, so size any external reset resistor/capacitor network to remain compatible with your programmer (PICkit/ICD/REAL ICE). Third, when substituting the -I/MM for the -E/MM, verify junction temperature: self-heating at 60 MIPS plus enclosure ambient must remain below the 85C I-grade limit.
Estimated: at 3.3V and roughly 65 mA core-plus-peripheral current, device dissipation is about 0.21 W, which is modest; thermal design is dominated by the PCB ePAD interface rather than the die. With a typical theta_JA around 40-50 C/W for a well-connected 6x6 QFN on a 2-layer board (verify exact figure in the datasheet), estimated junction rise is only 10 C above ambient, comfortably within the +125C E-grade ceiling. For high-I/O switching loads, add via arrays under the ePAD rather than relying on side-wall thermal paths.
Informations de conformité
RoHS compliance and lead-free finish per Microchip current-production dsPIC33EP product pages. Formal AEC-Q100 qualification level for this ordering code should be verified against Microchip qualification documentation; the -E suffix denotes extended commercial temperature range.
