DSPIC33EP256GM310T-I/PF - 70 MIPS 16-bit DSC 256KB Flash | Microchip
Référence : DSPIC33EP256GM310T-I/PF ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $7.2 | $7,20 |
| 10 | $6.55 | $65,50 |
| 100 | $5.8 | $580,00 |
| 500 | $5.35 | $2 675,00 |
| 1 000 | $4.9 | $4 900,00 |
DSPIC33EP256GM310T-I/PF Présentation
A digital signal controller combines the computational architecture of a microcontroller with the multiply-accumulate hardware of a DSP. In the power-management hierarchy of embedded systems, DSCs sit between general-purpose MCUs and dedicated DSPs, making them the standard choice for real-time control loops such as field-oriented motor control, digital power conversion, and sensor signal processing where deterministic interrupt latency and DSP-class math in a single chip are required.
Key features include 12 motor control PWM (MCPWM) channels, 8 input capture and 8 output compare peripherals, 2 quadrature encoder interfaces (QEI), and 4 integrated operational amplifiers that offload analog signal conditioning from external components. The Charge Time Measurement Unit (CTMU) supports capacitive touch and precision time measurement, while the Peripheral Trigger Generator (PTG) automates peripheral sequencing to reduce CPU load.
Architecturally, the dsPIC33E core uses an enhanced 16-bit pipeline with DSP instruction support (MAC, DSP multiply, barrel shifter), 85.5K x 24-bit program memory word organization, and low-power modes with boundary scan (JTAG) support. The integrated op-amps can be configured with the ADC for current-sense amplification in motor drives, eliminating external amplifier stages and board area.
Typical applications include precision motor control (BLDC, PMSM, stepper) drives, digital power supplies and solar inverters, and industrial sensing systems that need on-chip analog conditioning. The 12-channel MCPWM with dead-time insertion and fault inputs directly targets three-phase inverter designs.
A key design consideration: maximum operating frequency depends on temperature grade and supply conditions, so verify the electrical characteristics section of the manufacturer datasheet against your clock plan, and budget Flash for self-write endurance if field firmware updates are planned.
This page synthesizes distributor availability, drop-in same-family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP256GM310T-I/PF — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP256GM310T-I/PF (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core, Program Memory Size, Input Capture / Output Compare.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP256GM710T-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$5.4 / unité
Voir la fiche technique →DSPIC33EP512GM310T-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$15.95 / unité
Voir la fiche technique →DSPIC33EP256MU810T-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.1 / unité
Voir la fiche technique →DSPIC33EP128GM310T-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.75 / unité
Voir la fiche technique →DSPIC33EP256GM310T-E/PF
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256GM310-I/PF
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$4.14 / unité
Voir la fiche technique →DSPIC33EP256GM310T-I/PF Valeurs maximales et caractéristiques électriques
| Core | dsPIC33E 16-bit DSC |
| Core Performance | Up to 70 MIPS |
| Program Memory (Flash) | 256 KB |
| RAM | 16 KB (32KB reported for -E variant per Microchip USA) |
| Tension d'alimentation | 3.3 V |
| Program Memory Organization | 85.5K x 24 |
| Motor Control PWM (MCPWM) | 12 |
| Input Capture / Output Compare | 8 / 8 |
| Quadrature Encoder Interfaces | 2 |
| Operational Amplifiers | 4 |
| CTMU | Yes (Charge Time Measurement Unit) |
| PTG | Yes (Peripheral Trigger Generator) |
| Boîtier | 100-pin TQFP |
| Terminal Pitch | 0.5 mm |
| Température de fonctionnement | -40C to +125C (I grade) |
| Type de montage | Surface Mount |
| Packaging | Tape and Reel (T suffix) |
| Low Power Modes | Yes |
| Boundary Scan | Yes |
Guide de configuration des broches du DSPIC33EP256GM310T-I/PF 100-pin tqfp
Configuration des broches du DSPIC33EP256GM310T-I/PF (boîtier 100-pin tqfp). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP256GM310T-I/PF.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP256GM310T-I/PF convient pour 6 applications: Precision Motor Control (BLDC/PMSM Drives), Digital Power Supplies and Solar Inverters, Industrial Sensing and Condition Monitoring, Robotics and Servo Systems, Audio Signal Processing and DSP Systems, Lighting and Electronic Ballasts (HID/LED).
Precision Motor Control (BLDC/PMSM Drives)
The DSPIC33EP256GM310T-I/PF directly targets three-phase motor control: its 12 MCPWM channels provide complementary PWM outputs with dead-time insertion and fault protection, two QEIs accept incremental encoder feedback, and the 4 on-chip op-amps amplify shunt current signals into the ADC for FOC current loops - all at 70 MIPS with DSP MAC instructions executing the control mathematics. This eliminates external op-amp stages and reduces board area in servo drives, industrial automation axes, and e-mobility traction inverters. The 100-pin TQFP supplies the parallel GPIO needed for gate-drive enable, brake, and communication signals. A quantified benefit: single-chip current-loop + speed-loop execution removes latency versus two-chip analog/digital split architectures.
Recommandé
Digital Power Supplies and Solar Inverters
In digital power conversion, the 12 MCPWM channels support interleaved, phase-shifted, and complementary topologies with hardware dead-time and cycle-by-cycle current limiting via fault inputs. The PTG automates ADC-triggered PWM-update sequences without CPU intervention, freeing the 70 MIPS core for compensation-loop math executed with DSP instructions. On-chip op-amps condition inductor-current sense signals directly, and the CTMU supports precision timing measurements for power-quality diagnostics. Placed as the sole controller in a PFC plus LLC or micro-inverter design, it consolidates control, housekeeping, and communication in one 3.3V device rated -40C to +125C for outdoor and industrial environments.
Recommandé
Industrial Sensing and Condition Monitoring
The 4 integrated op-amps plus CTMU give this DSC a strong analog front end for industrial sensing nodes: op-amps amplify bridge or shunt signals into the ADC while the CTMU measures capacitance or time-of-flight for level, moisture, and proximity sensing. The 70 MIPS DSP core runs FFT-based vibration analysis and digital filtering locally, enabling predictive-maintenance endpoints that report over CAN via a transceiver or UART. With 85.5K x 24-bit program memory organization, there is ample room for signal-processing libraries plus a communication stack. The industrial -40C to +125C rating matches unconditioned factory-floor and outdoor installations.
Recommandé
Robotics and Servo Systems
Robot joint controllers benefit from this part's convergence of peripherals: dual QEIs read two encoders simultaneously, 12 MCPWM channels drive multiple motor bridges or one three-phase inverter plus auxiliaries, and the 70 MIPS core closes current, velocity, and position loops in software. Eight input captures support ultrasonic or hall-based sensing, while eight output compares generate auxiliary timing. The 256KB Flash holds trajectory planning, kinematics, and a communication stack (UART/SPI/I2C) concurrently. Compared with MCU-plus-FPGA approaches, a single DSPIC33EP256GM310 reduces BOM count while the PTG offloads deterministic peripheral choreography from the main control loop.
Recommandé
Audio Signal Processing and DSP Systems
With DSP multiply/MAC instructions, a barrel shifter, and 70 MIPS throughput, the GM310 implements audio filters, AGC, and effect processing for industrial intercoms, PA controllers, and embedded audio products. The on-chip op-amps bias and condition microphone signals ahead of the ADC, and DCI (audio codec interface) support in the dsPIC33E family connects directly to codec devices. The 256KB Flash accommodates multi-band EQ coefficients and boot code, while 16KB RAM buffers audio frames. Because it also handles keypad scanning, display driving, and networking on the same die, it consolidates what would otherwise require a DSP plus separate housekeeping MCU.
Recommandé
Lighting and Electronic Ballasts (HID/LED)
High-intensity discharge and high-power LED ballasts need precise, phase-shifted PWM with lamp-current sensing and fault shutdown - exactly the MCPWM + op-amp + fault-input combination on this DSC. The 12 PWM channels drive half-bridge or full-bridge resonant stages, on-chip op-amps amplify current-shunt feedback for constant-power regulation, and the CTMU supports lamp-end-of-life detection via precision timing. Running at 70 MIPS, the core executes digital compensation of the resonant converter loop. The -40C to +125C industrial temperature range suits sealed luminaires, and boundary scan support aids production test of densely populated ballast boards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP256GM310T-I/PF — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP256GM710T-I/PF | DSPIC33EP512GM310T-I/PF | DSPIC33EP256MU810T-I/PF | DSPIC33EP128GM310T-I/PF |
|---|---|---|---|---|---|
| Package | 100-pin TQFP | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same | 100-pin TQFP - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 256 KB | 256 KB | 512 KB | 256 KB | 128 KB |
| Core Performance | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| MCPWM Channels | 12 | 12 | 12 | 12 | 12 |
| Integrated Op-Amps | 4 | 4 | 4 | 4 | 4 |
| USB Module | No | No | No | Yes (full-speed USB 2.0 device) | No |
| CAN Modules | No | Yes (dual CAN 2.0B) | No | No | No |
| Operating Temperature | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C | -40C to +125C |
Principaux différenciateurs
- 4 integrated op-amps eliminate external signal conditioning (vs DSPIC33EP256MU810T-I/PF)
- Dual QEI for two-axis feedback (vs DSPIC33EP128GM310T-I/PF)
- Motor-control peripheral density at 70 MIPS (vs DSPIC33EP256GM710T-I/PF)
Notes de conception
Decouple all VDD/VDDCORE pins individually with 0.1uF ceramics placed within 2mm of each pin, plus one bulk 10uF per supply domain. The dsPIC33E requires the internal regulator output capacitor per datasheet layout guidelines - do not share it with other loads. On-VDDCORE capacitor selection directly affects 70 MIPS core stability; follow the reference schematic in the family datasheet rather than generic MCU layouts.
For motor-control designs, route MCPWM outputs away from encoder (QEI) traces to prevent false counts during switching transitions; ground-guard or space at least 3x trace width. Place the four op-amp ADC sense traces as short differential pairs over a solid ground plane. The 100-pin TQFP at 0.5mm pitch needs a well-defined solder stencil (typically 1:1 aperture with 5-10% reduction) to avoid bridging.
Verify the clock plan against the electrical characteristics table for your temperature grade - maximum frequency may be derated at corners, and the -E grade has different limits than the -I grade. Also confirm exact RAM size for your specific suffix before finalizing linker scripts, since sources cite 16KB (Mouser) versus 32KB (Microchip USA for -E variant); over-allocating RAM will cause link failures discovered late in development.
Informations de conformité
Comparison data on etei.com indicates RoHS compliance discussion for the family, but explicit RoHS/REACH status for this exact MPN was not stated in the verified data; check Microchip's product page environmental data for the definitive certificate.
