DSPIC33EP256GP502T-I/MM - 16-bit DSC, 70 MIPS, 256KB | Microchip
Référence : DSPIC33EP256GP502T-I/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.45 | $4,45 |
| 10 | $4.05 | $40,50 |
| 100 | $3.62 | $362,00 |
| 500 | $3.32 | $1 660,00 |
| 1 000 | $3.1 | $3 100,00 |
DSPIC33EP256GP502T-I/MM Présentation
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between a general-purpose MCU and a dedicated DSP, providing deterministic single-cycle multiply-accumulate (MAC) execution for real-time control loops while retaining flash memory, interrupt structure and communication peripherals familiar to MCU designers.
Key features include the enhanced dsPIC33E core running at 70 MIPS, Hi-Speed PWM outputs for motor control and power conversion, advanced analog integration with on-chip op-amps and comparators, a Charge Time Measurement Unit (CTMU) for capacitive touch and precision timing, a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing, and enhanced CAN (ECAN) communication for automotive and industrial networks.
The dsPIC33E architecture implements a modified Harvard pipeline with DSP instruction support (MPY, MAC, DO and REPEAT loops) and dual operand fetch, enabling single-cycle MAC operations that accelerate digital filtering, transforms and field-oriented motor control. Operating from a 3.3V supply, the industrial temperature grade (I, -40C to +85C) suits harsh environments. Code density is excellent, and the family is supported by MPLAB X IDE, MPLAB XC16 compiler, and low-cost in-circuit debugging via ICSP.
Typical applications include brushless DC and PMSM motor drives, digital power supplies (PFC, LLC), solar inverters, industrial sensors and CAN-based industrial control nodes.
Design consideration: place a low-ESR 0.1uF decoupling capacitor at every VDD/VSS pair and use the exposed pad as a low-inductance VSS connection; the on-chip PLL requires a stable 3.5V-5.5V? no - stable 3.3V rail with clean ground for jitter-sensitive PWM operation.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP256GP502T-I/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP256GP502T-I/MM (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core Speed, Timers, Packaging.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP256GP502-I/MM
✅ Remplacement direct✓ En stock
$3.79 / unité
Voir la fiche technique →DSPIC33EP256GP502T-E/MM
✅ Remplacement direct✓ En stock
$3.55 / unité
Voir la fiche technique →DSPIC33EP128GP502T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.68 / unité
Voir la fiche technique →DSPIC33EP64GP502T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP32GP502T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$2.19 / unité
Voir la fiche technique →DSPIC33EP256GP502T-I/MM Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33E DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| Tension d'alimentation | 3.3 V |
| Boîtier | 28-QFN-S (6x6 mm), exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial, I grade) |
| PWM | Hi-Speed PWM |
| Analog Integration | Op-Amps, Comparators, CTMU |
| Communication Interfaces | ECAN, UART, SPI, I2C |
| Peripheral Trigger Generator | Yes (PTG) |
| On-chip Op-Amps | Yes |
| Packaging | Tape & Reel (T suffix) |
| Programming/Debug | ICSP via MPLAB ICD/REAL ICE |
| Development Toolchain | MPLAB X IDE, XC16 compiler |
Configuration des broches de DSPIC33EP256GP502T-I/MM
| Broche 1 | MCLR — Master clear reset (active low), programming voltage input |
| Broche 2 | RB0/AN0 — Port B I/O, analog input 0 / VREF+ |
| Broche 3 | RB1/AN1 — Port B I/O, analog input 1 / VREF- |
| Broche 4 | RB2/AN2 — Port B I/O, analog input 2 |
| Broche 5 | RB3/AN3 — Port B I/O, analog input 3 |
| Broche 6 | RB4/AN4 — Port B I/O, analog input 4 |
| Broche 7 | VDD — Power supply (3.3V) |
| Broche 8 | VSS — Ground reference |
| Broche 9 | RA2/OSC1 — Port A I/O, primary oscillator input / external clock input |
| Broche 10 | RC15/OSC2 — Port C I/O, primary oscillator output / clock output |
| Broche 11 | RC13/SOSCI — Port C I/O, secondary oscillator input |
| Broche 12 | RC14/SOSCO — Port C I/O, secondary oscillator output / Timer1 clock input |
| Broche 13 | VDD — Power supply (3.3V) |
| Broche 14 | VSS — Ground reference |
| Broche 15 | RF4 — Port F I/O (EMUD3 debug channel) |
| Broche 16 | RF5 — Port F I/O (EMUC3 debug channel) |
| Broche 17 | RF3/RP2 — Port F I/O, remappable peripheral pin RP2 |
| Broche 18 | RF2/RP19 — Port F I/O, remappable peripheral pin RP19 |
| Broche 19 | VSS — Ground reference |
| Broche 20 | VDD — Power supply (3.3V) |
| Broche 21 | RF7/RP5 — Port F I/O, remappable pin RP5 (SDA1) |
| Broche 22 | RF6/RP6 — Port F I/O, remappable pin RP6 (SCL1) |
| Broche 23 | RB5/AN5 — Port B I/O, analog input 5 |
| Broche 24 | RG6/AN9 — Port G I/O, analog input 9, remappable RP20 |
| Broche 25 | RG7/AN10 — Port G I/O, analog input 10, remappable RP21 |
| Broche 26 | RG8/AN11 — Port G I/O, analog input 11, remappable RP22 |
| Broche 27 | RG9/AN12 — Port G I/O, analog input 12, remappable RP23 |
| Broche 28 | VDD — Power supply (3.3V) |
| Broche EP | Exposed Pad (VSS) — Thermal/electrical ground pad on package underside - solder to ground pour |
Applications typiques
DSPIC33EP256GP502T-I/MM convient pour 6 applications: Brushless DC / PMSM Motor Control, Digital Power Supplies (PFC / LLC / Buck), CAN-Based Industrial Control Nodes, Capacitive Touch and Charge-Time Measurement, Solar Micro-Inverters and Energy Conversion, Portable Instrumentation and Sensor Processing.
Brushless DC / PMSM Motor Control
The DSPIC33EP256GP502T-I/MM is a strong fit for sensorless and sensored BLDC and PMSM drives: its 70 MIPS DSP core executes single-cycle MAC instructions for field-oriented control (FOC) math, while the Hi-Speed PWM generates complementary outputs with dead-time insertion for three-phase inverters. On-chip op-amps can condition shunt-current feedback, and comparators provide fast over-current trip without external circuitry. Placed as the sole controller on a compact inverter board, the 6x6 mm QFN keeps the control section dense; the 32KB RAM comfortably holds FOC state variables and lookahead scheduling. The PTG can sequence ADC sampling with PWM for deterministic loop timing, reducing CPU interrupt load.
Recommandé
Digital Power Supplies (PFC / LLC / Buck)
Digital AC-DC and DC-DC conversion benefits directly from this DSC's high-resolution Hi-Speed PWM, which supports precise duty and phase control for PFC, LLC half-bridge, and synchronous buck topologies. The 70 MIPS core closes voltage and current loops with single-cycle multiply-accumulate arithmetic at switching frequencies of hundreds of kHz, while the CTMU and on-chip comparators implement fast-cycle-by-cycle current limiting. The Peripheral Trigger Generator synchronizes ADC sampling to the PWM period for low-jitter feedback, critical for loop stability. With 256KB Flash, designers can store multiple soft-start profiles, protection state machines, and firmware-update routines on a single compact 28-pin controller.
Recommandé
CAN-Based Industrial Control Nodes
With its Enhanced CAN (ECAN) module supporting CAN 2.0B at up to 1 Mbps, the DSPIC33EP256GP502T-I/MM serves as a compact intelligent node on industrial and vehicular networks. The 70 MIPS core runs the protocol stack and application logic concurrently, and the 256KB Flash stores diagnostic logs, bootloaders, and field-updatable firmware. The industrial -40C to +85C temperature range suits factory and outdoor equipment. Combined with an external CAN transceiver, the controller handles sensor acquisition through its 10-bit ADC, executes local control algorithms, and reports status over the bus, all within a 6x6 mm footprint that fits dense distributed I/O modules.
Recommandé
Capacitive Touch and Charge-Time Measurement
The integrated Charge Time Measurement Unit (CTMU) makes the DSPIC33EP256GP502T-I/MM well suited for capacitive touch sensing, ultrasonic time-of-flight, and precision current measurement. The CTMU measures charge transfer time against the internal reference, enabling touch buttons and sliders on PORTB analog pins without a dedicated touch controller. The on-chip op-amps buffer sensor nodes, and the 70 MIPS core runs drift-compensation and multi-key decoding algorithms in real time. In appliance and industrial HMI panels, the 28-pin QFN provides enough remappable pins for touch channels plus UART or SPI communication to a host, consolidating sensing, decision logic, and connectivity in one low-cost device.
Recommandé
Solar Micro-Inverters and Energy Conversion
Grid-tied micro-inverter and MPPT designs exploit the DSC's combination of DSP throughput and analog integration. The 70 MIPS core implements incremental-conductance or perturb-and-observe MPPT algorithms, while the Hi-Speed PWM drives the power stage with high-resolution phase-shifted outputs for LLC or flyback converters. The ADC, triggered by the PTG, samples panel voltage, current, and grid waveforms synchronously with PWM to minimize ripple-induced measurement error. The 256KB Flash accommodates anti-islanding protection, grid-code compliance routines, and communication stacks. The 6x6 mm QFN package with exposed pad provides the low-inductance grounding needed in the electrically noisy environment adjacent to switching power stages.
Recommandé
Portable Instrumentation and Sensor Processing
Battery-powered and handheld instruments benefit from the DSC's blend of signal-processing throughput and compact integration. The DSP engine accelerates digital filtering, FFT-based spectral analysis, and sensor linearization using single-cycle MAC operations, while the on-chip op-amps and comparators reduce external analog component count in signal chains. The 3.3V operation and low-power sleep modes extend battery life, and the industrial temperature grade supports field equipment. Typical end products include vibration analyzers, environmental monitors, and medical-style measurement devices where the 28-pin QFN's small 6x6 mm footprint fits slim enclosures. SPI and I2C interfaces connect displays, external ADCs, and memory for data logging within the 32KB RAM budget.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP256GP502T-I/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP256GP502-I/MM | DSPIC33EP256GP502T-E/MM | DSPIC33EP128GP502T-I/MM | DSPIC33EP64GP502T-I/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 256 KB (85.5K x 24) | 256 KB | 256 KB | 128 KB | 64 KB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +125C (E grade, AEC-Q100) | -40C to +85C | -40C to +85C |
| Packaging | Tape & Reel (T) | Tray/Tube | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
| Analog Peripherals | Op-amps, comparators, CTMU, ADC | Identical (same die) | Identical (same die) | Identical | Identical |
Principaux différenciateurs
- Maximum memory in the 28-pin GP family (vs DSPIC33EP128GP502T-I/MM)
- Automotive/extended-temp drop-in option (vs DSPIC33EP256GP502T-E/MM)
- Integrated op-amps and CTMU reduce BOM cost (vs DSPIC33EP64GP502T-I/MM)
Notes de conception
Connect all VDD pins (7, 13, 20, 28) to a single clean 3.3V rail and place a 0.1uF ceramic decoupling capacitor at each VDD/VSS pair, plus 4.7-10uF bulk capacitance near the device. Solder the exposed pad to a ground pour - it is the primary VSS connection for the QFN and also the thermal path. Jitter-sensitive Hi-Speed PWM operation degrades with noisy supplies, so keep the switching power stage ground separated from controller analog ground, joining at a single point.
Keep the crystal (OSC1/OSC2 on pins 9/10) within 10-15 mm of the device with short ground-guard traces. Use the Peripheral Pin Select (PPS) feature to route ECAN, UART and PWM pins away from analog inputs AN0-AN5 on PORTB. For programming, route MCLR, PGD and PGC to a standard 5-pin ICSP header; do not load MCLR with large capacitance, or ICSP programming will fail. ECAD footprints are freely available from the Component Search Engine for this MPN.
Configure configuration words (FICD, FPOR, FOSC) correctly at first programming - an incorrect oscillator configuration word can leave the device unresponsive after power-up and unrecoverable in-circuit without a bulk erase. Remapped RP pins must not be assigned to two peripherals simultaneously; PPS conflicts silently break communication. Finally, since this is the tape-and-reel variant, respect MSL floor-life limits and bake the reel if moisture indicators have been exceeded before reflow.
Informations de conformité
Current-production Microchip dsPIC33EP parts are RoHS compliant and lead-free per distributor listings. The I-grade part is not AEC-Q100 qualified; use DSPIC33EP256GP502T-E/MM for automotive-grade requirements. REACH/halogen declarations: consult Microchip environmental documents.
