DSPIC33EP512GP502T-I/MM - 16-bit 70 MIPS DSC, 512KB Flash | Microchip
Référence : DSPIC33EP512GP502T-I/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $4.67 | $4,67 |
| 10 | $4.35 | $43,50 |
| 100 | $3.95 | $395,00 |
| 500 | $3.6 | $1 800,00 |
| 1 000 | $3.25 | $3 250,00 |
DSPIC33EP512GP502T-I/MM Présentation
A digital signal controller combines the deterministic control structure of a microcontroller with the math acceleration of a DSP engine, including single-cycle multiply-accumulate (MAC) and hardware division support. DSCs occupy the middle of the embedded hierarchy between general-purpose MCUs and dedicated DSP ICs, making them the default choice for closed-loop power conversion and motor control where fast interrupt response and fixed-point arithmetic both matter.
Key features include 70 MIPS maximum core speed, 12-bit ADC performance with high sample-rate conversion, dual integrated operational amplifiers and comparators, a Charge Time Measurement Unit (CTMU), CAN 2.0B communication, four DMA channels, five 16-bit timers, high-speed PWM outputs, and a Peripheral Trigger Generator (PTG) that automates peripheral sequencing with minimal CPU intervention. Operating voltage is 3.3 V (per datasheet-class listing: 16-bit dsPIC RISC, 512 KB Flash, 3.3 V, 28-pin QFN-S EP, tape and reel).
The dsPIC33EP architecture pairs the enhanced Flash with an execution pipeline that sustains single-cycle instruction throughput at 70 MIPS, and the PTG plus DMA offload keeps the core free during time-critical control loops. The integrated op amps directly condition current-shunt or resolver signals ahead of the ADC, reducing external BOM count.
Typical applications span sensorless BLDC and PMSM motor control, digital power supplies (PFC, LLC), industrial automation nodes with CAN connectivity, and general-purpose signal conditioning where analog integration reduces board area.
Design consideration: the QFN-S exposed pad must be soldered to a grounded thermal pad for both heat dissipation and signal integrity; VCAP/VDDCORE requires the manufacturer-specified capacitance for stable core regulation.
This page adds value beyond the raw datasheet by consolidating distributor pricing, verified drop-in alternatives, practical layout notes, and an honest comparison across temperature-grade variants.
Alternatives de remplacement direct pour DSPIC33EP512GP502T-I/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512GP502T-I/MM (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Core, PWM, Supply Voltage.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512GP502T-E/MM
✅ Remplacement direct✓ En stock
$3.92 / unité
Voir la fiche technique →DSPIC33EP512GP502T-H/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP512GP502-I/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256GP502T-I/MM
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.1 / unité
Voir la fiche technique →DSPIC33EP32GP502T-E/MM
✅ Remplacement direct✓ En stock
$2.98 / unité
Voir la fiche technique →DSPIC33EP512GP502T-I/MM Valeurs maximales et caractéristiques électriques
| Core | 16-bit dsPIC33EP RISC with DSP engine |
| Core Speed | 70 MIPS (60 MHz class per family listing) |
| Program Memory | 512 KB (170K x 24) Flash |
| RAM | 48 KB |
| Tension d'alimentation | 3.3 V |
| Boîtier | 28-QFN-S (6x6 mm) with exposed pad |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (I grade) |
| Timers | 5 x 16-bit timers |
| DMA Channels | 4 |
| External Interrupts | Up to 3 |
| Integrated Analog | Op amps, comparators, CTMU |
| Communication Interfaces | CAN 2.0B, UART, SPI, I2C |
| Packaging | Tape & Reel (T suffix) |
Configuration des broches de DSPIC33EP512GP502T-I/MM
| Broche 1 | MCLR — Master clear reset input / programming voltage |
| Broche 2 | AN0/VREF+/CN2/RB0 — Analog input 0 / positive voltage reference |
| Broche 3 | AN1/VREF-/CN3/RB1 — Analog input 1 / negative voltage reference |
| Broche 4 | AN2/SS1/CN4/RB2 — Analog input 2 / SPI slave select |
| Broche 5 | AN3/IND/CN5/RB3 — Analog input 3 / comparator-inductor input |
| Broche 6 | AN4/C1IN-/CN6/RB4 — Analog input 4 / comparator 1 inverting input |
| Broche 7 | VDD — Power supply (3.3 V) |
| Broche 8 | VSS — Ground reference |
| Broche 9 | OSC1/CLKI/CN7/RA2 — Crystal oscillator input / external clock input |
| Broche 10 | OSC2/CLKO/CN8/RA3 — Crystal oscillator output / clock output |
| Broche 11 | VCAP/VDDCORE — Internal core regulator capacitor connection |
| Broche 12 | RP15/SDA1/CN11/RF3 — Remappable pin / I2C data |
| Broche 13 | RP14/SCL1/CN10/RF2 — Remappable pin / I2C clock |
| Broche 14 | INT0/RP2/CN12/RB5 — External interrupt 0 / remappable pin |
| Broche 15 | AN5/C1IN+/CN7/RB6 — Analog input 5 / comparator 1 non-inverting input |
| Broche 16 | AN6/OCFA/CN8/RB7 — Analog input 6 / PWM fault input |
| Broche 17 | AN7/RP0/CN9/RB8 — Analog input 7 / remappable pin |
| Broche 18 | AN8/RP1/CN10/RB9 — Analog input 8 / remappable pin |
| Broche 19 | AN9/RP3/CN11/RB10 — Analog input 9 / remappable pin |
| Broche 20 | AN10/RP4/CN12/RB11 — Analog input 10 / remappable pin |
| Broche 21 | AN11/RP17/CN13/RB12 — Analog input 11 / remappable pin |
| Broche 22 | AN12/RP18/CN14/RB13 — Analog input 12 / remappable pin |
| Broche 23 | PGD/RP19/CN15/RB14 — In-circuit debug data / remappable pin |
| Broche 24 | PGC/RP20/CN16/RB15 — In-circuit debug clock / remappable pin |
| Broche 25 | VSS — Ground reference |
| Broche 26 | VDD — Power supply (3.3 V) |
| Broche 27 | AVDD — Analog power supply |
| Broche 28 | AVSS — Analog ground |
Applications typiques
DSPIC33EP512GP502T-I/MM convient pour 6 applications: Sensorless BLDC/PMSM Motor Control, Digital Power Supplies (PFC, LLC, Buck), Industrial Automation CAN Nodes, Precision Sensor Signal Conditioning, Embedded Test and Measurement Probes, Lighting and Power Conversion Control.
Sensorless BLDC/PMSM Motor Control
The DSPIC33EP512GP502T-I/MM fits three-phase motor control because its 70 MIPS DSP core with single-cycle MAC executes field-oriented control loops at tens of kHz, while the integrated op amps amplify shunt-resistor current feedback directly into the ADC, eliminating external amplifier ICs. In a typical sensorless topology, the high-speed PWM module generates complementary three-phase drive signals with dead-time insertion, and back-EMF is sampled through the 12-bit ADC synchronized to the PWM. Using one DSC for control, PWM, and analog conditioning shrinks board area versus a discrete MCU-plus-ADC-plus-op-amp solution, and four DMA channels move ADC results without CPU overhead, keeping interrupt latency deterministic for the control loop.
Recommandé
Digital Power Supplies (PFC, LLC, Buck)
Digital power conversion benefits directly from the GP502's combination of high-speed PWM with fine resolution, fast 16-bit control math, and the Peripheral Trigger Generator that fires ADC sampling at the optimal point in each switching cycle. In a PFC or LLC controller, the PTG sequences ADC captures and PWM updates autonomously, so the CPU is reserved entirely for the compensation algorithm running at up to 70 MIPS. The integrated comparators provide cycle-by-cycle current limiting as a hardware fast path, independent of firmware. This hardware-analog-plus-DSP blend delivers the deterministic protection response of analog controllers with the flexibility and programmability of digital control, in a single 6x6 mm QFN-S footprint.
Recommandé
Industrial Automation CAN Nodes
For industrial field nodes, the GP502's integrated CAN 2.0B module plus UART, SPI and I2C gives a complete communication suite from one 3.3 V part. The 512 KB Flash is large enough to hold a full CANopen or custom protocol stack, a bootloader for field firmware updates, and the application control code with headroom to spare. The CTMU (Charge Time Measurement Unit) supports capacitive touch and precise time-interval measurement for sensor interfacing, while five 16-bit timers handle scheduling and encoder counting. Nodes built on this DSC integrate sensing, actuation and networking without external interface chips beyond a CAN transceiver, reducing BOM and qualification effort.
Recommandé
Precision Sensor Signal Conditioning
The GP502 integrates dual operational amplifiers, comparators, a 12-bit-class ADC and the CTMU, making it a compact front-end for bridges, RTDs, photodiodes and other low-level sensors. The op amps provide gain staging immediately adjacent to the ADC, shortening analog traces on the 6x6 mm package and improving noise immunity versus off-chip amplification. DMA channels stream conversion results to RAM at full ADC throughput, and the DSP engine applies fixed-point filtering (IIR/FIR) at 70 MIPS. In portable and industrial instruments, this level of analog integration removes two to three external ICs from the signal chain, cutting both board area and calibration complexity per channel.
Recommandé
Embedded Test and Measurement Probes
Handheld instruments and smart probes exploit the GP502's CTMU for precise charge and time-domain measurement, its timers for frequency capture, and the DSP engine for on-device waveform math. The 512 KB Flash supports a full acquisition, analysis and UI framework, while the 48 KB RAM buffers waveform samples for post-processing. USB-class or UART links (via remappable pins) stream results to a host PC, and CAN integrates the probe into automated test racks. Running all capture and analysis locally at 70 MIPS reduces host dependency and enables battery-powered operation, since the DSC handles measurement, filtering and communication in one low-power 3.3 V device.
Recommandé
Lighting and Power Conversion Control
High-intensity and smart lighting ballasts use the GP502's high-speed PWM with complementary outputs and dead-time control to drive half-bridge and LLC stages, while ADC sampling via PTG closes current and luminance loops. The integrated comparators give fast overcurrent protection independent of software, which is essential for lamp and LED driver reliability. On-board op amps condition dimming feedback and current-shunt signals without external amplifiers. With CAN and UART on the remappable pins, fixtures connect into building-automation networks (DALI gateways, CAN-based dimming buses), letting one 28-pin controller handle power conversion, control and networked dimming commands simultaneously.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512GP502T-I/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512GP502T-E/MM | DSPIC33EP512GP502T-H/MM | DSPIC33EP256GP502T-I/MM | DSPIC33EP32GP502T-E/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S/28-PQCC - same footprint | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 512 KB (170K x 24) | 512 KB | 512 KB | 256 KB | 32 KB |
| Core Speed | 70 MIPS | 70 MIPS class | 70 MIPS class | 70 MIPS class | 70 MIPS class |
| Operating Temperature | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +150C (H grade) | -40C to +85C (I grade) | -40C to +125C (E grade) |
| Packaging | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
| Key Peripherals | Op amps, comparators, CTMU, CAN, PTG | Identical peripheral set | Identical peripheral set | Identical peripheral set | Identical peripheral set |
Principaux différenciateurs
- Full 512 KB Flash in a 28-pin footprint (vs DSPIC33EP32GP502T-E/MM)
- Integrated analog front-end (vs DSPIC33EP256GP502T-I/MM)
- Lowest-cost temperature grade for standard industrial use (vs DSPIC33EP512GP502T-E/MM)
Notes de conception
The VCAP/VDDCORE pin stabilizes the internal 1.8 V-class core regulator. Fit the datasheet-specified low-ESR ceramic capacitor within a few millimeters of pin 11; an omitted or undersized VCAP capacitor is the most common cause of sporadic reset and brownout symptoms on dsPIC33EP boards. Decouple both VDD/VSS pairs with 0.1 uF ceramics placed close to the package, and keep AVDD/AVSS fed through an RC or ferrite filter from the digital 3.3 V rail to protect ADC noise performance.
The QFN-S exposed pad must be soldered to a PCB thermal pad - it is not optional. Connect it to a grounded pour with a stitched via array (typically 3x3 or 4x4 vias) to provide the low-inductance ground reference and heat spreading the 6x6 mm QFN package expects. During hand assembly, a hot-plate or reflow profile that wets the underside pad is required; solder-paste-only hand ironing will leave the thermal pad unwetted and cause intermittent ground faults.
For motor-control or power-conversion use, route PWM outputs away from the analog inputs (pins 2-6, 15-22) and keep the shunt-amplifier traces from the integrated op amps short and shielded by ground pour. Synchronize ADC sampling to the PWM period using the PTG or ADC trigger rather than polling - this eliminates sampling jitter that otherwise shows up as current-loop noise. Use the Peripheral Pin Select to route UART/SPI/I2C away from high dV/dt traces during PCB revision cycles.
Temperature-grade selection is the frequent ordering error: the I suffix is rated to +85C while E (+125C) and H (+150C) grades fit harsher environments - a design validated only at 25C may fail in enclosed enclosures that trap motor-driver heat. Also remember the T suffix means tape-and-reel minimum quantity; prototypers should order the non-T tube version. Finally, in-circuit programming uses PGC/PGD (pins 23/24) plus MCLR - reserve these pads and a 5-pin ICSP header on every board.
Informations de conformité
Compliance status was not stated in the provided verified web data. Modern Microchip dsPIC33EP parts are generally RoHS-compliant, but verify on the official Microchip product page before export documentation.
