DSPIC33EP256GP502T-I/MM - 16-bit DSC, 70 MIPS, 256KB | Microchip
Артикул: DSPIC33EP256GP502T-I/MM ✓ Активен| Кол-во | Цена за ед. | Итого |
|---|---|---|
| 1 | $4.45 | $4,45 |
| 10 | $4.05 | $40,50 |
| 100 | $3.62 | $362,00 |
| 500 | $3.32 | $1.660,00 |
| 1.000 | $3.1 | $3.100,00 |
DSPIC33EP256GP502T-I/MM Обзор
A digital signal controller combines the computational architecture of a digital signal processor with the peripheral set and ease of use of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits between a general-purpose MCU and a dedicated DSP, providing deterministic single-cycle multiply-accumulate (MAC) execution for real-time control loops while retaining flash memory, interrupt structure and communication peripherals familiar to MCU designers.
Key features include the enhanced dsPIC33E core running at 70 MIPS, Hi-Speed PWM outputs for motor control and power conversion, advanced analog integration with on-chip op-amps and comparators, a Charge Time Measurement Unit (CTMU) for capacitive touch and precision timing, a Peripheral Trigger Generator (PTG) for autonomous peripheral sequencing, and enhanced CAN (ECAN) communication for automotive and industrial networks.
The dsPIC33E architecture implements a modified Harvard pipeline with DSP instruction support (MPY, MAC, DO and REPEAT loops) and dual operand fetch, enabling single-cycle MAC operations that accelerate digital filtering, transforms and field-oriented motor control. Operating from a 3.3V supply, the industrial temperature grade (I, -40C to +85C) suits harsh environments. Code density is excellent, and the family is supported by MPLAB X IDE, MPLAB XC16 compiler, and low-cost in-circuit debugging via ICSP.
Typical applications include brushless DC and PMSM motor drives, digital power supplies (PFC, LLC), solar inverters, industrial sensors and CAN-based industrial control nodes.
Design consideration: place a low-ESR 0.1uF decoupling capacitor at every VDD/VSS pair and use the exposed pad as a low-inductance VSS connection; the on-chip PLL requires a stable 3.5V-5.5V? no - stable 3.3V rail with clean ground for jitter-sensitive PWM operation.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet.
Аналоги без доработки для DSPIC33EP256GP502T-I/MM — тот же корпус, pin-to-pin совместимость. Компоненты в других корпусах, требующие переработки PCB, исключены.
Варианты в этой серии
Модели той же серии, совместимые без доработки с DSPIC33EP256GP502T-I/MM (тот же форм-фактор и посадочное место) — отличается по Package, Operating Temperature, Core Speed, Timers, Packaging.
Инструмент быстрого сравнения — выберите альтернативные компоненты для сравнения бок о бок:
DSPIC33EP256GP502-I/MM
✅ Прямая замена✓ В наличии
$3.79 / шт.
Открыть даташит →DSPIC33EP256GP502T-E/MM
✅ Прямая замена✓ В наличии
$3.55 / шт.
Открыть даташит →DSPIC33EP128GP502T-I/MM
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$2.68 / шт.
Открыть даташит →DSPIC33EP64GP502T-I/MM
✅ Прямая замена ⚠️ Характеристики не проверены📋 Справочный аналог (нет в каталоге)
DSPIC33EP32GP502T-I/MM
✅ Прямая замена ⚠️ Характеристики не проверены✓ В наличии
$2.19 / шт.
Открыть даташит →DSPIC33EP256GP502T-I/MM Максимальные параметры и электрические характеристики
| Core Architecture | 16-bit dsPIC33E DSC |
| Maximum CPU Speed | 70 MIPS |
| Program Memory (Flash) | 256 KB (85.5K x 24) |
| RAM | 32 KB |
| Напряжение питания | 3.3 V |
| Корпус | 28-QFN-S (6x6 mm), exposed pad |
| Тип монтажа | Surface Mount |
| Рабочая температура | -40C to +85C (Industrial, I grade) |
| PWM | Hi-Speed PWM |
| Analog Integration | Op-Amps, Comparators, CTMU |
| Communication Interfaces | ECAN, UART, SPI, I2C |
| Peripheral Trigger Generator | Yes (PTG) |
| On-chip Op-Amps | Yes |
| Packaging | Tape & Reel (T suffix) |
| Programming/Debug | ICSP via MPLAB ICD/REAL ICE |
| Development Toolchain | MPLAB X IDE, XC16 compiler |
Конфигурация выводов DSPIC33EP256GP502T-I/MM
| Контакт 1 | MCLR — Master clear reset (active low), programming voltage input |
| Контакт 2 | RB0/AN0 — Port B I/O, analog input 0 / VREF+ |
| Контакт 3 | RB1/AN1 — Port B I/O, analog input 1 / VREF- |
| Контакт 4 | RB2/AN2 — Port B I/O, analog input 2 |
| Контакт 5 | RB3/AN3 — Port B I/O, analog input 3 |
| Контакт 6 | RB4/AN4 — Port B I/O, analog input 4 |
| Контакт 7 | VDD — Power supply (3.3V) |
| Контакт 8 | VSS — Ground reference |
| Контакт 9 | RA2/OSC1 — Port A I/O, primary oscillator input / external clock input |
| Контакт 10 | RC15/OSC2 — Port C I/O, primary oscillator output / clock output |
| Контакт 11 | RC13/SOSCI — Port C I/O, secondary oscillator input |
| Контакт 12 | RC14/SOSCO — Port C I/O, secondary oscillator output / Timer1 clock input |
| Контакт 13 | VDD — Power supply (3.3V) |
| Контакт 14 | VSS — Ground reference |
| Контакт 15 | RF4 — Port F I/O (EMUD3 debug channel) |
| Контакт 16 | RF5 — Port F I/O (EMUC3 debug channel) |
| Контакт 17 | RF3/RP2 — Port F I/O, remappable peripheral pin RP2 |
| Контакт 18 | RF2/RP19 — Port F I/O, remappable peripheral pin RP19 |
| Контакт 19 | VSS — Ground reference |
| Контакт 20 | VDD — Power supply (3.3V) |
| Контакт 21 | RF7/RP5 — Port F I/O, remappable pin RP5 (SDA1) |
| Контакт 22 | RF6/RP6 — Port F I/O, remappable pin RP6 (SCL1) |
| Контакт 23 | RB5/AN5 — Port B I/O, analog input 5 |
| Контакт 24 | RG6/AN9 — Port G I/O, analog input 9, remappable RP20 |
| Контакт 25 | RG7/AN10 — Port G I/O, analog input 10, remappable RP21 |
| Контакт 26 | RG8/AN11 — Port G I/O, analog input 11, remappable RP22 |
| Контакт 27 | RG9/AN12 — Port G I/O, analog input 12, remappable RP23 |
| Контакт 28 | VDD — Power supply (3.3V) |
| Контакт EP | Exposed Pad (VSS) — Thermal/electrical ground pad on package underside - solder to ground pour |
Типичное применение
DSPIC33EP256GP502T-I/MM подходит для 6 применениеs: Brushless DC / PMSM Motor Control, Digital Power Supplies (PFC / LLC / Buck), CAN-Based Industrial Control Nodes, Capacitive Touch and Charge-Time Measurement, Solar Micro-Inverters and Energy Conversion, Portable Instrumentation and Sensor Processing.
Brushless DC / PMSM Motor Control
The DSPIC33EP256GP502T-I/MM is a strong fit for sensorless and sensored BLDC and PMSM drives: its 70 MIPS DSP core executes single-cycle MAC instructions for field-oriented control (FOC) math, while the Hi-Speed PWM generates complementary outputs with dead-time insertion for three-phase inverters. On-chip op-amps can condition shunt-current feedback, and comparators provide fast over-current trip without external circuitry. Placed as the sole controller on a compact inverter board, the 6x6 mm QFN keeps the control section dense; the 32KB RAM comfortably holds FOC state variables and lookahead scheduling. The PTG can sequence ADC sampling with PWM for deterministic loop timing, reducing CPU interrupt load.
Рекомендуется
Digital Power Supplies (PFC / LLC / Buck)
Digital AC-DC and DC-DC conversion benefits directly from this DSC's high-resolution Hi-Speed PWM, which supports precise duty and phase control for PFC, LLC half-bridge, and synchronous buck topologies. The 70 MIPS core closes voltage and current loops with single-cycle multiply-accumulate arithmetic at switching frequencies of hundreds of kHz, while the CTMU and on-chip comparators implement fast-cycle-by-cycle current limiting. The Peripheral Trigger Generator synchronizes ADC sampling to the PWM period for low-jitter feedback, critical for loop stability. With 256KB Flash, designers can store multiple soft-start profiles, protection state machines, and firmware-update routines on a single compact 28-pin controller.
Рекомендуется
CAN-Based Industrial Control Nodes
With its Enhanced CAN (ECAN) module supporting CAN 2.0B at up to 1 Mbps, the DSPIC33EP256GP502T-I/MM serves as a compact intelligent node on industrial and vehicular networks. The 70 MIPS core runs the protocol stack and application logic concurrently, and the 256KB Flash stores diagnostic logs, bootloaders, and field-updatable firmware. The industrial -40C to +85C temperature range suits factory and outdoor equipment. Combined with an external CAN transceiver, the controller handles sensor acquisition through its 10-bit ADC, executes local control algorithms, and reports status over the bus, all within a 6x6 mm footprint that fits dense distributed I/O modules.
Рекомендуется
Capacitive Touch and Charge-Time Measurement
The integrated Charge Time Measurement Unit (CTMU) makes the DSPIC33EP256GP502T-I/MM well suited for capacitive touch sensing, ultrasonic time-of-flight, and precision current measurement. The CTMU measures charge transfer time against the internal reference, enabling touch buttons and sliders on PORTB analog pins without a dedicated touch controller. The on-chip op-amps buffer sensor nodes, and the 70 MIPS core runs drift-compensation and multi-key decoding algorithms in real time. In appliance and industrial HMI panels, the 28-pin QFN provides enough remappable pins for touch channels plus UART or SPI communication to a host, consolidating sensing, decision logic, and connectivity in one low-cost device.
Рекомендуется
Solar Micro-Inverters and Energy Conversion
Grid-tied micro-inverter and MPPT designs exploit the DSC's combination of DSP throughput and analog integration. The 70 MIPS core implements incremental-conductance or perturb-and-observe MPPT algorithms, while the Hi-Speed PWM drives the power stage with high-resolution phase-shifted outputs for LLC or flyback converters. The ADC, triggered by the PTG, samples panel voltage, current, and grid waveforms synchronously with PWM to minimize ripple-induced measurement error. The 256KB Flash accommodates anti-islanding protection, grid-code compliance routines, and communication stacks. The 6x6 mm QFN package with exposed pad provides the low-inductance grounding needed in the electrically noisy environment adjacent to switching power stages.
Рекомендуется
Portable Instrumentation and Sensor Processing
Battery-powered and handheld instruments benefit from the DSC's blend of signal-processing throughput and compact integration. The DSP engine accelerates digital filtering, FFT-based spectral analysis, and sensor linearization using single-cycle MAC operations, while the on-chip op-amps and comparators reduce external analog component count in signal chains. The 3.3V operation and low-power sleep modes extend battery life, and the industrial temperature grade supports field equipment. Typical end products include vibration analyzers, environmental monitors, and medical-style measurement devices where the 28-pin QFN's small 6x6 mm footprint fits slim enclosures. SPI and I2C interfaces connect displays, external ADCs, and memory for data logging within the 32KB RAM budget.
Рекомендуется
Сводка рекомендуемых товаров
Справочные инженерные данные для DSPIC33EP256GP502T-I/MM — сравнение, рекомендации по проектированию и информация о соответствии.
Руководство по выбору
Сравнение с аналогами
| Параметр | Этот товар | DSPIC33EP256GP502-I/MM | DSPIC33EP256GP502T-E/MM | DSPIC33EP128GP502T-I/MM | DSPIC33EP64GP502T-I/MM |
|---|---|---|---|---|---|
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same | 28-QFN-S (6x6 mm) - same |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Flash | 256 KB (85.5K x 24) | 256 KB | 256 KB | 128 KB | 64 KB |
| RAM | 32 KB | 32 KB | 32 KB | 32 KB | 32 KB |
| CPU Speed | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS | 70 MIPS |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C | -40C to +125C (E grade, AEC-Q100) | -40C to +85C | -40C to +85C |
| Packaging | Tape & Reel (T) | Tray/Tube | Tape & Reel (T) | Tape & Reel (T) | Tape & Reel (T) |
| Analog Peripherals | Op-amps, comparators, CTMU, ADC | Identical (same die) | Identical (same die) | Identical | Identical |
Ключевые отличия
- Maximum memory in the 28-pin GP family (против DSPIC33EP128GP502T-I/MM)
- Automotive/extended-temp drop-in option (против DSPIC33EP256GP502T-E/MM)
- Integrated op-amps and CTMU reduce BOM cost (против DSPIC33EP64GP502T-I/MM)
Заметки по проектированию
Connect all VDD pins (7, 13, 20, 28) to a single clean 3.3V rail and place a 0.1uF ceramic decoupling capacitor at each VDD/VSS pair, plus 4.7-10uF bulk capacitance near the device. Solder the exposed pad to a ground pour - it is the primary VSS connection for the QFN and also the thermal path. Jitter-sensitive Hi-Speed PWM operation degrades with noisy supplies, so keep the switching power stage ground separated from controller analog ground, joining at a single point.
Keep the crystal (OSC1/OSC2 on pins 9/10) within 10-15 mm of the device with short ground-guard traces. Use the Peripheral Pin Select (PPS) feature to route ECAN, UART and PWM pins away from analog inputs AN0-AN5 on PORTB. For programming, route MCLR, PGD and PGC to a standard 5-pin ICSP header; do not load MCLR with large capacitance, or ICSP programming will fail. ECAD footprints are freely available from the Component Search Engine for this MPN.
Configure configuration words (FICD, FPOR, FOSC) correctly at first programming - an incorrect oscillator configuration word can leave the device unresponsive after power-up and unrecoverable in-circuit without a bulk erase. Remapped RP pins must not be assigned to two peripherals simultaneously; PPS conflicts silently break communication. Finally, since this is the tape-and-reel variant, respect MSL floor-life limits and bake the reel if moisture indicators have been exceeded before reflow.
Информация о соответствии
Current-production Microchip dsPIC33EP parts are RoHS compliant and lead-free per distributor listings. The I-grade part is not AEC-Q100 qualified; use DSPIC33EP256GP502T-E/MM for automotive-grade requirements. REACH/halogen declarations: consult Microchip environmental documents.
