DSPIC33EP256MC506-I/PT - 16-Bit 70 MIPS DSC 64-TQFP | Microchip
Référence : DSPIC33EP256MC506-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.5 | $9,50 |
| 10 | $8.55 | $85,50 |
| 100 | $7.45 | $745,00 |
| 500 | $6.65 | $3 325,00 |
| 1 000 | $5.95 | $5 950,00 |
DSPIC33EP256MC506-I/PT Présentation
A digital signal controller combines the computational architecture of a digital signal processor (DSP) with the peripheral set and ease-of-use of a microcontroller (MCU). Within the power-management hierarchy of embedded systems, the DSC sits above general-purpose MCUs for control loops that demand fast math execution, and below dedicated DSPs where a full real-time operating environment is not required. The dsPIC33E core is Microchip's 16-bit DSC platform for high-performance embedded control.
Key features include a 70 MIPS dsPIC DSC core with single-cycle MAC, dual-operand fetch, and a barrel shifter; 256 KB Flash and 32 KB SRAM; four DMA channels for peripheral-to-memory transfers without CPU intervention; five timers; integrated high-performance op amps; high-speed PWM outputs for motor control; and a charge-time measurement unit (CTMU) for temperature and touch sensing. The 64-TQFP package provides sufficient I/O for advanced motor drive designs.
The architecture supports multiple internal bus arrangements and JTAG boundary scan for production test. Microchip states that 32-256 KB dsPIC33EP devices are feature- and pin-compatible, enabling straightforward migration within the family without PCB rework. The 64-pin TQFP package targets high-pin-count motor-control and digital-power designs.
Typical applications include precision motor control for BLDC, PMSM, and ACIM drives used in e-mobility (e-bikes, scooters, electric vehicles), digital switch-mode power supplies, photovoltaic inverters, and industrial automation loops where fast PWM, on-chip analog, and DSP-class math run inside a single control period.
A key design consideration: the core is sourced from a 60 MHz clock with the headline 70 MIPS delivered by the PLL, so supply decoupling, ground strategy, and Flash wait-state configuration should follow the manufacturer datasheet to achieve full rated throughput.
This page synthesizes distributor pricing context, verified drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, giving engineers a single citable reference for the DSPIC33EP256MC506-I/PT.
Alternatives de remplacement direct pour DSPIC33EP256MC506-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP256MC506-I/PT (même facteur de forme et même empreinte) — différant par Package, Operating Temperature, Core Architecture, Program Memory (Flash), ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP256MC506-E/PT
✅ Remplacement direct✓ En stock
$5.83 / unité
Voir la fiche technique →DSPIC33EP128MC506-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256MC504-E/PT
✅ Remplacement direct✓ En stock
$4.28 / unité
Voir la fiche technique →DSPIC33FJ256MC510-I/PT
✅ Remplacement direct✓ En stock
$6.55 / unité
Voir la fiche technique →DSPIC33FJ128MC506A-I/PT
✅ Remplacement direct✓ En stock
$3.2 / unité
Voir la fiche technique →DSPIC33EP256MC506-I/PT Valeurs maximales et caractéristiques électriques
| Core | dsPIC33E 16-bit DSC |
| CPU Clock Speed | 60 MHz (max, with PLL) |
| Instruction Throughput | 70 MIPS |
| Program Memory | 256 KB (85.5K x 24) Flash |
| RAM | 32 KB |
| DMA Channels | 4 |
| Timers | 5 |
| Boîtier | 64-pin TQFP (PT), 10x10 mm, 0.50 mm pitch |
| Type de montage | Surface Mount |
| Température de fonctionnement | -40C to +85C (Industrial) |
| Integrated Op Amps | Yes (on-chip, high-performance) |
| PWM | High-speed PWM for motor control |
| CTMU | Charge-Time Measurement Unit (temperature/touch) |
| Boundary Scan | JTAG IEEE 1149.1 |
| ICSP Programming | Yes (multiple PGECx/PGEDx pairs) |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33EP256MC506-I/PT
| Broche 1 | RP46/PWM4H/PMD6/RB6 — Remappable I/O / PWM / port pin |
| Broche 2 | RP47/PWM4L/PMD7/RB7 — Remappable I/O / PWM / port pin |
| Broche 3 | RP48/PWM5H/RB8 — Remappable I/O / PWM / port pin |
| Broche 4 | RP49/PWM5L/RB9 — Remappable I/O / PWM / port pin |
| Broche 5 | VSS — Ground reference |
| Broche 6 | OSC1/RC12 — Crystal oscillator input or general I/O |
| Broche 7 | OSC2/RC15 — Crystal oscillator output or general I/O |
| Broche 8 | VDD — Digital supply voltage |
| Broche 9 | PGC1/AN1/RP51/RC1 — ICSP clock / analog input / remappable I/O |
| Broche 10 | PGD1/AN0/RP50/RC0 — ICSP data / analog input / remappable I/O |
| Broche 11 | AN2/RP52/RC2 — Analog input / remappable I/O |
| Broche 12 | AN3/RP53/RC3 — Analog input / remappable I/O |
| Broche 13 | AN4/RP54/RC4 — Analog input / remappable I/O |
| Broche 14 | AN5/RP55/RC5 — Analog input / remappable I/O |
| Broche 15 | VSS — Ground reference |
| Broche 16 | VDD — Digital supply voltage |
| Broche 17 | AN6/RP56/RC6 — Analog input / remappable I/O |
| Broche 18 | AN7/RP57/RC7 — Analog input / remappable I/O |
| Broche 19 | AN8/RP58/RC8 — Analog input / remappable I/O |
| Broche 20 | AN9/RP59/RC9 — Analog input / remappable I/O |
| Broche 21 | AN10/RP60/RC10 — Analog input / remappable I/O |
| Broche 22 | AN11/RP61/RC11 — Analog input / remappable I/O |
| Broche 23 | AN12/RP62/RC12 — Analog input / remappable I/O |
| Broche 24 | AN13/RP63/RC13 — Analog input / remappable I/O |
| Broche 25 | AN14/RP64/RC14 — Analog input / remappable I/O |
| Broche 26 | AN15/RP65/RC15 — Analog input / remappable I/O |
| Broche 27 | AVSS — Analog ground reference |
| Broche 28 | AVDD — Analog supply voltage |
| Broche 29 | PGC2/RP66/RA0 — ICSP clock / remappable I/O / port pin |
| Broche 30 | PGD2/RP67/RA1 — ICSP data / remappable I/O / port pin |
| Broche 31 | RP68/PWM1H/PMD0/RA2 — Remappable I/O / PWM / port pin |
| Broche 32 | RP69/PWM1L/PMD1/RA3 — Remappable I/O / PWM / port pin |
| Broche 33 | RP70/PWM2H/PMD2/RA4 — Remappable I/O / PWM / port pin |
| Broche 34 | RP71/PWM2L/PMD3/RA5 — Remappable I/O / PWM / port pin |
| Broche 35 | RP72/PWM3H/PMD4/RA6 — Remappable I/O / PWM / port pin |
| Broche 36 | RP73/PWM3L/PMD5/RA7 — Remappable I/O / PWM / port pin |
| Broche 37 | RP74/RB0 — Remappable I/O / port pin |
| Broche 38 | RP75/RB1 — Remappable I/O / port pin |
| Broche 39 | RP76/RB2 — Remappable I/O / port pin |
| Broche 40 | RP77/RB3 — Remappable I/O / port pin |
| Broche 41 | RP78/RB4 — Remappable I/O / port pin |
| Broche 42 | RP79/RB5 — Remappable I/O / port pin |
| Broche 43 | VSS — Ground reference |
| Broche 44 | VDD — Digital supply voltage |
| Broche 45 | RP80/PWM6H/PMD8/RB10 — Remappable I/O / PWM / port pin |
| Broche 46 | RP81/PWM6L/PMD9/RB11 — Remappable I/O / PWM / port pin |
| Broche 47 | RP82/RB12 — Remappable I/O / port pin |
| Broche 48 | RP83/RB13 — Remappable I/O / port pin |
| Broche 49 | RP84/RB14 — Remappable I/O / port pin |
| Broche 50 | RP85/RB15 — Remappable I/O / port pin |
| Broche 51 | VSS — Ground reference |
| Broche 52 | TDO/RP86/RD0 — JTAG TDO / remappable I/O / port pin |
| Broche 53 | TCK/RP87/RD1 — JTAG TCK / remappable I/O / port pin |
| Broche 54 | TMS/RP88/RD2 — JTAG TMS / remappable I/O / port pin |
| Broche 55 | TDI/RP89/RD3 — JTAG TDI / remappable I/O / port pin |
| Broche 56 | MCLR/RD5 — Master clear (reset) input / port pin |
| Broche 57 | RP96/RD8 — Remappable I/O / port pin |
| Broche 58 | RP97/RD9 — Remappable I/O / port pin |
| Broche 59 | RP98/RD10 — Remappable I/O / port pin |
| Broche 60 | RP99/RD11 — Remappable I/O / port pin |
| Broche 61 | RP100/RD12 — Remappable I/O / port pin |
| Broche 62 | RP101/RD13 — Remappable I/O / port pin |
| Broche 63 | VDD — Digital supply voltage |
| Broche 64 | VSS — Ground reference |
Applications typiques
DSPIC33EP256MC506-I/PT convient pour 6 applications: BLDC / PMSM Motor Control for E-Mobility, Digital Switch-Mode Power Supply (SMPS) Control, Solar Photovoltaic Inverter Control, Industrial Servo and Stepper Drive, Touch-Sensing HMI and Capacitive Sensing, Automotive Body Electronics and Sensor Fusion.
BLDC / PMSM Motor Control for E-Mobility
The DSPIC33EP256MC506-I/PT fits BLDC and PMSM motor control in e-mobility thanks to its 70 MIPS dsPIC DSC core with single-cycle MAC for field-oriented control (FOC) math, high-speed PWM peripherals that generate complementary center-aligned switching at the MHz rate, and integrated high-performance op amps that sense phase currents directly. The 256 KB Flash comfortably hosts FOC state machines, sensorless observers, and CAN/CAN-FD communication stacks. Placed as the main control IC between the gate driver (e.g. Microchip MCP8026) and the inverter, it executes a current loop inside 10 us and a speed loop inside 1 ms, which is sufficient for traction-class e-bike and scooter drives up to several kW.
Recommandé
Digital Switch-Mode Power Supply (SMPS) Control
The DSPIC33EP256MC506-I/PT serves as the digital controller in SMPS designs thanks to its 70 MIPS throughput for digital compensator math, 12-bit ADC capable of multi-MHz sampling on current and voltage feedback, and high-resolution PWM for synchronous rectification duty control. The 256 KB Flash and 32 KB RAM allow full PID plus feed-forward compensator code, including adaptive dead-time correction. With CTMU and on-chip op amps, the same part senses temperature and current, eliminating external analog ICs. Compared with analog UC3842 designs, it enables programmable soft-start, telemetry, and firmware-updatable compensation curves in 500 W to 5 kW telecom and server PSUs.
Recommandé
Solar Photovoltaic Inverter Control
The DSPIC33EP256MC506-I/PT fits string and micro-inverter MPPT control thanks to its 70 MIPS DSP throughput running incremental-conductance MPPT at sub-millisecond rates, integrated op amps for current sensing, and 256 KB Flash for grid-synchronization PLL firmware. The 64-pin TQFP package exposes enough I/O for 3-phase IGBT gate drive PWM plus auxiliary relays and isolator interfaces. In a 3 kW single-phase micro-inverter topology, this DSC drives the IGBT bridge at up to 50 kHz while monitoring DC string voltage, AC current, and anti-islanding grid codes simultaneously, replacing legacy dsPIC33FJ designs with no PCB rework.
Recommandé
Industrial Servo and Stepper Drive
The DSPIC33EP256MC506-I/PT executes closed-loop servo control via its 70 MIPS core running PID plus feed-forward loops, dual-channel 12-bit ADC for resolver feedback, and high-speed PWM for trapezoidal or sinusoidal commutation. The 256 KB Flash stores multi-axis state machines and EtherCAT or RS-485 protocol stacks. Integrated op amps buffer encoder signals without external instrumentation stages, reducing BOM cost in stepper and servo drives used in CNC machines and robotics. Industrial servo drives benefit from the -40C to +85C industrial grade and JTAG boundary scan for production test.
Recommandé
Touch-Sensing HMI and Capacitive Sensing
The DSPIC33EP256MC506-I/PT is well suited for capacitive touch HMI panels thanks to its on-chip CTMU (Charge-Time Measurement Unit), which measures capacitance to ground with sub-pF resolution without external analog components. The 256 KB Flash stores gesture recognition, debouncing, and lighting control firmware; the 32 KB RAM holds multi-touch state. Industrial control panels, appliance touchpads, and automotive HMI controllers use this DSC to scan 20-30 capacitive channels while simultaneously driving LEDs or relays, replacing dsPIC33FJ touch designs with double the Flash and MIPS headroom.
Recommandé
Automotive Body Electronics and Sensor Fusion
The DSPIC33EP256MC506-I/PT (and its -Q1 automotive variant) is used in body-electronics modules thanks to its 70 MIPS core, four DMA channels, and integrated op amps. It fuses multiple sensor inputs (e.g. temperature, current, position) via CAN, LIN, or SPI while generating PWM outputs for actuators. The 256 KB Flash allows ISO 26262-style diagnostics and bootloader implementations; the 32 KB RAM holds sensor buffers and CAN message queues. Compared with the older dsPIC33FJ family, it doubles Flash, adds CTMU, and supports 5V-tolerant I/O on selected pins, simplifying BOM in BCM, HVAC, and lighting controllers.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP256MC506-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP256MC506-E/PT | DSPIC33EP128MC506-I/PT | DSPIC33EP256MC504-E/PT | DSPIC33FJ256MC510-I/PT | DSPIC33FJ128MC506A-I/PT |
|---|---|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 64-pin TQFP (PT), 10x10 mm | 64-pin TQFP (PT) - same | 64-pin TQFP (PT) - same | 64-pin TQFP (PT) - same | 64-pin TQFP (PT) - same | 64-pin TQFP (PT) - same |
| Core | dsPIC33E (70 MIPS) | dsPIC33E (70 MIPS) | dsPIC33E (70 MIPS) | dsPIC33E (70 MIPS) | dsPIC33FJ (50 MIPS) | dsPIC33FJ (50 MIPS) |
| Flash | 256 KB | 256 KB | 128 KB | 256 KB | 256 KB | 128 KB |
| RAM | 32 KB | 32 KB | 16 KB | 32 KB | 16 KB | 8 KB |
| Temperature Grade | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Extended -40C to +125C | Industrial -40C to +85C | Industrial -40C to +85C |
| Integrated Op Amps | Yes | Yes | Yes | Yes | No | No |
| CTMU | Yes | Yes | Yes | Yes | No | No |
| Pinout Compatible | Reference | Yes | Yes | Yes | Yes | Yes |
Principaux différenciateurs
- Higher MIPS than dsPIC33FJ 'MC' generation (vs DSPIC33FJ256MC510-I/PT)
- Integrated op amps reduce external analog BOM (vs DSPIC33FJ128MC506A-I/PT)
- Doubled Flash and RAM vs the 128 KB EP variant (vs DSPIC33EP128MC506-I/PT)
Notes de conception
Estimated: a 64-pin TQFP DSPIC33EP256MC506-I/PT drawing 70 MIPS at 3.3 V typically dissipates approximately 0.6-0.9 W at full activity. Decouple every VDD/VSS pair with a 100 nF X7R ceramic placed within 3 mm of the pin pair, and add one bulk 4.7 uF to 10 uF tantalum or ceramic per device. Place AVDD/AVSS decoupling close to pin 27-28 to keep ADC sampling noise below the 12-bit floor.
Estimated: the 64-pin TQFP (PT) package has a theta_JA of approximately 50-60 C/W on a standard JEDEC 4-layer test board, giving a junction temperature rise of 30-55 C above ambient at 0.9 W dissipation. For continuous high-CPU-load designs (e.g. sensorless FOC at 16 kHz), increase the ground copper pour under the exposed die pad and route thermal vias under the TQFP paddle area to stay within the 85 C industrial ceiling.
Keep analog traces (AN0-AN15, op-amp inputs/outputs) routed away from high-frequency switching nets like PWM outputs and the oscillator. Use a single continuous ground pour on the top layer stitched with vias to the bottom layer, and treat AVSS as a star-tie point tied to VSS at the device. Place the MCLR pull-up resistor (10 kohm) and decoupling capacitor within 5 mm of the pin.
Do not confuse the ICSP clock/data pairs PGC1/PGD1 (pins 9-10) with PGC2/PGD2 (pins 29-30) - the dsPIC33EP256MC506 has two pairs and the programmer must use them as a matched pair. Flash wait-state configuration is mandatory at 60 MHz CPU clock; failure to set the correct wait states causes erratic instruction fetch and silent data corruption. Always assert MCLR at power-up via a 10 kohm pull-up plus a 100 nF cap to VDD.
Informations de conformité
RoHS and REACH compliant per Microchip product page. The -I/PT suffix is industrial temperature grade (-40C to +85C), not AEC-Q100 qualified; for automotive use, consider the -E/PT (extended) grade or a -Q1 suffix variant. Conflict-minerals status is compliant per Microchip declaration.
