DSPIC33EP256MU814T-I/PL - 16-bit 60MIPS DSC, 256KB Flash | Microchip
Référence : DSPIC33EP256MU814T-I/PL ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.86 | $9,86 |
| 10 | $9.1 | $91,00 |
| 100 | $8.35 | $835,00 |
| 500 | $7.6 | $3 800,00 |
| 1 000 | $6.95 | $6 950,00 |
DSPIC33EP256MU814T-I/PL Présentation
A digital signal controller combines the compute throughput of a digital signal processor with the peripheral integration and deterministic control flow of a microcontroller. Within the power-management hierarchy of embedded systems, a DSC sits above a general-purpose MCU and is the preferred device class for closed-loop control tasks such as field-oriented motor control, digital power conversion, and industrial networking nodes, where hardware multiply-accumulate units and high-speed PWM modules matter more than raw MHz.
Key differentiating features of this device include the dsPIC33E 16-bit core with DSP engine (barrel shifter, 17x17 multiplier, single-cycle MAC), 15-channel DMA controller for low-CPU-overhead data movement, dual CAN 2.0B controllers for industrial networking, a full-speed USB 2.0 device peripheral, and multiple advanced analog blocks including a 10/12-bit ADC suited to motor phase-current sampling.
The MU8xx family variant emphasizes connectivity and PWM density: up to 27 general-purpose timers are cited across the family data, along with high-speed PWM outputs that support complementary and dead-time operation for three-phase inverters. IEEE 1149.2-compatible JTAG boundary scan, in-circuit programming, and five program plus three complex data breakpoints support production programming and in-application debugging.
Typical applications include brushless DC and PMSM motor drives for industrial automation, automotive-adjacent AEC-Q100-qualified control modules, USB-connected industrial instruments, and dual-CAN gateway or bridge controllers in factory and building automation networks.
Design consideration: this is a 3V to 3.6V device, so level shifting is required when interfacing with 5V peripherals, and the 144-LQFP layout demands a solid ground plane and decoupling at every VDD pair for USB and analog integrity.
This page synthesizes distributor pricing, drop-in family alternatives, and practical design notes not found in the manufacturer datasheet, with pricing verified as of 2026-09-24.
Alternatives de remplacement direct pour DSPIC33EP256MU814T-I/PL — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP256MU814T-I/PL (même facteur de forme et même empreinte) — différant par Core Architecture, Package, Supply Voltage, USB.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP256MU814T-E/PL
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP512MU814-I/PL
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$6.45 / unité
Voir la fiche technique →DSPIC33EP128MU814-I/PL
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP256MU814-I/ML
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP256MU814T-I/PL Valeurs maximales et caractéristiques électriques
| Core Architecture | 16-bit dsPIC33E RISC with DSP engine |
| Maximum CPU Speed | 60 MIPS |
| Clock Speed | 60 MHz |
| Program Memory | 256KB (85.5K x 24) Flash |
| SRAM | 28KB |
| DMA Channels | 15 |
| CAN Controllers | 2 x CAN 2.0B |
| USB | USB 2.0 full-speed device |
| Timers | 9 timers (device); 27 general-purpose timers cited across family |
| I/O Ports | 51 I/O |
| Tension d'alimentation | 3 V to 3.6 V |
| Température de fonctionnement | -40C to +85C (I grade) |
| Boîtier | 144-LQFP (20x20 mm) |
| Type de montage | Surface Mount |
| Debug / Test | IEEE 1149.2 compatible JTAG boundary scan, in-circuit and in-application programming |
| Breakpoints | 5 program and 3 complex data breakpoints |
| Qualification | AEC-Q100 (per distributor parametric data) |
| Lifecycle Stage | Active |
Guide de configuration des broches du DSPIC33EP256MU814T-I/PL 144-lqfp (20x20 mm)
Configuration des broches du DSPIC33EP256MU814T-I/PL (boîtier 144-lqfp (20x20 mm)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP256MU814T-I/PL.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP256MU814T-I/PL convient pour 6 applications: Industrial Motor Control (BLDC/PMSM Drives), Automotive Body and Motor Modules, USB-Connected Industrial Instruments, CAN Gateway and Bridge Controllers, Digital Power Conversion (Inverters and PFC), Embedded IoT and Building Automation Nodes.
Industrial Motor Control (BLDC/PMSM Drives)
The 60 MIPS dsPIC33E core with its single-cycle MAC and barrel shifter executes field-oriented control inner loops at 16-20 kHz PWM frequencies with ample cycle headroom for observer algorithms such as sliding-mode or flux estimators. The MU8xx family's high-speed PWM module supports complementary outputs with hardware dead-time insertion for three-phase inverter bridge control, while 15 DMA channels stream ADC phase-current samples to RAM without CPU intervention, reducing loop jitter. Dual CAN 2.0B controllers connect the drive to industrial fieldbus networks such as CANopen, eliminating an external CAN transceiver controller chip. The 144-LQFP package provides the pin density to expose all PWM, encoder quadrature, and analog inputs simultaneously.
Recommandé
Automotive Body and Motor Modules
Distributor parametric data classifies this MPN as automotive AEC-Q100 qualified, making it suitable for body electronics, DC-motor modules, and pump/fan control units that require both robust control performance and in-vehicle networking. The dual CAN 2.0B controllers support gateway topologies between powertrain and body buses, and the 60 MIPS core handles diagnostic processing (UDS-style services) concurrently with the control loop. The -40C to +85C industrial grade on the -I variant covers most under-dash environments; use the -E variant for under-hood positions reaching +125C. In-application programming supports field firmware updates over CAN, a common requirement in automotive maintenance strategies.
Recommandé
USB-Connected Industrial Instruments
The integrated USB 2.0 full-speed device peripheral allows the DSPIC33EP256MU814T-I/PL to connect directly to a PC without an external USB-UART bridge, simplifying data-acquisition instruments, handheld testers, and bench tools. The 15-channel DMA controller moves ADC and serial data to the USB endpoint buffers with minimal CPU load, sustaining continuous streaming while the 60 MIPS core runs signal-conditioning or FFT work in the background using the DSP MAC instructions. The 256KB Flash accommodates USB stacks, command processors, and application code with room to spare. The 3.0V-3.6V supply range matches common 3.3V rail systems; level-shift USB VBUS sensing appropriately.
Recommandé
CAN Gateway and Bridge Controllers
With two independent CAN 2.0B controllers on-chip, this DSC implements protocol gateways between two CAN segments - for example bridging a J1939 vehicle bus to an industrial CANopen segment - without adding an external CAN controller. The 60 MIPS core gives protocol translation (ID mapping, frame filtering, segmentation) roughly an order of magnitude more headroom than typical 8-bit gateway MCUs, and 15 DMA channels buffer frames efficiently. 256KB Flash stores dual protocol stacks plus firmware-update code, while 28KB SRAM provides deep FIFO buffering for burst traffic. The 144-pin LQFP exposes enough I/O for status LEDs, relays, and digital inputs in a compact single-chip gateway.
Recommandé
Digital Power Conversion (Inverters and PFC)
The dsPIC33EP MU814's high-speed PWM with complementary outputs, dead-time control, and high resolution suits digitally controlled inverters, totem-pole PFC stages, and LLC converters. The 60 MIPS DSP core closes current and voltage loops at switching frequencies up to several hundred kHz, and the advanced analog ADC samples input/output voltages and inductor currents synchronously with the PWM trigger, minimizing switching-noise-induced sampling error. 15 DMA channels handle telemetry logging. Because the device is AEC-Q100 listed in distributor data, it also fits high-reliability power systems such as telecom rectifiers and solar micro-inverter control boards requiring -40C to +85C industrial operation.
Recommandé
Embedded IoT and Building Automation Nodes
For connected nodes that must both control and communicate, this DSC combines a 16-bit control core, dual CAN for building/industrial networks, USB for local configuration, and 51 I/O pins for sensors, relays, and displays on one chip. The 256KB Flash supports RTOS kernels, communication stacks, and OTA-update bootloaders simultaneously, while in-application programming enables remote firmware upgrade over the network. The 3.0V-3.6V operating range pairs with standard 3.3V sensor supplies, and the industrial temperature grade covers unconditioned ceiling and plant-floor environments. The 144-LQFP's peripheral density removes the need for external I2C/SPI expansion chips in typical automation panels.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP256MU814T-I/PL — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP256MU814T-E/PL | DSPIC33EP512MU814-I/PL | DSPIC33EP128MU814-I/PL | DSPIC33EP256MU810T-I/PF |
|---|---|---|---|---|---|
| Package | 144-LQFP (20x20 mm) | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 144-LQFP (20x20 mm) - same | 80-TQFP (12x12 mm) - different |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Program Memory (Flash) | 256KB (85.5K x 24) | 256KB | 512KB | 128KB | 256KB |
| CPU Speed | 60 MIPS (60 MHz) | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| USB Peripheral | USB 2.0 full-speed device | Yes - same | Yes - same | Yes - same | Yes - MU family USB |
| CAN Controllers | 2 x CAN 2.0B | 2 x CAN | 2 x CAN | 2 x CAN | 2 x CAN |
| Temperature Range | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +85C (I grade) |
Principaux différenciateurs
- Extended temperature option on identical silicon (vs DSPIC33EP256MU814T-E/PL)
- Double the program memory on the same footprint (vs DSPIC33EP256MU814T-E/PL family upgrade path)
- USB plus dual CAN on one DSC (vs DSPIC33EP256MU810T-I/PF)
Notes de conception
The device operates from a 3.0V-3.6V rail; use a clean 3.3V LDO or buck output with at least 100nF ceramic decoupling at every VDD/VSS pair of the 144-LQFP, plus 10uF bulk capacitance near the package. The USB VBUS (5V) must be sensed/divided to a 3.3V-safe pin - never connect 5V directly to any I/O. Estimated: at 60 MIPS with all peripherals active, core current is in the tens-of-mA range per family datasheet figures; budget the housekeeping rail accordingly.
For the 20x20 mm 144-LQFP, use a solid ground plane on layer 2 and keep the USB D+/D- pair as a 90-ohm matched differential route away from PWM and CAN lines. Place the CAN transceivers' termination resistors at the bus connector, not at the MCU. Route ADC analog inputs away from high-dV/dt PWM traces and consider an RC anti-alias filter sized to your ADC sampling scheme before designing phase-current sensing circuits.
Do not confuse the T (tape-and-reel) ordering option with a different device: DSPIC33EP256MU814T-I/PL is the same silicon as the non-T part. Also confirm temperature grade at ordering: -I is -40C to +85C while -E is -40C to +125C in the same footprint. When substituting across family members (MU814 vs MU810), remember pin counts and I/O counts differ (51 I/O on the 144-pin part), so CAD footprints are NOT interchangeable even though firmware largely is.
Use JTAG (IEEE 1149.2 compatible) or the dedicated ICSP programming pins for production programming, keeping traces under 10 cm to the programming header. The 15-channel DMA controller can create simultaneous bus contention with the CPU during heavy ADC streaming - measure worst-case loop latency with breakpoints (5 program, 3 complex data breakpoints available) rather than assuming cycle counts from the block diagram.
Informations de conformité
Distributor parametric data (Datasheets.com, updated 25-APR-2024) lists this MPN as automotive AEC-Q100 in a 144-pin LQFP tape-and-reel format. Explicit RoHS/REACH/lead-free certificate statements were not present in captured web data for this MPN; verify via Microchip's environmental documentation.
