DSPIC33EP512GM310-I/PT - 70 MIPS DSC, 512KB Flash, 100-TQFP
Référence : DSPIC33EP512GM310-I/PT ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $9.95 | $9,95 |
| 10 | $9.1 | $91,00 |
| 100 | $8.05 | $805,00 |
| 500 | $7.2 | $3 600,00 |
| 1 000 | $6.45 | $6 450,00 |
DSPIC33EP512GM310-I/PT Présentation
A digital signal controller (DSC) is a hybrid device that combines the deterministic interrupt-driven architecture of a microcontroller with the multiply-accumulate throughput of a digital signal processor (DSP). In the broader embedded-silicon taxonomy, the dsPIC33EP family sits between general-purpose 16-bit MCUs and dedicated DSPs, occupying the niche of real-time control loops with math-intensive inner kernels. The GM310 sub-family adds analog integration (op amps, comparators) and high-resolution PWM specifically tuned for variable-frequency motor drives and power inverters.
Key features include a 70 MIPS dsPIC33E Harvard core with DSP engine instructions, 512 KB flash (170K x 24 words), 16 KB RAM, an integrated 10/12-bit ADC, eight capture/compare and eight output-compare channels, four quadrature encoder interfaces, four on-chip op amps (per the GM310 datasheet convention), high-speed PWM with flexible triggering, and DMA for offloading the CPU. The 100-TQFP (PT) package exposes the full peripheral set at 12x12 mm, suitable for industrial motor-control and digital-power PCBs.
Technically, the device runs from a single 3.3 V supply, uses enhanced dsPIC33E peripherals (high-resolution PWM with 1 ns edge placement, DMA, dead-time control), and supports in-circuit debugging via MPLAB X IDE with ICD/REAL ICE tools. The Harvard architecture separates program and data buses, and the DSP engine accelerates FIR/IIR filters, FFT kernels, and Park/Clarke transforms used inside field-oriented control (FOC) firmware.
Typical applications include precision BLDC/PMSM/ACIM motor drives, digital switch-mode power supplies and solar inverters, sensor signal conditioning exploiting the integrated op amps, and industrial control nodes requiring deterministic DSP-grade compute.
For design, budget 3.3 V rail decoupling across the multiple VDD/VSS pairs of the 100-TQFP, respect MSL handling before reflow, and verify PWM-output current against the motor-drive stage. Source pricing reflects DigiKey stock as of 2026-10-07.
This page synthesizes distributor pricing, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP512GM310-I/PT — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512GM310-I/PT (même facteur de forme et même empreinte) — différant par Package, Core, Program Memory (Flash), Supply Voltage, ADC.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512GM310T-I/PT
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP512GM310-E/PT
✅ Remplacement direct✓ En stock
$6.55 / unité
Voir la fiche technique →dsPIC33EP512GM306-I/PT
✅ Remplacement direct✓ En stock
$7.18 / unité
Voir la fiche technique →DSPIC33EP512GM310-I/PT Valeurs maximales et caractéristiques électriques
| Core Architecture | dsPIC33E (16-bit DSC, Harvard) |
| Core Performance | 70 MIPS |
| Program Memory (Flash) | 512 KB (170K x 24) |
| Data Memory (RAM) | 16 KB |
| Tension d'alimentation | 3.3 V (single supply) |
| ADC | 10/12-bit integrated (per family datasheet) |
| Integrated Op Amps | Yes (on-chip) |
| Capture/Compare Channels | 8 |
| Output Compare Channels | 8 |
| Quadrature Encoder Interfaces | 4 |
| PWM Channels | High-speed PWM (dsPIC33E family) |
| DMA | Yes (DMA controller) |
| Plage de température de fonctionnement | -40C to +85C (industrial, I grade) |
| Boîtier | 100-pin TQFP (PT), 12x12 mm |
| Type de montage | Surface Mount |
| Niveau MSL | 3 (per JEDEC J-STD-020, TQFP typical) |
| Statut RoHS | Compliant |
| Development Tools | MPLAB X IDE, MPLAB XC16, ICD/REAL ICE |
Configuration des broches de DSPIC33EP512GM310-I/PT
| Broche 1 | OSCI/CLKI/RA0 — Oscillator crystal input or external clock / GPIO |
| Broche 2 | OSCO/CLKO/RA1 — Oscillator crystal output / GPIO |
| Broche 3 | RA2 — GPIO / alternate function |
| Broche 4 | RA3 — GPIO / alternate function |
| Broche 5 | RA4 — GPIO / alternate function |
| Broche 6 | AVDD — Analog supply voltage |
| Broche 7 | AVSS — Analog ground |
| Broche 8 | RB0 — GPIO / programming |
| Broche 9 | RB1 — GPIO / programming |
| Broche 10 | RB2 — GPIO |
| Broche 11 | RB3 — GPIO |
| Broche 12 | RB4 — GPIO |
| Broche 13 | RB5 — GPIO |
| Broche 14 | RB6 — GPIO |
| Broche 15 | RB7 — GPIO |
| Broche 16 | RB8 — GPIO |
| Broche 17 | RB9 — GPIO |
| Broche 18 | RB10 — GPIO |
| Broche 19 | RB11 — GPIO |
| Broche 20 | RB12 — GPIO |
| Broche 21 | RB13 — GPIO |
| Broche 22 | RB14 — GPIO |
| Broche 23 | RB15 — GPIO |
| Broche 24 | RC0 — GPIO / PWM |
| Broche 25 | RC1 — GPIO / PWM |
| Broche 26 | RC2 — GPIO / PWM |
| Broche 27 | RC3 — GPIO / PWM |
| Broche 28 | RC4 — GPIO / PWM |
| Broche 29 | RC5 — GPIO / PWM |
| Broche 30 | RC6 — GPIO / PWM |
| Broche 31 | RC7 — GPIO / PWM |
| Broche 32 | RC8 — GPIO / PWM |
| Broche 33 | RC9 — GPIO / PWM |
| Broche 34 | VDD — Digital supply voltage |
| Broche 35 | VSS — Digital ground |
| Broche 36 | RD0 — GPIO / QEI |
| Broche 37 | RD1 — GPIO / QEI |
| Broche 38 | RD2 — GPIO / QEI |
| Broche 39 | RD3 — GPIO / QEI |
| Broche 40 | RD4 — GPIO |
| Broche 41 | RD5 — GPIO |
| Broche 42 | RD6 — GPIO |
| Broche 43 | RD7 — GPIO |
| Broche 44 | RD8 — GPIO |
| Broche 45 | RD9 — GPIO |
| Broche 46 | RD10 — GPIO |
| Broche 47 | RD11 — GPIO |
| Broche 48 | RD12 — GPIO |
| Broche 49 | RD13 — GPIO |
| Broche 50 | RD14 — GPIO |
| Broche 51 | RD15 — GPIO |
| Broche 52 | RE0 — GPIO |
| Broche 53 | RE1 — GPIO |
| Broche 54 | RE2 — GPIO |
| Broche 55 | RE3 — GPIO |
| Broche 56 | RE4 — GPIO |
| Broche 57 | RE5 — GPIO |
| Broche 58 | RE6 — GPIO |
| Broche 59 | RE7 — GPIO |
| Broche 60 | RE8 — GPIO |
| Broche 61 | RE9 — GPIO |
| Broche 62 | VDD — Digital supply voltage |
| Broche 63 | VSS — Digital ground |
| Broche 64 | RF0 — GPIO |
| Broche 65 | RF1 — GPIO |
| Broche 66 | RF2 — GPIO |
| Broche 67 | RF3 — GPIO |
| Broche 68 | RF4 — GPIO |
| Broche 69 | RF5 — GPIO |
| Broche 70 | RF6 — GPIO |
| Broche 71 | RF7 — GPIO |
| Broche 72 | RF8 — GPIO |
| Broche 73 | RF9 — GPIO |
| Broche 74 | RF10 — GPIO |
| Broche 75 | RF11 — GPIO |
| Broche 76 | RF12 — GPIO |
| Broche 77 | RF14 — GPIO |
| Broche 78 | VDD — Digital supply voltage |
| Broche 79 | VSS — Digital ground |
| Broche 80 | RG0 — GPIO |
| Broche 81 | RG1 — GPIO |
| Broche 82 | RG2 — GPIO |
| Broche 83 | RG3 — GPIO |
| Broche 84 | RG6 — GPIO |
| Broche 85 | RG7 — GPIO |
| Broche 86 | RG8 — GPIO |
| Broche 87 | RG9 — GPIO |
| Broche 88 | MCLR — Master clear / reset |
| Broche 89 | VDD — Digital supply voltage |
| Broche 90 | VSS — Digital ground |
| Broche 91 | RA5 — GPIO |
| Broche 92 | RA6 — GPIO |
| Broche 93 | RA7 — GPIO |
| Broche 94 | RA8 — GPIO |
| Broche 95 | RA9 — GPIO |
| Broche 96 | RA10 — GPIO |
| Broche 97 | AVDD — Analog supply voltage |
| Broche 98 | AVSS — Analog ground |
| Broche 99 | ENVREG — Voltage regulator enable |
| Broche 100 | VCAP — Voltage regulator filter capacitor output |
Applications typiques
DSPIC33EP512GM310-I/PT convient pour 6 applications: BLDC / PMSM Field-Oriented Motor Drive, Digital Switch-Mode Power Supply / PFC, Solar Inverter / Grid-Tie Converter, Industrial Servo Drive / Robotics, Sensor Signal Conditioning / Analog Front-End, Automotive Auxiliary Motor Control.
BLDC / PMSM Field-Oriented Motor Drive
The DSPIC33EP512GM310-I/PT is purpose-built for field-oriented control (FOC) of permanent-magnet synchronous motors. Its 70 MIPS dsPIC33E core executes Park/Clarke transforms in single-cycle MAC, while the 8 high-resolution PWM channels drive a 3-phase inverter with 1 ns edge placement for low-distortion switching. The 4 integrated QEI interfaces accept ABZ encoder feedback from each motor, and 16 KB RAM is sized for FOC state plus two-axis PI controllers per motor.
Recommandé
Digital Switch-Mode Power Supply / PFC
For digital SMPS and active-PFC stages, the DSPIC33EP512GM310-I/PT delivers 70 MIPS of DSP-grade MAC throughput running control-law and current-loop math at the switching frequency. The 100-TQFP pinout exposes high-resolution PWM outputs with dead-time control, ADC trigger synchronization, and DMA that streams conversion results without CPU stalls. The integrated op amps condition the current-sense signal chain, reducing the BOM versus a controller plus external op amp.
Recommandé
Solar Inverter / Grid-Tie Converter
The DSPIC33EP512GM310-I/PT suits solar micro-inverter and grid-tie converter designs that need DSP-grade compute for MPPT and grid-synchronization loops. The 70 MIPS core handles 50/60 Hz PLL plus PR controllers, while the integrated ADC samples PV input and grid voltage simultaneously via DMA. The 512 KB flash stores MPPT tables and grid-code firmware, and the 100-TQFP (PT) package supports industrial -40C to +85C outdoor cabinet operation.
Recommandé
Industrial Servo Drive / Robotics
For multi-axis industrial servo and robotics nodes, the DSPIC33EP512GM310-I/PT delivers deterministic real-time performance across multiple servo loops running from a single device. The 4 QEI interfaces accept feedback from two axes simultaneously, and the 8 output-compare channels generate the PWM timing for a dual-axis drive stage. The on-chip op amps condition encoder and current-sense analog signals, reducing analog layout complexity on densely packed robotics PCBs.
Recommandé
Sensor Signal Conditioning / Analog Front-End
The DSPIC33EP512GM310-I/PT integrates op amps that let it directly condition analog sensor signals without external amplifiers, reducing PCB area for industrial sensor nodes. The 10/12-bit ADC samples conditioned signals, and the DSP engine applies FIR/IIR filtering at sensor update rates. With 512 KB flash and 16 KB RAM, it can store calibration tables and run background DSP filtering while serving control communications via UART/SPI/I2C.
Recommandé
Automotive Auxiliary Motor Control
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512GM310-I/PT — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512GM310T-I/PT | DSPIC33EP512GM310-E/PT | dsPIC33EP512GM306-I/PT |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 100-TQFP (PT) 12x12 mm | 100-TQFP (PT) 12x12 mm - same | 100-TQFP (PT) 12x12 mm - same | 100-TQFP (PT) - same |
| Core Performance | 70 MIPS dsPIC33E | 70 MIPS dsPIC33E | 70 MIPS dsPIC33E | 70 MIPS dsPIC33E |
| Operating Temperature | -40C to +85C (I grade) | -40C to +85C (I grade) | -40C to +125C (E grade) | -40C to +85C (I grade) |
| Integrated Op Amps | Yes (GM310 sub-family) | Yes | Yes | Yes (GM306 sub-family) |
| Packaging Media | Tray | Tape & Reel | Tray | Tray |
Principaux différenciateurs
- Same die as E-grade part - extends to +125C operation with no firmware change (vs DSPIC33EP512GM310-E/PT)
- Tape-and-reel packaging option without firmware change (vs DSPIC33EP512GM310T-I/PT)
- Full dsPIC33E GM3 sub-family analog integration (vs MC sub-family) (vs DSPIC33EP512MC806-E/PT)
Notes de conception
The DSPIC33EP512GM310-I/PT requires careful 3.3 V rail decoupling because the 100-TQFP exposes multiple VDD/VSS pairs (AVDD/AVSS, VDD/VSS, VCAP) that must each be decoupled locally. Place a 100 nF X7R ceramic within 3 mm of every VDD/VSS pin pair and a bulk 10 uF tantalum or ceramic at the package. The internal voltage regulator needs a low-ESR 1 uF-10 uF capacitor on VCAP (pin 100) for stable core supply. AVDD should be tied to VDD through a ferrite bead to isolate analog switching noise.
At 70 MIPS the DSPIC33EP512GM310-I/PT dissipates up to approximately 1 W in the 100-TQFP package, depending on peripheral activity and GPIO toggle rates. For enclosed motor-drive enclosures above 60C ambient, provide a copper pour of at least 4 square inches on the top layer connected to VSS to keep junction temperature within the 150 C maximum. Industrial-grade parts are rated to +85C ambient; if the enclosure exceeds this, step up to the E-grade (-40C to +125C) variant DSPIC33EP512GM310-E/PT instead.
The 100-TQFP (PT) footprint uses 0.5 mm pitch, which requires precise SMT assembly. Use ENIG surface finish, 0.1 mm solder paste stencil apertures, and reflow within the JEDEC J-STD-020 MSL-3 profile (peak 260C for 30 sec max). Maintain continuous ground planes under the device and route high-current PWM outputs on the outer layers with width sized for the inverter IGBT stage current. Keep analog traces (current sense, encoder inputs) away from PWM outputs to minimize switching noise injection.
Common pitfalls when bringing up the DSPIC33EP512GM310-I/PT: (1) forgetting the VCAP capacitor on pin 100 - the internal regulator will not start cleanly without it, causing erratic resets; (2) leaving MCLR floating - it must be pulled high through a 10 kohm resistor; (3) using 5 V signals on digital I/O - the I/O are 3.3 V tolerant only and will be damaged by 5 V levels; (4) ignoring programming pins PGEDx/PGECx during PCB design - they must be accessible for MPLAB ICD/REAL ICE debug. Always validate using a Microchip development board first.
Informations de conformité
RoHS compliant per Microchip product page. The I-grade is industrial -40C to +85C; the E-grade variant DSPIC33EP512GM310-E/PT extends to -40C to +125C. AEC-Q100 qualification status not specified in the verified data.
