DSPIC33EP512MC202-E/MM - 16-bit 60 MIPS DSC, 512KB Flash | Microchip
Référence : DSPIC33EP512MC202-E/MM ✓ Actif| Qté | Prix unitaire | Total |
|---|---|---|
| 1 | $8.42 | $8,42 |
| 10 | $7.58 | $75,80 |
| 100 | $6.74 | $674,00 |
| 500 | $5.91 | $2 955,00 |
| 1 000 | $5.07 | $5 070,00 |
DSPIC33EP512MC202-E/MM Présentation
What is a digital signal controller? A DSC combines a microcontroller's deterministic peripherals and interrupt architecture with a digital signal processor's single-cycle MAC and DSP pipeline, occupying the design tier between a 16-bit MCU and a discrete DSP. In the semiconductor hierarchy a DSC sits within microcontrollers -> 16-bit MCUs -> DSP-enhanced MCUs, with motor-control and power-conversion as its two flagship applications. The dsPIC33E generation specifically targets precision closed-loop control where high-resolution PWM, on-chip analog front ends, and rotor-position feedback all converge in a single chip.
Key features include a 60 MIPS dsPIC DSC core with 24-bit instruction word and dual-operand fetch, three pairs of complementary MCPWM outputs with programmable dead time and 7.14 ns PWM resolution, a quadrature encoder interface (QEI) for rotor position sensing, integrated operational amplifiers and analog comparators that absorb the analog front end of current-sense loops, a Peripheral Trigger Generator (PTG) that sequences ADC and PWM events without CPU intervention, plus 4 KB of EEPROM-like data Flash and 12-bit ADC with 1.1 Msps throughput. The QFN-S package's central exposed pad carries thermal dissipation and the ground reference.
Architecturally, the part operates from 3.0 V to 3.6 V (3.3 V nominal), uses single-cycle multiply-accumulate for DSP kernels, and supports both ICSP and JTAG programming along with self-programming for field firmware updates. AEC-Q100 grade-1 thermal range (-40C to +125C) enables under-hood and industrial use.
Typical applications include field-oriented control of PMSM and BLDC motors, digital PFC and LLC converters, UPS inverters, solar microinverters, and automotive auxiliary motor drives. Design consideration: a 3.3 V LDO with tight tolerance is mandatory because the core voltage window is narrow; the QFN's exposed pad must be soldered to a continuous ground pour that doubles as a thermal path.
This page synthesizes distributor pricing, drop-in alternatives within the dsPIC33EP MC family, and practical design notes that complement - not replace - the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP512MC202-E/MM — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP512MC202-E/MM (même facteur de forme et même empreinte) — différant par Operating Temperature, Package, Core Architecture, Program Memory (Flash), DMA Channels.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP512MC502-I/MM
✅ Remplacement direct✓ En stock
$4.19 / unité
Voir la fiche technique →DSPIC33EP512MC204-I/MM
✅ Remplacement direct📋 Alternative de référence (hors catalogue)
DSPIC33EP256MC202-E/MM
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →DSPIC33EP512MC202-E/MM Valeurs maximales et caractéristiques électriques
| Core Architecture | dsPIC33E DSC, 16-bit data path with 24-bit instructions |
| CPU Performance | 60 MIPS at 3.3 V (70 MIPS device family maximum) |
| Program Memory (Flash) | 512 KB (170K x 24 words) |
| Data RAM | 48 KB |
| Data EEPROM | 4 KB |
| Supply Voltage (VDD) | 3.0 V to 3.6 V |
| Température de fonctionnement | -40C to +125C (extended grade, -E) |
| Boîtier | 28-pin QFN-S (6x6 mm) with exposed thermal pad |
| PWM Outputs | 3 complementary pairs with 7.14 ns resolution and programmable dead time |
| Quadrature Encoder Interface (QEI) | 1 module |
| ADC | 12-bit, up to 1.1 Msps, multiple S&H channels |
| Operational Amplifiers | Up to 4 on-chip op amps (current-sense / signal conditioning) |
| Analog Comparators | Up to 4 with programmable reference |
| Peripheral Trigger Generator (PTG) | Yes (autonomous event sequencing) |
| Communication Peripherals | UART, SPI, I2C (count depends on pinout configuration) |
| Programming / Debug | ICSP and JTAG (2-wire and 4-wire) |
| Statut RoHS | Compliant |
Configuration des broches de DSPIC33EP512MC202-E/MM
| Broche 1 | RA0 — Port A bit 0 / analog input |
| Broche 2 | RA1 — Port A bit 1 / analog input |
| Broche 3 | RA2 — Port A bit 2 / analog input |
| Broche 4 | RA3 — Port A bit 3 / analog input |
| Broche 5 | RA4 — Port A bit 4 |
| Broche 6 | VDD — Core supply voltage (3.0-3.6 V) |
| Broche 7 | OSC1/CLKI — Crystal oscillator input or external clock |
| Broche 8 | OSC2/CLKO — Crystal oscillator output |
| Broche 9 | PGED1 — ICSP data / JTAG TDO |
| Broche 10 | PGEC1 — ICSP clock / JTAG TCK |
| Broche 11 | RB0 — Port B bit 0 / PWM fault input |
| Broche 12 | RB1 — Port B bit 1 |
| Broche 13 | RB2 — Port B bit 2 |
| Broche 14 | RB3 — Port B bit 3 |
| Broche 15 | RB4 — Port B bit 4 |
| Broche 16 | RB5 — Port B bit 5 |
| Broche 17 | RB6 — Port B bit 6 |
| Broche 18 | RB7 — Port B bit 7 |
| Broche 19 | VSS — Ground reference |
| Broche 20 | RC0 — Port C bit 0 |
| Broche 21 | RC1 — Port C bit 1 |
| Broche 22 | RC2 — Port C bit 2 |
| Broche 23 | RC3 — Port C bit 3 |
| Broche 24 | RC4 — Port C bit 4 |
| Broche 25 | RC5 — Port C bit 5 |
| Broche 26 | RC6 — Port C bit 6 |
| Broche 27 | RC7 — Port C bit 7 |
| Broche 28 | VDD — Core supply voltage (3.0-3.6 V) |
Applications typiques
DSPIC33EP512MC202-E/MM convient pour 6 applications: PMSM / BLDC Field-Oriented Control, Digital PFC and LLC Converters, Solar Microinverters and String Inverters, Automotive Auxiliary Motor Control, UPS Inverters and Bidirectional Power Converters, Industrial Servo Drives and Robotics.
PMSM / BLDC Field-Oriented Control
The DSPIC33EP512MC202-E/MM's 60 MIPS core executes field-oriented control loops in single-cycle MAC instructions, while its 7.14 ns-resolution MCPWM with programmable dead time drives three-phase IGBT or MOSFET bridges directly. The integrated 4 op amps condition shunt-resistor current-sense signals without external amplifiers, the QEI module decodes ABZ encoder feedback for rotor position, and the Peripheral Trigger Generator samples the ADC synchronously with the PWM carrier to remove sample-point jitter. In a typical 1 kW PMSM drive this combination eliminates 4-6 external op-amp ICs and lets one DSC handle torque, speed and current loops in real time at up to 20 kHz switching frequency with sub-1% torque ripple.
Recommandé
Digital PFC and LLC Converters
In digital power factor correction and LLC resonant converters the DSPIC33EP512MC202-E/MM runs average-current-mode control loops at fixed 65-100 kHz switching with the on-chip 12-bit 1.1 Msps ADC. The 60 MIPS throughput is sufficient for PFC coefficient updates, input voltage feed-forward, and brown-out handling in real time, while the high-resolution PWM adjusts duty cycle in 7.14 ns increments for accurate valley-switching in the LLC stage. The integrated comparators serve as cycle-by-cycle peak current limiters with sub-microsecond response, replacing external comparator ICs. Combined with its 512 KB Flash, designers can fit a full state-machine firmware plus adaptive control tables without external memory.
Recommandé
Solar Microinverters and String Inverters
Solar microinverters use the DSPIC33EP512MC202-E/MM for MPPT, grid-synchronization PLL, and anti-islanding protection all in one part. Its 60 MIPS core runs perturb-and-observe or incremental-conductance MPPT at 10-50 Hz, while the high-resolution MCPWM generates the 50/60 Hz sine-modulated inverter output and the high-frequency DC-DC stage simultaneously. The integrated op amps handle current sensing on the DC and AC sides, and the 4 KB EEPROM stores calibration and lifetime telemetry. The -40C to +125C grade plus AEC-Q100 alignment supports outdoor inverter installations under harsh thermal and humidity conditions.
Recommandé
Automotive Auxiliary Motor Control
The DSPIC33EP512MC202-E/MM is a strong fit for automotive auxiliary drives such as electric power steering pumps, HVAC blowers, fuel pumps, and active grille shutters. AEC-Q100 grade-1 thermal range, 60 MIPS core, and integrated MCPWM/QEI handle the BLDC or brushed-DC motor while the on-chip op amps and comparators interface directly to HALL sensors and shunt resistors. The 512 KB Flash supports AUTOSAR-style firmware plus diagnostics and fault logging, while the 48 KB RAM absorbs CAN/J1939 message buffers. Its 28-QFN-S 6x6 mm footprint is small enough for integration into space-constrained ECU housings.
Recommandé
UPS Inverters and Bidirectional Power Converters
Uninterruptible power supplies use the DSPIC33EP512MC202-E/MM to drive the bidirectional inverter bridge that switches between grid-tie mode and battery-backup mode. The 60 MIPS throughput supports dual-loop control (outer voltage loop, inner current loop) plus state-of-charge estimation for the battery. The 7.14 ns PWM resolution gives clean 50/60 Hz sine output with low total harmonic distortion, while the on-chip comparators perform fast over-current protection. The 4 KB EEPROM stores UPS configuration and battery aging parameters, and the AEC-Q100-grade thermal range supports industrial and telecom cabinet deployments.
Recommandé
Industrial Servo Drives and Robotics
In industrial servo amplifiers and small robotic joints, the DSPIC33EP512MC202-E/MM runs torque, velocity and position loops at 4-8 kHz with sub-1 ms latency. The QEI module handles 24-bit incremental encoder feedback, the MCPWM generates center-aligned SVPWM waveforms, and the 12-bit ADC samples phase currents within the PWM cycle via the Peripheral Trigger Generator. The 60 MIPS core is sufficient for cascaded PI/PID loops plus feed-forward acceleration terms, while the 48 KB RAM handles trajectory tables. The -40C to +125C operating range is suitable for factory floor and outdoor robotics, and ICSP/JTAG allows in-system firmware updates.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP512MC202-E/MM — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP512MC502-I/MM | DSPIC33EP512MC204-I/MM | DSPIC33EP256MC202-E/MM |
|---|---|---|---|---|
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Package | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) | 28-QFN-S (6x6 mm) |
| Program Memory (Flash) | 512 KB | 512 KB | 256 KB | 256 KB |
| RAM | 48 KB | 48 KB | 48 KB | 32 KB |
| Core Speed | 60 MIPS | 60 MIPS | 60 MIPS | 60 MIPS |
| Temperature Grade | -40C to +125C (-E) | -40C to +85C (-I) | -40C to +85C (-I) | -40C to +125C (-E) |
| PWM Resolution | 7.14 ns | 7.14 ns | 7.14 ns | 7.14 ns |
| On-chip Op Amps | Yes (up to 4) | Yes (up to 4) | Yes (up to 4) | Yes (up to 4) |
Principaux différenciateurs
- Highest-density 28-QFN member of the dsPIC33EP MC family at 512 KB Flash (vs DSPIC33EP256MC202-E/MM)
- Extended -40C to +125C operating range (vs industrial -I grade) (vs DSPIC33EP512MC502-I/MM)
- 7.14 ns PWM resolution with on-chip op amps and comparators (vs DSPIC33EP512GP502-E/MM)
Notes de conception
The DSPIC33EP512MC202-E/MM operates from 3.0 V to 3.6 V and draws up to 70 mA under full DSP load. Place a low-ESR 10 uF ceramic decoupling capacitor directly on each VDD pin and a 0.1 uF X7R bypass cap within 5 mm of the package. A 3.3 V LDO with 200 mA headroom (such as Microchip MCP1825 or TI TPS7A4533) is recommended - the narrow supply window makes brown-out avoidance critical during PWM-induced rail noise.
Although the 28-QFN-S package exposes a thermal pad, the part rarely needs active heatsinking at 60 MIPS because supply voltage is low (3.3 V). However, in 125C ambient applications, solder the exposed pad to a 100 mm^2 ground pour with 9 thermal vias on a 0.4 mm pitch. Estimated: with theta_JA of ~30 C/W on a standard 4-layer PCB, 70 mA x 3.3 V = 0.23 W dissipation yields a junction rise of approximately 7C above ambient - well within the 125C limit.
Keep the ICSP/JTAG lines (PGEC1, PGED1) short and away from PWM switching nodes to avoid in-circuit programming failures. Route the crystal oscillator traces within 5 mm of the OSC1/OSC2 pins with a guard ground on both sides. Use a continuous ground plane under the device for the analog reference (AVDD) supply - split analog and digital grounds only at one point near the regulator output. The QFN's exposed pad must be soldered for electrical ground and thermal performance; missing solder joints degrade ADC accuracy and thermal dissipation.
Estimated: enabling high-resolution PWM mode (7.14 ns) requires configuring the PWM clock prescaler and ensuring the master time base is fed from a 60 MHz Fosc source; mistakes here silently reduce effective PWM resolution to 14 ns. Avoid powering the device above 3.6 V - exceeding the absolute-maximum rating causes permanent Flash corruption. When migrating from -I (industrial) to -E (extended) temperature grade, recalibrate the internal bandgap and oscillator trimming values stored in Flash configuration bits.
Informations de conformité
RoHS compliant per Microchip product page; AEC-Q100 grade 1 thermal alignment per -E suffix; halogen-free and lead-free per Microchip packaging materials declaration.
