DSPIC33EP64GS502-E/MX - 16-bit 70MIPS DSC, 64KB Flash | Microchip
Référence : DSPIC33EP64GS502-E/MX ✓ Actif| Qté | Prix unitaire | Total |
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| 1 | $0 | $0,00 |
| 10 | $0 | $0,00 |
| 100 | $0 | $0,00 |
| 500 | $0 | $0,00 |
| 1 000 | $0 | $0,00 |
DSPIC33EP64GS502-E/MX Présentation
A digital signal controller combines the computational throughput of a DSP with the peripheral integration and ease of use of a microcontroller. Within the power-management hierarchy, the dsPIC33EP family of DSCs sits at the heart of digital power conversion systems, where it replaces analog control loops with firmware-based control (SMPS control, PFC, digital power supplies), sampling sensor data through high-speed ADCs and driving power stages through dedicated PWM hardware.
Key features of the GS50x family include a high-speed, interconnected 12-bit ADC with a programmable gain amplifier (PGA), an on-chip 12-bit DAC, comparators, and a high-resolution PWM module purpose-built for switching power supplies. The interconnection fabric allows ADC, PWM, DAC, and comparators to trigger each other with minimal CPU latency, a defining characteristic of the dsPIC33EPXXGS50X family.
Architecturally, the device uses a 16-bit modified Harvard core with DSP instructions, executing from zero-wait-state Flash at 70 MIPS. The dedicated digital power peripherals (high-speed PWM with dead-time control, 12-bit ADC with multiple sample-and-hold channels, integrated comparators) form a tight analog-to-PWM loop essential for peak-current-mode and voltage-mode control at high switching frequencies.
Typical applications include switched-mode power supplies (SMPS), power factor correction (PFC) converters, digital lighting ballasts, battery chargers, and uninterruptible power supplies. Microchip's Interleaved PFC reference design, producing up to 350 W from universal AC input, is based on this controller family.
Design consideration: the -E extended-temperature variant should be chosen when ambient conditions exceed the industrial -40C to +85C window; verify package thermal resistance for the SPDIP housing at full clock speed.
This page synthesizes distributor listings, family datasheet context, drop-in alternatives, and practical design notes not found in the manufacturer datasheet.
Alternatives de remplacement direct pour DSPIC33EP64GS502-E/MX — même boîtier, compatible broche à broche. Les références à boîtier différent nécessitant une retouche du PCB sont exclues.
Variantes de cette série
Modèles de la même série directement compatibles avec DSPIC33EP64GS502-E/MX (même facteur de forme et même empreinte) — différant par Package, Core Architecture, Operating Temperature, Mounting Type, Functional Safety.
Outil de comparaison rapide — sélectionnez des références alternatives pour une comparaison côte à côte :
DSPIC33EP64GS502-I/MX
✅ Remplacement direct✓ En stock
Contactez-nous pour le prix
Voir la fiche technique →DSPIC33EP32GS502-E/MX
✅ Remplacement direct ⚠️ Spécifications non vérifiées✓ En stock
$3.95 / unité
Voir la fiche technique →DSPIC33EP32GS502-I/MX
✅ Remplacement direct ⚠️ Spécifications non vérifiées📋 Alternative de référence (hors catalogue)
DSPIC33EP64GS502-E/MX Valeurs maximales et caractéristiques électriques
| Core | dsPIC33EP 16-bit DSC |
| Maximum Processing Speed | 70 MIPS |
| Program Memory (Flash) | 64 KB (64K x 8) |
| RAM | 8 KB |
| ADC Resolution | 12-bit |
| DAC Resolution | 12-bit |
| Target Applications | Digital power / SMPS |
| Peripherals | High-Speed PWM, ADC, PGA, Comparators |
| Connectivity | I2C (per family peripherals) |
| Boîtier | 28-pin SPDIP (MX) |
| Type de montage | Through Hole |
| Température de fonctionnement | -40C to +125C (extended, -E) |
| Programmability | In-Circuit Serial Programming (ICSP) |
| Functional Safety | dsPIC33EP FuSa (Functional Safety) supported family |
| Core Voltage | 3.3 V (per dsPIC33EP family) |
Guide de configuration des broches du DSPIC33EP64GS502-E/MX 28-pin spdip (mx)
Configuration des broches du DSPIC33EP64GS502-E/MX (boîtier 28-pin spdip (mx)). Ce circuit intégré numérique comprend des GPIO, des interfaces de communication (UART, SPI, I2C) et des broches d'alimentation. Consultez la fiche technique du fabricant pour les fonctions alternatives des broches et les options de configuration. Indispensable pour la conception de systèmes embarqués et la conception de circuits imprimés.
Aucune donnée de brochage détaillée disponible pour DSPIC33EP64GS502-E/MX.
Consultez la fiche technique pour la configuration complète des broches.
Applications typiques
DSPIC33EP64GS502-E/MX convient pour 6 applications: Switched-Mode Power Supplies (SMPS), Power Factor Correction (PFC) Converters, Digital Lighting Ballasts and LED Drivers, Battery Chargers, Uninterruptible Power Supplies (UPS), Solar Micro-Inverters and DC-DC Power Optimizers.
Switched-Mode Power Supplies (SMPS)
The DSPIC33EP64GS502-E/MX is purpose-built for firmware-based SMPS control. Its interconnected high-speed PWM with dead-time and high-resolution control drives buck, boost, and flyaway power stages, while the 12-bit ADC with PGA samples output voltage and inductor current each switching cycle. Integrated comparators provide cycle-by-cycle overcurrent trip independent of CPU latency, protecting the converter during transients. Because the ADC-to-PWM path is hardwired, control-loop latency stays low even at several-hundred-kHz switching frequencies. Compared with analog controllers, firmware control enables soft-start profiles, adaptive compensation, and telemetry over I2C. Designers should budget CPU cycles for loop execution at 70 MIPS and verify junction temperature in the SPDIP package near hot power stages.
Recommandé
Power Factor Correction (PFC) Converters
Microchip's Interleaved PFC reference design, delivering up to 350 W from a universal AC input, demonstrates the dsPIC33EPXXGS50X family in PFC front ends. The DSPIC33EP64GS502-E/MX computes input current shaping with DSP multiply-accumulate instructions at 70 MIPS, samples the rectified input and inductor currents through the 12-bit ADC/PGA, and controls interleaved boost phases with multiple high-resolution PWM outputs. The 12-bit DAC can generate current-reference waveforms synchronized to the AC line. Firmware PFC achieves high power factor across wide load ranges and adapts compensation digitally, which fixed analog control cannot. Ensure the -E extended temperature rating and SPDIP thermal path match the enclosure ambient near the bridge rectifier.
Recommandé
Digital Lighting Ballasts and LED Drivers
In HID ballasts and high-power LED drivers, the DSPIC33EP64GS502-E/MX provides both constant-current regulation and lamp ignition sequencing in one device. The interconnected high-speed PWM generates the switching and ignition-frequency ramps, the 12-bit ADC monitors LED string current and thermals, and the comparators implement fast overcurrent protection for shorted-string events. The on-chip 12-bit DAC can produce dimming reference levels without external parts. At 70 MIPS the controller runs lamp model algorithms and the control loop concurrently. The -E temperature rating supports enclosed luminaires where ambient near the driver PCB exceeds +85C, and the through-hole SPDIP package suits lamp ballast boards assembled with mixed technology.
Recommandé
Battery Chargers
Smart battery chargers benefit from the DSPIC33EP64GS502-E/MX combination of DSP control and analog integration. The 12-bit ADC with PGA measures charge current and pack voltage precisely, enabling CC/CV, trickle, and taper profiles in firmware, while the high-speed PWM drives the buck or flyback charge stage with controlled dead time. Integrated comparators provide hardware overcurrent and reverse-polarity protection independent of software, and the 12-bit DAC can synthesize charge-current references. I2C connectivity supports battery gauges and host communication. The -E extended range covers chargers in hot environments such as engine bays, and 64 KB Flash stores multiple chemistry algorithms with room for logging.
Recommandé
Uninterruptible Power Supplies (UPS)
Line-interactive and double-conversion UPS designs use the DSPIC33EP64GS502-E/MX to control the inverter bridge, AC-DC front end, and transfer logic in a single 16-bit DSC. The high-resolution interconnected PWM generates sinusoidal inverter modulation, the 12-bit ADC samples output voltage, battery voltage, and current through the PGA, and comparators protect against overload transients faster than any interrupt-driven routine. At 70 MIPS with DSP instructions, the controller closes the inverter voltage loop and manages battery charge concurrently. The -E rating tolerates battery-compartment ambient temperatures above +85C, and the through-hole SPDIP option simplifies servicing in industrial UPS frames.
Recommandé
Solar Micro-Inverters and DC-DC Power Optimizers
Photovoltaic power electronics require MPPT (maximum power point tracking) algorithms running alongside a fast DC-DC control loop - exactly the workload the DSPIC33EP64GS502-E/MX was designed for. The 12-bit ADC and PGA sample panel voltage and current for the perturb-and-observe MPPT routine, while the interconnected high-speed PWM regulates the boost or flyback stage with cycle-level updates. Comparators add hardware overcurrent limits for panel fault conditions. The 70 MIPS DSP core leaves ample headroom for MPPT, safety checks, and communication. Outdoor-mounted optimizer electronics benefit from the -E grade (-40C to +125C), and the SPDIP through-hole package suits conformal-coated, serviceable converter boards.
Recommandé
Récapitulatif des produits recommandés
Données de référence d'ingénierie pour DSPIC33EP64GS502-E/MX — comparaison, recommandations de conception et informations de conformité.
Guide de sélection
Comparaison avec les alternatives
| Paramètre | Ce produit | DSPIC33EP64GS502-I/MX | DSPIC33EP32GS502-E/MX | DSPIC33EP64GS502-E/MM |
|---|---|---|---|---|
| Package | 28-pin SPDIP (MX) | 28-pin SPDIP (MX) - same | 28-pin SPDIP (MX) - same | 28-QFN-S (6x6) - different footprint |
| Brand | Microchip Technology | Microchip Technology | Microchip Technology | Microchip Technology |
| Flash Memory | 64 KB | 64 KB | 32 KB | 64 KB |
| RAM | 8 KB | 8 KB | 8 KB | 8 KB |
| Core Speed | 70 MIPS | 70 MIPS | 70 MIPS | 60-70 MIPS (per distributor listing) |
| Operating Temperature | -40C to +125C (E) | -40C to +85C (I) | -40C to +125C (E) | -40C to +125C (E) |
| Digital Power Peripherals (PWM/ADC/PGA/Comparators) | Yes | Yes | Yes | Yes |
| Target Application | Digital power / SMPS | Digital power / SMPS | Digital power / SMPS | Digital power / SMPS (SMT) |
Principaux différenciateurs
- Extended temperature range up to +125C (vs DSPIC33EP64GS502-I/MX)
- Double the program memory (vs DSPIC33EP32GS502-E/MX)
- Through-hole serviceability (vs DSPIC33EP64GS502-E/MM)
Notes de conception
Package compatibility is the dominant selection risk in this family: -MX is 28-pin SPDIP, -MM is 28-QFN-S (6x6), and -2N is 28-UQFN (6x6). These are NOT interchangeable on a PCB despite sharing the same die and pin functions. Confirm the footprint suffix before ordering replacements. Also note that -E parts are rated to +125C ambient, but the through-hole SPDIP package has higher thermal resistance than the QFN, so junction temperature at 70 MIPS must be verified against the datasheet thermal data for your airflow and board conditions.
Like all dsPIC33EP devices, this DSC runs from a 3.3 V supply (verify the exact operating range in the family datasheet 70005127d). In digital power converters, isolate the DSC analog supply from the power-stage switching noise: use ferrite beads or RC filters on AVDD, and follow Microchip's family datasheet decoupling recommendations. The ADC/PGA accuracy driving the control loop depends directly on analog supply quality, so a clean analog rail measurably improves converter output regulation and transient response.
Estimated: a 28-pin SPDIP in a sealed enclosure at +105C ambient running the core at 70 MIPS will have a junction-to-ambient rise determined by the SPDIP theta-JA from the datasheet; with only tens of mA of core current this rise is typically modest, but if the DSC is mounted on the same PCB as a hot power stage or heatsinked component, radiated and conducted heat can push junction temperature beyond the +125C rating. Place the controller away from hot components and verify with a thermal measurement in the final enclosure.
Informations de conformité
Compliance status not stated in the provided web data; verify on the Microchip product page or the distributor RoHS certificate for this exact MPN.
